JPS6016111B2 - Lead frame for optical coupling device - Google Patents
Lead frame for optical coupling deviceInfo
- Publication number
- JPS6016111B2 JPS6016111B2 JP53011193A JP1119378A JPS6016111B2 JP S6016111 B2 JPS6016111 B2 JP S6016111B2 JP 53011193 A JP53011193 A JP 53011193A JP 1119378 A JP1119378 A JP 1119378A JP S6016111 B2 JPS6016111 B2 JP S6016111B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- light emitting
- emitting element
- photocoupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】
本発明は光結合素子（フオトカプラ）を得るためのりー
ドフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame for obtaining a photocoupler.
第１図は通常用いられているフオトカプラの構成を示す
断面図であり、この構成を得るためのりードフレームと
して第２図に示すものが用いられていた。FIG. 1 is a sectional view showing the structure of a commonly used photocoupler, and the lead frame shown in FIG. 2 was used to obtain this structure.
即ち、金属板材を打抜き或いはエッチング加工すること
により、発光素子用リードフレ−ムーと受光素子用リー
ドフレーム２をそれぞれ別個に設け、リードフレームー
のリード部１，の先端部にＬＥＤ等の発光素子３を配置
し、リード部１２と発光素子３とをワイヤ４で接続し、
リードフレーム２のリード部２，の先端部にフオトトラ
ンジスタ等の受光素子５を配置し、リード部２２，２３
と受光素子５をワイヤ６，７で接続する。そして発光素
子３と受光素子５が対向するようにフレーム１，２を対
向させ、素子３，５間を光透過性の樹脂ェンキャップ剤
８で覆い、しかる後にトランスフアモールド等で、樹脂
封止９を施こす。最後にフレーム１，２の不要部分を除
去すれば、第１図のフオトカプラが得られるものである
。しかしながら上記のようなフオトカプラにあっては、
別個のりードフレーム１，２を用いなければらないため
、製造が複雑化され、またリードフレーム１にはリード
部２，〜２３を位置させるための空所１０を設けかつリ
ードフレーム２にはリード部１，，１２を位置させるた
めの空所１１を設ける必要があるため、金属板材の材料
利用率が大中に低下し、コストアップの原因となってい
た。That is, a lead frame for a light emitting element and a lead frame for a light receiving element 2 are provided separately by punching or etching a metal plate material, and a light emitting element 3 such as an LED is attached to the tip of the lead part 1 of the lead frame. , connect the lead part 12 and the light emitting element 3 with the wire 4,
A light receiving element 5 such as a phototransistor is arranged at the tip of the lead part 2 of the lead frame 2, and the lead part 22, 23
and the light receiving element 5 are connected by wires 6 and 7. The frames 1 and 2 are then placed opposite each other so that the light-emitting element 3 and the light-receiving element 5 face each other, and the space between the elements 3 and 5 is covered with a light-transmitting resin capping agent 8. After that, a resin sealing agent 9 is formed using transfer molding or the like. apply. Finally, by removing unnecessary portions of frames 1 and 2, the photocoupler shown in FIG. 1 is obtained. However, in the photocoupler as mentioned above,
Separate lead frames 1 and 2 must be used, which complicates manufacturing, and lead frame 1 is provided with a cavity 10 for positioning lead portions 2 and 23, and lead frame 2 is provided with a cavity 10 for positioning the lead portions 2 and Since it is necessary to provide a space 11 for positioning the parts 1, 12, the material utilization rate of the metal plate material is significantly reduced, causing an increase in cost.
本発明は上記実情に鑑みてなされたもので、環状連結部
から、一方は前記環状連結部の内方へ、他方は前記環状
連結部の外方へ突出した複数のリードを設け、前記環状
連結部を、前記一方及び他方のリードの所定部分が対向
するように折返した構成とすることにより、材料利用率
が向上しかつ製造が容易化された光結合素子用リードフ
レームを提供しようとするものである。The present invention has been made in view of the above circumstances, and includes a plurality of leads, one of which protrudes inwardly from the annular connecting portion, and the other protruding outward from the annular connecting portion. An object of the present invention is to provide a lead frame for an optical coupling element that improves material utilization and facilitates manufacturing by having a structure in which the predetermined portions of the one lead and the other lead are folded back so as to face each other. It is.
