JPS6015163B2 - How to hold the crystal oscillation piece - Google Patents
How to hold the crystal oscillation pieceInfo
- Publication number
- JPS6015163B2 JPS6015163B2 JP7759478A JP7759478A JPS6015163B2 JP S6015163 B2 JPS6015163 B2 JP S6015163B2 JP 7759478 A JP7759478 A JP 7759478A JP 7759478 A JP7759478 A JP 7759478A JP S6015163 B2 JPS6015163 B2 JP S6015163B2
- Authority
- JP
- Japan
- Prior art keywords
- piece
- holding member
- crystal
- plating
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013078 crystal Substances 0.000 title claims description 67
- 230000010355 oscillation Effects 0.000 title claims description 29
- 238000007747 plating Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229910015363 Au—Sn Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910017980 Ag—Sn Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- -1 Au-ln Inorganic materials 0.000 description 1
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、水晶発振片の保持部村への固着を強固にし、
かつ、この固遅工程の工数を低減させ、水晶振動子の小
型化を可能にする水晶発振片の保持方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention firmly fixes the crystal oscillator piece to the holding part,
The present invention also relates to a method for holding a crystal oscillator piece that reduces the number of man-hours in this fixation/delay process and enables miniaturization of the crystal oscillator.
本発明の目的は、水晶発振片表面と保持部村表面のＡｕ
あるいはＡｇおよびＳｎあるいはｌｎ等の薄膜を加熱に
よって拡散熔融することによってＡｕあるいはＡｇとＳ
ｎあるいはｌｎ等の合金層を形成することにより、水晶
発振片の保持部材への固着強度を強くすることである。The object of the present invention is to
Alternatively, by diffusing and melting a thin film of Ag and Sn or ln by heating, Au or Ag and S
The purpose is to strengthen the fixing strength of the crystal oscillation piece to the holding member by forming an alloy layer such as n or ln.
本発明の目的は、あらかじめ保持部材表面にＡｕメッキ
あるいはＡｇメッキとＳｎメッキあるいはｌｎメッキ等
を層状に形成せしめ、これを加熱によるＡｕあるいはＡ
ｇとＳｎあるいはｌｎ等の拡散溶融によってＡｕあるい
はＡｇとＳｎあるいはｌｎ等のロウ合金を形成せしめる
ことにより、水晶発振片の保持部村への固着工程の工数
を低減せしめ、更には歩留りをも向上させることである
。本発明のさらに他の目的は、ロゥ材を別個に給材する
のではなく、あらかじめ保持部材表面に形成せしめられ
たＡｕあるいはＡｇとＳｎあるいはｌｎ等の層状メッキ
を拡散溶融することによってそのままＡｕあるいはＡｇ
とＳｎあるいはｌｎ等のロウ合金を形成する方法をとる
ことにより、水晶発振片の保持部及び保持部材そのもの
を小さくし、ひいては０水晶振動子自体の４・型化を可
能にすることである。The object of the present invention is to form a layer of Au plating, Ag plating, Sn plating, Inn plating, etc. on the surface of the holding member in advance, and then heat the Au or Ag plating.
By forming a solder alloy such as Au or Ag and Sn or ln by diffusion melting of g and Sn or ln, it is possible to reduce the number of man-hours in the process of fixing the crystal oscillator piece to the holding part, and further improve the yield. It is to let. Still another object of the present invention is to diffuse and melt the layered plating of Au or Ag and Sn or ln formed on the surface of the holding member in advance, instead of supplying the brazing material separately. Ag
By using a method of forming a solder alloy such as Sn or ln, it is possible to reduce the size of the holding portion of the crystal oscillation piece and the holding member itself, thereby making it possible to make the crystal resonator itself into a 4-type crystal resonator.
第１，２図は従来の保持方法によって音又型水晶発振片
を固着する様子を示したものであり、図中１，５は水晶
発振片、２，６は保持部材、３はタハンダゴテ、４はハ
ンダゴテによって給材されるハンダ、７はハンダチップ
を示すものである。Figures 1 and 2 show how the sonic crystal oscillator piece is fixed using the conventional holding method. 7 indicates solder supplied by a soldering iron, and 7 indicates a solder chip.
