JPS6035390B2 - Adhesive resin composition - Google Patents
Adhesive resin compositionInfo
- Publication number
- JPS6035390B2 JPS6035390B2 JP5561276A JP5561276A JPS6035390B2 JP S6035390 B2 JPS6035390 B2 JP S6035390B2 JP 5561276 A JP5561276 A JP 5561276A JP 5561276 A JP5561276 A JP 5561276A JP S6035390 B2 JPS6035390 B2 JP S6035390B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- resin composition
- inorganic filler
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title claims description 10
- 239000004840 adhesive resin Substances 0.000 title claims description 8
- 229920006223 adhesive resin Polymers 0.000 title claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000011256 inorganic filler Substances 0.000 claims description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 14
- 229920006122 polyamide resin Polymers 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical group [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 22
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000004576 sand Substances 0.000 description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 17
- 239000011342 resin composition Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 229910052956 cinnabar Inorganic materials 0.000 description 9
- -1 glycidyl ester Chemical class 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000004927 clay Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 235000012222 talc Nutrition 0.000 description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- LMVLMHGTZULBRX-UHFFFAOYSA-N 2-[2,2,2-tris(2-hydroxyphenyl)ethyl]phenol Chemical compound OC1=CC=CC=C1CC(C=1C(=CC=CC=1)O)(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LMVLMHGTZULBRX-UHFFFAOYSA-N 0.000 description 1
- VSKXJRZPVDLHFY-UHFFFAOYSA-N 2-methylcyclohexane-1-carboxylic acid Chemical compound CC1CCCCC1C(O)=O VSKXJRZPVDLHFY-UHFFFAOYSA-N 0.000 description 1
- PAVVCVOUEPIKQF-UHFFFAOYSA-N 3-phenylpropane-1,1,1-triol Chemical compound OC(O)(O)CCC1=CC=CC=C1 PAVVCVOUEPIKQF-UHFFFAOYSA-N 0.000 description 1
- JKETWUADWJKEKN-UHFFFAOYSA-N 4-(3,4-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 JKETWUADWJKEKN-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- ZUGAOYSWHHGDJY-UHFFFAOYSA-K 5-hydroxy-2,8,9-trioxa-1-aluminabicyclo[3.3.2]decane-3,7,10-trione Chemical compound [Al+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O ZUGAOYSWHHGDJY-UHFFFAOYSA-K 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical class CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- NHOWLEZFTHYCTP-UHFFFAOYSA-N benzylhydrazine Chemical compound NNCC1=CC=CC=C1 NHOWLEZFTHYCTP-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- MRVZORUPSXTRHD-UHFFFAOYSA-N bis(hydroxymethyl)phosphorylmethanol Chemical compound OCP(=O)(CO)CO MRVZORUPSXTRHD-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001354 calcium citrate Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000011280 coal tar Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 150000004759 cyclic silanes Chemical class 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- MGHPNCMVUAKAIE-UHFFFAOYSA-N diphenylmethanamine Chemical compound C=1C=CC=CC=1C(N)C1=CC=CC=C1 MGHPNCMVUAKAIE-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052621 halloysite Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000004337 magnesium citrate Substances 0.000 description 1
- 229960005336 magnesium citrate Drugs 0.000 description 1
- 235000002538 magnesium citrate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZZYXNRREDYWPLN-UHFFFAOYSA-N pyridine-2,3-diamine Chemical compound NC1=CC=CN=C1N ZZYXNRREDYWPLN-UHFFFAOYSA-N 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000011083 sodium citrates Nutrition 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- PLSARIKBYIPYPF-UHFFFAOYSA-H trimagnesium dicitrate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O PLSARIKBYIPYPF-UHFFFAOYSA-H 0.000 description 1
- KNXVOGGZOFOROK-UHFFFAOYSA-N trimagnesium;dioxido(oxo)silane;hydroxy-oxido-oxosilane Chemical compound [Mg+2].[Mg+2].[Mg+2].O[Si]([O-])=O.O[Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O KNXVOGGZOFOROK-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
本発明は湿潤面または水中下にて充分に硬化するととも
に、湿潤面または水中下にて樹脂組成物コンクリ−ト、
岡山管等の被着体を公知の材料に比して著しく強固に接
着する水中接着用樹脂組成物に関するものであり、特に
樹脂組成物構造体、例えば骨材を樹脂マトリックスで結
合したレジンコンクリート等の地下埋設用構造体の水漏
れ等の補修用接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention cures resin composition concrete sufficiently on a wet surface or under water, and cures resin composition concrete on a wet surface or under water.
