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JPS6034785B2 - Sample exchange device for electron beam equipment - Google Patents
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JPS6034785B2 - Sample exchange device for electron beam equipment - Google Patents

Sample exchange device for electron beam equipment

Info

Publication number
JPS6034785B2
JPS6034785B2 JP56039396A JP3939681A JPS6034785B2 JP S6034785 B2 JPS6034785 B2 JP S6034785B2 JP 56039396 A JP56039396 A JP 56039396A JP 3939681 A JP3939681 A JP 3939681A JP S6034785 B2 JPS6034785 B2 JP S6034785B2
Authority
JP
Japan
Prior art keywords
sample
leak
valve
sample exchange
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56039396A
Other languages
Japanese (ja)
Other versions
JPS57154757A (en
Inventor
佳久 南川
洋一 藤倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56039396A priority Critical patent/JPS6034785B2/en
Publication of JPS57154757A publication Critical patent/JPS57154757A/en
Publication of JPS6034785B2 publication Critical patent/JPS6034785B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/18Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)

Description

【発明の詳細な説明】 本発明は電子線装置の試料交換装置に係り、特に、試料
交換装置内への真空リーク手段の改良に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sample exchange device for an electron beam apparatus, and more particularly to an improvement of vacuum leak means into the sample exchange device.

最近は半導体試料の表面に電子線で微細で精密な図形を
描画させる技術が開発されているが、この電子線描画装
置の試料上に塵挨や金属粉等が付着するとその部分は電
子線を遮断するので描画されずに不良品となる。
Recently, a technology has been developed to draw fine and precise patterns on the surface of a semiconductor sample using an electron beam. However, if dust or metal powder adheres to the sample using this electron beam drawing device, that part will be exposed to the electron beam. Since it is blocked, it is not drawn and becomes a defective product.

そのような付着粒子は0.1仏程度の極めて小さなもの
であっても問題となるので、十分な注意を払わなければ
ならない。このような電子線装置は試料に加工を施す試
料室に接続して試料交換室を備えており、試料交換室内
で所定の予備処理を行った後試料導入バルフを開いて試
料室内に導入される。即ち、試料交換室内では試料導入
装置に試料を設置した後所定の真空度となるまで排気し
ている。このときは勿論試料は清浄化され、特に、表面
に塵挨等が付着しないように試料交換室内は清掃されて
いる。しかるに試料交換室内には試料導入バルブや試料
の横移動および上下移動機構を設けてあるので、これら
の機構から金属粉や塵挨が発生することを完全に除くこ
とは不可能である。したがって、試料交換室に空気を急
速に導入してリークさせた時は、この導入空気が試料交
換室内の塵挨等を舞い上らせて清浄化した試料上に付着
させる。従来のリーク弁はリーク速度を制御できなかっ
たので、このような危険性が大きい。また、リーク速度
を遅くるためにリーク弁の閉口面積を小さくする場合も
あるが、リークに要する時間が長くなり実用的でない。
従釆はリーク弁でIJークさせた後浮遊した粒子が落着
くまで待った後、試料を試料交換室内に挿入するように
していたが、装置の稼動率は大幅に低下する。
Even if such adhered particles are extremely small, on the order of 0.1 French, they can become a problem, and therefore sufficient care must be taken. Such electron beam equipment is equipped with a sample exchange chamber connected to the sample chamber where the sample is processed, and after performing predetermined preliminary processing in the sample exchange chamber, the sample is introduced into the sample chamber by opening the sample introduction valve. . That is, the sample exchange chamber is evacuated until a predetermined degree of vacuum is reached after a sample is placed in the sample introduction device. At this time, of course, the sample is cleaned, and in particular, the sample exchange chamber is cleaned to prevent dust from adhering to the surface. However, since the sample exchange chamber is provided with a sample introduction valve and a mechanism for moving the sample horizontally and vertically, it is impossible to completely eliminate the generation of metal powder and dust from these mechanisms. Therefore, when air is rapidly introduced into the sample exchange chamber to cause a leak, the introduced air blows up dust and the like in the sample exchange chamber and deposits it on the cleaned sample. Conventional leak valves pose such a risk because they cannot control the leak rate. Further, in some cases, the closing area of the leak valve is made smaller in order to slow down the leak speed, but this increases the time required for the leak to occur, which is not practical.
The conventional method was to insert the sample into the sample exchange chamber after injecting the IJ with the leak valve and waiting until the suspended particles settled down, but this greatly reduced the operating rate of the device.

