JPS6026261B2 - pin receiving contact - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pin-receiving contact for a ceramic pin, and a multipole contact assembly incorporating such a pin-receiving contact.

When forming an electrical connection between a multi-pole high-density BI and a multilayer printed circuit board, according to the conventional technology, the electrical connection between the BI and the printed circuit board is formed using a large number of contact springs. .

When LSIs become larger, the contact length L becomes larger because extremely large forces are required to use the contact springs, and the total length of the springs is usually about 2 cm. There were drawbacks. In order to overcome this drawback, the inventor of the present application considered using pins to form the connection between the LSI and the printed circuit board, but when the LSI becomes extremely large, it becomes difficult to use pins for one LSI ceramic. You will need more pins than books.

Although it has become possible to shorten the contact length L by using pins, it has been found that a force of 100 x 9 or more is required to connect a large number of pins, for example, if the number of pins exceeds 1000. . If such a force is used, the LSI ceramic may warp, causing poor contact. The pin receiving contact of the present invention is for receiving the above-mentioned pin.

The pin receiving contact of the present invention, which is formed into an elongated hollow cylindrical body from a conductive material, has a base portion that extends outwardly from the foot body in a circular shape so that the bottom portion is iron-fitted within the insulating holder. A spring contact portion that should come into contact with the conductive part of the through hole of the printed circuit board is formed above the cylindrical body slightly below the center of the cylindrical body so as to protrude from the upper end of the cylindrical body. Nearby, a tongue-shaped contact part is pushed inward to make contact with one of the pins. Such a contact portion is formed as a tongue-like piece by making a U-shaped cut in the knot-like body and pushing the inner part of the U toward the inside of the cylindrical body. The present invention also relates to a multipole contact assembly incorporating the pin receiving contact described above. As mentioned above, when there are 1,000 or more pins in the 1 ceramic, a force of 100 kg or more is required to align the ceramics to the multilayer printed circuit board, which may warp the LSI ceramic and cause undesirable results. . The inventors of the present application have solved this problem as explained below. First, the insulating holder for supporting the pin receiving contact was not sized to correspond to the multilayer printed circuit board, but was formed from several rectangular parallelepiped blocks.

A multilayer printed circuit board in which through holes are formed is placed on each of these blocks, and the pin receiving armrest is in a state of iron engagement with the through holes. A guide insulator with a through hole is disposed above the multilayer printed circuit board, and the upper part of the pin receiving contact is in the lower part of the through hole, and the lower half of the LSI ceramic pin is in the through hole. It is enshrined in the upper part. After this arrangement is completed, the rectangular parallelepiped blocks are sequentially pushed upward using a loading mechanism equipped with an appropriate cam mechanism so that the multilayer printed circuit board and the rectangular parallelepiped blocks approach each other leaving a slight gap, and the blocks are fixed. . In this state, the upper part of the protruding contact part of the pin receiving contact is pushed up to the upper surface of the multilayer printed circuit board,
The overhanging contact portion contacts the guide portion of the through hole of the multilayer printed circuit board. Further, the upper part of the pin receiving contact advances further upward in the through hole of the guide insulator, and the tongue-shaped contact part of the contact grips the pin that is already located in the through hole, between the pin and the contact. The contact relationship is completed. The effect of such an assembly is achieved by using a pin-receiving contact having a structure such that it contacts elastically with the conductive portion of the through hole of the '11 multilayer printed circuit board and contacts the ceramic pin with the inner surface of the contact. , contact with the pin of the large fake 1 is ensured.

In this technique, the inner surface of the through hole of the printed circuit board is used as a conductive part, which has not been seen in the prior art. Next, the pins and contacts are brought together and separated by driving from the back side of the 1-ceramic mounting surface, so the top surface of the 1-ceramic is kept completely blank, reducing the possibility of damage to the LSI ceramic. All will be gone. Furthermore, the insulating holder supporting the pin receiving contact is formed by a plurality of rectangular parallelepiped blocks,
Since the insulating holder is installed through the installation of individual blocks, the force required for joining and removing it can be reduced to a fraction of that of conventional techniques. This is advantageous when there are 100 or more pins and a force of 100k9 or more is required to attach one ceramic. In addition, nothing is placed on top of the fake 1 ceramic, and nothing is placed between the 1 ceramic, the guide insulator, the multilayer printed circuit board, and around these components. These parts are effectively cooled, which means that
This is a significant advantage compared to the prior art, which required mounting devices to be placed between and around these components, which inhibited the cooling effect. In addition, the elastic contact can come into contact with the ceramic pin and the so-called through hole in the substrate over a short distance, and by shortening L, the speed of the circuit can be increased. The invention will now be described with reference to the accompanying drawings. FIG. 1 is a diagram showing the multi-pole contact assembly according to the present invention in a separated state, with an insulating holder 1 consisting of a plurality of rectangular parallelepiped blocks 2 at the bottom, a multilayer printed circuit board 10 above it, and a multilayer printed circuit board 10 above it. 2 shows a guide insulator 20 fixed to a printed circuit board and an LSI ceramic 30 above it.