It relates to a resin composition for underwater adhesion that bonds adherends such as Okayama pipes significantly more strongly than known materials, and in particular to resin composition structures, such as resin concrete in which aggregate is bonded with a resin matrix. This product relates to an adhesive for repairing water leaks in underground structures.
近年、下水道工事、地下鉄工事等の土木建設分野で湧水
地帯での作業が多くなり、かかる場合での被着体の接合
作業或いは止水作業には種々の接着剤或いは止水用目止
め剤が使用されているが公知の接着剤或いは止水用目止
め剤で湿潤面或いは水中下での接着強度が充分で、かつ
長期性能が良好なるものの存在は例を見ていない。In recent years, work in the field of civil engineering such as sewerage work and subway construction has increased in areas with spring water, and in such cases, various adhesives or sealants are used for bonding work of adherends or work to stop water. However, there have been no known adhesives or water sealants that have sufficient adhesive strength on wet surfaces or under water and have good long-term performance.
本発明者等はかかる公知の水中接着剤或いは止水用目止
め剤の欠点を改良すべく鋭意研究した結果、本発明にか
かる組成物を用いることによって、水中接着強度が極め
てすぐれ、かつ長期性能も良好となることを見出し、こ
の知見に基づいて本発明を完成するにいたつた。The present inventors have conducted intensive research to improve the drawbacks of such known underwater adhesives or water sealants, and have found that by using the composition according to the present invention, underwater adhesive strength is extremely excellent and long-term performance is achieved. It was also found that the present invention was completed based on this finding.
すなわち、本発明によれば、
1 ェポキシ樹脂:10の重量部
2 ポリァミド系樹脂:上記樹脂を硬化させるのに必要
な重量部3 蛙酸塩を主成分とする無機充填剤:10〜
250重量部を含む無機充填剤:30〜65の重量部4
シラン処理剤:0.03〜5.の重量部からなる水中
接着用樹脂組成物を与えることにより、強固な水中接着
強度を有し、かつすぐれた長期性能をもった水中接着剤
、止水用目止め剤が得られる。That is, according to the present invention, 1 Epoxy resin: 10 parts by weight 2 Polyamide resin: 3 parts by weight necessary for curing the resin Inorganic filler whose main component is frog salt: 10~
Inorganic filler containing 250 parts by weight: 30-65 parts by weight 4
Silane treatment agent: 0.03-5. By providing an underwater adhesive resin composition consisting of parts by weight of , it is possible to obtain an underwater adhesive and a water-stopping filler having strong underwater adhesive strength and excellent long-term performance.
本発明組成物は前述の各成分を充分に淀練することによ
り得られるが、以下に本発明を具体的に詳述する。The composition of the present invention can be obtained by thoroughly stirring the above-mentioned components, and the present invention will be specifically described below.
本発明に使用するヱポキシ樹脂は公知であり、1分子中
に少なくとも2個以上のェポキシ基を有する化合物で、
例えばグリシジルェポキシ樹脂のうち、グリシジルェー
テル類としてはビスフェノールAのジグリシジルエーテ
ル、レゾルシノールのジグリシジルエーテル、テトラク
ロロビスフエノールAのジグリシジルエーテル、ブタン
ジオ−ルのジグリシジルエーテル、ポリプロピレングリ
コールのジグリシジルエーテル、1.3ービス〔3(2
,3−エポキシプロポキシ)プロピル〕テトラメチルジ
オキサン、グリセリンのテトラグリシジルエーテル、ト
リス−(ヒドロキシメチル)−フオスフインオキサイド
のトリグリシジルエーナル、トリヒドロキシフエニルプ
ロパンのトリグリシジルエーテル、ポリアリルグリシジ
ルエーナル、テトラキス(ヒドロキシフエニル)エタン
のテトラグリシジルエーテル、エポキシノボラツク、環
状シランェポキシ等が挙げられ、グリシジルェステル類
としてはフタル酸グリシジルヱステル、リノレィン酸ダ
ィマーのグリシジルェステル等が挙げられ、グリシジル
アミン類としてはN−グリシジルアニリン、4,4′ジ
(メチル、グリシジル)アミノジフエニルメタン、pー
アミノフエノールのグリシジルエーテル、グリシジルア
ミン等が挙げられる。The epoxy resin used in the present invention is a well-known compound having at least two or more epoxy groups in one molecule.
