JPS6024567B2 - Manufacturing method for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component, and specifically to a method of packaging an electronic component with a thermosetting powder resin and applying a display stamp to the electronic component.

The purpose of the present invention is to save the necessary equipment and time in the packaging and marking process of electronic components, and to significantly reduce the manufacturing cost of electronic components. The method of exterior packaging and display stamping using powdered resin will be described.

Generally, powder coating is used as an exterior coating method for electronic components because it is easy to create a relatively thick film without pinholes, there is less loss of coating raw materials, and there is less sagging of the coating. became widely used. The most commonly used powder coating method is the fluidized immersion method, which is illustrated in FIG. In the figure, 1 is an electronic component element, 2 is a lead wire, and 3 is a lead wire.
and 4 is a holder, 5 is a fluidized monkey tank, and 6 is a thermosetting powder resin. The powder resin 6 is fluidized and injected into the fluidized soaking tank 5 by air flow through a perforated plate (not shown), and the lead wires 2 are held by the holders 3 and 4, and the lead wires 2 are held at an appropriate temperature. Hot electronic component element 1
After being immersed in powdered resin 6 and pulled up, the powdered resin adhered and coated on element 1 is heated to semi-cure, and further heated to be cured. In FIG. 1, a case has been described in which one electronic component is powder coated, but in reality, in order to streamline the process, many electronic components are often dip coated at the same time. The surface of the electronic component with the exterior is marked with the rating,
In order to stamp the manufacturer's name and dry the stamped ink, the entire electronic component is heated or the stamp display surface is dried by infrared irradiation or the like. The display stamping and stamping drying processes are often performed simultaneously on a large number of electronic components. The steps in the present invention are shown in FIG. 2 in comparison with the conventional steps. That is, in the method of the present invention, the process of display stamping, which was performed after the resin hardens in the conventional method, is performed in a semi-cured state that does not interfere with stamping during the process of curing the resin. It is characterized by a process of drying the marking ink as well as curing, which saves equipment and time in the process of packaging and display marking of electronic parts, and significantly reduces manufacturing costs of electronic parts. This is a reduction. Embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a cross-sectional view of an electronic component coated with powder resin by the fluidized infiltration method previously explained in FIG. It is a powdered resin. The electronic component shown in FIG. 3 is heated at an appropriate temperature and time, and the thermosetting resin powder 7 is brought into a semi-hardened state. FIG. 4 is a plan view of an electronic component on which a display stamp is applied in a semi-cured resin state, and 8 is a display stamp portion. After marking the display, electronic components are added, and the marking ink is dried, which also serves as the main curing of the resin. Heating for curing the resin is usually performed at a higher temperature or for a longer time than heating for semi-curing, or at a higher temperature and for a longer time. As a result, the semi-cured resin surface and the marking ink particles are softened and integrated by heating, and the marking ink adheres better than when the same ink is used to print on a smooth resin surface that has been heat-cured and then dried. A 50% improvement in strength was observed. As can be seen from the above explanation, when the method of the present invention is compared with the conventional method, the independent stamp drying step is eliminated and is absorbed into the resin curing step.

By performing the display stamping process after the resin is semi-cured and before the resin is fully cured, the ink stamped with the display firmly adheres to the resin layer as the resin hardens, resulting in a display that is more difficult to erase than the display produced by conventional methods. It also has the effect of being obtained. Table 1 shows the abrasion resistance test results of the secondary display and the display according to the present invention regarding the stamp display. This is what is shown.

Table 1 As described above, the method of the present invention aims to shorten the process and save equipment and time in the packaging and display stamping process of electronic parts, and significantly reduces the cost required for manufacturing.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram of the fluid immersion method, Figure 2 is a process comparison diagram, Figure 3 is a cross-sectional view of an electronic component, Figure 4 is a plan view of an electronic component,
In FIGS. 1, 3, and 4, 1...electronic component element, 2...lead wire, 3 and 4...
...Holder, 5...Fluidized soaking tank, 6...
... Powder resin, 7 ... Powder resin attached to element 1, 8 ... Display stamp part. Collar 2IQ multi'1 possible J bowl hunting 41 possible

Claims (1)

[Claims] 1 Covering electronic component elements with thermosetting powder resin,
A method of manufacturing an electronic component, which comprises heating the component to semi-cure the resin, marking the surface of the semi-cured resin by stamping, and then heating to fully cure the resin.