以下図面を参照して本発明の−実施例を説明する。Embodiments of the present invention will be described below with reference to the drawings.
第３図は一枚の金属板材を打抜き或いはエッチング加工
することにより形成したりードフレ−ムであり、このリ
ードフレーム２０内には、一端側にＬＥＤ等の発光素子
２１を配置する発光素子配置用リード部２２、該リード
部の両側に発光素子給電用リード部２３，，２３２、が
並置され、これらリード部２２，２３，，２３２ は内
側連続部２４、外側連結部２５で連結されている。また
上記りードフレーム２０‘こは、ＩＪード部２２の延長
方向に受光素子配置用リード部２６、譲りード部の両側
に受光素子給電用リード部２７，，２７２が並置され、
これらリード部２６，２７，，２７２ は、連結部２４
．２５と並行する外側連結部２８で連結されている。そ
して上記連結部２４，２５，２８はこれと直交する連結
部２９で連結された構成となっている。なお、本リード
フレーム２０は、一度に多数のフオトカプラを得るため
のものであるため、以上の構成を１ブロックとして多数
のブロックが連結部２４，２５，２８の延長方向に設け
られており、各ブロック間において連結部２４，２５，
２８は連結部２９で連結されている。FIG. 3 shows a lead frame formed by punching or etching a single metal plate. Inside this lead frame 20, there is a lead frame 20 for arranging a light emitting element 21 such as an LED on one end. Lead portions 22 and light emitting element power supply lead portions 23, 232 are juxtaposed on both sides of the lead portion, and these lead portions 22, 23, 232 are connected by an inner continuous portion 24 and an outer connecting portion 25. In addition, the lead frame 20' has a lead part 26 for arranging a light receiving element in the extending direction of the IJ code part 22, and lead parts 27, 272 for powering the light receiving element on both sides of the yield lead part.
These lead portions 26, 27, 272 are connected to the connecting portion 24.
．． They are connected by an outer connecting portion 28 that is parallel to 25. The connecting portions 24, 25, and 28 are connected by a connecting portion 29 orthogonal thereto. In addition, since this lead frame 20 is for obtaining a large number of photocouplers at once, a large number of blocks are provided in the extending direction of the connecting portions 24, 25, 28, with the above configuration as one block, and each Connecting parts 24, 25,
28 are connected by a connecting portion 29.
またリード部２２，２３，，２３２，２６，２７１，２
７２は先端側で下方に折曲がり、段差がついた構成とな
っていること、更にここでは使用に供しないリード部２
３，をわざわざ設け、リード部２２にマウントする素子
とかこれに要するワイヤボンディングの数により機能を
変えられるようにしたことは、第２図の場合と同様であ
る。しかして、上記のようなリードフレーム２０を用い
てフオトカプラを得るには、次のようにすればよい。Also, the lead parts 22, 23, 232, 26, 271, 2
72 is bent downward at the tip side and has a step structure, and the lead portion 2 which is not used here.
3 is specially provided so that the function can be changed depending on the number of elements mounted on the lead portion 22 and the number of wire bondings required for this, as in the case of FIG. Therefore, in order to obtain a photocoupler using the lead frame 20 as described above, the following procedure may be performed.