For example, among glycidylepoxy resins, the glycidyl ethers include diglycidyl ether of bisphenol A, diglycidyl ether of resorcinol, diglycidyl ether of tetrachlorobisphenol A, diglycidyl ether of butanediol, and diglycidyl ether of polypropylene glycol. Glycidyl ether, 1.3-bis[3(2
, 3-epoxypropoxy)propyl]tetramethyldioxane, tetraglycidyl ether of glycerin, triglycidyl ether of tris-(hydroxymethyl)-phosphine oxide, triglycidyl ether of trihydroxyphenylpropane, polyallylglycidyl ether, Examples of the glycidyl esters include tetraglycidyl ether of tetrakis(hydroxyphenyl)ethane, epoxy novolac, and cyclic silane epoxy. Examples of the glycidyl esters include glycidyl ester of phthalate and glycidyl ester of linoleic acid dimer. Examples include N-glycidylaniline, 4,4' di(methyl, glycidyl)aminodiphenylmethane, glycidyl ether of p-aminophenol, and glycidylamine.
更に非グリシジルェポキシ樹脂としては、レモネン・ジ
オキサイド、ビニルシクロヘキセンジオキサイド、3,
4エポキシー6メチルシクロヘキシルーメチルー3,4
ーヱポキシー6ーメチルーシクロヘキサンカルボキシー
ト、ビス(3,4ーエポキシー6−メチルシクロヘキシ
ルメチル)アジベート、エポキシ化ポリオレフイン、ェ
ポキシ化大豆油等が挙げられる。特に一般的に使用され
ているビスフェノールA−ェピクロルヒドリン縮合物の
ェポキシ当量180〜200ェポキシ樹脂が有効である
。本発明に使用するポリアミド系樹脂はアミノ基とカル
ポキシル基が作用して得られる物質で、分子中に−NH
CO−の如き結合を1個以上有する高分子化合物で、前
記ヱポキシ樹脂を硬化可能な物質である。Furthermore, non-glycidyl epoxy resins include lemonene dioxide, vinylcyclohexene dioxide, 3,
4 epoxy 6 methyl cyclohexyl methyl-3,4
Examples include -epoxy 6-methyl-cyclohexane carboxylate, bis(3,4-epoxy 6-methylcyclohexylmethyl)adibate, epoxidized polyolefin, and epoxidized soybean oil. In particular, a commonly used epoxy resin made from a bisphenol A-epichlorohydrin condensate having an epoxy equivalent of 180 to 200 is effective. The polyamide resin used in the present invention is a substance obtained by the interaction of amino groups and carpoxyl groups, and -NH
It is a polymer compound having one or more bonds such as CO-, and is a substance capable of curing the above-mentioned epoxy resin.
具体的には、トーマィド(富士化成)、サンマィド(三
和化学)、ラックマィド(大日本インキ)、Lubri
zol(L地rjzoICorp)、バーサミド(第一
ゼネラル)等が挙げられる。特に、芳香族ポリアミン、
例えばメタフェニレンジアミン、ジアミノジフエニルメ
タン、ジアミノジフエニルスルフオン、キシリレンジア
ミン、アミノベンジルアミン、ベンジジン、4700一
0−フエニレンジアミン、Bis(3.4−ジアミノフ
エニル)スルフオン、ジアミノピリジン等をポリアミン
として使用したポリアミド系樹脂が有効である。Specifically, Tormide (Fuji Kasei), Sunmide (Sanwa Chemical), Lucmide (Dainippon Ink), Lubri
Examples include zol (LJZOIC Corp), versamide (Daiichi General), and the like. In particular, aromatic polyamines,
For example, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfon, xylylenediamine, aminobenzylamine, benzidine, 4700-0-phenylenediamine, Bis(3,4-diaminophenyl)sulfone, diaminopyridine, etc. Polyamide resin used as polyamine is effective.
