JPS6040949B2 - soldering equipment - Google Patents
soldering equipmentInfo
- Publication number
- JPS6040949B2 JPS6040949B2 JP16118779A JP16118779A JPS6040949B2 JP S6040949 B2 JPS6040949 B2 JP S6040949B2 JP 16118779 A JP16118779 A JP 16118779A JP 16118779 A JP16118779 A JP 16118779A JP S6040949 B2 JPS6040949 B2 JP S6040949B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- intake
- soldered
- section
- level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Attitude Control For Articles On Conveyors (AREA)
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 本発明は、はんだ付け装置に関するものである。[Detailed description of the invention] The present invention relates to a soldering device.
従来のはんだ付け装置では、はんだ付けラインコンベヤ
によって搬送されるホルダの保持爪に人手によって被は
んだ付け物を装着したり、また上記保持爪から人手によ
って被はんだ付け物を取外したりしているが、これでは
作業能率が悪くまた作業者の負担も多く、この被はんだ
付け物の装着および取外しの困難性が作業能率の高い有
効なはんだ付けラインのネックになっていた。In conventional soldering equipment, the objects to be soldered are manually attached to the holding claws of a holder conveyed by a soldering line conveyor, and the objects to be soldered are manually removed from the holding claws. This results in poor work efficiency and puts a heavy burden on the worker, and the difficulty of attaching and removing the objects to be soldered has become a bottleneck to an effective soldering line with high work efficiency.
本発明はこのような点に鑑みなされたもので、はんだ付
けラインの作業スピードを損なうことな〈はんだ付けラ
インコンベヤに対する後はんだ付け物の取入および取出
が自動的にできるようにし、はんだ付け作業の完全な省
力化と高能率化を図ろうとするものである。The present invention has been made in view of the above points, and it is possible to automatically load and unload post-soldered items to and from a soldering line conveyor without impairing the work speed of the soldering line, thereby speeding up the soldering work. The aim is to achieve complete labor savings and high efficiency.
本発明の一実施例を図面に基づいて説明する。An embodiment of the present invention will be described based on the drawings.
はんだ付けラインコンベヤ1を無機状に配設する。この
はんだ付けラインコンベヤ1は、内外一対の無端状の搬
送レール2,3を床面に対し水平に設け、その内側の搬
送レール2に沿って無機状の搬送チェン4を配設し「
この搬送チヱン4に所定の間隔を介して搬送ピン5を突
設して成る。A soldering line conveyor 1 is arranged in an inorganic manner. This soldering line conveyor 1 has a pair of inner and outer endless conveyor rails 2 and 3 horizontally disposed on the floor, and an inorganic conveyor chain 4 arranged along the inner conveyor rail 2.
Conveyance pins 5 are provided projecting from the conveyance chain 4 at predetermined intervals.
また、上記はんだ付けラインコンベヤ1によって搬送さ
れるホルダ6の両側の転輪7を上記搬送レール2,3上
で移動自在に戦支し、このホルダ6の内側部から突設し
た連結板8を上記搬送ピン5に上下動自在に鉄着する。
そうして、図示しない駆動モータによって上記搬送チェ
ン4を間欠的に回行駆動し、これによって上言己ホルダ
6を搬送レール2,3に沿って無端状に間欠的に回行駆
動する。Further, rollers 7 on both sides of the holder 6 conveyed by the soldering line conveyor 1 are movably supported on the conveyance rails 2 and 3, and a connecting plate 8 protruding from the inside of the holder 6 is supported. It is iron-bonded to the conveying pin 5 so that it can move up and down.
Then, the conveyance chain 4 is driven to rotate intermittently by a drive motor (not shown), and thereby the holder 6 is driven to rotate intermittently in an endless manner along the conveyance rails 2 and 3.
また、上記ホルダ6には被はんだ付け物としてのプリン
ト基板Pを保持する少なくとも一対の保持爪9を設けて
おく。Further, the holder 6 is provided with at least a pair of holding claws 9 for holding a printed circuit board P as an object to be soldered.
