JPS6028384B2 - resist developing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resist developing apparatus, and more particularly to an apparatus suitable for developing a resist layer deposited on a semiconductor wafer.

Photo-etching technology is widely used in the manufacturing process of semiconductor devices.

There are two types of photoresists used for photoetching: negative type and positive type. As the structures of semiconductor devices become smaller and more dense, the need for microfabrication is increasing, and for this purpose, positive resists that can be subjected to microetching are increasingly being used. For positive resists, the most important factor is the management of development conditions, especially the temperature of the developer. FIG. 1 shows a schematic diagram of a conventional device for adjusting the developer temperature. In the figure, 1 is a developer container, 2 is, for example, a liquid sending pump for sending the developer into the device, 3 is a temperature control unit that adjusts the temperature of the developer, and 4 is a developer liquid to be distributed in the device. An adjustment valve 5 for adjusting the amount is a nozzle, which is arranged so as to inject a developing solution whose temperature and liquid amount have been adjusted onto the semiconductor wafer 10. The respective parts are connected by conduits 6, 6', . . . through which the developer passes.
In addition, as shown by the broken line in the figure, the regulating valve 4 is a three-way valve, and one conduit is connected to the liquid feeding pump 2 through a conduit 7 so that the liquid circulation can be measured as necessary. In particular, when discharging developer from the nozzle is stopped, the developer that remains in the conduit leading from the adjustment unit to the liquid volume adjustment valve and whose temperature has decreased is removed from the nozzle when discharging is resumed. It is possible to avoid such a situation as causing the liquid to be discharged from the inside. Although the above-mentioned apparatus uses a liquid feed pump 2 as a means for sending the developer into the apparatus, if the developer container is placed at the highest point of the apparatus, the liquid can be sent without using a liquid feed pump. In the developing device as described above, the relationship between the amount of developer discharged from the nozzle and the temperature is shown, for example, in FIG.

That is, the discharge amount Vocc shown on the horizontal axis is ejected from the nozzle until the temperature of the developer shown on the vertical axis reaches the set temperature t° C. desired for development. This discharge amount Vocc
Since the liquid corresponding to the wafer should not be injected onto the wafer, during this ejection period, the ejected liquid is received by a member of the same type as the defective wafer to prevent the wafer holding device from becoming contaminated. This has made the process complicated and has been a major obstacle to automation. This invention improves the drawbacks of conventional resist developing devices,
The present invention provides a resist developing device that facilitates process management and is also suitable for automation.

This invention provides a temperature measuring section for detecting the temperature of the developing solution in the nozzle of a conventional resist developing device, and only when the solution temperature is within a set temperature range, a shirt plate is installed between the nozzle and the semiconductor wafer so that it can move forward and backward. The present invention is characterized by the provision of a retractable shirt sleeve and its driving section. Next, one embodiment of the present invention will be explained in detail with reference to the drawings.

Note that FIG. 3 is a schematic diagram showing one embodiment, and shows some parts already shown in FIG. 3. Since the regulating valve 4, nozzle 5, and conduit 6 are the same, they are shown with the same numbers in the figure and their explanations will be omitted. Next, the main parts of the invention indicated by thick lines in the figure will be explained in detail. Reference numeral 11 indicates a temperature measuring unit such as a thermocouple provided in the nozzle 5, and 12 indicates a temperature measuring unit, which has the shape of a liquid receiving tray for receiving the developer discharged from the nozzle, as shown in FIG. It is attached to the shaft of 12a.

The temperature of the developer detected by the above thermometer is within the set temperature range (
The motor 12a is driven by a signal sent from the temperature measuring unit only when the developing temperature specified by the resist is within the range of 300°C and 0.5qo, for example.
The shirt is evacuated from between the nozzle and the semiconductor wafer. Even after the discharge of the liquid from the nozzle has started, the temperature equivalent to the above-mentioned discharge amount Vocc has not yet reached the set temperature.While the liquid is being discharged, the shirt cover 12 is positioned in front of the nozzle and the liquid is not discharged. When the temperature of the liquid rises to a desired temperature, the shirt cover 12 is automatically retracted so that the liquid is sprayed onto the wafer. Therefore, even before the liquid ejected from the nozzle reaches the set temperature, the wafer may be positioned at a location where the developer should be sprayed. Note that the drive of this shaft is not limited to the rotation of the motor, but may freely select rotation, stepwise movement (forward, backward), etc. by cam operation, rack and pinion pairing corners, air cylinder, spring, etc., or a combination thereof. . According to this invention, the temperature of the developer acting on the wafer can be limited within a set temperature range, and is particularly effective for positive type resists having a narrow temperature range suitable for development.

In addition, it is suitable for process automation because it is easy to manage development conditions and does not require human labor. Furthermore, even if there is an interval between development processes, there is no need to receive the ejected liquid on a defective wafer or a substitute member when restarting the process. Note that the apparatus of the present invention is not limited to the embodiments, but can be widely applied to negative type resists, other spin coatings, and the like.

[Brief explanation of the drawing]

Figure 1 is a diagram showing the outline of a conventional resist developing device, Figure 2
The figure is a diagram showing the relationship between the amount of developer discharged and the liquid temperature, Figure 3 is a diagram showing the outline of a resist developing device according to one embodiment, and Figure 4 is a diagram showing a part of the shutter device section of the resist developing device. FIG. Note that the same reference numerals in the figures indicate the same or corresponding parts, respectively. 1...Developer container, 2...
...Liquid pump, 3...Temperature control section, 4...
...Adjustment valve, 5...Nozzle, 6,7...
Conduit, 10... Semiconductor wafer, 11...
・Temperature measurement section, 12...Shirt evening, 12a...
Shirt drive motor, 13... Shirt drive unit. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] 1 a developer container, a temperature control section that adjusts the temperature of the developer,
A resist developing device is equipped with an adjustment valve that adjusts the amount of developer sent out from a container, and a nozzle that injects the developer whose temperature and amount have been adjusted onto the opposing semiconductor wafer. a temperature-measuring section that detects the temperature of the developer when it is injected from the nozzle; a shutter that is movable forward and backward between the nozzle and the semiconductor wafer; and a temperature-measuring section that is controlled by signals from the temperature-measuring section. A resistor equipped with a shutter device comprising a shutter drive section that evacuates the shutter laterally from a position between the nozzle and the semiconductor wafer only when the liquid temperature detected by the section is within a set temperature range. Developing device.