まずリード部２２上のＢ−８線に沿った位置に発光素子
２１を配置（マウント）し、またリ−ド部２６上のＡ−
Ａ′線に沿った位置に受光素子３０を配置して後、リー
ド部２３２と発光素子２１をボンディングワイヤ３１で
接続し、受光素子３０とりード部２７，，２７２をボン
ディングワイヤ３２，３３で接続する。次に連結部２５
，２９で構成される環状連結部を、素子２１，３０間の
中央部つまりＣ−Ｃ′線に沿った位置で図示矢印Ｄ方向
に折り返すことにより、素子２１，３０を対向させる。
この工程以後の素子２１，３０間のェンキャッブ工程、
樹脂封止工程、フレームの不要部の除去工程等は前記従
来例の場合と同様であるから、説明を省略する。以上の
如きリードフレーム２０を用いてフオトカプラを得る場
合の利点は、一つのりードフレーム内に、発光素子側の
りード部と、受光例のリード部とを近接して形成できる
構成であるため、第２図の場合のようにＩＪ−ドフレー
ムに空所１０，１ １を設ける必要がなく、従ってリー
ドフレームの材料利用率が向上する。First, the light emitting element 21 is placed (mounted) at a position along the line B-8 on the lead part 22, and
After arranging the light receiving element 30 at a position along line A', the lead part 232 and the light emitting element 21 are connected with the bonding wire 31, and the lead parts 27, 272 of the light receiving element 30 are connected with the bonding wires 32, 33. Connecting. Next, the connecting part 25
, 29 is folded back in the direction of arrow D in the figure at the center between the elements 21 and 30, that is, at a position along line C-C', so that the elements 21 and 30 face each other.
Encap process between the elements 21 and 30 after this process,
The resin sealing process, the process of removing unnecessary portions of the frame, etc. are the same as in the conventional example, so their explanations will be omitted. The advantage of obtaining a photocoupler using the lead frame 20 as described above is that the lead part on the light emitting element side and the lead part in the light receiving example can be formed close to each other in one lead frame. , it is not necessary to provide void spaces 10, 11 in the IJ-board frame as in the case of FIG. 2, and therefore the material utilization rate of the lead frame is improved.
また第２図の場合のように発光素子側のＩＪードフレー
ム１と受光素子側のりードフレーム２を別々に形成する
必要がなく、単一のりードフレ−ム２０を使用すればよ
いため、素子マウント工程、ワイヤボンディング工程等
が発光及び受光素子側とも同一装置ないし同一機構内で
行なえる等で、組立て工程が簡単化されるものである。
なお、本発明は上記実施例のみに限られるものではなく
、例えば第５図に示すように異なるフォトカプラを得る
ためのＩＪード部どうしを相入り組ませていわゆる合掌
型とし、更に材料利用率の向上をはかるようにしてもよ
い。In addition, there is no need to separately form the IJ lead frame 1 on the light emitting element side and the lead frame 2 on the light receiving element side as in the case of Fig. 2, and it is sufficient to use a single lead frame 20. This simplifies the assembly process because the process, wire bonding process, etc. can be performed in the same device or mechanism for both the light emitting and light receiving elements.
It should be noted that the present invention is not limited to the above-mentioned embodiments. For example, as shown in FIG. 5, in order to obtain different photocouplers, the IJ joints may be interlaced to form a so-called gassho type, and the material utilization may be further improved. It is also possible to try to improve the rate.
この第５図の場合は６ピンのフオトカプラ用リードフレ
ームと８ピンのフオトカプラ用リードフレームを同一リ
ードフレームで合掌型の構成としたものであるが、６ピ
ンどうしの合掌型、８ピソどうしの合掌型等の構成とす
ることもできる。また第５図の８ピン側のりードフレー
ムは発光素子と受光素子を２対有したフオトカプラとな
るものである。以上説明した如く本発明によれば、金属
材料の利用率が向上しかつ製造が容易化されるので、大
中にコストが低減化された光結合素子が得られるもので
ある。In the case of Fig. 5, the lead frame for a 6-pin photocoupler and the lead frame for an 8-pin photocoupler are the same lead frame and have a clasped-in configuration, but there are also 6-pin and 8-pin clasped-together configurations. It can also be configured as a mold or the like. Further, the read frame on the 8-pin side in FIG. 5 is a photocoupler having two pairs of a light emitting element and a light receiving element. As explained above, according to the present invention, the utilization rate of metal materials is improved and manufacturing is facilitated, so that an optical coupling element with a significantly reduced cost can be obtained.