この保持爪9は、下端が内方に閉じるように図示しない
‘まねによって附勢されて保持力を有し、またこの保持
爪9の上端には上記保持力に抗して下端を関らくための
ローう11が軸着してある。また、上記はんだ付けライ
ンコンベヤ1に沿って順次、被はんだ付け物取入部12
、発泡式フラクサ13、プリヒ−タ14、被はんだ付け
物上下動式はんだ槽15、冷却ファン16、リードカッ
ター7、ローラブラシ18、発泡式フラクサ19、プリ
ヒータ21、噴流式はんだ槽22、浸贋式洗浄装置23
、冷却ファン24、被はんだ付け物取出部25および保
持爪洗浄装置26を配列する。This holding claw 9 has a holding force by being urged by an imitation (not shown) so that the lower end closes inward, and the lower end is attached to the upper end of this holding claw 9 against the above-mentioned holding force. The row 11 is pivoted. Further, along the soldering line conveyor 1, the soldering object receiving portions 12
, foaming fluxer 13, preheater 14, soldering object vertically moving solder tank 15, cooling fan 16, lead cutter 7, roller brush 18, foaming fluxer 19, preheater 21, jet soldering tank 22, immersion counterfeit type cleaning device 23
, a cooling fan 24, a soldering object removal section 25, and a holding claw cleaning device 26 are arranged.
なお27は排気ダクト、28は排気ファンである。そう
して、上記取入部12で外部からホルダ6の保持爪9に
プリント基板Pを装着し、上記フラクサ13でプリント
基板Pをの下面にフラツクスをに塗布し、上記プリヒー
タ14で予加熱し、上記はんだ槽15の位置でプリント
基板Pを下降させてその下面をはんだ槽15内の溶解は
んだに浸贋することにより、プリント基板Pとこれに挿
着されている電気部品のリード線とを仮にはんだ付けし
て仮に固定し、上記冷却ファン16で冷却し、上託りー
ドカッタ17でプリント基板Pの下方に突出している余
分なりード線を切断し、上記ローラブラシ18で切断さ
れているリード線を完全に敬除き、上記フラクサ19、
プリヒータ21および噴流式はんだ槽22で上記仮には
んだ付けした部分を確実に本はんだ付けし、上記浸簿式
洗浄装置23および冷却ファン24を経て、上記取出部
25でホルダ6の保持爪9に保持されているプリント基
板Pを外部に取外し、上記洗浄装置26で保持爪9のみ
を洗浄して附着しているフラツクスを洗い落す。Note that 27 is an exhaust duct, and 28 is an exhaust fan. Then, the printed circuit board P is attached to the holding claws 9 of the holder 6 from the outside at the intake part 12, flux is applied to the lower surface of the printed circuit board P using the fluxer 13, and preheated by the preheater 14. By lowering the printed circuit board P at the position of the solder bath 15 and dipping its lower surface into the melted solder in the solder bath 15, the printed circuit board P and the lead wires of the electrical components inserted therein are temporarily connected. The leads are temporarily fixed by soldering, cooled by the cooling fan 16, excess lead wires protruding below the printed circuit board P are cut by the superposition cutter 17, and the leads are cut by the roller brush 18. Completely ignore the line, and use the above fluxer 19.
The pre-heater 21 and the jet soldering bath 22 are used to securely solder the temporarily soldered parts, and the soldered parts are passed through the immersion type cleaning device 23 and the cooling fan 24, and then held in the holding claws 9 of the holder 6 by the extraction section 25. The attached printed circuit board P is removed to the outside, and only the holding claws 9 are cleaned using the cleaning device 26 to wash off the adhering flux.
また、上記被はんだ付け物取入部12および被はんだ付
け物取出部25において、はんだ付けラインコンベヤ1
の上方に上記ホルダ−6を一定の位置に位置決めすると
ともに固定するホルダ位贋決め機構31をそれぞれ設け
る。Furthermore, in the soldering object intake section 12 and the soldering object removal section 25, the soldering line conveyor 1
A holder positioning mechanism 31 is provided above the holder 6 for positioning and fixing the holder 6 at a fixed position.
