JPS6028123B2 - Local coating device for resistor - Google Patents
Local coating device for resistorInfo
- Publication number
- JPS6028123B2 JPS6028123B2 JP54157132A JP15713279A JPS6028123B2 JP S6028123 B2 JPS6028123 B2 JP S6028123B2 JP 54157132 A JP54157132 A JP 54157132A JP 15713279 A JP15713279 A JP 15713279A JP S6028123 B2 JPS6028123 B2 JP S6028123B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- nozzle
- paste
- melting point
- point substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 title claims description 9
- 239000011248 coating agent Substances 0.000 title claims description 8
- 238000002844 melting Methods 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001877 deodorizing effect Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
本発明は整列移送される抵抗体の表面の一部に一定量、
一定面積ペースト状低融点物質を塗布する抵抗体の局部
塗布装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method in which a certain amount of
The present invention relates to a local coating device for a resistor that applies a paste-like low melting point substance to a fixed area.
以下、本発明装置について説明する前に、製品及びペー
スト状低融点物質を塗布する目的について第１図ととも
に説明する。まず、製品は抵抗体１と、その軸方向の両
端より引き出されているリード線２，２′とで構成され
ている。そして、電子部品である抵抗体１の中央部にペ
ースト状低融点物質３を塗布することにより、抵抗体１
に過負荷電圧が印加された時に回路を切断し機器、装置
の保護をしている。すなわち、抵抗体１にヒュ−ズ機能
をもたせている。この抵抗体１への低融点物質３の塗布
方法の従来例を第２図とともに説明すると、Ｖ溝４ａ，
４ｂを有する抵抗体整列拾具４にリード線２，２′を有
する抵抗体１を整列させ、ペースト状低融点物質３を多
量入れてある容器（図示せず）より毛筆（図示せず）に
少量吸着させ、手によりリード線２，２′を押えて抵抗
体１を固定し、毛筆に少量吸着されたペースト状低融点
物質３を塗布していた。Hereinafter, before explaining the apparatus of the present invention, the product and the purpose of applying the paste-like low melting point substance will be explained with reference to FIG. First, the product is composed of a resistor 1 and lead wires 2, 2' drawn out from both ends of the resistor in the axial direction. Then, by applying a paste-like low melting point substance 3 to the center part of the resistor 1, which is an electronic component, the resistor 1
It protects equipment and equipment by cutting off the circuit when an overload voltage is applied to it. That is, the resistor 1 has a fuse function. A conventional example of the method of applying the low melting point substance 3 to the resistor 1 will be explained with reference to FIG.
The resistor 1 having the lead wires 2 and 2' is aligned with the resistor alignment pick 4 having the resistor 4b, and is placed in a brush (not shown) from a container (not shown) containing a large amount of paste-like low melting point substance 3. A small amount of the paste-like low-melting substance 3 was adsorbed, the resistor 1 was fixed by holding down the lead wires 2 and 2' by hand, and the paste-like low-melting substance 3 adsorbed in a small amount was applied to a brush.
したがって、上述の説明でも解るように製品特性を大き
く左右させるペースト状低融点物質を毛筆で塗布するこ
とによって塗布量にバラッキが生じ、この結果溶断時間
にバラッキが生じて機器、装置を保護する役目を果さな
い場合がある。また作業自体も相当熟練を要し、１日少
量の生産量しか処理できない状態である。そこで本装置
はこれらの問題点を一挙に解決し、さらに生産量も大中
に向上させることができる装置を提供しようとするもの
である。Therefore, as can be seen from the above explanation, applying a paste-like low melting point substance that greatly affects product characteristics with a brush causes variations in the amount of application, which results in variations in fusing time, which serves to protect equipment and equipment. may not be achieved. The work itself requires considerable skill, and only a small amount of production can be done each day. Therefore, the present apparatus is an attempt to solve these problems all at once, and to provide an apparatus that can greatly increase the production amount.
本装置の一実施例を第３図、第４図イ，口とともに説明
する。An embodiment of this device will be described with reference to FIGS. 3 and 4.