第１図はフオトカプラの構成を示す断面図、第２図は従
来のフオトカプラ用リードフレームを示す斜視図、第３
図は本発明の一実施例を示す斜視図、第４図はその折返
し後の構成を示す斜視図、第５図は本発明の他の実施例
の斜視図である。
２０……リードフレーム、２１・・…・発光素子、２２
・・…・発光素子配置用リード部、２３２・・・・・・
発光素子給電用リード部、２４，２５，２８，２９・・
・・・・連結部、２６……受光素子配置用リード部、２
７・，２７２・・・・・・受光素子給電用リード部、３
０・・・・・・受光素子。
第１図
第２図
第３図
第４図
第５図Fig. 1 is a sectional view showing the structure of a photocoupler, Fig. 2 is a perspective view showing a conventional lead frame for photocoupler, and Fig. 3 is a sectional view showing the structure of a photocoupler.
The figure is a perspective view showing one embodiment of the present invention, FIG. 4 is a perspective view showing the configuration after folding the same, and FIG. 5 is a perspective view of another embodiment of the present invention. 20...Lead frame, 21...Light emitting element, 22
...Lead part for light emitting element arrangement, 232...
Light emitting element power supply lead part, 24, 25, 28, 29...
...Connection part, 26...Lead part for light-receiving element arrangement, 2
7.,272...Lead part for power supply to light receiving element, 3
0... Light receiving element. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5
Claims (1)
他方は前記環状連結部の外方へ突出した複数のリードを
設け、前記環状連結部、前記一方及び他方のリードの所
定部分が対向するように折返したことを特徴とする光結
合素子用リードフレーム。1 from the annular connection part, one inward of the annular connection part,
A lead frame for an optical coupling device, characterized in that the other is provided with a plurality of leads protruding outward from the annular connecting portion, and is folded back so that the annular connecting portion and predetermined portions of the one and the other leads face each other. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53011193A JPS6016111B2 (en) | 1978-02-03 | 1978-02-03 | Lead frame for optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53011193A JPS6016111B2 (en) | 1978-02-03 | 1978-02-03 | Lead frame for optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54104787A JPS54104787A (en) | 1979-08-17 |
| JPS6016111B2 true JPS6016111B2 (en) | 1985-04-23 |
Family
ID=11771211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53011193A Expired JPS6016111B2 (en) | 1978-02-03 | 1978-02-03 | Lead frame for optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016111B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154205U (en) * | 1983-03-31 | 1984-10-16 | 株式会社島津製作所 | X-ray fluoroscopy equipment |
| US5148243A (en) * | 1985-06-25 | 1992-09-15 | Hewlett-Packard Company | Optical isolator with encapsulation |
| US5049527A (en) * | 1985-06-25 | 1991-09-17 | Hewlett-Packard Company | Optical isolator |
| US4633582A (en) * | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
| US5176255A (en) * | 1991-06-19 | 1993-01-05 | North American Specialties Corporation | Lead frame for integrated circuits or the like and method of manufacture |
| US5920113A (en) * | 1996-08-13 | 1999-07-06 | Motorola, Inc. | Leadframe structure having moveable sub-frame |
| JP6239840B2 (en) * | 2013-03-27 | 2017-11-29 | ローム株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| TWI559576B (en) * | 2013-11-05 | 2016-11-21 | 立昌先進科技股份有限公司 | A chip type diode package element and its manufacturing method |
| US9496206B2 (en) * | 2015-04-10 | 2016-11-15 | Texas Instruments Incorporated | Flippable leadframe for packaged electronic system having vertically stacked chips and components |
-
1978
- 1978-02-03 JP JP53011193A patent/JPS6016111B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54104787A (en) | 1979-08-17 |
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