またこれらのポリアミド系樹脂に(環状)脂肪族ポリア
ミン、ポリメルカプタン等の速硬化性或いは低温硬化性
のェポキシ樹脂硬化剤を必要添加すれば低温(例えば0
00)硬化型の水中接着剤が得られる。In addition, if a fast-curing or low-temperature curing epoxy resin curing agent such as (cyclo)aliphatic polyamine or polymercaptan is added to these polyamide resins, it can be cured at low temperatures (for example, 0
00) A curable underwater adhesive is obtained.
本発明に使用する桂酸塩を主成分とする無機充填剤は、
例えば桂酸マグネシウム、桂酸アルミニウム、桂酸カル
シウム、桂酸カリウム、桂酸ナトリウム、等の桂酸塩を
主成分とする無機充填剤で具体的には滑石、ソープスト
ーン、タルカム、フレンチチョーク、ステアタィト等と
いったタルク類、カオリナイト、デツカサイト、ハロイ
サイトセリサイト、パイロフイライト、モンモリロナイ
ト、ベントナィト、酸性白土等といったクレー類等が挙
げられる。The inorganic filler mainly composed of citrate used in the present invention is
For example, inorganic fillers mainly composed of citrate salts such as magnesium citrate, aluminum citrate, calcium citrate, potassium citrate, sodium citrate, etc. Specifically, talc, soapstone, talcum, French chalk, and steatite. Examples include talcs such as kaolinite, detsukasite, halloysite sericite, pyrophyllite, montmorillonite, bentonite, and clays such as acid clay.
前述のェポキシ樹脂100重量部に対し、上記桂酸塩を
主成分とする無機充填剤は1〜30の重量部好ましくは
10〜25の重量部を配合することが望ましい。It is desirable to mix 1 to 30 parts by weight, preferably 10 to 25 parts by weight, of the above-mentioned inorganic filler whose main component is citrate to 100 parts by weight of the above-mentioned epoxy resin.
また蛙酸塩を主成分とする無機充填剤とともに鉄粉、鋼
粉、アルミニウム粉、銀粉等の金属粉を10〜200重
量部を配合するとより接着強度の高い水中接着剤が得ら
れ、さらに石英粉、桂砂、ホワイトカーボン、川砂、等
のSi02を含む無機充填剤を10〜20の重量部添加
すると有効である。本発明に使用するシラン処理剤は、
アミノシラン類、ェポキシシラン類、等貝体的にはy−
ァミ/プロピルトリエトキシシラン、N一B一(アミノ
エチル)一yーアミノプロピルトリメトキシシラン、y
−グリシドキシブロピルトリメトキシシラン、8−(3
,4ーエポキシシクロヘキシル)エチルートリメトキシ
シラン等が挙げられる。かかるシラン処理剤は前述のェ
ポキシ樹脂100重量部に対して0.03〜5.0重量
部配合することが望ましい。本発明にかかる樹脂組成物
は他に増量剤、補強剤等を混合してもよい。In addition, when 10 to 200 parts by weight of metal powder such as iron powder, steel powder, aluminum powder, or silver powder is mixed with an inorganic filler whose main component is quartz salt, an underwater adhesive with higher adhesive strength can be obtained. It is effective to add 10 to 20 parts by weight of an inorganic filler containing Si02, such as powder, cinnabar sand, white carbon, river sand, etc. The silane treatment agent used in the present invention is
Aminosilanes, epoxysilanes, etc.