すなわち、機枠32に左右一対の取付板33を介してェ
アシリンダ34をそれぞれ固定し、このヱアシリンダ3
4のピストンロッド35の先端に案内ブロック36を固
着し、この案内ブロック36の下端に位置決め体37を
固着し、この位置決め体37の先端に位置決め用の円錐
溝38を設け、この円錐溝38と、上記ホルダ6の両側
部から上方に突談されたホルダ位置決めピン39とが隊
合するようにする。That is, the air cylinders 34 are each fixed to the machine frame 32 via a pair of left and right mounting plates 33, and the air cylinders 34 are
A guide block 36 is fixed to the tip of the piston rod 35 of No. 4, a positioning body 37 is fixed to the lower end of this guide block 36, and a conical groove 38 for positioning is provided at the tip of this positioning body 37. , and holder positioning pins 39 extending upward from both sides of the holder 6 are aligned.
なお41は上記案内ブロック36と摺動自在に競合した
案内棒である。そうして、上記ホルダ6が上記取入部1
2および取出部25において停止したら、この停止をリ
ミットスイッチなどで検知して上記ェアシリンダ34の
ピストンロッド35を押下げ、上誌円錐溝38を上記ホ
ルダ位置決めピン39に俵合し、この鉄合によりホルダ
6を正確に位置決め固定する。また、上記被はんだ付け
物取入部12および被はんだ付け物取出部25において
、上記保持爪9を開閉する取入側および取出側の保持爪
開閉機構42を、上記保持爪9の停止位置の上方にそれ
ぞれ配置する。Note that 41 is a guide rod that slidably competes with the guide block 36 described above. Then, the holder 6 is inserted into the intake section 1.
2 and the take-out part 25, this stop is detected by a limit switch or the like, and the piston rod 35 of the air cylinder 34 is pushed down, the upper conical groove 38 is fitted with the holder positioning pin 39, and this iron fitting To accurately position and fix the holder 6. In addition, in the soldering object intake section 12 and the soldering object removal section 25, the holding claw opening/closing mechanisms 42 on the intake side and the extraction side for opening and closing the holding claws 9 are arranged above the stopping position of the holding claws 9. Place them respectively.
すなわち、上記機枠32に左右一対の取付板43を固着
し、この取付板43には中央部に穴44を穿設しておき
、この穴44の両側部の上面にコンベャ方向のガイド4
5を固着し、この両側のガイド45間の上部スライダ4
6をコンベヤ方向に摺動自在に鉄合し、このスラィダ4
6の下面には斜溝47を穿設しておき、また上記取付板
43上にェアシリンダ48を固着し、そのピストンロッ
ド49を上記スラィダ46の一端面に接続する。That is, a pair of left and right mounting plates 43 are fixed to the machine frame 32, a hole 44 is bored in the center of the mounting plate 43, and guides 4 in the conveyor direction are provided on the upper surface of both sides of the hole 44.
5, and the upper slider 4 between the guides 45 on both sides.
6 is slidably fitted in the direction of the conveyor, and this slider 4
A diagonal groove 47 is bored in the lower surface of the slider 6, and an air cylinder 48 is fixed on the mounting plate 43, and its piston rod 49 is connected to one end surface of the slider 46.
また上記穴44の両側部の下面に支持部51を固着し、
この両側の支持部51間に横方向のガイド52を架設し
、このガイド52に下部スラィダ53を横方向に糟動自
在に欧合し、このスラィダ53の上面にローラ54を回
動自在に鞄支し、このローラ54を上記斜簿47に移動
自在に鉄合し、また上記スラィダ53の下面に開閉爪板
55を固着し、この開閉爪板55の先端部を前記保持爪
9のoーラ11の外側部に配置する。そうして、上記ェ
アシリンダ48のピストンロッド49を押出し、上部ス
ライダ46の斜溝47をコンベヤ方向に移動し、この斜
溝47にoーフ54を介して鉄合した下部スラィダ53
を横方向のガイド52に沿って内方に移動し、この下部
スラィダ53の開閉爪板55により保持爪9のローラ1
1を内方に押動して保持爪9の先端部を外方に開き、こ
の保持爪9で保持しているプリント基板Pを解放する。Further, supporting parts 51 are fixed to the lower surfaces of both sides of the hole 44,
A lateral guide 52 is installed between the supporting parts 51 on both sides, a lower slider 53 is fitted to the guide 52 so as to be able to move freely in the lateral direction, and a roller 54 is rotatably attached to the upper surface of the slider 53. The roller 54 is movably iron-coupled to the slanted register 47, and an opening/closing claw plate 55 is fixed to the lower surface of the slider 53. 11. Then, the piston rod 49 of the air cylinder 48 is pushed out, the diagonal groove 47 of the upper slider 46 is moved toward the conveyor, and the lower slider 53 is iron-coupled to the diagonal groove 47 via the orifice 54.
