JPS602943B2 - Method for measuring and adjusting moisture in foundry sand - Google Patents
Method for measuring and adjusting moisture in foundry sandInfo
- Publication number
- JPS602943B2 JPS602943B2 JP11383679A JP11383679A JPS602943B2 JP S602943 B2 JPS602943 B2 JP S602943B2 JP 11383679 A JP11383679 A JP 11383679A JP 11383679 A JP11383679 A JP 11383679A JP S602943 B2 JPS602943 B2 JP S602943B2
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- foundry sand
- value
- measuring
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004576 sand Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000004898 kneading Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 5
- 239000003110 molding sand Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 101700004678 SLIT3 Proteins 0.000 description 3
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Accessories For Mixers (AREA)
Description
【発明の詳細な説明】
本発明は鋳物砂の水分測定及び調節方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for measuring and controlling the moisture content of foundry sand.
従来に於けるこの種の方法は鋳物砂に附着した水分の量
に併なう鋳物砂の成型性の変動に着目し、これを測定す
ることによって鋳物砂の水分量を知り水分添加を行なう
水分調節方法が良く知られている。This type of conventional method focuses on the variation in the moldability of foundry sand depending on the amount of water attached to it, and by measuring this, the amount of water in the foundry sand can be determined and the water content can be adjusted accordingly. The method of adjustment is well known.
以下第1図〜第4図に基づき従来例について説暁する。A conventional example will be explained below based on FIGS. 1 to 4.
第1図は従来に於ける水分測定装置である。上部トラフ
1の下方に於いて右方にいくにつれて次第に間隔を大き
くしたスリット5,7,9を設け、且つ底が右方にいく
につれて低くなるようにした4ケタの中間トラフ4,6
,8,10を設ける。又、中間トラフ4の上方に位置す
るよう上部トラフ1の底部2へスリット3を設ける。更
に中間トラフ4,6,8,10の下方に下部トラフ11
を設けて上部トラフ1の本体にて支承し、該下部トラフ
11の底部側壁にスリット5,7,9より落下する鋳物
砂18を検出する光電管12P,13P,14P及び投
光器12P′,13P′,14P′(第2図)の透光用
の孔12,13,14を設ける。こうした構成からなる
鋳物砂分離装置1′を振動装置15を備えた弾性支承体
16によって支持し、更に混練装置(図示せず)から前
記鋳物砂18を該鋳物砂分離装置1′へ供給する為のシ
ュート17を設ける。第2図は第1図の−点鎖線部をA
,A′矢視方向から見た断面図である。FIG. 1 shows a conventional moisture measuring device. Four-digit intermediate troughs 4, 6 are provided below the upper trough 1 with slits 5, 7, 9 whose spacing gradually increases as they go to the right, and whose bottoms become lower as they go to the right.
, 8, and 10 are provided. Further, a slit 3 is provided in the bottom 2 of the upper trough 1 so as to be located above the intermediate trough 4. Furthermore, a lower trough 11 is located below the intermediate troughs 4, 6, 8, and 10.
are provided and supported by the main body of the upper trough 1, and phototubes 12P, 13P, 14P and floodlights 12P', 13P', for detecting the molding sand 18 falling from the slits 5, 7, 9 on the bottom side wall of the lower trough 11. Light-transmitting holes 12, 13, and 14 of 14P' (FIG. 2) are provided. The molding sand separator 1' having such a configuration is supported by an elastic support 16 equipped with a vibration device 15, and the molding sand 18 is further supplied to the molding sand separator 1' from a kneading device (not shown). A chute 17 is provided. Figure 2 shows the − dot-dashed line in Figure 1.
, is a sectional view seen from the direction of arrow A'.
1は上部トラフ、2は上部トラフ1の底部、8は中間ト
ラフ、11は下部トラフ、12,13,14は透光用の
孔、12P,13P,14Pは光電管、12P′,13
P′,14P′は投光器である。1 is an upper trough, 2 is the bottom of the upper trough 1, 8 is an intermediate trough, 11 is a lower trough, 12, 13, 14 are holes for light transmission, 12P, 13P, 14P are phototubes, 12P', 13
P' and 14P' are projectors.