また、この場合は試料交換室内に未描画の試料を1枚ず
つ挿入しなければならないので、更に稼動率を低下させ
るという欠点をもっていた。本発明は高品質の製品を高
能率で得ることができる電子線装置の試料交換装置を提
供することを目的とし、その特徴とするところは、試料
交換室内に設置した真空計の真空度を示す出力信号によ
って、リーク弁のりーク速度を制御するごとく構成した
ことにある。
Furthermore, in this case, undrawn samples must be inserted into the sample exchange chamber one by one, which further reduces the operating rate. The purpose of the present invention is to provide a sample exchange device for an electron beam device that can obtain high-quality products with high efficiency. The reason is that the leak speed of the leak valve is controlled by the output signal.

第1図は本発明の一実施例である試料交換装置の系統図
である。
FIG. 1 is a system diagram of a sample exchange device which is an embodiment of the present invention.

試料室1と試料交換室2との間には試料導入バルブ4が
設置されており、試料交襖室2内の上下機構6の上に敷
直した試料3aを移送機構5で押すことにより、試料導
入バルブ4を介して試料室1内に導入することができる
。また、上下機構6の上の他の試料3bは試料3aが加
工されて引出された後に試料室1内に導入して同様に加
工される。このようにして2枚の試料3の上に電子線描
画を実施した後は、試料交換室2内を排気していた真空
排気装置8の排気通路に設けてあるバルブ7を閉じてか
らリーク弁11を徐々に開弁して試料交換室2内を大気
圧に戻し、上の蓋を開いて加工ずみの試料3取り出すよ
うにしている。以上の操作は従来の試料交換装置の操作
と同じであるが、本実施例の装置ではリーク弁11を合
理的に開弁させて試料交換室2内の真空度を制御するた
めに次のような手段を設けている。
A sample introduction valve 4 is installed between the sample chamber 1 and the sample exchange chamber 2, and by pushing the sample 3a, which has been re-placed on the vertical mechanism 6 in the sample exchange chamber 2, with the transfer mechanism 5, The sample can be introduced into the sample chamber 1 via the sample introduction valve 4 . Further, the other sample 3b on the vertical mechanism 6 is introduced into the sample chamber 1 after the sample 3a is processed and pulled out, and processed in the same manner. After performing electron beam lithography on the two samples 3 in this way, close the valve 7 provided in the exhaust passage of the vacuum exhaust device 8 that was evacuating the inside of the sample exchange chamber 2, and then open the leak valve. The valve 11 is gradually opened to return the inside of the sample exchange chamber 2 to atmospheric pressure, and the upper lid is opened to take out the processed sample 3. The above operations are the same as those of conventional sample exchange devices, but in the device of this embodiment, in order to rationally open the leak valve 11 and control the degree of vacuum in the sample exchange chamber 2, the following steps are performed. We have put in place measures to

即ち、試料交換室2内には真空計18を設置し、その出
力信号は真空検出回路19を介して処理装置17に接続
されている。また、リーク弁11に取り付けたりーク検
出器12の出力信号はリーク検出回路13を介して処理
装置17に供給される。このようにして真空計18およ
びリーク弁11の動作状態の検知信号を入力して演算し
た処理装置17は、制御回路16に出力して発信回路1
5より信号を発生させ、駆動回路14の出力によって電
磁弁10の開弁周期を調節する。電磁弁10は空気源9
の圧縮空気をリーク弁11のェアシリンダに送り、リー
ク弁11の開弁度を変化させることによってリーク量を
調節している。このように構成された試料交換装置は、
試料交換室2内への空気リークが室内の塵挨を舞い上ら
せないようなリーク速度となるように設定して置くこと
によって、リーク弁11のリーク状態をリーク検出器1
2および真空計18で検出・測定し乍ら自動的に試料交
換室2内を大気圧まで上昇させることができる。
That is, a vacuum gauge 18 is installed in the sample exchange chamber 2, and its output signal is connected to the processing device 17 via a vacuum detection circuit 19. Further, an output signal from a leak detector 12 attached to the leak valve 11 is supplied to a processing device 17 via a leak detection circuit 13. The processing device 17 that inputs and calculates the detection signals of the operating states of the vacuum gauge 18 and the leak valve 11 in this way outputs them to the control circuit 16 and outputs them to the transmitting circuit 1.
5 generates a signal, and the opening period of the electromagnetic valve 10 is adjusted by the output of the drive circuit 14. Solenoid valve 10 is air source 9
The compressed air is sent to the air cylinder of the leak valve 11, and the amount of leakage is adjusted by changing the degree of opening of the leak valve 11. The sample exchange device configured in this way is
By setting the leak rate so that air leaks into the sample exchange chamber 2 does not stir up dust in the chamber, the leak state of the leak valve 11 can be detected by the leak detector 1.
2 and the vacuum gauge 18, the pressure inside the sample exchange chamber 2 can be automatically raised to atmospheric pressure.