このうち、第１図は水晶発振片の保持部材への固着を、
ハンダゴテによる熔融ハンダの給材によって行う方式を
示すものであり、第２図はハンダチッｏプを保持部材と
水晶発振片の間にはさみ、こののち、加熱することによ
ってハンダチップを溶融し保持部材と水晶発振片を固着
する方式を示すものである。第１図および第２図より明
らかなように従来の水晶発振片の保持方法においては、
接合材夕としてハンダを用いており、しかも、水晶発振
片や保持部材等の被接合材とは別個に接合材を給材して
し、たために、被接合材の保持姿勢、接合材の供給量等
が不安定であり、全体的にみて水晶発振片の保持部材へ
の固着強度は弱いものであった。また従来の水晶発振片
の保持方式においては、例えば第１図においては、溶融
せるハンダをハンダゴテのコテ先によって水晶発振片と
保持部材の被接合部へ供給しなければならず、また第２
図においては、極めて小さなハンダチップをピンセット
等によって被接合部へ給材し、しかもこれを加熱溶融す
るまで移動しないように位置を保持しなければならない
ため、水晶発振片の保持部村への固着工程が作業的に見
て著しく煩雑であり工数も高く、従って固着位置不良、
ハンダ量不良等の不良が多く歩蟹りの低いものであった
。更に従来の水晶発振片の保持方式においては、上に記
したように水晶発振片の保持部材への固着工程が煩雑で
あるからばかりではなく、ハンダゴテのコテ先によって
溶融ハンダを供給するにしても寸法的に限界があり、あ
る寸法より小さい水晶振動子の製造は不可能であった。
このように、従来の水晶発振片の保持方式は、水晶発振
片の保持部材への固着強度が弱く、固着工程の工数が高
く、また小型水晶振動子の製造が不可能である等、種々
欠点を有するものであった。Of these, Figure 1 shows how the crystal oscillation piece is fixed to the holding member.
This method is performed by feeding molten solder with a soldering iron. Figure 2 shows a method in which a solder chip is sandwiched between a holding member and a crystal oscillation piece, and then heated to melt the solder chip and connect it to the holding member. This shows a method of fixing a crystal oscillator piece. As is clear from Figures 1 and 2, in the conventional method of holding a crystal oscillation piece,
Solder is used as the bonding material, and the bonding material is supplied separately from the materials to be bonded, such as the crystal oscillator piece and the holding member. The amount, etc. was unstable, and the strength of fixing the crystal oscillation piece to the holding member was weak overall. Furthermore, in the conventional method of holding a crystal oscillator piece, as shown in FIG.
In the figure, an extremely small solder chip is fed to the part to be joined using tweezers, etc., and it must be held in place so as not to move until it is heated and melted, so the crystal oscillation piece is stuck to the holding part. The process is extremely complicated and requires a lot of man-hours, resulting in poor fixing position and
There were many defects such as insufficient amount of solder, and the number of defects was low. Furthermore, in the conventional method of holding the crystal oscillator piece, not only is the process of fixing the crystal oscillator piece to the holding member complicated as described above, but also the process of fixing the crystal oscillator piece to the holding member is complicated, but even if molten solder is supplied with the tip of a soldering iron, Due to size limitations, it was impossible to manufacture crystal resonators smaller than a certain size.