is moved inwardly along the lateral guide 52, and the roller 1 of the holding claw 9 is moved by the opening/closing claw plate 55 of the lower slider 53.
1 inward to open the tips of the holding claws 9 outward and release the printed circuit board P held by the holding claws 9.
また、前記被はんだ付け物取入部12および被はんだ付
け物取出部25において、はんだ付けラインコンベヤ1
の側方に、プリント基板Pの間隔を介して上下方向に複
数段に収容する取入側の収容済みの収容体56および取
出側の空の収容体57をそれぞれ配置する。In addition, in the soldering object intake section 12 and the soldering object removal section 25, the soldering line conveyor 1
On the side of the board, there are disposed a plurality of storage bodies 56 on the intake side and empty housing bodies 57 on the extraction side, which are housed in a plurality of stages in the vertical direction with the interval between the printed circuit boards P interposed therebetween.
すなわち、箱状の収容本体を、上板58と、下坂59と
、この上下板58,59を支持する4隅のアングル61
とによって形成し、この収容本体の両側部においてそれ
ぞれ一対の支柱62,63を上下板58,59間に設け
、この両側の支柱62,63に上下方向に複数段の被は
んだ付け物挿着部64をそれぞれ平行かつ水平に対設し
、この挿着部64の対向面部に被はんだ付け物挿入溝6
5をプリント基板Pの厚みに形成する。That is, the box-shaped housing main body is divided into an upper plate 58, a lower slope 59, and angles 61 at four corners that support the upper and lower plates 58, 59.
A pair of support columns 62 and 63 are provided between the upper and lower plates 58 and 59 on both sides of the housing body, and a plurality of stages of soldering object insertion sections are provided in the vertical direction on the support columns 62 and 63 on both sides. 64 are arranged in parallel and horizontally opposite each other, and a soldering object insertion groove 6 is provided on the opposing surface of the insertion portion 64.
5 is formed to have the thickness of the printed circuit board P.
なお上記各挿入溝65の間にはプリント基板Pの厚みよ
り充分に大きな間隔66を設けておき、これによりプリ
ント基板Pに挿着されている図示しない電気部品やその
リード線が他の基板Pのものと相互に干渉し合うのを防
止する。また上記各挿入溝65の両端には関口67を設
けておき、この関口67を通してプリント基板Pの上記
挿入溝65への挿入および上記挿入溝65からの取出し
を行う。また各挿入溝65の内部には、先端部が挿入溝
65の底面よりやや突出された押えばね68をプリント
基板Pの取出方向に向けて固着しておき、これによりプ
リント基板Pの挿入溝65からの自由な抜け落ちを防止
する。また上記一側の支柱63は、上下板58,59に
穿設した最孔69に沿って移動調整可能に設け、プリン
ト基板Pの大きさに応じて移動調整した後にねじで上下
板58,59に固定する。また、上記収容体56,57
の下板59の下面には、4隈部にボール形の移動論71
を設け、中央部にガイド円盤体72、ロックピン73お
よび送込みピン74をそれぞれ設けておく。A gap 66 that is sufficiently larger than the thickness of the printed circuit board P is provided between each of the insertion grooves 65, so that electrical components (not shown) and their lead wires inserted into the printed circuit board P can be easily connected to other circuit boards P. prevent mutual interference with other objects. Further, a gate 67 is provided at both ends of each of the insertion grooves 65, and the printed circuit board P is inserted into and taken out from the insertion groove 65 through the gate 67. Further, inside each insertion groove 65, a presser spring 68 whose tip end slightly protrudes from the bottom surface of the insertion groove 65 is fixed in the direction in which the printed circuit board P is taken out. Prevents free falling out. Further, the support column 63 on one side is provided so as to be movable and adjustable along the outermost hole 69 bored in the upper and lower plates 58, 59, and after adjusting the movement according to the size of the printed circuit board P, the upper and lower plates 58, 59 are screwed together. Fixed to. In addition, the containers 56, 57
On the lower surface of the lower plate 59, there are ball-shaped movement mechanisms 71 in the four corners.
