JPS6023914B2 - Gold wax - Google Patents
Gold waxInfo
- Publication number
- JPS6023914B2 JPS6023914B2 JP2346877A JP2346877A JPS6023914B2 JP S6023914 B2 JPS6023914 B2 JP S6023914B2 JP 2346877 A JP2346877 A JP 2346877A JP 2346877 A JP2346877 A JP 2346877A JP S6023914 B2 JPS6023914 B2 JP S6023914B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- liquidus temperature
- color
- gold solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Adornments (AREA)
Description
【発明の詳細な説明】
本発明は、一般の金ろうと比較して液相線温度が低く、
しかもその色調が金色を呈する金ろうに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention has a lower liquidus temperature than general gold solder,
Moreover, it relates to gold wax that has a golden color tone.
一般に装身具、宝鯛品等をろう付する場合、ろう材とし
ては主に金ろうが使用されているが、この場合、特に下
記の条件を満足する金ろうである事が望まれる。Generally, when brazing jewelry, treasure items, etc., gold solder is mainly used as the brazing material, but in this case, it is especially desirable that the gold solder satisfies the following conditions.
０１低い温度でろう付作業する為に液相温度が高くても
７５０ＣＯ程度である事。01 Since the brazing work is performed at a low temperature, the liquidus temperature must be around 750 CO even if it is high.
脚 色調が金色である事。Legs should be golden in color.
然し乍ら、従来用いられている金色の金ろうは、液相線
温度が８００００以上と高く、一方この液相線温度を８
００ｏｏ以下にした金ろうは、色調が白色であるという
欠点があった。However, the conventionally used gold-colored solder has a high liquidus temperature of 80,000 or higher;
The gold solder made to be less than 00oo had a drawback of being white in color.
本発明は上述した諸事情に鑑みてなされたものでその目
的は上記の二条件を満足する金ろうを提供せんとするも
のである。The present invention has been made in view of the above-mentioned circumstances, and its object is to provide a gold solder that satisfies the above two conditions.
本発明の金ろうは、重量比でＡｕ３５％以上５０％未満
、Ａｇ１０〜３５％，Ｃｕｌｏ〜３０％，Ｚｎ３〜１５
％，ｌｎ３〜１３％の範囲にて構成したものである。The gold solder of the present invention has a weight ratio of 35% to less than 50% Au, 10 to 35% Ag, 30% to Culo, and 3 to 15% Zn.
%, ln in the range of 3 to 13%.
然して本発明の金ろう成分組成範囲を上述の如く限定し
た理由について説明すると、Ａｕの上限５０％は、金ろ
うの価格をあまり引き上げない為と液相線温度が高くて
も７５０℃程度に押える為であり、下限３５％は色調を
金色にする為と耐食性を満足させる為である。Ａｇの上
限３０％は液相線温度を７５０ｑＣ程度に押える為と色
調を金色にする為であり、下限１０％は流動性を向上さ
せる為である。Ｃｕの上限３０％は液相線温度を７５０
ｑｏ程度に押える為と色調を金色し、さらに流動性を減
じさせない為であり、下限１０％は機械的強度を減じさ
せない為である。Ｚｎの上限１５％は色調を金色にする
と共に、耐色性及び機械的強度を減じさせない為であり
、下限３％は液相線温度を７５０ｑｏ程度に押える為で
ある。ｌｎは、流動性を良くすると共に液相線温度を７
５０マ０程度に押えるのに有効であるが、添加量が１３
％を超えると、加工性並びに機械的強度が低下してしま
い、また３％未満であると、流動性を向上せしめる事が
できないので、３％〜１３％とした。次に本発明の金ろ
うの特性をより明瞭ならしめる為に、具体的な実施例を
もって説明する。However, to explain the reason why the composition range of the gold solder component of the present invention is limited as described above, the upper limit of 50% of Au is set so as not to increase the price of gold solder too much, and to keep the liquidus temperature to about 750 ° C. even if the liquidus temperature is high. The lower limit of 35% is to make the color golden and to satisfy the corrosion resistance. The upper limit of Ag is 30% to suppress the liquidus temperature to about 750 qC and to make the color golden, and the lower limit of 10% is to improve fluidity. The upper limit of Cu is 30%, the liquidus temperature is 750
The reason for this is to keep the color to about qo, to make the color golden and not to reduce the fluidity, and the lower limit of 10% is to not reduce the mechanical strength. The upper limit of 15% of Zn is to make the color golden and not reduce the color fastness and mechanical strength, and the lower limit of 3% is to suppress the liquidus temperature to about 750 qo. ln improves fluidity and lowers the liquidus temperature to 7
It is effective to suppress the temperature to about 50 mm, but the amount added is 13 mm.
