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JPS6027747B2 - electrical contact materials - Google Patents
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JPS6027747B2 - electrical contact materials - Google Patents

electrical contact materials

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Publication number
JPS6027747B2
JPS6027747B2 JP54133260A JP13326079A JPS6027747B2 JP S6027747 B2 JPS6027747 B2 JP S6027747B2 JP 54133260 A JP54133260 A JP 54133260A JP 13326079 A JP13326079 A JP 13326079A JP S6027747 B2 JPS6027747 B2 JP S6027747B2
Authority
JP
Japan
Prior art keywords
oxide
weight
contact
electrical contact
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54133260A
Other languages
Japanese (ja)
Other versions
JPS5658940A (en
Inventor
三吉 信太
信二 大隈
立郎 菊池
晴日 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54133260A priority Critical patent/JPS6027747B2/en
Publication of JPS5658940A publication Critical patent/JPS5658940A/en
Publication of JPS6027747B2 publication Critical patent/JPS6027747B2/en
Expired legal-status Critical Current

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Description

【発明の詳細な説明】 本発明は、電気接点材料、特にAg金属酸化物複合接点
材料に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electrical contact materials, particularly Ag metal oxide composite contact materials.

Ag酸化物系接点材料として、Ag一Cd○の接点材料
が広く利用されている。
As an Ag oxide-based contact material, a contact material of Ag-Cd○ is widely used.

Ag−Cd○接点材料は、接点材料に要求される接触抵
抗、耐溶着、耐消耗などの特性に対して、平均的に優れ
た性能を示すだけでなく、機械加工性も実用上十分であ
るために、リレー、ノーヒユーズブレーカや、家庭用電
子機器の電源スイッチなど、数アンペア以上の負荷電流
城に多く利用されている。しかしながら、近時、各種の
電源開閉器に対して、安全上の規制が厳しくなるにつれ
て、接点材料に対して、これまで以上の特性が求められ
るようになって来ている。特に、家庭用電気機器におい
ては、スイッチの軽燥作性、小型化が要求され、他方で
は安全面から見たときの開離不能に結びつく溶着と絶縁
劣化を招く消耗の両性能の向上が強く望まれている。加
えて、最近においては、Ag資材の急激なコスト上昇に
ともない、経済性の面から、接点の大きさを、より小さ
くする傾向があり、結果的には、接点の単位面積当りの
開閉負荷を大きくとれる材料が求められている。本発明
は、以上のような点に鑑みて、Ag−Cd○鞍点材料に
かわり得る接点材料を提供するものであって、基本的に
は、Ag−Bi203接点材料の特性改良に関して提案
するものである。
Ag-Cd○ contact material not only shows excellent average performance in terms of properties such as contact resistance, welding resistance, and wear resistance required for contact materials, but also has sufficient machinability for practical use. Therefore, they are often used for load currents of several amperes or more, such as relays, no-fuse breakers, and power switches for household electronic equipment. However, in recent years, as safety regulations have become stricter for various power switches, contact materials have come to be required to have better properties than ever before. In particular, for household electrical equipment, switches are required to be easier to operate and more compact, and on the other hand, from a safety standpoint, there is a strong need to improve the performance of both welding, which can lead to inability to separate, and wear, which can lead to insulation deterioration. desired. In addition, in recent years, with the rapid rise in the cost of Ag materials, there has been a trend to reduce the size of contacts from an economic standpoint, and as a result, the switching load per unit area of contacts has been reduced. There is a need for materials that can be produced in large quantities. In view of the above points, the present invention provides a contact material that can replace the Ag-Cd○ saddle point material, and basically proposes improvements in the characteristics of the Ag-Bi203 contact material. be.

Agマトリクス中に、Bi203を分散させた接点材料
は、特開昭52−13356y号公報に明らかにされて
いるように、接触抵抗が抵く、耐溶着性の優れた接点材
料であるが、欠点として消耗量が多いということが見受
けられた。
A contact material in which Bi203 is dispersed in an Ag matrix is a contact material with low contact resistance and excellent welding resistance, as disclosed in JP-A-52-13356Y, but it has drawbacks. It was observed that there was a large amount of wear and tear.