A guide disc body 72, a lock pin 73, and a feed pin 74 are provided in the center.
また、上記はんだ付けラインコンベヤ1の側方に、上記
取入側および取出側の収容体56,57をプリント基板
Pの収容間隔で上下方向に間欠移送する取入側および取
出側の収容体縦送り機構75,76をそれぞれ設ける。Further, on the side of the soldering line conveyor 1, there are vertically arranged containers 56 and 57 on the intake side and the output side, which are intermittently transferred vertically at intervals of the printed circuit board P. Feeding mechanisms 75 and 76 are provided, respectively.
すなわち、機枠32に一対のガイドポスト78を立設し
、このガイドポスト78にスライダ79を介して上下動
基板81を上下動自在に設け、この上下動基板81から
縦送りベース82を水平に突設し、また上記機枠32の
上下部にスプロケットホィル84,85を回動自在に軸
着し、この上下のスプロケツトホイル84,85間に無
端チェック86を巻掛け、この無端チェン86の一部を
上記上下動基板81の裏面の接続部87に連結する。ま
た上記下方のスプロケツトホィル85の駆動軸88にべ
ベルギャ89を一体的に鉄着し、このべベルギャ89に
回転駆動装置91のべベルギャ92を噛合わせる。上記
回転駆動装置91は、モータとウオーム減速機とトルク
リミッタとによって形成する。そうして、上記回転駆動
装置91のべベルギャ92を間欠的に駆動して上記チェ
ン86を間欠的に回行し、このチェン86に連結された
上記縦送りベース82を収容体56,57の収容間隔で
上下方向に間欠移送する。That is, a pair of guide posts 78 are installed upright on the machine frame 32, a vertically movable base plate 81 is vertically movably provided on the guide post 78 via a slider 79, and the vertical feed base 82 is horizontally moved from the vertically movable base plate 81. Furthermore, sprocket wheels 84 and 85 are rotatably attached to the upper and lower parts of the machine frame 32, and an endless check 86 is wound between the upper and lower sprocket wheels 84 and 85. is connected to a connecting portion 87 on the back surface of the vertically movable board 81. Further, a bevel gear 89 is integrally iron-bonded to the drive shaft 88 of the lower sprocket wheel 85, and a bevel gear 92 of a rotational drive device 91 is engaged with this bevel gear 89. The rotation drive device 91 is formed by a motor, a worm reducer, and a torque limiter. Then, the bevel gear 92 of the rotary drive device 91 is intermittently driven to rotate the chain 86 intermittently, and the vertical feed base 82 connected to the chain 86 is moved between the containers 56 and 57. It is intermittently transferred vertically at storage intervals.
また、上記取入側および取出側の収容体縦送り機構75
,76の縦送りベース82に、収容体56,57をこの
縦送りベース82上に位置決めするとともに固定する収
容体位置決め機構93をそれぞれ設ける。In addition, the storage body vertical feeding mechanism 75 on the intake side and the extraction side
, 76 are each provided with a container positioning mechanism 93 for positioning and fixing the containers 56, 57 on the vertical feed base 82.