次に作用について説明する。Next, the effect will be explained.
第1図に於いて振動装置15を作動して分離装置1′全
体を振動させながら、混練装置(図示せず)より上部ト
ラフーへ鋳物砂18をシュート17を経て供給する。供
給された鋳物砂18は上部トラフ1上を右方へ移動して
、ほとんどの鋳物砂18はスリット3から落下する。し
かし水分量がある限度以上になると鋳物砂18はスリッ
ト3の間隔より大きく凝集してスリット3からは落下せ
ず、そのま)上部トラフー上を右方へ移動し底部2の右
端より落下する事となる。スリット3から下方の中間ト
ラフ4へ落下した鋳物砂18は更に中間トラフ4,6,
8,10の順に右方へ移動する。この移動する過程に於
いて水分量の少ない程スリット5,7,9の順に落下す
る。しかし水分量がある限度以上になるとスリット5,
7,9の間隔より大きく凝集してスリット5,7,9か
らは落下せず右方へ移動し中間トラフ10の右端より落
下する。スリット5,7,9から落下した鋳物砂18は
トラフ11上を再び右方へ移動する。In FIG. 1, the vibration device 15 is operated to vibrate the entire separator 1', and molding sand 18 is supplied from the kneading device (not shown) to the upper trough through the chute 17. The supplied molding sand 18 moves to the right on the upper trough 1, and most of the molding sand 18 falls from the slit 3. However, when the moisture content exceeds a certain limit, the foundry sand 18 aggregates larger than the spacing between the slits 3 and does not fall from the slits 3, but instead moves to the right on the upper trough and falls from the right end of the bottom part 2. becomes. The foundry sand 18 that has fallen from the slit 3 to the intermediate trough 4 below is further transferred to the intermediate troughs 4, 6,
Move to the right in the order of 8 and 10. During this moving process, the smaller the amount of water, the more it falls into the slits 5, 7, and 9 in this order. However, when the water content exceeds a certain limit, slit 5,
The particles agglomerate to a greater extent than the distance between the slits 5, 7, and 9, and do not fall from the slits 5, 7, and 9, but move to the right and fall from the right end of the intermediate trough 10. The molding sand 18 that has fallen from the slits 5, 7, and 9 moves on the trough 11 to the right again.
この移動過程に於いてスリット5から落下した鋳物砂1
8が孔12の位置に来ると光電管12日こよって検出さ
れる。同様にスリット7,9から落下した鋳物砂18を
夫々孔13,14に於いて光電管13P,14Pにより
検出する。第3図は上記の光電管12P,13P,14
Pの実際の検出結果を示す。The foundry sand 1 that fell from the slit 5 during this movement process
When 8 comes to the position of the hole 12, it is detected by the photocell 12. Similarly, molding sand 18 falling from slits 7 and 9 is detected by phototubes 13P and 14P in holes 13 and 14, respectively. Figure 3 shows the above photocells 12P, 13P, 14.
The actual detection results of P are shown.
グラフ20,21,22は夫々光電管12P,13P,
14PのON,OFF状況を示す。第4図は水分調節方
法の従来例を示す図である。Graphs 20, 21, and 22 are phototubes 12P, 13P, respectively.
Indicates the ON/OFF status of 14P. FIG. 4 is a diagram showing a conventional example of a moisture adjustment method.
第4図に於ける12P,13P,14Pは第1図〜第3
図に於いて述べた光電管である。12S,13S,14
Sは各光電管12P,13P,14PのONの時の出力
信号である。12P, 13P, 14P in Figure 4 are from Figures 1 to 3.
This is the phototube mentioned in the figure. 12S, 13S, 14
S is an output signal when each phototube 12P, 13P, 14P is turned on.