発明者らは、この点に改良のため、種々検討を重ね、A
gマトリクス中において、Bi203とSn02を分散
させて反応させ、BiとSnの複合酸化物(Bi2Sn
207)に転換させた材料が、耐消耗性を著しく改善さ
せ、かつ耐溶着性の面においても改良効果を示すことを
見し、出した。しかしながら、前述したように、最近の
煩向により、接点の形状を小さくし、単位面積当りの開
閉負荷を大きくすると、開閉回数が増えるにつれて、接
点の周辺に酸化物が抜けたAgに富む層が生成し始める
。このときの接点断面を示すとt第1図のとおりである
。図において、1,1′は俵点ばね、2,2′はAg一
酸化物接点、3,3′はAgに富む層である。開閉回数
がさらに増すと、Agに富む層はそれに比例して成長す
るために、接点表面全体におけるAgに富む層の面積は
、開閉回教の二乗に比例するようになる。その結果、接
点表面の真に接触している点がAgに富む層に存在する
割合も二乗に比例する。当然のことながら、Agに富む
層は耐溶着性に劣るため、接点の落着発生回数が著しく
増加し始める。その傾向を第2図に示すが、開閉回数に
対して、累積落着発生回数は概略二乗曲線を示す。発明
者等は、上記AgマトリクスにBi−Snの酸化物(B
i2S比07)を分散した材料に関して引き続いて、改
良検討し、Agに富む層の発生を防止する方法として、
ln,Cd,Sbなどの酸化物を少量添加することが効
果を示すことを見し、出した。
In order to improve this point, the inventors conducted various studies and developed A.
In the g matrix, Bi203 and Sn02 are dispersed and reacted to form a composite oxide of Bi and Sn (Bi2Sn
We found that a material converted to 207) significantly improved wear resistance and also showed an improvement effect in terms of welding resistance. However, as mentioned above, due to recent trends, the shape of the contact is made smaller and the switching load per unit area is increased. Start generating. The cross section of the contact at this time is shown in Fig. 1. In the figure, 1 and 1' are Tawara point springs, 2 and 2' are Ag monoxide contacts, and 3 and 3' are Ag-rich layers. As the number of openings and closings increases further, the Ag-rich layer grows proportionally, so that the area of the Ag-rich layer on the entire contact surface becomes proportional to the square of the opening and closing times. As a result, the proportion of true contact points on the contact surface in the Ag-rich layer is also proportional to the square of the contact surface. Naturally, since the Ag-rich layer has poor adhesion resistance, the number of occurrences of contact dropout begins to increase significantly. The tendency is shown in FIG. 2, where the cumulative number of occurrences of settling shows a roughly squared curve with respect to the number of openings and closings. The inventors added Bi-Sn oxide (B
Subsequently, improvements were made to the material in which i2S ratio 07) was dispersed, and as a method for preventing the formation of an Ag-rich layer,
It was found that adding small amounts of oxides such as ln, Cd, and Sb was effective.

この中で、Cdは公害元素として規制されているところ
から望ましいものではなく、Sbの酸化物は消耗量が増
加し、接触抵抗も変動しやすくなるなどの面から、他の
特性に対する欠点が発生しやすい。lnの酸化物は、こ
のような見地からすれば比較的欠点の少ない添加物であ
ることが見し、出された。次に本発明の材料についてさ
らに詳し説明する。
Among these, Cd is not desirable because it is regulated as a polluting element, and Sb oxides have disadvantages in other properties, such as increasing consumption and making contact resistance more likely to fluctuate. It's easy to do. The oxide of ln was found to be an additive with relatively few drawbacks from this point of view, and was developed. Next, the material of the present invention will be explained in more detail.