Ami/propyltriethoxysilane, N-B-(aminoethyl)-aminopropyltrimethoxysilane, y
-glycidoxypropyltrimethoxysilane, 8-(3
, 4-epoxycyclohexyl)ethyltrimethoxysilane, and the like. It is desirable that such a silane treatment agent be blended in an amount of 0.03 to 5.0 parts by weight per 100 parts by weight of the above-mentioned epoxy resin. The resin composition according to the present invention may also contain other fillers, reinforcing agents, and the like.
これのものとしては例えば、コールタール、ガラス繊維
、アスベスト繊維ほう素繊維、送素繊維、セルロース、
ビニロン繊維等の有機繊維、ポリエチレン粉、ポリプロ
ピレン粉、アスベスト粉、スレート粉、酸化アルミニウ
ム、水酸化アルミニウム、チョーク粉、カーボンブラッ
ク、グラフアイトなどがあり、これらのいずれもその用
途に応じ有効に用いることができる。さらに本発明にか
かる樹脂組成物の使用にあたっては、水中に流し込む方
法、湿潤面にコープィングする方法等種々の方法が考え
られるが、接着強度をより向上させるためには、被着部
分をブラスト処理することによって、表面の汚れ等をと
り除くと共に接着面積を多くすることが有効である。以
下に本発明の態様を明確にするため、実施例を挙げて説
明するが、本発明は実施例によってその範囲を制限され
るものではない。Examples of these include coal tar, glass fiber, asbestos fiber, boron fiber, dye fiber, cellulose,
There are organic fibers such as vinylon fiber, polyethylene powder, polypropylene powder, asbestos powder, slate powder, aluminum oxide, aluminum hydroxide, chalk powder, carbon black, graphite, etc., and any of these can be used effectively depending on the purpose. I can do it. Furthermore, various methods are conceivable for using the resin composition of the present invention, such as pouring it into water and coping it on a wet surface, but in order to further improve the adhesive strength, it is recommended that the adhered part be subjected to blasting treatment. By doing so, it is effective to remove dirt and the like from the surface and increase the bonding area. EXAMPLES In order to clarify aspects of the present invention, examples will be described below, but the scope of the present invention is not limited by the examples.
実施例 1
ビスフェノールA型ヱポキシ樹脂ェピコート828(シ
ェル化学):10の重量部に分子構造中に芳香族基を持
つポリアミド系樹脂トーマィド5000(富士化成):
55重量部、夕ルク:10の重量部、桂砂7号:5の重
量部、砂鉄:3の重量部およびy−グリシドキシプロピ
ルトリメトキシシランA−187(U.C.C):1重
量部を混合し、一週間水中に放置した被着体(援着面積
6×6cのを接着間隙を1.0肌として上記渥合物を水
中で流込み、水中硬化させると共に、1日間水中養生し
、4点曲げ試験法により接着曲げ強度を測定した。Example 1 Bisphenol A type epipoxy resin Epicoat 828 (Shell Chemical Co., Ltd.): 10 parts by weight of polyamide resin Tomide 5000 (Fuji Kasei Co., Ltd.) having an aromatic group in its molecular structure:
55 parts by weight, Yuruk: 10 parts by weight, cinnabar sand No. 7: 5 parts by weight, iron sand: 3 parts by weight, and y-glycidoxypropyltrimethoxysilane A-187 (U.C.C.): 1 Parts by weight were mixed and left in water for one week.The above composite was poured into water with an adhesion gap of 1.0 cm on an adherend (adhered area: 6 x 6 cm), cured in water, and left in water for one day. After curing, the adhesive bending strength was measured using a four-point bending test method.
結果は下表に示す通りとなった。比較例 1
ビスフェノールA型ェポキシ樹脂ェピコート828:1
00重量部にポリアミンTTA(トリエチレンテトラミ
ン):10重量部、タルク:100重量部、桂砂7号:
5の重量部、砂鉄:3の重量部、およびyーグリシドキ
シプロピルトリメトキシシランA−187:1重量部を
混合し、実施例1の樹脂組成物‘3}を被着体とし、実
施例1と同様に処理した。The results were as shown in the table below. Comparative Example 1 Bisphenol A epoxy resin Epicoat 828:1
00 parts by weight, polyamine TTA (triethylenetetramine): 10 parts by weight, talc: 100 parts by weight, cinnabar sand No. 7:
5 parts by weight, iron sand: 3 parts by weight, and y-glycidoxypropyltrimethoxysilane A-187: 1 part by weight were mixed, and the resin composition '3} of Example 1 was used as an adherend. It was treated in the same manner as in Example 1.