23,24,25は順に流量を大きくした給水管である
。23, 24, and 25 are water supply pipes whose flow rates are increased in this order.
23V,24V,25Vは各出力信号12S,13S,
14Sに基づき作動する制御弁であり、順に流量が大き
くなっている。23V, 24V, 25V are each output signal 12S, 13S,
These are control valves that operate based on 14S, and the flow rate increases in order.
26は鋳物砂18の泥練装置である。26 is a mud kneading device for the foundry sand 18.
27は各出力信号12S,13S,14Sを制御弁23
V,24V,25Vの操作信号に変換する為の調節器で
ある。27 is a control valve 23 for each output signal 12S, 13S, 14S.
This is a regulator for converting into V, 24V, and 25V operation signals.
次に作用について説明する。Next, the effect will be explained.
各光電管12P,13P,14Pの検出による夫々の出
力信号12S,13S,14Sは調節器27により制御
弁23V,24V,25Vの操作信号12S′,13S
′,14S′に変換される。こうして制御弁23V,2
4V,25Vを開閉することによって混練装置26に於
いて鋳物砂18への水分添加量を調節する。こうした従
来例に依る水分測定及び水分調節方法には次の大きな3
つの問題点がある為に通常の鋳物砂の水分管理に対して
利用価値は極めて低いものであった。The output signals 12S, 13S, 14S resulting from the detection of each phototube 12P, 13P, 14P are converted into operation signals 12S', 13S of the control valves 23V, 24V, 25V by the regulator 27.
', 14S'. In this way, the control valve 23V, 2
The amount of water added to the foundry sand 18 in the kneading device 26 is adjusted by opening and closing 4V and 25V. These conventional moisture measurement and moisture adjustment methods include the following three major methods:
Because of the following problems, its utility value for controlling the moisture content of ordinary foundry sand was extremely low.
先ず第一に水分測定に関しては、第3図のグラフ20,
21,22にて示される様に、鋳物砂の実際の水分を数
値(%)として人が目議する為の指示が出来なかった点
である。First of all, regarding moisture measurement, graph 20 in Figure 3,
As shown in 21 and 22, it was not possible to provide instructions for people to estimate the actual moisture content of foundry sand as a numerical value (%).
従って目標水分量と比較することが出来ない為、漉練過
程に於ける水分添加量が適切か否かの判断を人間に依っ
てすることが極めて困難であった。即ち水分の測定指示
装置として利用する事が出来なかった。第二に水分調節
に関しては、第3図のグラフ20,21,22にて示さ
れるように各光電管のONからOFF、あるいはOFF
からONに移る時間が極めて短い為に制御弁の開閉動作
が追従出来ない点である。Therefore, since it is not possible to compare the water content with the target water content, it is extremely difficult for humans to judge whether or not the amount of water added during the straining process is appropriate. In other words, it could not be used as a moisture measurement/instruction device. Second, regarding moisture control, as shown in graphs 20, 21, and 22 in Figure 3, each phototube can be turned from ON to OFF or OFF.
The point is that the time it takes to change from ON to ON is extremely short, so the opening/closing operation of the control valve cannot follow it.
第三に同じく水分調節に関する問題点として次の事が挙
げられる。Thirdly, the following problems can also be raised regarding moisture control.
第1図に於いて鋳物砂の水分の少ない程、光電管12P
,13P,14Pの順に検出するのであるが、スリット
5,7,9から鋳物砂が落下する場合、全体として同一
水分でありながら、濠練の不均一やダマの影響等により
、ある鋳物砂はスリット5から落下し、ある鋳物砂はス
リット7から落下する場合があることである。更に同じ
光電管、例えば光電管12Pにて検出する鋳物砂に於い
ても、当然水分量に、或る中、即ちバラツキがある。こ
れはスリット数に限度がある以上当然の事である。しか
しながらこれに対し従来例の水分添加は同一光電管で検
出した場合には単一の水分添加しか行なわれない。従っ
て通常の鋳物砂の水分管理上に於いて、目標水分値に対
する水分調節の厳密な精度を維持することが困難となる
。本発明の目的は第1図に示す測定装置を利用して、以
上の3つの従来欠点を解消した鋳物砂の水分測定及び調
節方法を可能とすることである。In Figure 1, the lower the moisture content of the foundry sand, the higher the photocell 12P.