このようにすればリーク初期は極めて少量の空気導入量
であるが、圧力が上昇するにつれて導入量を増加させて
短時間で大気圧とすることができるので、この試料交換
装置の実験効率を向上させることができる。今、リーク
弁11の閉口面積をS、大気圧力をP,、容器内圧力を
P2とすると、このリーク弁1 1のリーク速度はS(
P,一P2)によって定まる。
In this way, an extremely small amount of air is introduced at the beginning of the leak, but as the pressure rises, the amount introduced can be increased to reach atmospheric pressure in a short time, improving the experimental efficiency of this sample exchange device. can be done. Now, if the closed area of the leak valve 11 is S, the atmospheric pressure is P, and the pressure inside the container is P2, then the leak rate of this leak valve 11 is S(
P, - P2).

したがって、試料交換室2内の圧力は空気を導入するこ
とによって次第にP2が上昇するので、P2が増加した
分だけリーク弁11の関口面積を増加させてもリーク速
度には影響しない。即ち、試料交換室2内の粒子が舞い
上らないようなリーク速度を予め実験的に求めてリーク
弁11の関口面積を制御することによって、欠陥を生じ
させない試料交換を行うことができる。上記電磁弁10
はマイクロコンピュータ等を用いた処理装置15が発生
するパルス電流によって間欠的的に開弁しリーク弁11
の開度を調節している。
Therefore, since the pressure inside the sample exchange chamber 2 gradually increases as P2 increases by introducing air, even if the entrance area of the leak valve 11 is increased by the amount that P2 increases, the leak rate is not affected. That is, by experimentally determining in advance a leak rate that does not cause particles in the sample exchange chamber 2 to fly up, and controlling the entrance area of the leak valve 11, it is possible to exchange samples without causing defects. The above solenoid valve 10
The leak valve 11 is opened intermittently by a pulse current generated by a processing device 15 using a microcomputer or the like.
The opening degree is adjusted.

リーク弁11はパルス周波数が高いときは作動しないが
、その周波数が低下するとェアシリンダー全ストローク
の途中、例えば1/10,1/5等で動作し、それに伴
ってリークバルブが半開きの状態となり、周波数の変化
によってバルブの開弁面積を変化させるようにしている
。なお、第1図のりーク弁11は従来から用いられてい
るものと同じもので良い。本実施例の試料交換装置は、
試料交換室内の圧力を検出し乍ら試料室内の塵挨等が舞
い上ることのないようなリーク速度でIJーク弁11を
介して空気を導入することによって、試料交換能率を向
上させることができる。
The leak valve 11 does not operate when the pulse frequency is high, but when the frequency decreases, it operates in the middle of the air cylinder's full stroke, for example, at 1/10, 1/5, etc., and the leak valve becomes half open accordingly. , the opening area of the valve is changed by changing the frequency. Note that the leak valve 11 shown in FIG. 1 may be the same as that conventionally used. The sample exchange device of this example is as follows:
The efficiency of sample exchange can be improved by introducing air through the IJ leak valve 11 at a leak rate that does not cause dust or the like to fly up inside the sample chamber while detecting the pressure inside the sample exchange chamber. can.

また、試料交換室内には複数枚の試料を収容して実験効
率を高めることができる等の効果が得られる。上記実施
例ではリーク弁11を作動させるェアシIJンダに圧縮
空気を導入したが、一般に用いられているニードルスロ
ーリーク便をパルスモーターで回転調節させても同様の
効果が得られる。
Moreover, effects such as being able to accommodate a plurality of samples in the sample exchange chamber and increasing experimental efficiency can be obtained. In the above embodiment, compressed air was introduced into the air cylinder to operate the leak valve 11, but the same effect can be obtained by adjusting the rotation of a commonly used needle slow leak stool using a pulse motor.