接着曲げ強度は30kg/のであった。比較例 2ビス
フヱノールA型ェポキシ樹脂ェピコート828:10の
重量部にポリアミド系樹脂トーマィド5000:55重
量部、桂砂7号:5の重量部、砂鉄:30重量部および
y−グリシドキシプロピルトリメトキシシラソA−18
7:1重量部を混合し、実施例1の樹脂組成物【3}を
被着体とし、実施例1と同様に処理した。The adhesive bending strength was 30 kg/. Comparative Example 2 Bisphenol A type epoxy resin Epicoat 828:10 parts by weight, polyamide resin Tomide 5000:55 parts by weight, cinnabar sand No. 7:5 parts by weight, iron sand: 30 parts by weight and y-glycidoxypropyltrimethoxy Silaso A-18
7:1 part by weight was mixed, and the resin composition [3} of Example 1 was used as an adherend and treated in the same manner as in Example 1.
接着曲げ強度は70k9/cめであった。比較例 3ビ
スフェノ−ルA型ェポキシ樹脂ェピコート828:10
0重量部にボリアミド系樹脂トーマィド5000:55
重量部、タルク:100重量部、桂砂7号:5の重量部
、砂鉄:3の重量部を混合し、実施例1の樹脂組成物‘
3’を被看体とし、実施例1と同様に処理した。The adhesive bending strength was 70k9/c. Comparative example 3 Bisphenol A type epoxy resin Epicoat 828:10
Boryamide resin Tomide 5000:55 to 0 parts by weight
Parts by weight, 100 parts by weight of talc, 5 parts by weight of cinnabar sand No. 7, and 3 parts by weight of iron sand were mixed to form the resin composition of Example 1.
3' was used as the subject and treated in the same manner as in Example 1.
接着曲げ強度は83k9/めであった。実施例 2ビス
フェノールA型ェポキシ樹脂ェピコート828:10の
重量部にポリアミド系樹脂トーマイド5000:55重
量部、クレー(ホワイトテックス):10の重量部、桂
砂7号:70重量部、砂鉄:5の重量部、およびy−グ
リシドキシプロピルトリメトキシシランA−187:1
重量部を混合し、実施例1の樹脂組成物{3}を被着体
とし、実施例1と同機に処理した。The adhesive bending strength was 83k9/m. Example 2 Bisphenol A type epoxy resin Epicoat 828:10 parts by weight, polyamide resin Tomide 5000: 55 parts by weight, clay (White Tex): 10 parts by weight, cinnabar sand No. 7: 70 parts by weight, iron sand: 5 parts by weight. parts by weight, and y-glycidoxypropyltrimethoxysilane A-187:1
Parts by weight were mixed, and the resin composition {3} of Example 1 was used as an adherend and processed in the same machine as Example 1.
接着曲げ強度は168k9/めであった。実施例 3ビ
スフェノールA型ェポキシ樹脂ェピコート828:10
の重量部にポリアミド系樹脂トーマイド5000:55
重量部、クレー(ホワイトテツクス):10の重量部、
桂砂7号:70重量部、およびyーグリシドキシプロピ
ルトリメトキシシランA−187:1重量部を混合し、
実施例1の樹脂組成物脚を被着体とし、実施例1と同様
に処理した。The adhesive bending strength was 168k9/m. Example 3 Bisphenol A epoxy resin Epicoat 828:10
The weight part of polyamide resin Tomide 5000:55
Parts by weight, clay (white text): 10 parts by weight,
Mixing 70 parts by weight of cinnabar sand No. 7 and 1 part by weight of y-glycidoxypropyltrimethoxysilane A-187,
The resin composition legs of Example 1 were used as adherends and treated in the same manner as in Example 1.