As described above, the conventional method of holding the crystal oscillator piece has various drawbacks, such as the strength of fixing the crystal oscillator piece to the holding member is weak, the number of man-hours required for the fixing process is high, and it is impossible to manufacture small crystal oscillators. It had a
本発明はかかる欠点を除去するものであり、第３図は本
発明による水晶発振片の保持方式によって音又型水晶発
振片を保持したものを示すものである。以下Ａｕメッキ
とＳｎメッキを層状に施したものについて代表的に説明
する。第３〜５図中、８，１１，１７は水晶発振片、９
，１４，２川ま保持部材、１２，１８は水晶発振片の下
地電極、１３，１９は水晶発振片のＡｕ電極、１５は保
持部材のＡｕメッキ層、１ ６は保持部材のＳｎメッキ
層、１０，２１はＡｕ−Ｓｎ合金層を示すものである。
第３図ないし、第５図より明らかなように、本発明によ
る水晶発振片の保持方法は水晶発振片と保持部村の接合
材として、堅くて接着強度の高いＡｕ−Ｓｎ系合金を最
終的に用いているばかりでなく、保持部材にＡｕメッキ
およびＳｎメッキを層状に施しているためハンダチップ
や溶融ハンダが片寄って保持部材や水晶発振片につくと
いうことがなく、これら被接合材の保持姿勢や接合材の
供給量が安定である為、水晶発振片の保持部材への固着
強度が極めて強いものである。また第４図、第５図に詳
しく説明するように、本発明における水晶発振片の保持
方法は、ハンダチップや熔融ハンダ等を被接合部村とは
別個に供給することなしに、あらかじめ保持部材に施さ
れた層状のＡｕメッキおよびＳｎメッキ（第４図１ ５
，１ ６）を加熱によって溶融合金化（第５図２１）す
るため、水晶発振片の保持部材への固着工程が極めて単
純であり、従って工数も低く、歩留りも高いものである
。さらに本発明における水晶発振片の保持方式において
は、ハンダチップや溶融ハンダ等の接合材を、水晶発振
片あるいは保持部材等の被接合部材とは別個に供給する
ことなしに、接合材となるＡｕメッキ及び‐Ｓｎメッキ
を層状にあらかじめ保持部材に施している為、超小型水
晶振動子を製造するうえで、ハンダチップや溶融ハンダ
の特に作業的な意味での寸法的限界が無意味となり、水
晶振動子の小型化が可能となるものであり、とりわけ、
腕時計用水晶振動子への応用としては有望なるものがあ
るものである。The present invention aims to eliminate such drawbacks, and FIG. 3 shows a crystal oscillator piece held by the crystal oscillator piece holding method according to the present invention. Hereinafter, a case in which Au plating and Sn plating are applied in layers will be representatively explained. In Figures 3 to 5, 8, 11, 17 are crystal oscillation pieces, 9
, 14, 2 Kawama holding members, 12 and 18 are base electrodes of the crystal oscillation piece, 13 and 19 are Au electrodes of the crystal oscillation piece, 15 is an Au plating layer of the holding member, 16 is a Sn plating layer of the holding member, Reference numerals 10 and 21 indicate Au-Sn alloy layers.
As is clear from FIGS. 3 to 5, the method for holding a crystal oscillation piece according to the present invention uses a hard Au-Sn alloy with high adhesive strength as the bonding material between the crystal oscillation piece and the holding part. In addition, since the holding member is coated with Au plating and Sn plating in layers, solder chips and molten solder do not get stuck to the holding member or crystal oscillator piece in a biased manner, making it possible to hold these materials to be joined. Since the posture and the amount of bonding material supplied are stable, the fixing strength of the crystal oscillator piece to the holding member is extremely strong. Further, as explained in detail in FIGS. 4 and 5, the method of holding the crystal oscillation piece in the present invention is such that the holding member is not supplied with solder chips or molten solder separately from the parts to be joined. The layered Au plating and Sn plating applied to the
, 16) are melted into an alloy by heating (FIG. 5, 21), the process of fixing the crystal oscillation piece to the holding member is extremely simple, and therefore the number of man-hours is low and the yield is high. Furthermore, in the holding method of the crystal oscillation piece in the present invention, the bonding material such as a solder chip or molten solder is not supplied separately from the crystal oscillation piece or the member to be joined such as the holding member. Since plating and -Sn plating are applied to the holding member in advance in a layered manner, the dimensional limitations of solder chips and molten solder, especially in terms of work, become meaningless when manufacturing ultra-small crystal resonators. This makes it possible to miniaturize the vibrator, and in particular,
There are some promising applications for crystal resonators for wristwatches.