すなわち、上記縦送りベース82の下面に一対のガイド
94を間隔を介して固着し、このガイド94間にスラィ
ダ95を摺動自在に鉄合しこのスラィダ95の凹溝96
内に収容体固定爪97の基部を挿入して軸98で回動自
在に軸着し、この収容体固定爪97の先端部は上記ベー
ス82の穴99を通して上方に突出させるとともに、こ
の先端部にV溝101を形成し、このV溝101が前記
収容体56,57の下面のロックピン73に鉄合するよ
うにし、また上記固定爪97とスライダ95との間に圧
縮コイルばね102を介設して上記固定爪97の先端部
を上方に附勢するとともに、この固定爪97の搬入側に
は傾斜面103を形成しておく。That is, a pair of guides 94 are fixed to the lower surface of the vertical feed base 82 with a gap between them, a slider 95 is slidably fitted between the guides 94, and the groove 96 of the slider 95 is fitted.
The base of the container fixing claw 97 is inserted into the interior and is rotatably fixed on a shaft 98, and the tip of the container fixing claw 97 is made to protrude upward through the hole 99 of the base 82. A V-groove 101 is formed in the holder so that the V-groove 101 is iron-fitted to the lock pin 73 on the lower surface of the containers 56 and 57, and a compression coil spring 102 is interposed between the fixing pawl 97 and the slider 95. In addition, an inclined surface 103 is formed on the loading side of the fixing claw 97 to urge the tip of the fixing claw 97 upward.
また上記ベース182の下面にェアシリンダ104を固
定し、このェアシリンダ104のピストンロッド105
の先端を上記スライダ95の一端面に接続する。また上
記縦送りベース82の中央部上面に一対のガイド106
を平行間隔を介して固着し、この一対のガイド106間
に前記収容体56,57の下面のガイド円盤体72を摺
動自在に鉄合するようにし、また上記上下動基板81の
表面に収容体56,57を係止するストッパ107を固
着する。108はリミットスイッチである。Further, the air cylinder 104 is fixed to the lower surface of the base 182, and the piston rod 105 of this air cylinder 104 is fixed to the lower surface of the base 182.
The tip of the slider 95 is connected to one end surface of the slider 95. Furthermore, a pair of guides 106 are provided on the upper surface of the central portion of the vertical feed base 82.
are fixed at a parallel interval, and the guide disc body 72 on the lower surface of the housing bodies 56, 57 is slidably fitted between the pair of guides 106, and is housed on the surface of the vertically movable base plate 81. A stopper 107 that locks the bodies 56 and 57 is fixed. 108 is a limit switch.
そうして、収容体66,57を上記ガイド106に沿っ
て上記縦送りベース82上に送込むと、収容体56,5
7の下面のロックピン73は上記固定爪97の懐斜面1
03などを押下げてこの固定爪97やのV溝101の先
方に入り込み、同時に上記固定爪97は圧縮コイルばね
102によって図示の状態に復帰して上記ロックピン7
3の戻りを係止する。Then, when the containers 66, 57 are fed onto the vertical feed base 82 along the guide 106, the containers 56, 57
The lock pin 73 on the lower surface of 7 is connected to the inner surface 1 of the fixing claw 97.
03 and the like to enter the V-groove 101 of the fixing claw 97, and at the same time, the fixing claw 97 is returned to the illustrated state by the compression coil spring 102, and the lock pin 7 is pushed down.
Lock the return of step 3.
この状態で上記ピストンロッド105を引込めると、上
記固定爪97はそのV溝1 301によって上記ロック
ピン73を上下動基板81側に押圧し、上記収容体56
,57を上記ストッパ107に押当て、収容体56,5
7を定位鷹に固定する。またこの収容体56,57を上
記縦送りベース82から取外すときは上記ピストンロ4
ッド105を押出して上記固定爪97とロックピン73
との鉄合を解除し、上記収容体56,57を特上げれば
よい。また、上記取入側および敬出側の縦送りベース8
2の待機位置に、上記収容体56,57をこの縦送りベ
ース82に向けて水平に移送する収容体機送り機構11
1,112を接続する。When the piston rod 105 is retracted in this state, the fixing claw 97 presses the lock pin 73 toward the vertical movable base plate 81 with its V groove 1 301, and the housing body 56
, 57 against the stopper 107, and the containers 56, 5
7 is fixed on the stereotaxic hawk. Also, when removing the containers 56 and 57 from the vertical feed base 82, the piston rod 4
Push out the pad 105 and attach the fixing claw 97 and lock pin 73.