本発明の材料は、Agマトリクス中にBj−Snの酸化
物(Bi2S−07)を主たる酸化物として分散し、さ
らに、BiとSnの組成比率によって、Biの酸化物(
Bi203)またはSnの酸化物(Sn02)を若干量
含有し、加えてlnの酸化物(ln203)を分散して
いるAg−酸化物複合接点材料で、その含有されている
酸化物の量は、金属換算値でBi25重量%、SnがB
iの2倍を越えない範囲で4〜8重量%(ただし、4重
量%を含まず)、lnl.8〜5重量%(ただし1.母
重量%を含まず)、で、残部がAgとなっている。
The material of the present invention has a Bj-Sn oxide (Bi2S-07) dispersed as a main oxide in an Ag matrix, and furthermore, a Bi oxide (Bi2S-07) is dispersed in an Ag matrix depending on the composition ratio of Bi and Sn.
It is an Ag-oxide composite contact material containing a small amount of oxide of Sn (Sn02) or oxide of Sn (Sn02), and in addition, an oxide of ln (ln203) is dispersed, and the amount of the contained oxide is as follows: Bi 25% by weight in metal equivalent value, Sn is B
i, 4 to 8% by weight (excluding 4% by weight), lnl. 8 to 5% by weight (excluding 1.% by weight), with the remainder being Ag.

この組成比関係において、所望の性能を見し、出し得る
ものであって、特に、前述の如き小型接点における開閉
電流が大きいときに著しい開閉性能の向上を期待するこ
とができる。本発明の材料に含まれる主たる酸化物のB
i−S中酸化物(Bi2S山07)は、Bjの酸化物(
Bi203)とSnの酸化物(Sn02)をモル比で1
:2の割合にて700〜900℃の範囲内の温度で加熱
することにより、黄緑右横造を持つ酸化物として生成す
る。
In this compositional ratio relationship, the desired performance can be determined and achieved, and a significant improvement in switching performance can be expected, especially when the switching current is large in a small contact as described above. Main oxide B contained in the material of the present invention
The oxide in i-S (Bi2S mountain 07) is the oxide of Bj (
Bi203) and Sn oxide (Sn02) in a molar ratio of 1
By heating at a temperature in the range of 700 to 900° C. at a ratio of 2:2, an oxide with a yellow-green right-lateral structure is produced.

その融点は、1200℃以上で昇華性を示し、Agマト
リクス中に分散させることにより、耐溶着性、耐消耗性
の改善効果が大きい。Agマトリクス中に、上記Bi−
Snの酸化物およびlnの酸化物を分散させる手法とし
て、Ag−Bi−Sn−lnの四元合金を、酸化雰囲気
中にて加熱し、Bi,Sn,lnを選択的に酸化させる
いわゆる内部酸化法がとられるが、BiとSnについて
言えば、前記モル比より換算し、四元合金中のBi重量
xとSn重量yがy/x〒0.57の関係において、B
iぶn207を生成させることができる。
Its melting point shows sublimation at 1200° C. or higher, and by dispersing it in an Ag matrix, it has a great effect of improving welding resistance and abrasion resistance. In the Ag matrix, the above Bi-
As a method for dispersing Sn oxide and ln oxide, a quaternary alloy of Ag-Bi-Sn-ln is heated in an oxidizing atmosphere and Bi, Sn, and ln are selectively oxidized using so-called internal oxidation. However, regarding Bi and Sn, when converted from the above molar ratio, Bi weight x and Sn weight y in the quaternary alloy are y/x〒0.57, then B
ibn207 can be generated.