接着曲げ強度は120k9/めであった。実施例4
リノレン酸の2量体1モルとジェチレントリアミン2モ
ルを反応して得られた分子構造中に芳香族基を持たない
ポリアミド系樹脂:5の重量部とビスフェノールA型ェ
ポキシ樹脂ェピコート828:100重量部、クレー(
ホワイトテックス):10の重量部、桂砂7号:7の重
量部、砂鉄:5の雲量部、およびyーグリシドキシプロ
ピルトリメトキシシランA−187:1重量部を混合し
、実施例1の樹脂組成物■を被着体とし、実施例1と同
様に処理した。The adhesive bending strength was 120k9/m. Example 4 5 parts by weight of a polyamide resin without aromatic groups in the molecular structure obtained by reacting 1 mole of linolenic acid dimer with 2 moles of jettylene triamine and bisphenol A epoxy resin Epicoat 828. : 100 parts by weight, clay (
Example 1: White Tex): 10 parts by weight, cinnabar sand No. 7: 7 parts by weight, iron sand: 5 parts by weight, and y-glycidoxypropyltrimethoxysilane A-187: 1 part by weight. The resin composition (2) was used as an adherend and treated in the same manner as in Example 1.
接着曲げ強度は110k9/めであった。実施例 5グ
リシジルェステル型ェポキシ樹脂ェピコート190(シ
ェル化学):10の重量部にポリアミド系樹脂トーマィ
ド5000:5の重量部、クレー(ホワイトテックス)
:100重量部、桂砂7号:70重量部、砂鉄:5の重
量部、およびy−グリシドキシプロピルトリメトキシシ
ランA−187:1重量部を混合し、実施例1の樹脂組
成物‘3}を被着体とし、実施例1と同機に処理した。The adhesive bending strength was 110k9/m. Example 5 Glycidyl ester type epoxy resin Epicoat 190 (Shell Chemical): 10 parts by weight, polyamide resin Tomide 5000: 5 parts by weight, clay (White Tex)
: 100 parts by weight, cinnabar sand No. 7: 70 parts by weight, iron sand: 5 parts by weight, and y-glycidoxypropyltrimethoxysilane A-187: 1 part by weight were mixed to form the resin composition of Example 1. 3} was used as the adherend and processed in the same manner as in Example 1.
接着曲げ強度は130k9/めであった。実施例 6
ビスフェノールA型ェポキシ樹脂ェピコート828:1
0の重量部にポリアミド系樹脂トーマイド5000:5
5重量部、クレー(ホワイトテツクス):10の重量部
畦砂7号:70重量部、砂鉄:50重量部、およびyー
アミノプロピルトリェトキシシランA−1100(U.
C.C):1重量部を混合し、実施例1の樹脂組成物脚
を被着体とし、実施例1と同様に処理した。The adhesive bending strength was 130k9/m. Example 6 Bisphenol A epoxy resin Epiquat 828:1
0 weight part to polyamide resin Tomide 5000:5
5 parts by weight, clay (white text): 10 parts by weight, ridge sand No. 7: 70 parts by weight, iron sand: 50 parts by weight, and y-aminopropyltriethoxysilane A-1100 (U.
C. C): 1 part by weight was mixed and treated in the same manner as in Example 1 using the resin composition leg of Example 1 as an adherend.
