JPS6019630B2 - contact - Google Patents
contactInfo
- Publication number
- JPS6019630B2 JPS6019630B2 JP9031279A JP9031279A JPS6019630B2 JP S6019630 B2 JPS6019630 B2 JP S6019630B2 JP 9031279 A JP9031279 A JP 9031279A JP 9031279 A JP9031279 A JP 9031279A JP S6019630 B2 JPS6019630 B2 JP S6019630B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- plating
- phosphor bronze
- contact
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 26
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 20
- 229910000906 Bronze Inorganic materials 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 239000010974 bronze Substances 0.000 claims description 17
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 17
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 13
- 230000004907 flux Effects 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229940044654 phenolsulfonic acid Drugs 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241001574715 Eremas Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- -1 ariminium Chemical compound 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229940044652 phenolsulfonate Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 229940013123 stannous chloride Drugs 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- RAZPXVHCSOQXHL-UHFFFAOYSA-J sulfuric acid;tin(4+);disulfate Chemical compound [Sn+4].OS(O)(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RAZPXVHCSOQXHL-UHFFFAOYSA-J 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 239000011366 tin-based material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
Description
【発明の詳細な説明】
本発明は、錫または錫合金をめつきしたりん青銅製接触
子に関するものであり、特に高温使用下で秀れた耐剥離
性を有するようめつき後特別な加熱溶融処理を施すこと
によって作製される上記接触子に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a phosphor bronze contact plated with tin or a tin alloy, which is specially heated and melted after plating to have excellent peeling resistance under high-temperature use. The present invention relates to the above-mentioned contactor manufactured by performing a treatment.
電子機器には回路接続用のコネクタ接触子が多数使用さ
れている。Many connector contacts for circuit connection are used in electronic devices.
コネクタ接触子用の材料としてはべりリゥム鋼、チタン
鋼、りん青銅等の母材に表面接点用金属として金、銀等
のめつきを施したものがあるが、価格や量産性の点から
民生用電子機器用には適切でない。民生用電子機器にお
いては、母村としてりん青銅を用いそして表面接点用金
属として錫または錫合金をめつきした接触子が主に用い
られている。ところが、電子機器の内部にこれら接触子
を組込んで使用する場合、機器内部が通電による発熱の
ため10000前後に昇温するから、接触子はこのよう
な比較的高温に長時間曝されていることになる。Materials for connector contacts include base materials such as beryllium steel, titanium steel, and phosphor bronze plated with gold, silver, etc. as surface contact metals, but from the viewpoint of cost and mass production, they are not suitable for consumer use. Not suitable for electronic equipment. In consumer electronic devices, contacts are mainly used in which phosphor bronze is used as the base material and tin or tin alloy is plated as the surface contact metal. However, when these contacts are used inside electronic devices, the temperature inside the device rises to around 10,000 ℃ due to heat generation due to electricity, so the contacts are exposed to such relatively high temperatures for a long time. It turns out.
加えて、電子機器は、機械的振動を受けることも多い。
こうした使用条件下で、めつきが母村から剥離し、接触
不良となる欠点が認識されていた。この高温でのめつき
層の剥離は、りん青銅一すず系の固有の問題である。こ
の剥離の原因については、界面に特別な化合物が生成す
る等の意見もあるが、いまだ解明されていない。Additionally, electronic devices are often subject to mechanical vibrations.
It has been recognized that under such usage conditions, the plating peels off from the base plate, resulting in poor contact. Peeling of the plated layer at high temperatures is a problem inherent to phosphor bronze-tin-based materials. As for the cause of this peeling, there is an opinion that a special compound is generated at the interface, but it has not yet been elucidated.
剥離防止の対策として、ニッケルの下地めつきを施すか
、2山以上の厚い銅下地めつきを施す試みや、銀を含む
特別な錫合金を使用する提案もあるが、経済性の面等か
ら好ましくない。As a measure to prevent peeling, there are attempts to apply nickel underplating or thick copper underplating with two or more peaks, and proposals to use a special tin alloy containing silver, but from an economical point of view, etc. Undesirable.