しかしながら、Biは合金中において偏折しやすいため
に、内部酸化処理により確実にBi−Snの酸化物に転
化させることは困難であり、Biの酸化物、Snの酸化
物が単独で存在することがある。また、当然のことなが
ら、上記y/xの値が0.57より大きくなれば、Bi
の酸化物が単独で存在する機会が少なくなり、Snの酸
化物含有量が増加して来る。上記y/xの値が0.57
より小さくなれば、この逆の傾向になることは明白であ
る。しかるに、本発明材が主としてその用途とされる開
閉電流の大きな小型後′点の場合には、上記y/xの値
が0.57より大きく、Snの酸化物がBi−Snの酸
化物と共存している状態で消耗量が少ない。しかし、l
nの酸化物存在下にあってSn酸化物が増加すると、加
工性が著しく悪化し、接触抵抗も上昇するので、ln酸
化物の量は前述のAgの富む層が生成することを防止し
得る最少量とし、Sn酸化物量はy/xを1〜2程度ま
で取れるようにすることが望ましい。本発明材料の組成
は、上述の如き条件下の下で求められたもので、金属換
算組成は、少なくともBi2〜5重量%、Sn4〜8重
量%(ただし4重量%を除く)、lnl.8〜5重量%
(ただし1.鶴重量%を含まず)、および残部Agより
なるものである。上記組成との関連において、Agマト
リクス中に分散させる酸化物の働きをまとめて示すなら
ば、Biの酸化物は耐溶着性の改良に効果があり、Sn
の酸化物はアーク消耗を低減させること及びBi酸化物
との相乗作用でもつて耐溶着性の改善に効果がある。そ
して、lnの酸化物は本発明材の用途とされる開閉負荷
電流の大きい小型接点において、先にも記した接点周辺
のAgに富む層の生成を抑制し、結果として耐溶着性の
改良に寄与するとともに、アーク消耗の低減にも効果を
示す。しかし、lnの酸化物は、Bi酸化物によって得
ているところの材料本体の耐落着性について、これをや
や阻害する煩向があり、この点でBi酸化物含有量を増
加させる必要がある。各酸化物の含有量は用途によって
、選択される余地を有するものであるが、本発明材の組
成においてはその最少量は本発明材の目的に対して実用
的効果の認められる下限として設定されたものである。
他方、各酸化物について、その含有量が増大すると、B
i酸化物については、これをAgマトリクス中に分散す
る際に、後述の実施例にて示すような合金ィンゴットを
作製する場合にBi含有量の固溶限を越えるとより偏祈
しやすくなり、その結果Agマトリクス中にBiの酸化
物が単独で偏在し、消耗量の増加を招く。Snの酸化物
については、ln酸化物の存在下にあっては添加量が増
大すると、接触抵抗が上昇しやすく加工館も降下する。
特に、ln酸化物を金属換算値で1.母重量%を越えて
添加しているために、Sn酸化物量が増大することによ
る弊害が生じやすくBi量と関連でその添加量は規制さ
れる必要がある。lnの酸化物については、Sn酸化物
との兼合いで添加量が増えると加工性が悪化し、接触抵
抗も上昇しやすいものであるが、本発明材の目的として
いる用途に対しては、Sn酸化物量に先行してその含有
量は考えられるべきである。しかしながら、耐熔着性を
降下させる面が強く生ずる恐れがある。以上の観点から
、各成分組成の上限が設定されるものである。本発明に
かかる材料においては、さらに添加酸化物としてBj−
Cnの酸化物(たとえばC船i204)を含有させるこ
とができる。
However, since Bi is easily polarized in the alloy, it is difficult to reliably convert it into Bi-Sn oxide by internal oxidation treatment, and Bi oxide and Sn oxide exist alone. There is. Also, as a matter of course, if the value of y/x above becomes larger than 0.57, Bi
The chances of the oxide of Sn existing alone decreases, and the oxide content of Sn increases. The value of y/x above is 0.57
It is clear that as the size becomes smaller, the opposite trend will occur. However, in the case of small-sized devices with large switching currents, for which the material of the present invention is mainly used, the value of y/x is larger than 0.57, and the Sn oxide is different from the Bi-Sn oxide. There is little consumption when they coexist. However, l
When Sn oxide increases in the presence of n oxide, processability deteriorates significantly and contact resistance increases, so the amount of ln oxide can prevent the formation of the above-mentioned Ag-rich layer. It is desirable that the amount of Sn oxide be set to a minimum amount so that y/x can be adjusted to about 1 to 2. The composition of the material of the present invention was determined under the conditions described above, and the composition in terms of metal is at least 2 to 5% by weight of Bi, 4 to 8% by weight of Sn (excluding 4% by weight), and lnl. 8-5% by weight
(However, 1.% by weight of Tsuru is not included), and the balance consists of Ag. In relation to the above composition, if we summarize the functions of oxides dispersed in the Ag matrix, Bi oxides are effective in improving welding resistance, and Sn oxides are effective in improving welding resistance.
The oxide is effective in reducing arc consumption and improving the welding resistance through a synergistic effect with the Bi oxide. In addition, the ln oxide suppresses the formation of the Ag-rich layer around the contacts mentioned above in small contacts with large switching load currents for which the present invention material is used, and as a result improves welding resistance. It is also effective in reducing arc consumption. However, the ln oxide has a tendency to somewhat impede the settling resistance of the material body which is obtained by the Bi oxide, and in this respect it is necessary to increase the Bi oxide content. The content of each oxide can be selected depending on the application, but in the composition of the material of the present invention, the minimum amount is set as the lower limit that is recognized as having a practical effect for the purpose of the material of the present invention. It is something that
On the other hand, for each oxide, as its content increases, B
Regarding i-oxide, when dispersing it in an Ag matrix, when producing an alloy ingot as shown in the example below, if the solid solubility limit of the Bi content is exceeded, it becomes more likely to become unbalanced. As a result, Bi oxide is unevenly distributed alone in the Ag matrix, leading to an increase in consumption. Regarding Sn oxides, in the presence of ln oxides, as the amount added increases, the contact resistance tends to increase and the processing capacity also decreases.
In particular, ln oxide has a metal equivalent value of 1. Since the amount of Sn oxide is added in excess of the base weight %, adverse effects are likely to occur due to an increase in the amount of Sn oxide, so the amount added must be regulated in relation to the amount of Bi. Regarding the ln oxide, if the amount added increases in balance with the Sn oxide, the workability deteriorates and the contact resistance tends to increase. Its content should be considered before the amount of Sn oxide. However, there is a possibility that this may seriously deteriorate the welding resistance. From the above viewpoint, the upper limit of each component composition is set. In the material according to the present invention, Bj-
An oxide of Cn (for example, C ship i204) can be included.