, 13P, and 14P are detected in this order. When the foundry sand falls from the slits 5, 7, and 9, although the moisture content is the same as a whole, due to uneven drilling, the influence of clumps, etc., some of the foundry sand Some molding sand may fall from the slit 5, and some molding sand may fall from the slit 7. Furthermore, even in foundry sand detected by the same phototube, for example phototube 12P, there is naturally some variation in the moisture content. This is natural since there is a limit to the number of slits. However, in contrast, in the case of water addition in the conventional example, only a single water addition is performed when the same phototube is used for detection. Therefore, in normal moisture management of foundry sand, it is difficult to maintain strict accuracy in moisture control with respect to the target moisture value. It is an object of the present invention to provide a method for measuring and adjusting the moisture content of foundry sand that eliminates the three conventional drawbacks described above by using the measuring device shown in FIG.
本発明について第5図〜第7図の実施例に基づき説明す
る。第5図は本発明の鋳物砂の水分測定指示及び調節方
法の一実施例図である。The present invention will be explained based on the embodiments shown in FIGS. 5 to 7. FIG. 5 is an embodiment of the method for measuring and adjusting the moisture content of foundry sand according to the present invention.
12P,13P,14Pは第1図〜第3図に於いて述べ
た光電管である。12P, 13P, and 14P are the phototubes described in FIGS. 1 to 3.
12S,13S,14Sは各々の光電管12P,13P
,1 4PのONの時の出力信号である。12S, 13S, 14S are respective phototubes 12P, 13P
, 1 This is the output signal when 4P is ON.
30は入力信号12S,13S,14Sにより演算を行
なう記憶演算装置、30′は入力信号30Sにより水分
値(%)を表示する指示制御装置、32は操作信号31
Sにより作動する制御弁、33は給水管である。30 is a storage/arithmetic device that performs calculations based on the input signals 12S, 13S, and 14S; 30' is an instruction control device that displays the moisture value (%) based on the input signal 30S; and 32 is an operation signal 31.
A control valve operated by S, 33 is a water supply pipe.
18,26は第4図に示す鋳物砂及び鷹連装置である。Reference numerals 18 and 26 are foundry sand and tumbler devices shown in FIG.
次に本発明の作用について説明する。各光電管12P,
13P,14Pからの出力信号12S.13S,14S
は従来例に於いて説明した様に第3図にて示される。こ
の出力信号12S,13S,14Sの組合せ、即ち各光
電管12P,13P,14PのON,OFFの組合せに
基づき水分量を数値(%)として指示する。Next, the operation of the present invention will be explained. Each photocell 12P,
Output signals from 13P and 14P 12S. 13S, 14S
is shown in FIG. 3 as explained in the conventional example. Based on the combination of the output signals 12S, 13S, and 14S, that is, the combination of ON and OFF of each phototube 12P, 13P, and 14P, the moisture content is indicated as a numerical value (%).
これは第1表に示す様に予め第1表各光電管12P,1
3P,14PのON,OFFの組合せに対応する水分値
(%)を求めておくものとする。As shown in Table 1, each photocell 12P, 1
It is assumed that the moisture value (%) corresponding to the ON/OFF combination of 3P and 14P is determined in advance.
