JPS6021664B2 - insulated wire - Google Patents
insulated wireInfo
- Publication number
- JPS6021664B2 JPS6021664B2 JP5590479A JP5590479A JPS6021664B2 JP S6021664 B2 JPS6021664 B2 JP S6021664B2 JP 5590479 A JP5590479 A JP 5590479A JP 5590479 A JP5590479 A JP 5590479A JP S6021664 B2 JPS6021664 B2 JP S6021664B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular weight
- epoxy resin
- insulated wire
- weight
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Description
【発明の詳細な説明】
本発明は、コイル自体を構成している絶縁電線の絶縁層
樹脂に特定組成のものを用い、コイルの温度がある温度
に上昇すると絶縁電線の絶縁層が軟化溶融して導体が露
出し、線間短絡を誘発せしめる、いわゆるヒューズ電線
に関するものである。Detailed Description of the Invention The present invention uses a specific composition for the insulating layer resin of the insulated wire that constitutes the coil itself, and when the temperature of the coil rises to a certain temperature, the insulating layer of the insulated wire softens and melts. This relates to so-called fuse wires, where the conductor is exposed and a short circuit occurs between the wires.
この種の絶縁電線として従来公知のものに、特閥昭49
−103181号公報、持公昭51一13866号公報
に見られる如く、ナイロン−12又はこれにポリウレタ
ン系樹脂を添加した絶縁塗料を導体上に塗布燐付した絶
縁電線を挙げることができる。This type of insulated wire was previously known as
As seen in Japanese Patent No. 103181 and Japanese Publication No. 51-113866, examples include insulated wires in which a conductor is coated with an insulating paint made of nylon-12 or nylon-12 to which a polyurethane resin is added.
しかしながらこのナイロン−12は主体とするものでは
、下記に示す種々の欠点を有する。■絶縁層の溶融短絡
温度がナイロン−12の熱軟化温度(180qo)付近
に定まっており、これを任意に変化させることができな
い。■焼付塗料の安定性が悪くゲル化しやすい。■均一
な塗膜厚さを形成し難く、溶融短絡温度の許容中が大き
い、等である。本発明は上記の欠点を改良した新規組成
の絶縁皮膜を有する絶縁電線に係り、その要旨とすると
ころは、分子量30000以上の高分子量ェポキシ樹脂
10の重量部に、ェポキシ当量400〜3500の低分
子量臭素化ェポキシ樹脂を20〜6の重量部配合した絶
縁塗料を導体上に塗布鏡付した絶縁電線に存する。However, materials based on nylon-12 have various drawbacks as shown below. (2) The melting short-circuit temperature of the insulating layer is fixed around the thermal softening temperature of nylon-12 (180 qo), and cannot be changed arbitrarily. ■Baking paint has poor stability and tends to gel. (2) It is difficult to form a uniform coating thickness, and the allowable melting short circuit temperature is large. The present invention relates to an insulated wire having an insulating film of a new composition that improves the above-mentioned drawbacks. The invention consists in an insulated wire in which a conductor is coated with an insulating paint containing 20 to 6 parts by weight of a brominated epoxy resin.
本発明において絶縁塗膜を形成する樹脂にヱポキシ樹脂
を使用した理由は、これが汎用樹脂で低い軟化温度のも
のから高分子量の固体状のものまで任意の軟化点の樹脂
が入手可能であり、かつ各グレード間での相溶性が良好
なためである。The reason for using an epoxy resin as the resin for forming the insulating coating film in the present invention is that it is a general-purpose resin and resins with any softening point are available, from low softening temperature ones to high molecular weight solid ones, and This is because the compatibility between each grade is good.
分子量30000以上の高分子量ェポキシ樹脂は絶縁皮
膜形成の主成分をなし、具体的には、ェポメートYP−
4にS−2斑(東都化成株式会社商品名)、ェポノール
OL55(シェル化学社商品名)、PKHH(ユニオン
カーバイト社商品名)を挙げることができる。またェポ
キシ当量400〜3500の低分子量臭素化ェポキシ樹
脂は、絶縁皮膜の溶融短絡温度を任意に設定するために
配合されるもので、具体的には特殊タイプの臭素化ェポ
キシ樹脂であるYDB−500,700(東都化成株式
会社商品名)、ビスフヱノール−A型臭素化ェポキシ樹
脂であるYPT−4WS2粥(同上社商品名)などが有
効である。分子量30000以上の高分子量ェポキシ樹
脂は、導体との密着性、皮膜形成性に優れ、この樹脂を
基材として、これに軟化点の低い低分子量臭素化ェポキ
シ樹脂を配合することにより、任意の溶融短絡温度を有
する絶縁電線を得ることができるものである。High molecular weight epoxy resin with a molecular weight of 30,000 or more is the main component for forming an insulating film, and specifically, Epomate YP-
Examples of 4 include S-2 Spot (trade name, Toto Kasei Co., Ltd.), Eponol OL55 (trade name, Shell Chemical Co., Ltd.), and PKHH (trade name, Union Carbide Co., Ltd.). In addition, a low molecular weight brominated epoxy resin with an epoxy equivalent of 400 to 3500 is blended to arbitrarily set the melting short-circuit temperature of the insulating film, and specifically YDB-500 is a special type of brominated epoxy resin. , 700 (trade name of Toto Kasei Co., Ltd.) and YPT-4WS2 porridge (trade name of the same company), which is a bisphenol-A type brominated epoxy resin, are effective. High-molecular-weight epoxy resin with a molecular weight of 30,000 or more has excellent adhesion with conductors and film-forming properties, and by using this resin as a base material and blending it with a low-molecular-weight brominated epoxy resin with a low softening point, it can be melted into any desired state. It is possible to obtain an insulated wire having a short circuit temperature.