Bi−Cnの酸化物構造は数種認められるが、いずれも
融点が低く、通常酸化ビスマス(Bi203)の融点8
25午○よりも低し、。そのほとんどは780〜800
0○付近にある。この酸化物が存在すると、加工性が著
しく改善されるが、他方アーク消耗が増加し、大抵の場
合には接点特性の降下を招くことが多い。したがって、
量的に過大に加えることは望ましくなく、必要最少量に
押えられるべきである。添加する場合には、先のAg‐
Bi−Sn−lnの四元合金にさらに金属Cuとして添
加して、内部酸化法により選択的にCのの型に酸化し、
さらにBi203と反応させてC肘i204などの型に
転化させるものである。望ましい添加量は金属Cuに換
算して0.016〜2重量%である。Cuの0.01亀
重量%は酸化物(Cu0)にすると0.02重量%に相
当し、効果が認められる最少量である。以上説明した本
発明の材料についてより具体的に実施例にもとづいて説
明する。
Several types of Bi-Cn oxide structures are recognized, but all of them have low melting points, and the melting point of bismuth oxide (Bi203) is usually 8.
Lower than 25:00 ○. Most of them are 780-800
It's around 0○. The presence of this oxide significantly improves processability, but on the other hand increases arc wear and often leads to deterioration of contact properties. therefore,
It is undesirable to add an excessive amount, and the amount should be kept to the minimum necessary. When adding, the above Ag-
Further, metal Cu is added to the Bi-Sn-ln quaternary alloy and selectively oxidized to the C type by an internal oxidation method.
Furthermore, it reacts with Bi203 and converts it into forms such as C elbow i204. A desirable addition amount is 0.016 to 2% by weight in terms of metal Cu. 0.01% by weight of Cu corresponds to 0.02% by weight in terms of oxide (Cu0), which is the minimum amount in which an effect is recognized. The materials of the present invention explained above will be explained in more detail based on Examples.

本発明の組成に従って、Ag,Bi,Sn,lnおよび
Cuを合量20M溶解し、Ag−Bi−Sn−lnを主
成分とするィンゴットを作った。
According to the composition of the present invention, Ag, Bi, Sn, ln, and Cu were dissolved in a total amount of 20 M to produce an ingot containing Ag-Bi-Sn-ln as a main component.