If it exceeds 3%, processability and mechanical strength will decrease, and if it is less than 3%, fluidity cannot be improved, so it is set at 3% to 13%. Next, in order to make the characteristics of the gold solder of the present invention more clear, specific examples will be explained.
下表において、本発明の実施品Ｎｏ．１と従来品として
Ｎｏ．２〜４に示す組成の試料２００ｇを電気炉にて熱
分析を行ない、その液相線温度並びに固相線温度を測定
し、又これらの試料を溶解鋳造した後伸線加工を施こし
て３０肋の線材とし、この線材を使用してろう付作業を
行ないその色調を観察したところ、下表の右欄に示すよ
うな結果が出た。上記表で明らかなように本発明の実施
品Ｎｏ．１の金ろうは、従来品蛇．２，３の金ろうに比
較してその液相線温度は約２００ｑ○程度の低いもので
ある。In the table below, the implementation product No. of the present invention. 1 and No. 1 as a conventional product. 200g of samples with the compositions shown in 2 to 4 were thermally analyzed in an electric furnace to measure their liquidus temperature and solidus temperature, and after melting and casting these samples, they were wire drawn and When we performed brazing work using this wire rod and observed its color tone, we found the results shown in the right column of the table below. As is clear from the above table, the implementation product No. of the present invention. The first gold solder is a conventional snake. Its liquidus temperature is about 200q○, which is lower than that of No. 2 and 3 solder metals.
従って従来品より低い温度にてろう付作業を行なう事が
できるものである。又その色調についても液相線温度の
低い従来品Ｎｏ．４の金ろうと比較して従来品Ｎｏ．４
の金ろうが白色であるのに対し、実施品Ｍ．１は全て金
色を呈しているものである。又、従来品の液相線温度の
高いＮｏ．２，３の金ろうと比較しても見劣りのしない
ものである。以上詳記した通り本発明の金ろうは、液相
線温度が低いので低い温度でろう付作業ができ、又その
色調も金色を呈しているので、装身具、宝飯品のろう付
には最適である。Therefore, brazing work can be performed at a lower temperature than conventional products. Also, regarding its color tone, the conventional product No. 1 has a lower liquidus temperature. Compared to No. 4 gold solder, conventional product No. 4
While the gold solder of M. 1 is all gold in color. In addition, the conventional product No. 1 has a high liquidus temperature. It is comparable to a few gold waxes. As detailed above, the gold solder of the present invention has a low liquidus temperature, so it can be brazed at a low temperature, and its color is golden, making it ideal for brazing jewelry and treasured items. be.
Claims (1)
５％，Ｃｕ１０〜３０％，Ｚｎ３〜１５％，Ｉｎ３〜１
３％の範囲にて構成した事を特徴とする金ろう。1 Weight ratio: Au 35% or more and less than 50%, Ag 10-3
5%, Cu10-30%, Zn3-15%, In3-1
Gold solder characterized by being composed of 3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2346877A JPS6023914B2 (en) | 1977-03-04 | 1977-03-04 | Gold wax |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2346877A JPS6023914B2 (en) | 1977-03-04 | 1977-03-04 | Gold wax |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53108054A JPS53108054A (en) | 1978-09-20 |
| JPS6023914B2 true JPS6023914B2 (en) | 1985-06-10 |
Family
ID=12111351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2346877A Expired JPS6023914B2 (en) | 1977-03-04 | 1977-03-04 | Gold wax |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023914B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5770099A (en) * | 1980-10-20 | 1982-04-30 | Seiko Epson Corp | Gold brazing filler metal |
| CN112176215B (en) * | 2020-10-15 | 2022-01-11 | 深圳市宝瑞莱珠宝首饰有限公司 | Corrosion-resistant 18K gold for jewelry and process thereof |
-
1977
- 1977-03-04 JP JP2346877A patent/JPS6023914B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53108054A (en) | 1978-09-20 |
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