本発明者は、錫あるいは錫合金をりん青銅母材にめつき
後、めつき層を加熱溶融処理するかあるいは溶融めつき
をすることによって、上述した剥離問題が解決されうろ
ことを見出した。The inventors of the present invention have found that the above-mentioned peeling problem can be solved by plating tin or a tin alloy onto a phosphor bronze base material and then subjecting the plated layer to heat melting treatment or melt plating.
斯くして、本発明は、りん青銅母材とこれに錫あるいは
錫合金をめつきし、然る後加熱溶融処理を行うか域し、
は溶融めつきを行なうことによって形成された錫あるい
は錫合金層とを具備することを特徴とする接触子を提供
する。Thus, the present invention includes plating a phosphor bronze base material with tin or a tin alloy, and then subjecting it to a heating and melting treatment,
provides a contact characterized by comprising a tin or tin alloy layer formed by hot-dip plating.
本発明においては、りん青銅の条にめつきおよび加熱熔
融処理をした後接触子に成型するのが通例であるが、り
ん青銅の条を接触子に成型した後にめつきおよび加熱熔
融処理することもできる。In the present invention, it is customary to mold a phosphor bronze strip into a contact after plating and heat-melting it. You can also do it.
りん青銅はばね用りん青銅としてJISに規定される各
種のものを包括するものであり、錫3〜10%およびり
ん0.03〜0.35%の範囲にある。りん青銅条は、
アルカリ脱脂、電解脱脂、酸洗、水洗等の所定の浄化処
理後、銅下地めつきを必要に応じ施される。本発明にお
いては、鋼地下めつき醸しで錫あるいは錫合金めつき層
の剥離を防止しうるものである。錫あるいは錫合金のめ
つきは電解めつきおよび無電解めつき或いは溶融めつき
のいずれでも実施することができる。Phosphor bronze includes various types of phosphor bronze specified by JIS as phosphor bronze for springs, and is in the range of 3 to 10% tin and 0.03 to 0.35% phosphorus. Phosphor bronze strip is
After predetermined purification treatments such as alkaline degreasing, electrolytic degreasing, pickling, and water washing, copper underplating is applied as necessary. In the present invention, peeling of the tin or tin alloy plating layer can be prevented by enhancing the steel subsurface plating. Plating of tin or a tin alloy can be carried out by electrolytic plating, electroless plating or hot-dip plating.
錫合金としては、一般にはんだ材料として知られる鉛、
ビスマス、カドミウム、アンチモン、インジウム、アリ
ミニウム、亜鉛等を一種以上含むものを包括するもので
ある。めつき条件は従来と変ることはない。亀解めつき
俗としては、錫酸カリウム、錫酸ナトリウム、塩化第一
錫等を使用してのアルカリ俗、しゆう酸塩俗、ホウフッ
化浴、硫酸塩俗、フェノールスルホン酸浴等がいずれも
使用できる。溶融めつきは、所定のフラックス水溶液(
ZnC12の40oBeの水溶液)に1〜2秒浸債後溶
融めつき槽に1凪砂、程度浸潰し、エアーブローにより
めつき層の厚さを適宜調整する所謂溶融めつきが代表的
である。フラックス水溶液への浸債の代りに、フラック
スを溶融めつき層に浮上させ、そのフラツクス層を通し
て熔融めつき層に浸けるようにすることもできる。こう
して、錫あるいは錫合金でめつきされたりん青銅条は続
いて加熱溶融処理を受ける。放熱溶融処理はリフロー処
理とも呼ばれるもので、バーナ直火型炉、ェレマ炉等の
加熱炉において炉温550〜腿oooの温度で3〜1の
砂加熱することによって行われる。この処理によって、
錫あるいは錫合金層の再溶融と流動化が起る。但し溶融
めつきしたものについては再溶融は特に行なう必要はな
い。本発明に従って作製された接触子は高温下での使用
中にもめつき層の剥離を生じない。Tin alloys include lead, which is generally known as a solder material,
It includes those containing one or more of bismuth, cadmium, antimony, indium, ariminium, zinc, etc. The plating conditions remain the same as before. Examples of baths that can be used to solve the problem include alkaline baths using potassium stannate, sodium stannate, stannous chloride, etc., oxalate baths, fluoroborate baths, sulfate baths, and phenolsulfonic acid baths. can also be used. For melt plating, use a specified flux aqueous solution (
A typical method is so-called hot melt plating, in which the material is immersed in a 40oBe aqueous solution of ZnC12 for 1 to 2 seconds, then immersed in a hot melt plating tank for about 1 hour, and the thickness of the plating layer is adjusted appropriately by air blowing. Instead of immersing the flux in an aqueous solution, it is also possible to float the flux onto the molten layer and allow the flux to soak through the flux layer into the molten layer. The phosphor bronze strip plated with tin or tin alloy is then subsequently subjected to a heat melting process. The heat dissipation melting process is also called reflow process, and is carried out by heating the sand in a heating furnace such as a burner direct-fired furnace or an erema furnace at a furnace temperature of 550 to 1000 yen. With this process,
Remelting and fluidization of the tin or tin alloy layer takes place. However, it is not necessary to re-melt the melted material. Contacts made according to the present invention do not suffer from peeling of the plating layer during use at high temperatures.