以上に説明したような内容は、ＡｕメッキとＳｎメッキ
を層状に保持部材に施したものばかりではなく、Ａｕや
Ａｇと拡散しやすく、かつ、ＡｕやＡｇとの合金が強固
なロウ材を作り得る各種金属とＡｕやＡｇとの組み合わ
せ、例えばＡｕ−ｌｎ、Ａｕ−Ｇｅ、Ａｕ−Ｎｂ、Ａｕ
−Ｓｂ、Ａｇ−Ｓｎ、Ａｇ−ｌｎ等、種々のメッキを層
状に水晶発振片を保持する保持部材に施すものについて
共通に言えるものである。以上述べたように、本発明に
おける水晶発振片の保持方法は、水晶発振片の保持部材
への固着強度を強固にし、固着工程を簡略化、低工数化
、高歩留り化し、さらには水晶振動子の小型化を可能に
する等、種々利点を有するものである。The content explained above is not limited to the case where Au plating and Sn plating are applied to the holding member in a layered manner. Combinations of various metals to be obtained with Au and Ag, such as Au-ln, Au-Ge, Au-Nb, Au
This can be said in common for holding members that hold a crystal oscillation piece, which are coated with various platings such as -Sb, Ag-Sn, Ag-ln, etc. in a layered manner. As described above, the method for holding a crystal oscillation piece in the present invention strengthens the strength of fixing the crystal oscillation piece to the holding member, simplifies the fixing process, reduces man-hours, and increases yield, and further improves the fixing strength of the crystal oscillation piece to the holding member. It has various advantages such as making it possible to downsize the device.
尚、水晶振動子とは水晶発振片が種々の形態によって保
持部材に保持され、各種容器に収納された状態のものを
示すものである。また本発明は、あらかじめ保持部村に
施されるＡｕあるいはＡｇとＳｎあるいはｌｎ等の層状
メッキが説明図に示したごとく２層のみではなく３層、
４層等、２層以上のＡｕあるいはＡｇ−Ｓｎあるいはｌ
ｎ等の層状メッキは全て含み、また、Ｓｎメッキが純粋
なＳｎメッキばかりではなく５％重量比のＰｂを含むメ
ッキ等、Ｓｎ基メッキを含み、さらには、水晶発振片が
説明図に示されたような音又型水晶発振片ばかりでなく
、厚みこり水晶発振片、輪郭こり水晶発振片、縦振動水
晶発振片等、いかなる振動姿態の水晶発振片をも含む等
、本発明の基本的な考えを逸脱することなく、若干の変
更を加えたものを含むことはもちろんである。Note that the term "crystal oscillator" refers to a crystal oscillation piece held by a holding member in various forms and housed in various containers. In addition, the present invention provides that the layered plating of Au, Ag and Sn or In, etc. applied to the holding portion in advance is not only two layers as shown in the explanatory diagram, but three layers.
2 or more layers of Au or Ag-Sn or l, such as 4 layers
In addition, Sn plating includes not only pure Sn plating but also Sn-based plating such as plating containing Pb at a weight ratio of 5%, and crystal oscillator pieces are shown in the explanatory diagram. The basic principles of the present invention include not only a tone-shaped crystal oscillator piece, but also a crystal oscillator piece with any vibration mode, such as a thick crystal oscillator piece, a contoured crystal oscillator piece, a longitudinal vibration crystal oscillator piece, etc. It goes without saying that it includes slight changes without departing from the original idea.
第１図 ハンダゴテによって供給される溶融ハンダによ
って保持部材と水晶発振片を接合する、従来の水晶発振
片の保持方法。
第２図 ハンダチップを保持部材と水晶発振片の間に披
持した後、これを加熱溶融することによって保持部村と
水晶発振片を接合する、従来の水晶発振片の保持方法。
第３図 本発明によって水晶発振片を保持部材に保持し
たものの一例。第４図 第３図におけるＡ−Ａ′断面の
加熱溶融前の拡大図。第５図第３図におけるＡ−Ａ′断
面の加熱溶融後の拡大図。１，５，８，１１，１７・・
・・・・水晶発振片、２，６，９，１４，２０・・・・
・・保持部材、３・・・・・・ハンダゴテ、４・・・・
・・溶融ハンダ、７・・・・・・ハンダチップ、１０，
２１…・・・Ａｕ−Ｓｎ合金層、１ ２，１８……水晶
発振片表面の下地電極、１３，１９・・・・・・水晶発
振片表面のＡｕ電極、１５・・・・・・保持部村のＡｕ
メッキ層、１６・・・・・・保持部材のＳｎメッキ層。
うｒｌ図う←２図
斗３図
斗４図
÷〆Ｓ図Fig. 1 A conventional method for holding a crystal oscillator piece, in which the holding member and the crystal oscillator piece are joined using molten solder supplied by a soldering iron. Fig. 2 A conventional method for holding a crystal oscillator piece, in which a solder chip is held between a holding member and a crystal oscillator piece, and then the holding member and the crystal oscillator piece are joined by heating and melting the solder chip.