Connections between the LSI ceramic 30 and the multilayer printed circuit board 10 are made through a large number of contact pins 31. contact pin 3
1 is a substitute for the spring used in the conventional technique, and has the effect of shortening the contact length L. Guide insulator 2
01 This is a large number of through holes 2 for guiding the contact pins 31.
1 is formed, and a through hole 2 is also formed in the multilayer printed circuit board 10.
A large number of through holes 11 corresponding to 1 are formed. The insulating holder 1 is shown supporting a large number of pin receiving contacts 3. FIG. 2 is a diagram showing the pin receiving contact 3 in more detail. The pin receiving contact 3 is made of a conductive material and has an elongated hollow cylindrical shape. The base 32 of the pin receiving contact 3 extends outwardly in a circular manner to ensure that the pin receiving contact 3 is firmly supported within the block 2. It has been found that good results can be obtained by forming several spring contact portions 33 for contacting the guide portions of the through holes 11 of the multilayer printed circuit board slightly below the approximately central portion of the pin receiving contact 3. The spring contact portion 33 is formed to have spring properties by making a U-shaped cut in the cylindrical body of the pin receiving contact 3 and making this U-shaped portion project outward. A pin contact portion 34 is formed near the upper end of the cylindrical body of the pin receiving contact 3, and the contact portion 34 is formed by making a U-shaped cut in the cylindrical body as in the case of the spring contact portion 33, and forming a U-shaped It is made by pushing the section inside a cylinder. It has been found that it is better to make several such pin contact parts. In typical practical applications, approximately 10 such pin receiving contacts are used per assembly. The multipole contact assembly of the present invention is shown in FIG. 3 in an unferrous condition.

In FIG. 3, the left part shows the pin receiving contact in cross section, and the right part shows this part without cutting. FIG. 4 shows a state in which the block 2 is pushed up close to the multilayer printed circuit board 10 and the multi-pole contact assembly is joined together by a method as will be described later. In the drawings, the pin and pin receiving contact on the left are shown in cross-section, and the pin and pin receiving contact on the right are shown uncut. In the state shown in Fig. 4, contact pin 3
1 is held by the pin contact portion 34 of the pin receiving contact 3 to form an electrical connection, and the spring bale contact portion 33 of the pin receiving contact 3 makes elastic contact with the conductive portion 12 of the multilayer printed circuit board 10. to form electrical connections. As is clear from FIG. 4, a sufficient gap is maintained between the LSI ceramic 30 and the guide insulator 20 and between the guide insulator 20 and the multilayer printed circuit board 10 without being obstructed by anything. . This is advantageous for cooling the multipole contact assembly of the present invention. The assembly of the block 2 constituting the insulating holder 1 will be explained with reference to FIG.

In the upper part of FIG. 5, the insulating holder 1 which has not yet been assembled is shown, but the clamping opening 5 of the iron fitting 4 attached to the printed circuit board is fitted onto the outer edge of the block 2. Then, when the handle 6 of the tetsuai 4 is pushed inward as shown in the figure, the block 2 is pushed upward as seen in the figure and a drumming condition as shown in FIG. 4 is brought about. When leaving block 2, the operation opposite to the above may be performed.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a state before assembly of a ceramic, a guide insulator, a multilayer printed circuit board, and an insulating holder according to the present invention, FIG. 2 is a perspective view of a pin receiving contact according to the invention, and FIG. 4 and 4 are diagrams showing the state of the multipolar contact assembly of the present invention before and after joining, respectively, and FIG. 5 is a diagram showing the assembled state of the block of the insulating holder. In the figure, 1 is an insulating holder, 2 is a block, 3 is a pin receiving contact, 4 is a bag fitting, 5 is a clip opening, 6 is a handle, 1
Kawama multilayer printed circuit board, 11 is a through hole, 12 is a conductive part, 20 is a guide insulator, 21 is a through hole, 30 is an LSI ceramic, 31 is a contact pin, 32 is a base, 33 is a spring contact part, 34 is a pin The contact parts are shown respectively. Soup 5 Spear 1 Ice 2 Spear 5 Spear 4

Claims (1)

[Claims] 1. In a pin receiving contact formed in an elongated hollow cylindrical body from a conductive material, a spring contact portion provided below the cylindrical body and protruding outward in order to make contact with the inner surface of a through hole of a printed circuit board. and a pin receiving contact comprising a pin contact portion provided above the cylindrical body and pushed inward to make contact with a pin of an LSI, and a base expanding outward at the bottom of the cylindrical body. .