その溶解にはアルミナるつぼを使用し、アルゴン雰囲気
にて高周波炉を用いて行なった。溶湯は、15×30×
7仇肌3の金型に鋳込まれた。このようにして作製した
インゴットを、ただちに圧延機を用いて、厚さ1肌程度
の鱗片状のチップに粉砕した。これを、700℃の空気
中に6凪時間加熱し、Bi,Sn,lnなどを選択的に
内部酸化させるとともに、Biの酸化物を複合酸化物に
転化させた。次に、これを再度圧延機によって、厚さ0
.2脚以下のチップとした。上記0.2凧以下の厚さの
チップは、洗浄されたのち、2仇肌の径の円筒型に装填
され、8トン/地の圧力で成型された。次いで、この成
型体を900℃の温度で空気中にて2時間燐結した。こ
の暁給体は600午0の温度押出いこて3肌径の線材に
加工された。その後、冷間加工と塊錨を繰返しながら、
蓬1.7肋の線材まで加工し、さらに、径3.5側、曲
率半径8柳の球面頭部を有する接点鋲に加工され、接点
開閉試験の試料とされた。接点特性は、第3図に示した
回路によって行なった試験により評価された。
An alumina crucible was used for the melting, and a high frequency furnace was used in an argon atmosphere. The molten metal is 15×30×
It was cast into the mold of 7 enemies 3. The ingot thus produced was immediately ground into scale-like chips with a thickness of about 1 skin using a rolling mill. This was heated in air at 700°C for 6 hours to selectively internally oxidize Bi, Sn, In, etc., and convert the Bi oxide into a composite oxide. Next, this is rolled again using a rolling machine to a thickness of 0.
.. The chip size was 2 legs or less. After the chips having a thickness of 0.2 mm or less were cleaned, they were loaded into a cylindrical mold with a diameter of 2 mm and molded at a pressure of 8 tons/ground. Next, this molded body was phosphorized in air at a temperature of 900° C. for 2 hours. This material was extruded at a temperature of 600 pm and processed into a wire rod with a diameter of 3 skins. After that, while repeating cold working and lump anchoring,
The wire was processed to have a length of 1.7 ribs, and was further processed into a contact rivet with a spherical head of willow with a diameter of 3.5 and a radius of curvature of 8, which was used as a sample for a contact opening/closing test. Contact characteristics were evaluated by tests conducted using the circuit shown in FIG.