FIG. 3 is an example of a crystal oscillation piece held by a holding member according to the present invention. FIG. 4 is an enlarged view of the A-A' cross section in FIG. 3 before heating and melting. FIG. 5 is an enlarged view of the A-A' cross section in FIG. 3 after heating and melting. 1, 5, 8, 11, 17...
...Crystal oscillation piece, 2, 6, 9, 14, 20...
...Holding member, 3... Soldering iron, 4...
...Melted solder, 7...Solder chip, 10,
21... Au-Sn alloy layer, 1 2, 18... Base electrode on the surface of the crystal oscillation piece, 13, 19... Au electrode on the surface of the crystal oscillation piece, 15... Holding Bemura's Au
Plating layer, 16... Sn plating layer of the holding member. Url diagram ← 2 diagram 3 diagram 4 diagram ÷ S diagram
Claims (1)
いる水晶振動子において、前記保持部材にはＡｕあるい
はＡｇメツキと、ＳｎあるいはＩｎメツキ等のＡｕある
いはＡｇに対する拡散性が比較的すぐれている金属のメ
ツキの２種類のメツキが層状に施されており、この保持
部材を水晶発振片に形成された金属薄膜上に接触後、加
熱によつて水晶発振片表面および保持部材表面のＡｕあ
るいはＡｇ及びＳｎあるいはＩｎ等を拡散溶融すること
によつて水晶発振片を保持部材上に固着することを特徴
とする水晶発振片の保持方法。1. In a crystal resonator in which a crystal oscillation piece is enclosed in an airtight container via a holding member, the holding member has Au or Ag plating, and Sn or In plating, which has relatively excellent diffusivity for Au or Ag. Two types of metal plating are applied in layers, and after this holding member is brought into contact with the metal thin film formed on the crystal oscillator piece, the Au or Au on the surface of the crystal oscillator piece and the surface of the holding member is heated. A method for holding a crystal oscillation piece, which comprises fixing the crystal oscillation piece on a holding member by diffusing and melting Ag, Sn, In, or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7759478A JPS6015163B2 (en) | 1978-06-27 | 1978-06-27 | How to hold the crystal oscillation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7759478A JPS6015163B2 (en) | 1978-06-27 | 1978-06-27 | How to hold the crystal oscillation piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS554175A JPS554175A (en) | 1980-01-12 |
| JPS6015163B2 true JPS6015163B2 (en) | 1985-04-18 |
Family
ID=13638277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7759478A Expired JPS6015163B2 (en) | 1978-06-27 | 1978-06-27 | How to hold the crystal oscillation piece |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6015163B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55134523A (en) * | 1979-04-06 | 1980-10-20 | Citizen Watch Co Ltd | Support structure of tuning fork type crystal vibrator |
| JPS5797213A (en) * | 1980-12-09 | 1982-06-16 | Seiko Epson Corp | Supporting method of quartz oscillator |
| JPS57170612A (en) * | 1981-04-14 | 1982-10-20 | Seiko Epson Corp | Mounting method for glass-sealed quartz oscillator |
| JPS59125125U (en) * | 1983-02-08 | 1984-08-23 | 日本電波工業株式会社 | Cage for tuning fork crystal resonator |
| JPS60101821U (en) * | 1983-12-13 | 1985-07-11 | 株式会社大真空 | Support structure of small crystal unit |
-
1978
- 1978-06-27 JP JP7759478A patent/JPS6015163B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS554175A (en) | 1980-01-12 |
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