(但し第1表に示すのは主な組合せのみである。)この
第1表の水分値(%)を以下設定水分値と呼ぶこと)す
る。この設定水分値を求める方法は、各種の水分値(%
)に混練調整した鋳物砂を第1図の測定装置にて実際に
測定して各種水分値(%)に対応する各光電管12P,
13P,14PのON,OFF状態を知る事によって撮
られる。この設定水分値(%)と、これに対応する各光
電管のON,OFFの組合せを記憶演算装置30に記憶
させておき、第6図に於いて示す様なグラフ20,21
,22(第3図に同じ)からなる出力信号12S,13
S,14Sの組合せとを記憶演算装置30にて比較を行
ない、例えば第6図に於けるa,b,c,d……i(%
)という様に0.1秒毎に水分量を数値(%)に置換す
る為の換算を行なう。(However, Table 1 shows only the main combinations.) The moisture values (%) in Table 1 are hereinafter referred to as set moisture values). The method for determining this set moisture value is based on various moisture values (%
) The foundry sand mixed and adjusted was actually measured using the measuring device shown in Figure 1, and each phototube 12P, corresponding to various moisture values (%),
Photographs can be taken by knowing the ON and OFF states of 13P and 14P. This set moisture value (%) and the corresponding combination of ON and OFF of each phototube are stored in the storage/arithmetic unit 30, and the graphs 20, 21 as shown in FIG.
, 22 (same as in FIG. 3)
For example, a, b, c, d...i (%) in FIG.
), conversion is performed every 0.1 seconds to replace the moisture content with a numerical value (%).
そしてこの換算水分値(%)の100ケ毎について第7
図に示す様に、平均水分値を,b′,c′・・・・・・
e′(%)・・・・・・を算出する。即ち0.1秒毎に
点線部で示す様に1ケの換算水分値(%)を次々に更新
して、常に100ケの換算水分値(%)についての平均
を行ない、平均水分値(%)を算出する。そしてこの平
均水分値(%)を指示制御装置30′へ入力信号30S
として人が自訴出来るように指示する。(これにて従来
の第一の問題点を解消できることとなる。)次に水分の
調節に関しては指示制御装置30′にて前記平均水分値
(%)と、目標水分値(%)との偏差値を求めて、これ
に応じた適切は水分添加を行なう様に制御弁32の操作
信号31Sに変換する。And for every 100 of this converted moisture value (%), the seventh
As shown in the figure, the average moisture values are b', c'...
Calculate e' (%)... That is, as shown by the dotted line every 0.1 seconds, one converted moisture value (%) is updated one after another, and the 100 converted moisture values (%) are always averaged to obtain the average moisture value (%). ) is calculated. Then, this average moisture value (%) is input to the instruction control device 30' as a signal 30S.
Instruct the person to file a self-prosecution. (This makes it possible to solve the first problem of the conventional method.) Next, regarding moisture adjustment, the instruction and control device 30' determines the deviation between the average moisture value (%) and the target moisture value (%). The value is determined and converted into an operation signal 31S for the control valve 32 so as to add water appropriately according to the value.
そしてこの操作信号31Sは0.1秒毎に、規則的に出
力されることによって確実に制御弁32の動作が追従し
て、弁開度を調節するこをが出来る。間、前記平均水分
値(%)は0.1秒毎に算出する場合を示したが、制御
弁32の動作特性に応じてこの算出時間の間隔を適宜増
減することにより、正確に制御弁32の動作を追従せし
め得ることは明らかである。This operation signal 31S is outputted regularly every 0.1 seconds, so that the operation of the control valve 32 can reliably follow and adjust the valve opening degree. In the above, the average moisture value (%) is calculated every 0.1 seconds, but by appropriately increasing or decreasing the calculation time interval according to the operating characteristics of the control valve 32, the average moisture value (%) can be calculated accurately. It is clear that it is possible to follow the motion of
(これにて従来の第二の問題点を解消できることとなる
。)次に先に例示した様に換算水分値(%)100ケ毎
について平均する目的について述べる。(This solves the second conventional problem.) Next, the purpose of averaging every 100 converted moisture values (%) as illustrated above will be described.