まず、Ｖ溝を有するアタッチメント付チェーン５ａ，５
ｂの溝に抵抗体１のリード線２，２′を敷直し、それら
抵抗体１を製品ガイド９ａ，９ｂにより定位層に整列さ
せる。そして一定の回転角度を有する回転軸８とノズル
ホルダ‐７とにより保持され、整列させれ送られてくる
抵抗体１と同期して回転、上下される塗布ノズル６によ
り、抵抗体１の表面の一部にペースト状低融点物質３を
一定量、一定面積塗布する。この時抵抗体１は回転させ
ず、また塗布量の調整はノズル６の径と該ノズル６の回
転上下が上死点に達し停止した時の時間によって調整す
る。このように本考案においては整列、移送される抵抗
体と同期して回転、上下されるノズルによって該抵抗体
が塗布されるため、塗布量のバラッキは少なくなり、特
性の安定化が図れることにより、高安定性の製品を市場
に出荷することができるものである。First, chains 5a, 5 with attachments having V grooves
The lead wires 2 and 2' of the resistor 1 are laid out again in the groove b, and the resistor 1 is aligned with the localization layer by the product guides 9a and 9b. The coating nozzle 6 is held by a rotating shaft 8 having a constant rotation angle and a nozzle holder 7, and is rotated and moved up and down in synchronization with the aligned and sent resistor 1, to coat the surface of the resistor 1. A certain amount of paste-like low melting point substance 3 is applied to a certain area. At this time, the resistor 1 is not rotated, and the amount of coating is adjusted by the diameter of the nozzle 6 and the time taken when the nozzle 6 reaches top dead center and stops. In this way, in the present invention, the resistor is applied by a nozzle that rotates and moves up and down in synchronization with the resistor that is aligned and transferred, so the variation in the amount of coating is reduced and the characteristics are stabilized. , it is possible to ship highly stable products to the market.
また、手作業の１の音以上もの生産性向上が図れるなど
、簡単な装置でもつてペースト状低融点物質の塗布手段
として有用な装置を提案することができるものである。Furthermore, it is possible to propose a device that is simple but useful as a means for applying a paste-like low-melting point substance, which can improve productivity by more than just one step of manual labor.
第１図はペースト状低融点物質を塗布した抵抗体の正面
図、第２図は従釆の塗布方法を説明する抵抗体整列治臭
の斜視図、第３図は本発明装置の一実施例を示す概略構
成図、第４図イ，口は同装置の塗布工程を説明する要部
概略側面図である。
１・・…・抵抗体、３・・・・・・ペースト状低融点物
質、６・・・・・・塗布用ノズル、８・・・・・・回転
軸。
第１図第２図
第３図
第４図Fig. 1 is a front view of a resistor coated with a paste-like low melting point substance, Fig. 2 is a perspective view of a resistor alignment and deodorizing method explaining the method of applying a substructure, and Fig. 3 is an embodiment of the device of the present invention. FIG. 4A is a schematic side view of the main part explaining the coating process of the same apparatus. 1... Resistor, 3... Paste-like low melting point substance, 6... Coating nozzle, 8... Rotating shaft. Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
用ノズルを、このノズルの回転周期と同期して整列移送
される抵抗体の近傍に配置し、上記ノズルと抵抗体とが
交叉する時に該抵抗体を回転させずにその表面上の一部
にペースト状低融点物質を一定量、一定面積該塗布用ノ
ズルにより塗布することを特徴とする抵抗体の局部塗布
装置。1. A coating nozzle attached to a rotating shaft having a constant rotation angle is placed near a resistor that is aligned and transferred in synchronization with the rotation period of this nozzle, and when the nozzle and resistor intersect, A local coating device for a resistor, characterized in that a certain amount of a paste-like low melting point substance is applied to a certain area on a part of the surface of the resistor using the application nozzle without rotating the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54157132A JPS6028123B2 (en) | 1979-12-03 | 1979-12-03 | Local coating device for resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54157132A JPS6028123B2 (en) | 1979-12-03 | 1979-12-03 | Local coating device for resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5679403A JPS5679403A (en) | 1981-06-30 |
| JPS6028123B2 true JPS6028123B2 (en) | 1985-07-03 |
Family
ID=15642896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54157132A Expired JPS6028123B2 (en) | 1979-12-03 | 1979-12-03 | Local coating device for resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028123B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750644B2 (en) * | 1993-05-17 | 1995-05-31 | 光伯 横山 | Automatic winding machine |
-
1979
- 1979-12-03 JP JP54157132A patent/JPS6028123B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5679403A (en) | 1981-06-30 |
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