例えば、10530の温度で60風時間保持した後90
0 曲げ剥離試験を行っても剥離は全く生じない。以下
、実施例を述べる。For example, after holding for 60 wind hours at a temperature of 10,530 90
0 No peeling occurs at all even if a bending peel test is performed. Examples will be described below.
実施例 1
ばね用りん青銅条をアルカリ脱脂、電解脱脂、そして酸
洗中和後硫酸錫格で1.5仏の錫めつきを行った。Example 1 A phosphor bronze strip for a spring was subjected to alkaline degreasing, electrolytic degreasing, pickling and neutralization, and then tin plating with a tin sulfate rating of 1.5 degrees.
硫酸錫格ならびにめつき条件は下記の通りである:硫酸
錫裕 硫酸第1錫 72夕/そ硫酸
100夕/そ格温
30つ○
電流密度 船/dm2
こうして錫めつきされた条をバーナ直火型加熱炉におい
て650qCに5秒間保持した後温風で乾燥した。The tin sulfate rating and plating conditions are as follows: tin sulfate sulfuric acid stannous sulfate 72/sulfuric acid
100 evenings / so high temperature
30 current density ships/dm2 The thus tinned strip was held at 650 qC for 5 seconds in a burner direct-fired heating furnace and then dried with warm air.
その後、この条を接触子の形状に成型した。こうして作
製された接触子を10500において60加持間大気加
熱した後、900 曲げによる剥離試験を行ったが、め
つき層の剥離は全く認められなかつた。比較例 1
実施例1の試料に加熱溶融処理を施さずに接触子を作製
した。This strip was then molded into the shape of a contact. The thus prepared contact was heated in the atmosphere at 10500°C for 60 hours, and then subjected to a peel test by bending at 900°C, but no peeling of the plating layer was observed. Comparative Example 1 A contact was produced without subjecting the sample of Example 1 to heat-melting treatment.
これを105ooにおいて36独特間保持後剥離試験を
したところめつき層の剥離が生じた。実施例 2
ばね用りん青銅条をアルカリ脱脂、電解脱脂そして酸洗
中和後フェノールスルホン酸俗で半田めつきした。When this was subjected to a peel test after being held for 36 hours at 105 oo, the plated layer peeled off. Example 2 A phosphor bronze strip for a spring was subjected to alkaline degreasing, electrolytic degreasing, pickling and neutralization, and then soldering with phenol sulfonic acid.
めつき浴組成および条件は次の通りとした。フェノール
スルホン酸第1錫 160夕/そフェノールスルホ
ン酸鉛 160夕/そフェノールスルホン酸
150夕/ク格温
3oqo電流密度
3A/dでその後、ェレマ炉において650oo
で20秒間加熱後放冷した。The plating bath composition and conditions were as follows. Stannous phenolsulfonic acid 160 t/lead phenolsulfonate 160 t/sphenol sulfonic acid
150 evenings/Kuke temperature
3oqo current density
3 A/d and then 650 oo in the Erema furnace.
After heating for 20 seconds, the mixture was allowed to cool.