このことは、先に述べた測定指示精度を向上させると共
に、従来の第三の問題点を解消することに結びつくもの
であり、本発明の最も重要な点である。従来の第三の問
題点で述べた様に同一の光電管にて、検出される鋳物砂
にも水分量のバラッキがあり、更にスリット5,7,9
(第1図)から鋳物砂が落下する場合に、同一水分量で
ありながら、ある鋳物砂はスリット5から落下し、ある
鋳物砂はスリット7から落下する場合が起り得る。これ
に加えて前記設定水分値(第1表)の設定誤差等を考慮
すれば、第6図に示す0.1秒毎の換算水分値(%)a
,b,c・・・・・・i(%)は単に数値化した丈に過
ぎず、その数値(%)の信頼度は極めて低いものとなる
。従ってこれを解消する為に以上例示した通り、100
ケの換算水分値(%)を0.1秒毎に平均した、平均水
分値(%)を求めることによって、測定精度のバラッキ
を挟正しようとするものである。こうして求めた平均水
分値(%)に基づいて前に説明した様に第5図の制御弁
32を制御する為、目標水分値に対する厳密な精度を維
持しつつ適切な水分添加を行なうことが可能となる。具
体的に数値で表現すれば従来精度士0.3%〜士0.5
%を±0.1%以下に向上できることとなる。以上本発
明の効果を纏めて繰り返し述べると、第一に従来に於い
て出来なかった水分値(%)の監視を可能とし、しかも
指示精度を向上させた鋳物砂の水分測定指示装置を可能
とした。This is the most important point of the present invention, as it improves the measurement instruction accuracy mentioned above and also solves the third conventional problem. As mentioned in the third problem with the conventional method, there is variation in the moisture content of the foundry sand detected by the same phototube, and in addition
(FIG. 1), some of the foundry sand may fall from the slit 5 and some from the slit 7 even though they have the same moisture content. In addition to this, considering the setting error of the set moisture value (Table 1), the converted moisture value (%) a every 0.1 seconds shown in Figure 6
, b, c...i (%) is simply the length expressed numerically, and the reliability of the numerical value (%) is extremely low. Therefore, in order to solve this problem, as illustrated above, 100
By calculating the average moisture value (%) obtained by averaging the converted moisture values (%) of 1.0 to 1.0 seconds every 0.1 seconds, it is intended to correct for variations in measurement accuracy. Since the control valve 32 shown in FIG. 5 is controlled as described above based on the average moisture value (%) determined in this way, it is possible to perform appropriate moisture addition while maintaining strict accuracy with respect to the target moisture value. becomes. Specifically expressed in numerical terms, the conventional accuracy is 0.3% to 0.5
% can be improved to ±0.1% or less. To summarize and reiterate the effects of the present invention, firstly, it has made possible to monitor the moisture value (%), which was not possible in the past, and to provide a molding sand moisture measurement and instruction device with improved indication accuracy. did.
第二に水分測定指示装置からの操作信号に対して、水分
添加調節部の作動が確実に追従出釆るような鋳物砂の水
分調節装置を可能とした。第三に上記水分調節装置に於
ける調節精度を従釆の士0.3%〜土0.5%から土0
.1%以下に向上させることが出来る点である。Second, it has become possible to provide a molding sand moisture control device in which the operation of the moisture addition control section reliably follows the operation signal from the moisture measurement instruction device. Thirdly, adjust the accuracy of the moisture adjustment device from 0.3% to 0.5% to 0.
.. This is a point that can be improved to 1% or less.
