JPS6025893B2 - Chip type electrolytic capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-type electrolytic capacitor having a structure that can withstand solder immersion and long-term high-temperature use.

Currently, in response to trends such as miniaturization of electrical components and automation of mounting on printed wiring boards, chip components with lead wires removed from electrical components are being developed, and this is also progressing in the field of electrolytic capacitors.

Conventionally, as shown in FIG.
At least a capacitor element 3 is built into an aluminum case 2, sealed with a rubber sealing body 4, and the aluminum case 2 itself is configured as a first electrode, for example, a cathode,
The first metal terminal plate 5 is fixed here, and the rubber sealing body 4 is
A second metal terminal plate 7 is fixed to the second electrode, for example, an anode, of the lead wire 6 via the cable, and the rubber seal 4 and the second metal terminal plate 7 are further bonded with an insulating resin 8. It was stuck.

As shown in Table 2 below, in conventional chip-type electrolytic capacitors, when a mouse is immersed in solder at a temperature of 26 mm, the rubber seal expands, causing damage to the electrolytic capacitor. The changes in capacitance [rF], loss [%], and leakage current [muA] were so large compared to before soldering that it could not be used.

In view of these problems, the present invention provides an improved chip-type electrolytic capacitor in which a heat-resistant resin layer is further provided on the aluminum case.

Embodiments of the present invention will be described below with reference to FIGS. 2 and 3.

In FIG. 2, a chip type electrolytic capacitor 1 according to the present invention incorporates at least a capacitor element 3 in an aluminum case 2, seals it with a rubber sealing body 4, and uses the aluminum case 2 itself as a first electrode, for example, a cathode. The first L-shaped terminal plate 5 is fixed to the first lead wire 9 provided in the aluminum case 2, and the second electrode of the second lead wire 6 is connected to the second lead wire 6 via the rubber sealing body 4. For example, the second L-shaped terminal plate 7 is fixed to the anode, and the aluminum case 2 and the rubber seal 4 between the first and second terminal plates 5 and 7 are entirely covered with an insulating resin 8. do.

As shown in FIG. 3, in a chip-type electrolytic capacitor 1 according to an embodiment of the present invention, first and second lead wires 9 and 6 are drawn out from a rubber sealing body 4, and the first lead wire 9 is It is folded back to the opposite side and fixed to the first L-shaped terminal plate 5, and is otherwise the same as the chip type electrolytic capacitor 1 shown in FIG.

In the chip type electrolytic capacitor 1 according to the present invention, the first
The shape of the side surface of the second L-shaped terminal plate 5.7 may be square as shown in the figure, or may be other shapes such as hexagonal or semicircular. Furthermore, in order to automate polarity determination of the chip electrolytic capacitor 1, the first L-shaped terminal plate 5 may be made of a non-magnetic material such as yellow steel, and the second L-shaped terminal plate 7 may be made of a magnetic material such as iron. preferable. As the insulating resin 8, thermosetting resin such as eboxy resin or phenol resin,
Alternatively, it is an ultraviolet curable resin such as modified epoxy resin or phenol resin. Examples of resin coating and molding methods include spin coating and mold molding. next,
Tables 1 and 2 show the electrolytic capacitor rating 50[V]-1[
Comparisons are shown before and after the test in which the product according to the present invention and the product according to the conventional example (Mom F) were immersed in solder at a temperature of 260 [° C.] for a period of time.

Table 1 is based on the present invention, and Table 2 is based on the conventional example. Table 1: Based on the present invention K Table 2: Based on the conventional example As can be seen from Tables 1 and 2, the product according to the present invention has a higher solder penetration than the conventional example. It is possible to provide a stable chip-type electrolytic capacitor with little change in capacity [[F]], loss [%], and leakage current [A] even afterward.

In addition, it can withstand long-term use at an ambient temperature of 85 [°C] and 200 field hours.

[Brief explanation of the drawing]

Fig. 1 is a partial sectional view showing a conventional example, and Fig. 2 is a -
FIG. 3 is a partial sectional view showing another embodiment of the present invention. In the figure, 1 is a chip type electrolytic capacitor, 2 is an aluminum case, 3 is a capacitor element, 4 is a rubber sealing body, 5 and 7 are terminal plates, 6 and 9 are lead wires, and 8 is resin. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. At least a capacitor element is assembled in an aluminum case, sealed with a rubber sealing body, a first L-shaped terminal plate is fixed to a first lead wire, and a second L-shaped terminal plate is fixed to a second lead wire. L of
A chip-type electrolytic capacitor consisting of a fixed terminal plate and an insulating resin covering the entire aluminum case. 2. The chip-type electrolytic capacitor according to claim 1, wherein the resin is a thermosetting resin. 3. The chip-type electrolytic capacitor according to claim 1, wherein the resin is an ultraviolet curing resin. 4. The chip-type electrolytic capacitor according to claim 1, wherein the first L-shaped terminal plate is a non-magnetic material, and the second L-shaped terminal plate is a magnetic material.