なお、パルスモーターの代りにサーボモーターや回転速
度が一定であるモ−ターを用いても良い。この場合は圧
縮空気を用いていないで電気的に行なっているので、更
に簡単な構成となる。本発明の電子線装置の試料交換装
置は、試料交換室内に空気を導入するりーク時間を短縮
して実験効率を高め、試料に塵挨等を付着させることな
く高品質の加工試料を効率良く得ることができるという
効果が得られる。
Note that a servo motor or a motor with a constant rotation speed may be used instead of the pulse motor. In this case, since the process is performed electrically without using compressed air, the configuration is even simpler. The sample exchange device of the electron beam apparatus of the present invention improves experimental efficiency by shortening the leak time for introducing air into the sample exchange chamber, and efficiently processes high-quality processed samples without causing dust or the like to adhere to the sample. You can get the effect that you can.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例である試料交換装置の説明図
である。 1・・・・・・試料室、2・・・・・・試料交換室、3
・・・・・・試料、4・・・・・・試料導入バルブ、5
・・・・・・移送機構、6・・・・・・上下機構、7…
・・・バルブ、8・・・・」・真空排気装層、9・・・
・・・空気源、10・・・・・・電磁弁、11・・…・
リーク弁、12・・・・・・リーク検出器、13……リ
ーク検出回路、14・・…・駆動回路、15・・・…発
信回路、16・・・・・・制御回路、17・・・・・・
処理装置、18・・・・・・真空計、19・・・・・・
真空検出回路。
FIG. 1 is an explanatory diagram of a sample exchange device which is an embodiment of the present invention. 1...Sample room, 2...Sample exchange room, 3
...Sample, 4...Sample introduction valve, 5
...Transfer mechanism, 6...Vertical mechanism, 7...
・・・Valve, 8...''・Vacuum exhaust layer, 9...
...Air source, 10...Solenoid valve, 11...
Leak valve, 12... Leak detector, 13... Leak detection circuit, 14... Drive circuit, 15... Transmission circuit, 16... Control circuit, 17...・・・・・・
Processing device, 18... Vacuum gauge, 19...
Vacuum detection circuit.

Claims (1)

【特許請求の範囲】[Claims] 1 試料室とは試料導入バルブを介して連通し、真空排
気装置とはバルブを介して連通し、リーク弁と試料移送
機構を取り付けた試料交換室を有する電子線装置の試料
交換装置において、上記試料交換室内に設置した真空計
の真空度を示す出力信号によつて、上記リーク弁のリー
ク速度を制御するごとく構成したことを特徴とする電子
線装置の試料交換装置。
1 In a sample exchange device for an electron beam device having a sample exchange chamber that communicates with the sample chamber via a sample introduction valve, communicates with the vacuum exhaust device via a valve, and is equipped with a leak valve and a sample transfer mechanism, the above-mentioned A sample exchange device for an electron beam apparatus, characterized in that the leak rate of the leak valve is controlled by an output signal indicating the degree of vacuum from a vacuum gauge installed in the sample exchange chamber.
JP56039396A 1981-03-20 1981-03-20 Sample exchange device for electron beam equipment Expired JPS6034785B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56039396A JPS6034785B2 (en) 1981-03-20 1981-03-20 Sample exchange device for electron beam equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56039396A JPS6034785B2 (en) 1981-03-20 1981-03-20 Sample exchange device for electron beam equipment

Publications (2)

Publication Number Publication Date
JPS57154757A JPS57154757A (en) 1982-09-24
JPS6034785B2 true JPS6034785B2 (en) 1985-08-10

Family

ID=12551829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56039396A Expired JPS6034785B2 (en) 1981-03-20 1981-03-20 Sample exchange device for electron beam equipment

Country Status (1)

Country Link
JP (1) JPS6034785B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220041877A (en) * 2019-07-31 2022-04-01 라이카 카메라 악티엔게젤샤프트 sensor unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325803B2 (en) * 2010-01-28 2013-10-23 株式会社日立ハイテクノロジーズ Pre-evacuation vacuum apparatus and charged particle beam apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220041877A (en) * 2019-07-31 2022-04-01 라이카 카메라 악티엔게젤샤프트 sensor unit

Also Published As

Publication number Publication date
JPS57154757A (en) 1982-09-24

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