JPS6031232B2 - Heat-melting adhesive for processing electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-melting adhesive used for cutting semiconductor single crystals and precision machining of ceramic materials.

Normally, semiconductor single crystals and piezoelectric ceramics are produced in large blocks, and in order to process them into electronic components,
It is processed into slices with a thickness of approximately 100 to 250 microns in accordance with the crystal axis or polarization direction.

A circular diamond cutter or wire saw is used for this slicing process. Generally, blocks such as semiconductors and piezoelectric ceramics are glued to a holding jig made of an unglazed plate or glass with an adhesive, and then sliced. The cutting at this time is performed until it passes through the adhesive layer and cuts into a part of the holding jig. Therefore, the adhesive used at this time needs to have a strong adhesive force, but it also needs to be able to stably continue machining according to the set slice thickness, and to avoid clogging the diamond cutter and reduce cutting efficiency. It also does not impair cutting accuracy, does not swell or dissolve in the lubricating oil sprayed during leveling work and cause a decrease in adhesive strength, and has excellent workability, especially for adhesion work and peeling work. The adhesive must be easily removed after slicing, the adhesive must be removed by a simple method such as using a solvent or heating, and the slices must not crack or chip, which are extremely difficult conditions. In order to eliminate the above-mentioned drawbacks, the inventors have discovered a basic composition of a hot-melt adhesive consisting of a polyester resin as a main component, other plasticizers, and fillers.

Specifically, 20 to 30 parts by weight of a plasticizer and 40 to 10 parts by weight of an inorganic filler are added to 10 parts by weight of a polyester resin synthesized from trihydroxybalmitic acid and a higher aliphatic dibasic acid. This is a heat-melting type electronic component processing adhesive made by uniformly dispersing and mixing the above-mentioned higher aliphatic dibasic acids, such as suberic acid, azelaic acid, sebacic acid, or sheath. The present invention is a heat-melting adhesive for processing electronic parts, in which the filler added to the filler is barium sulfate, shelium nitride, or a combination of the two. Examples will be described below. Example
1 Trihydroxypalmitic acid (C, 6 days 3205) 1
Mol and 2 moles of Cherolic acid (C,5 mother o06) are dehydrated while heating at a temperature in the range of 140 to 160 oo for 70 minutes under a reduced pressure of 1 ton of Hg to form a brown large panicle. A resinous material was obtained.

After cooling it to room temperature, take it out and pulverize it.
When its melting point was measured, it was in the temperature range of 85 to 11 pi. Next, to the resin thus obtained, 40% tricresyl phosphate as a plasticizer and 200% barium sulfate as an inorganic precipitant were added, and the mixture was heated at 140qo until the resin, plasticizer, and filler were uniformly mixed. It was washed like this for about 30 minutes. As a result, the softening point is 85qo (JIS59
A heat-melting type adhesive having an adhesion shear strength of 60k9/average or higher between aluminum plates was obtained using the 09 round sphere method). In this case, it is important that the amount of plasticizer added is in the range of 20 to 30 g. If the amount is less than 20 g, the adhesive force will not be sufficient and the slices will peel off during slicing.

If the diameter is 30 or more, the diamond cutter is likely to become clogged, resulting in a decrease in cutting efficiency and cutting accuracy. Example
2-trihydroxypalmitic acid-(C, 6 days 3205
) and 1.5 moles of sebacic acid at a temperature in the range of 120 to 140 oC under a vacuum of 100 Hg.
A dehydration reaction was carried out while heating for 0 minutes to obtain a yellow sticky resinous material.

Next, to 200 μm of the resin thus obtained, 50 μm of diethyl phthalate as a plasticizer and 80 μm of nitrided shelium powder as an inorganic filler were added, and the plasticizer and filler were uniformly mixed at a temperature of 140 μm. I worshiped it like this until it was done. As a result, a heat-melting adhesive having a softening point of 8000 (JIS 5909 single sphere method) and an adhesive shear strength between aluminum plates of 40k9/base was obtained. In this case, it is important that the nitride column used as an inorganic filler is in the range of 40 to 100 gr.If the amount added is less than 4 g, the diamond cutter will easily become clogged, making it difficult to perform highly accurate slicing work. No staff available.

On the other hand, if the amount added is more than 10 mm, the adhesive force will not be sufficient and the slices will peel off during slicing. Example 1
The adhesive obtained in step 2 was used for slicing a piezoelectric/magnetic block with a size of 1 x 1 x 5, and a thin plate with a thickness of 100 microns was cut out by 1 square.

At this time, the work of gluing the piezoelectric porcelain block to the unglazed fixing tool is extremely easy and quick, as it only requires preheating the object to be adhered to a temperature of 11 degrees, applying adhesive, and cooling. I was able to do it in time. A donut-shaped diamond cutter with a diameter of 205 mm, an inner diameter of 8 mm, and a thickness of 230 microns was used for the slicing process. As a result, approximately 90% of the thin slices obtained by slicing 1000 women were 1 micron thick, making it possible to process them with extremely high precision. In addition, phenomena such as peeling of the slice from the fixing jig, flying off, and chipping, which occur due to insufficient adhesive strength during slicing, did not occur at all when the adhesive according to the present invention was used. After the slicing process was completed, the adhesive could be completely removed from the sliced surface by simply soaking it in denatured alcohol at room temperature for 30 to 6 minutes.

Claims (1)

[Claims] 1 100 parts by weight of a polyester resin synthesized from trihydroxypalmitic acid and higher aliphatic dibasic acid,
20 to 30 parts by weight of a plasticizer and 40 to 100 parts by weight of an inorganic filler are uniformly dispersed and mixed, and the higher aliphatic dibasic acid is one of suberic acid, azelaic acid, sebacic acid, or sierolic acid. 1. A hot-melting adhesive for processing electronic parts, which is a mixture, and the filler is barium sulfate, boron nitride, or a combination of the two.