すなわち、スイッチS,として、ASTM型試験機を用
いて接触力30夕、開離力40夕、開閉速度10伽/秒
なる開閉条件とし、試験負荷として、商用電源周波数6
0HZ、電圧125V、ダイオード保護抵抗器r二1.
250、負荷R=12.50、容量C=1140山Fと
した。従って、突入電流のピークは160A、定常10
Aである。スイッチS2は、容量Cの電荷をスイッチS
,をオンする直前に放電させるための回路を構成するも
のである。接点特性の評価は、上記条件にて3×1ぴ回
開閉したときの溶着回数、すなわち接点を開欧するため
に40夕を越える力を要した回数、および3×1ぴ回開
閥後の俊点の消耗量により行なった。試験数量は各6対
であり、表に各特性の最4・値と最大値として結果を示
した。参考までに、比較試料としてAg−Cd0、およ
びAg一Bi−Sn合金を同機の製法にて作製した材料
の試験結果もあわせて示す。表 表の結果から明らかなように、本発明による接点材料は
、従来のAg−Cd○の接点に対して、落着消耗のいず
れの特性においても、きわめて優れた値を示すものであ
る。
That is, as the switch S, using an ASTM type testing machine, the opening/closing conditions were set as contact force of 30 mm, separation force of 40 mm, and opening/closing speed of 10 mm/sec, and the test load was a commercial power supply frequency of 6 mm.
0Hz, voltage 125V, diode protection resistor r21.
250, load R=12.50, and capacity C=1140 peak F. Therefore, the peak inrush current is 160A, and the steady state is 10A.
It is A. Switch S2 transfers the charge of capacitor C to switch S
, constitutes a circuit for discharging immediately before turning on. The evaluation of the contact characteristics was based on the number of welds when the contact was opened and closed 3×1 times under the above conditions, that is, the number of times a force exceeding 40 degrees was required to open the contact, and the number of welds after opening and closing 3×1 times. This was done based on the amount of points consumed. The number of tests was 6 pairs each, and the results are shown in the table as the maximum and maximum values for each characteristic. For reference, test results of Ag-Cd0 and Ag-Bi-Sn alloys produced using the same manufacturing method are also shown as comparative samples. As is clear from the results in the table, the contact material according to the present invention exhibits extremely superior values in all characteristics of wear and tear compared to the conventional Ag-Cd◯ contact.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は電気賎点材料の従釆例の開閉試験時における接
点断面の模型図である。 第2図は同じく従来例の開閉回数と累積落着回数の関係
を表わす曲線図である。第3図は本発明にかかる電気接
点材料の典型的な使用形態の一例を示し、試験回路とし
て使用したものである。第1図 第2図 第3図
FIG. 1 is a schematic diagram of a cross section of a contact during a switching test using a conventional electrical connection material. FIG. 2 is a curve diagram showing the relationship between the number of openings and closings and the cumulative number of landings in the conventional example. FIG. 3 shows an example of a typical usage of the electrical contact material according to the present invention, which is used as a test circuit. Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】 1 Agマトリクスに分散している酸化物がBi−Sn
の酸化物(Bi_2Sn_2O_7)とSnの酸化物(
SnO_2)であるAg一酸化物系電気接点材料であつ
て、その金属合成成分が、金属換算値でBiが2〜5重
量%、SnがBiの2倍を越えない範囲で4〜8重量%
(ただし4重量%を含まず)、In1.8〜5重量%(
ただし1.8重量%を含まず)、残部Agの割合である
ことを特徴とする電気接点材料。 2 Agマトリクスに分散している主たる酸化物がBi
−Snの酸化物(Bi_2Sn_2O_7)とSnの酸
化物(SnO_2)であるAg酸化物系電気接点材料で
あつて、その金属合成成分が、金属換算値でBi2〜5
重量%、SnがBiの2倍を越えない範囲で4〜8重量
%(ただし4重量%を含まず)、In1.8〜5重量%
(ただし1.8重量%を含まず)、Cu0.06〜2重
量%、残部Agの割合であることを特徴とする電気接点
材料。
[Claims] 1. The oxide dispersed in the Ag matrix is Bi-Sn.
oxide (Bi_2Sn_2O_7) and Sn oxide (Bi_2Sn_2O_7)
SnO_2) is an Ag monoxide-based electrical contact material whose metal synthesis components include 2 to 5% by weight of Bi and 4 to 8% by weight of Sn within a range not exceeding twice the amount of Bi.
(However, excluding 4% by weight), In1.8 to 5% by weight (
An electrical contact material characterized in that the proportion is 1.8% by weight (excluding 1.8% by weight), with the balance being Ag. 2 The main oxide dispersed in the Ag matrix is Bi
-Ag oxide-based electrical contact material that is an oxide of Sn (Bi_2Sn_2O_7) and an oxide of Sn (SnO_2), whose metal synthesis components are Bi2 to 5 in metal equivalent value.
Weight%, Sn not exceeding twice that of Bi, 4 to 8 weight% (excluding 4 weight%), In 1.8 to 5 weight%
An electrical contact material characterized by having a proportion of Cu (excluding 1.8% by weight), 0.06 to 2% by weight of Cu, and the balance being Ag.
JP54133260A 1979-10-15 1979-10-15 electrical contact materials Expired JPS6027747B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54133260A JPS6027747B2 (en) 1979-10-15 1979-10-15 electrical contact materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54133260A JPS6027747B2 (en) 1979-10-15 1979-10-15 electrical contact materials

Publications (2)

Publication Number Publication Date
JPS5658940A JPS5658940A (en) 1981-05-22
JPS6027747B2 true JPS6027747B2 (en) 1985-07-01

Family

ID=15100451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54133260A Expired JPS6027747B2 (en) 1979-10-15 1979-10-15 electrical contact materials

Country Status (1)

Country Link
JP (1) JPS6027747B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0257649A (en) * 1989-06-21 1990-02-27 Chugai Electric Ind Co Ltd Electric contact material made of selectively and internally oxidized silver-tin alloy containing bismuth
CN115491539B (en) * 2022-08-30 2023-04-18 昆明理工大学 Enhanced AgSnO 2 Electric contact material and preparation method thereof

Also Published As

Publication number Publication date
JPS5658940A (en) 1981-05-22

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