第1図は従来の水分測定装置を示す断面図、第2図は第
1図の一点鎖線部をA,A′矢視方向から見た断面図、
第3図は第1図の測定装置による測定結果を示す図、第
4図は従来の水分調節方法の実施例図、第5図は本発明
の水分測定及び調節方法の実施例図、第6図は本発明に
於いて第3図の測定結果から水分値を換算する実施例図
、第7図は本発明による換算水分値の平均値を求める実
施例図である。
1,4,6,8,10:トラフ、3,5,7.9:スリ
ット、12P,13P,14P:センサー、18:鋳物
砂、26:混練装置、30:記憶演算装置、30′:指
示制御装置、a,b,c〜−i:換算水分値、a′,b
′,c′〜e′:平均水分値。
ナー図
才2図
才3図
才4図
才5図
才る図
オ7図Fig. 1 is a cross-sectional view showing a conventional moisture measuring device, Fig. 2 is a cross-sectional view of the dashed-dotted line in Fig. 1, viewed from the direction of arrows A and A';
FIG. 3 is a diagram showing the measurement results by the measuring device of FIG. 1, FIG. 4 is an example of the conventional moisture adjustment method, FIG. 5 is an example of the moisture measurement and adjustment method of the present invention, and FIG. The figure is an example diagram for converting the moisture value from the measurement results shown in FIG. 3 in the present invention, and FIG. 7 is an example diagram for calculating the average value of the converted moisture value according to the present invention. 1, 4, 6, 8, 10: trough, 3, 5, 7.9: slit, 12P, 13P, 14P: sensor, 18: foundry sand, 26: kneading device, 30: memory calculation device, 30': instruction Control device, a, b, c to -i: Converted moisture value, a', b
', c' to e': average moisture value. Nah, 2, 3, 4, 5, 5, O, 7
Claims (1)
を設けたトラフに供給し、前記スリツトのいずれから落
下したことを複数個のセンサーで検出して水分値を測定
し、且つこれに基づいて目標水分値を維持するよに、水
分添加量を調節する鋳物砂の水分測定及び調節方法に於
いて、予め前記複数個のセンサーの検出作動の組合せ状
態に対応する水分値を設定し、該設定水分値を記憶させ
た記憶演算装置により、前記複数個のセンサーから送ら
れる検出作動の組合せを、或る一定時間々隔毎に水分値
に換算を行ない、該換算水分値の或る一定個数について
の平均値を、前記一定時間々隔毎に求め、該平均水分値
の指示制御装置への入力とし、監視可能に指示すると共
に、前記混練装置にて水分添加量を調節することを特徴
とする鋳物砂の水分測定及び調節方法。1. Feed foundry sand from a kneading device to a trough provided with a plurality of slits of different widths, detect with a plurality of sensors which of the slits it has fallen from, and measure the moisture content, and based on this, In the method of measuring and adjusting the moisture content of foundry sand to adjust the amount of water added so as to maintain the target moisture value, a moisture value corresponding to the combination state of the detection operations of the plurality of sensors is set in advance, and the moisture value is set. A storage/arithmetic device that stores moisture values converts the combination of detection operations sent from the plurality of sensors into moisture values at certain fixed time intervals, and for a certain fixed number of the converted moisture values. The average value of the kneading apparatus is characterized in that the average value of the kneading apparatus is obtained at regular time intervals, and the average moisture value is inputted to the instruction control device to provide a monitorable instruction and to adjust the amount of water added in the kneading device. Method for measuring and adjusting moisture in foundry sand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383679A JPS602943B2 (en) | 1979-09-05 | 1979-09-05 | Method for measuring and adjusting moisture in foundry sand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11383679A JPS602943B2 (en) | 1979-09-05 | 1979-09-05 | Method for measuring and adjusting moisture in foundry sand |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5637558A JPS5637558A (en) | 1981-04-11 |
| JPS602943B2 true JPS602943B2 (en) | 1985-01-24 |
Family
ID=14622258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11383679A Expired JPS602943B2 (en) | 1979-09-05 | 1979-09-05 | Method for measuring and adjusting moisture in foundry sand |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602943B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124526A (en) * | 1982-01-20 | 1983-07-25 | Shinagawa Refract Co Ltd | Automatic control device for pouring construction equipment |
| JPS60115345A (en) * | 1983-11-25 | 1985-06-21 | Sintokogio Ltd | Method and device for deciding reconditioned molding sand |
-
1979
- 1979-09-05 JP JP11383679A patent/JPS602943B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5637558A (en) | 1981-04-11 |
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