得られためつき材を接触子に成型し、105qoにおい
て60畑時間保持後90o 曲げ剥離試験を行ったが、
いずれも半田めつき層の剥離を生じなかった。実施例
3
ばね用りん青銅条をアルカリ脱脂、電解脱脂、そして酸
洗中和後水洗して、4山史塩化亜鉛水溶液のフラックス
を塗布後3.20午0における俗温の熔融錫に浸潰して
2仏の厚さの錫めつきを施した。The obtained mating material was molded into a contact, and after being held at 105 qo for 60 hours, a 90 o bending peel test was conducted.
In neither case did the solder plating layer peel off. Example
3 Phosphor bronze strips for springs are degreased with alkaline, electrolytically degreased, pickled, neutralized, washed with water, coated with a flux of 4 Yamashi zinc chloride aqueous solution, and immersed in molten tin at ordinary temperature at 3.20 pm. It is tinned to the thickness of a Buddha.
その後、接触子に成型後105午0において60斑時間
保持した後先さと同様に、剥離試験したが、めつき層の
剥離はいずれも認められなかった。実施例 4
実施例3と同様に前処理したばね用りん青銅条にフラッ
クス塗布後300qoの格温の60%錫〜40%鉛の半
田格に浸債することにより2仏の半田溶融めつきを行っ
た。Thereafter, after molding into a contact, a peeling test was performed in the same manner as the tip after holding it for 60 hours at 105 pm, but no peeling of the plating layer was observed. Example 4 A phosphor bronze strip for springs pretreated in the same manner as in Example 3 was coated with flux and then immersed in a solder grade of 60% tin to 40% lead at a temperature of 300 qo to achieve two degrees of solder melt plating. went.
実施例3と同様に剥離試験したが、めつき層の剥離は生
じなかった。以上説明したように、本発明は非常に簡単
な操作で従来のりん青銅−錫接触子に見られた高溢剥離
間題を解決したものである。A peel test was conducted in the same manner as in Example 3, but no peeling of the plated layer occurred. As explained above, the present invention solves the problem of excessive exfoliation seen in conventional phosphor bronze-tin contacts with a very simple operation.
Claims (1)
、然る後加熱溶融処理を行うことによつて形成された錫
あるいは錫合金層とを具備することを特徴とする接触子
。 2 りん青銅母材とこれに錫あるいは錫合金を溶融めつ
きすることによつて形成された錫あるいは錫合金層とを
具備することを特徴とする接触子。[Scope of Claims] 1. It is characterized by comprising a phosphor bronze base material, a tin or tin alloy layer formed by plating tin or a tin alloy thereon, and then subjecting it to a heating and melting treatment. A contact element. 2. A contact comprising a phosphor bronze base material and a tin or tin alloy layer formed by melt-plating tin or a tin alloy thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9031279A JPS6019630B2 (en) | 1979-07-18 | 1979-07-18 | contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9031279A JPS6019630B2 (en) | 1979-07-18 | 1979-07-18 | contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5615569A JPS5615569A (en) | 1981-02-14 |
| JPS6019630B2 true JPS6019630B2 (en) | 1985-05-17 |
Family
ID=13995006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9031279A Expired JPS6019630B2 (en) | 1979-07-18 | 1979-07-18 | contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6019630B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6414832U (en) * | 1987-07-20 | 1989-01-25 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61151914A (en) * | 1984-12-26 | 1986-07-10 | 日本鉱業株式会社 | Contactor |
| JPS6353872A (en) * | 1986-08-22 | 1988-03-08 | 三菱電機株式会社 | Contactor material |
| JPS6430124A (en) * | 1987-07-24 | 1989-02-01 | Nippon Mining Co | Manufacture of contactor |
| US5002503A (en) * | 1989-09-08 | 1991-03-26 | Viacom International, Inc., Cable Division | Coaxial cable connector |
| DE4005836C2 (en) * | 1990-02-23 | 1999-10-28 | Stolberger Metallwerke Gmbh | Electrical connector pair |
| US5180482A (en) * | 1991-07-22 | 1993-01-19 | At&T Bell Laboratories | Thermal annealing of palladium alloys |
| JPH10134869A (en) * | 1996-10-30 | 1998-05-22 | Yazaki Corp | Terminal material and terminal |
-
1979
- 1979-07-18 JP JP9031279A patent/JPS6019630B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6414832U (en) * | 1987-07-20 | 1989-01-25 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5615569A (en) | 1981-02-14 |
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