Claims (1)
る無機充填剤、10〜250重量部を含む無機充填剤、
30〜650重量部、シラン処理剤、0.03〜5.0
重量部、及び上記樹脂を硬化させるのに必要なポリアミ
ド系樹脂からなる接着用樹脂組成物。 2 エポキシ樹脂が、グリシジルエポキシ樹脂である請
求範囲1記載の接着用樹脂組成物。 3 グリシジルエポキシ樹脂がビスフエノールA型エポ
キシ樹脂である請求範囲1記載の接着用樹脂組成物。 4 シラン処理剤がアミノシラン類またはエポキシシラ
ン類である請求範囲1記載の接着用樹脂組成物。 5 無機充填剤が硅酸塩を主成分とする無機充填剤:1
0〜250重量部および金属粉:10〜200重量部を
含む無機充填剤:30〜650重量部である請求範囲1
記載の接着用樹脂組成物。 6 無機充填剤が硅酸塩を主成分とする無機充填剤:1
0〜250重量部、金属粉:10〜200重量部および
SiO_2分を含む無機充填剤10〜200重量部であ
る請求範囲1記載の接着用樹脂組成物。 7 ポリアミド系樹脂が分子構造中に芳香族基を有する
ポリアミド系樹脂である請求範囲1記載の接着用樹脂組
成物。[Scope of Claims] 1. An inorganic filler containing 100 parts by weight of an epoxy resin and 10 to 250 parts by weight of an inorganic filler whose main component is silicate;
30-650 parts by weight, silane treatment agent, 0.03-5.0
parts by weight, and a polyamide resin necessary for curing the resin. 2. The adhesive resin composition according to claim 1, wherein the epoxy resin is a glycidyl epoxy resin. 3. The adhesive resin composition according to claim 1, wherein the glycidyl epoxy resin is a bisphenol A type epoxy resin. 4. The adhesive resin composition according to claim 1, wherein the silane treatment agent is an aminosilane or an epoxysilane. 5 Inorganic filler whose main component is silicate: 1
Claim 1: 0 to 250 parts by weight and 30 to 650 parts by weight of an inorganic filler containing 10 to 200 parts by weight of metal powder.
The adhesive resin composition described above. 6 Inorganic filler whose main component is silicate: 1
2. The adhesive resin composition according to claim 1, which contains 0 to 250 parts by weight of the inorganic filler, 10 to 200 parts by weight of metal powder, and 10 to 200 parts by weight of the inorganic filler containing SiO_2. 7. The adhesive resin composition according to claim 1, wherein the polyamide resin has an aromatic group in its molecular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5561276A JPS6035390B2 (en) | 1976-05-15 | 1976-05-15 | Adhesive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5561276A JPS6035390B2 (en) | 1976-05-15 | 1976-05-15 | Adhesive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52138532A JPS52138532A (en) | 1977-11-18 |
| JPS6035390B2 true JPS6035390B2 (en) | 1985-08-14 |
Family
ID=13003578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5561276A Expired JPS6035390B2 (en) | 1976-05-15 | 1976-05-15 | Adhesive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035390B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0534735U (en) * | 1991-10-08 | 1993-05-07 | 株式会社ケンウツド | Compound sound device |
| US20200368004A1 (en) * | 2018-01-30 | 2020-11-26 | Toei Electric Co., Ltd. | Lateral branch detection device, lateral branch detection probe, lateral branch detection method, and program for same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5481360A (en) * | 1977-12-12 | 1979-06-28 | Toshiba Corp | Insulating resin composition |
| JPS5759975A (en) * | 1980-09-29 | 1982-04-10 | Takeda Chem Ind Ltd | Adhesive composition |
| JPS57133117A (en) * | 1981-02-10 | 1982-08-17 | Nippon Kokan Kk <Nkk> | Epoxy mastic for molding in form |
| JPS6069174A (en) * | 1983-09-27 | 1985-04-19 | Toshiba Chem Corp | One-pack adhesive |
| JPS61236875A (en) * | 1985-04-15 | 1986-10-22 | Toshiba Chem Corp | One-pack type adhesive |
| JP2014230437A (en) * | 2013-05-24 | 2014-12-08 | シンフォニアテクノロジー株式会社 | Linear motor and manufacturing method thereof |
| CN104277750B (en) * | 2014-09-24 | 2016-04-27 | 慧融高科(武汉)新型材料有限公司 | A kind of plastics sizing agent that can use under water and preparation method thereof |
-
1976
- 1976-05-15 JP JP5561276A patent/JPS6035390B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0534735U (en) * | 1991-10-08 | 1993-05-07 | 株式会社ケンウツド | Compound sound device |
| US20200368004A1 (en) * | 2018-01-30 | 2020-11-26 | Toei Electric Co., Ltd. | Lateral branch detection device, lateral branch detection probe, lateral branch detection method, and program for same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52138532A (en) | 1977-11-18 |
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