JPS6021458B2 - contact device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application] The present invention relates to a contact device comprising movable and fixed contacts using silver or a silver alloy as the contact material.

[Problems with the prior art] Conventionally, this type of contact device has both movable and fixed contacts made entirely of silver or silver alloy, or has a head part shaped like that shown in Fig. 7 to reduce consumption of silver material. There is one in which the head part A is made of steel or a copper alloy material, and a silver material layer is pasted over both sides of the upper surface of the head part A.

By the way, for contacts used in items classified as wiring devices under the Electrical Appliances and Materials Control Law, for example, the rating is 1.
In the case of 00VI Hiro, there is a regulation that the thickness of silver or silver alloy must be 0.5 ribs or more, and ``On the other hand, due to the rising price of silver materials, it is important to reduce consumption while satisfying the above regulations in the manufacture of saddle point devices.'' This is an important issue for businesses.

In addition, it is also an important issue to improve the heat dissipation effect of the contacts in order to suppress the rise in temperature of the contacts. In order to improve the heat dissipation effect of the contact, it is desirable to increase the surface area of the contact, especially the contact area with the contact plate.

However, in the above-mentioned conventional devices, in order to improve the heat dissipation effect not only in the former case but also in the latter case, the diameter of the head portion A must be increased in plan view, and in this case, the silver material must be used on areas other than the effective contact surface. Both of them end up increasing the amount of expensive silver material consumed, leading to an increase in the cost of the contact device. [Object of the Invention] The present invention has been made in view of the above, and its purpose is to improve the heat dissipation effect of the contact and to reduce the consumption of silver or silver alloy materials, thereby reducing the cost. To provide contact devices.

[Disclosure of the Invention] The contact device according to the present invention is characterized in that “at least one of the contacts includes a head portion made of copper or a copper alloy material and a chip made of silver or a silver alloy material; A recess is formed with a diameter sufficiently larger than that of the chip and is formed on the upper center surface of the recess for adhering the chip to the iron interlayer.By fixing the chip to the recess, the chips are bonded to each other or to the silver or silver. It is characterized by a contact made of an alloy material.

(Example) The present invention will be described below based on FIGS. 1 to 3, which are shown as an example. Reference numeral 1 denotes a movable contact made of silver or silver alloy material, and the upper surface (lower side in the drawing) A curved contact surface la is formed on the contact surface la, and its lower surface (upper side in the drawing) is fixed to a movable contact plate (not shown).

Reference numeral 2 denotes a fixed contact, which consists of a head portion 4 made of copper or copper alloy material and a tip 5 made of silver or iron alloy material in the shape of a flat plate or disc having a predetermined thickness and a required contact area. .

This head part 4 is formed to have a diameter sufficiently larger than that of the chip 5, and has a raised part 3 on the upper center surface of which the chip 5 is fixed between the iron parts. It is fixed to a plate (not shown). Thus, the contact surface a of the movable contact 1 made of silver or silver alloy material is joined within the width x of the chip 5. Y is the width of the contact surface la and is set to be the same as the width X of the chip 5. (Operation) Figure 1 shows the off state.

If the movable contact 1 is driven and repeats on and off operations, the tip 5 will wear out (the same applies to the movable contact 1) as shown in Figure 2 due to the arc generated between both contacts 1 and 2. In this case, Even if worn out, the main electrical contact parts are the silver or silver alloy material parts of both contacts 1 and 2.If the phenomenon shown in Fig. 2 further progresses, the upper surface 2a of the head part 4 will become arced as shown in Fig. 3. However, since the copper or copper alloy that is the material of the head part 4 is a high melting point material, this is a very small amount, and the functions of the head part 4, such as heat dissipation area or current carrying capacity, are not impaired. Even if the contacts 1 and 2 generate heat due to the current or arc, good heat radiation is carried out from the fixed contact plate contact portion of the head portion 4, which has a diameter sufficiently larger than the required contact area, to the fixed contact plate. 5 shows a different embodiment, in which the top surface of the chip 5 of the fixed contact 2 and the top surface 2a of the head portion 4 are at the same height, and the same effects as in the embodiment described above are achieved.

FIG. 6 shows another different embodiment in which the movable bushing point 1 is also formed by a head part and a chip, and the fixed contact 2 has a chip 5.
The upper surface is made to protrude from the upper surface 2a of the head portion, and the upper surface of the chip of the movable competitive point 1 is recessed from the upper surface of the head portion, thereby further improving the heat dissipation effect of the above-described embodiment.

〔Effect of the invention〕

As described above, the contact device according to the present invention includes a head portion in which at least one of the contacts is made of copper or a copper alloy material, and a chip made of silver or a silver alloy material, and the head portion is connected to the chip. A part which is formed to have a sufficiently larger diameter and which fixes the chip with iron is formed on the upper center surface of the part, and by fixing the chip with iron to the part, the chips are made of silver or silver alloy material together or with the chip. Since the contacts are connected, even if the contacts generate heat due to current or arcing, good heat dissipation occurs from the fixed contact plate contact part of the head section, which has a diameter sufficiently larger than the required contact area, to the fixed contact plate. Expensive silver or silver alloy material only needs to be used for a given thickness and the required contact area, which improves the heat dissipation effect of the contact and reduces the consumption of silver or silver alloy material to improve the contact device. This has the effect of making it cheaper.

[Brief explanation of drawings]

1 to 3 show an embodiment of the contact device according to the present invention, in which FIG. 1 is a front view, FIGS. 2 and 3 are front views showing progress of contact wear, and FIG. 4 is a front view of the contact device according to the present invention. 5 is a front view of a different embodiment, FIG. 5 is a front view showing progress of contact wear, FIG. 6 is a front view of another different embodiment, and FIG. 7 is a front view of a conventional example. DESCRIPTION OF SYMBOLS 1... Movable contact, 2... Fixed contact, 3... Recessed part, 4... Head part, 5... Chip. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] 1. A contact device consisting of movable and fixed contacts made of silver or silver alloy material, in which at least one of the contacts is a head part made of copper or copper alloy material, and a chip made of silver or silver alloy material. Therefore, the head portion is formed to have a diameter sufficiently larger than that of the chip, and a recessed portion is formed on the upper center surface of the head portion, into which the chip is fitted and secured, and the chip is fitted and secured to the recessed portion. A contact device characterized in that contacts made of silver or a silver alloy material are connected to each other or to a chip.