低分子量臭素化ェポキシ樹脂の配合量は、上記高分子量
ェポキシ樹脂100重量部に対し20〜60重量部の範
囲が、良好な皮膜特性を与える。次に本発明の実施例に
ついて説明する。The blending amount of the low molecular weight brominated epoxy resin is in the range of 20 to 60 parts by weight based on 100 parts by weight of the above-mentioned high molecular weight epoxy resin, providing good film properties. Next, examples of the present invention will be described.
表−1に示す配合組成の樹脂をmークレゾール、キシロ
ールの混合溶剤に溶解し、樹脂濃度25%の塗料をつく
り、0.150肋の銅線に塗布暁付し本発明に係る絶縁
電線を製造した。各実施例の絶縁電線の諸特性を表−2
に示す。表−1塗料配合
表−2特性試験結果
※コイル短絡温度試験は、実施例に用いた各絶縁電線を
1700ターン巻回したコイルを−次側してこれに12
0Vの電圧を印加し、一方導体径0.4側のポリウレタ
ン銅線を230ターン巻回したコイルを二次側としこの
端末をショートさせた試験用トランスを用いて行なった
。A resin having the composition shown in Table 1 is dissolved in a mixed solvent of m-cresol and xylene to make a paint with a resin concentration of 25%, and the paint is coated on a 0.150-bar copper wire to produce an insulated wire according to the present invention. did. Table 2 shows the characteristics of the insulated wires of each example.
Shown below. Table-1 Paint formulation table-2 Characteristics test results
The test was conducted using a test transformer to which a voltage of 0 V was applied, and a coil in which a polyurethane copper wire with a conductor diameter of 0.4 was wound 230 turns was used as the secondary side, and the terminals of this coil were short-circuited.
二次コイルの端末をショートさせてあるため、一次コイ
ルに電流を流すと過電流が流れ、トランスが温度上昇す
る。トランスの温度上昇によって導体抵抗が変化するの
で、この変化を測定し、溶断時の抵抗値より抵抗換算し
、溶断温度を求めた。上記の構成からなる本発明によれ
ば、絶縁皮膜形成成分たる分子量30000以上の高分
子量ェポキシ樹脂に、ェポキシ当量400〜3500の
低分子量臭素化ェポキシ樹脂を添加しているので、従来
のこの種絶縁電線の有し欠点を解消でき、表−2にみら
れる如く設計上要求される任意のコイル短絡温度を有す
るヒューズ電線が得られる。Since the terminals of the secondary coil are short-circuited, when current flows through the primary coil, an overcurrent flows and the temperature of the transformer rises. Since the conductor resistance changes as the temperature of the transformer increases, this change was measured and converted into resistance from the resistance value at the time of fusing to determine the fusing temperature. According to the present invention having the above structure, a low molecular weight brominated epoxy resin having an epoxy equivalent of 400 to 3500 is added to a high molecular weight epoxy resin having a molecular weight of 30,000 or more, which is an insulating film forming component. It is possible to solve the disadvantages of the electric wire and to obtain a fuse electric wire having any coil short-circuit temperature required in the design, as shown in Table 2.
Claims (1)
高分子量エポキシ樹脂100重量部に、絶縁皮膜の溶融
短絡温度を任意に設定するためのエポキシ当量400〜
3500の低分子量臭素化エポキシ樹脂を20〜60重
量部配合した絶縁塗料を、導体上に塗布焼付したことを
特徴とするヒユーズ特性を有する絶縁電線。1 100 parts by weight of a high molecular weight epoxy resin with a molecular weight of 30,000 or more as an insulating film forming component, and an epoxy equivalent of 400 to 400 to arbitrarily set the melting short-circuit temperature of the insulating film.
An insulated wire having fuse characteristics characterized in that an insulating paint containing 20 to 60 parts by weight of a low molecular weight brominated epoxy resin of 3500 is applied and baked onto a conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590479A JPS6021664B2 (en) | 1979-05-08 | 1979-05-08 | insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5590479A JPS6021664B2 (en) | 1979-05-08 | 1979-05-08 | insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55147572A JPS55147572A (en) | 1980-11-17 |
| JPS6021664B2 true JPS6021664B2 (en) | 1985-05-29 |
Family
ID=13012093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5590479A Expired JPS6021664B2 (en) | 1979-05-08 | 1979-05-08 | insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021664B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976699A (en) * | 1995-11-09 | 1999-11-02 | Sumitomo Bakelite Company Limited | Insulating adhesive for multilayer printed circuit board |
| JP2010108758A (en) * | 2008-10-30 | 2010-05-13 | Sumitomo Electric Wintec Inc | Phenoxy resin insulating varnish and insulation wire using it |
-
1979
- 1979-05-08 JP JP5590479A patent/JPS6021664B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55147572A (en) | 1980-11-17 |
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