It is only necessary to release the iron connection between the two and raise the above-mentioned containers 56 and 57. In addition, the vertical feed base 8 on the intake side and ejection side
2, a container transport mechanism 11 horizontally transports the containers 56 and 57 toward the vertical feed base 82;
Connect 1,112.
すなわち、機枠32に横送りベース113を固夕着し、
このベース113の中央部の平行間隔114に収容体送
込み爪115の基部116を摺動自在に接合するととも
に、この収容体送込み爪115が上記ベース113上を
進退するようにし、また上託送込み爪115の先端にV
溝117を設ひけ、このV溝117が上記収容体56,
57の下面の送り込みピン74に競合するようにする。That is, the transverse feed base 113 is firmly attached to the machine frame 32,
A base 116 of a container feed claw 115 is slidably joined to the parallel interval 114 in the center of this base 113, and the container feed claw 115 is made to move forward and backward on the base 113, and V at the tip of the built-in claw 115
A groove 117 is provided, and this V-groove 117 serves as the container 56,
57 so as to compete with the feed pin 74 on the lower surface.
また上記機送りベース113の下方において機枠32に
一対のスプロケットホィル118を回動自在に軸支し、
この一対のスブロケットホィル118夕闇に無機チェン
119を巻掛け、このチェン119の一部を上記収容体
送込み爪115の基部116に接続する。また上記一万
のスプロケツトホィル118の駆動軸121にチェン伝
動機構122を介してモータなどの回転駆動装置123
を接続0する。そうして、上記回転駆動装置123を一
定時間駆動して、上記横送りベース113上に戦遣され
ている収容体56,57の送込みピン74を上託送込み
爪115のV溝117によって押動し、収容体56,5
7を上記横送りベース113上から同一レベルの縦送り
ベース82上に移載する。A pair of sprocket wheels 118 are rotatably supported on the machine frame 32 below the machine feed base 113,
An inorganic chain 119 is wound around the pair of sprocket wheels 118, and a part of the chain 119 is connected to the base 116 of the container feeding claw 115. Further, a rotary drive device 123 such as a motor is connected to the drive shaft 121 of the ten thousand sprocket wheels 118 via a chain transmission mechanism 122.
Connect 0. Then, the rotary drive device 123 is driven for a certain period of time, and the feed pins 74 of the containers 56 and 57 that are being sent on the traverse feed base 113 are pushed by the V groove 117 of the delivery claw 115. moving, the container 56,5
7 is transferred from the horizontal feed base 113 to the vertical feed base 82 at the same level.
なお彼はんだ付け物取入部12では、上記縦送りベース
82は下方で待機しているので、上記収容体横送り機構
111は下方定位層に設け、また彼はんだ付け物取出部
25では、上記縦送りベース82は上方で待機している
ので、上記収容体横送り機構1 12は上方定位層に設
ける。また、上記被はんだ付け物取入部12および被は
んだ付け物取出部25において、上記保持爪9の停止位
置の下方に、上記保持爪9と同一のレベルとこの保持爪
9より下方の一定下降レベルとの間で上下動される被は
んだ付け物受け体124,125および126,127
を配置する。In addition, in the soldering material taking-in section 12, the vertical feeding base 82 is waiting at the bottom, so the container horizontal feeding mechanism 111 is provided in the downward orientation layer, and in the soldering material taking-out section 25, the vertical feeding base 82 is waiting at the bottom. Since the feeding base 82 is on standby above, the container lateral feeding mechanism 112 is provided in the upper orientation layer. In addition, in the soldering object inlet part 12 and the soldering object removal part 25, below the stopping position of the holding claw 9, there is a level that is the same as that of the holding claw 9, and a certain descending level below the holding claw 9. soldering object receivers 124, 125 and 126, 127 that are moved up and down between
Place.
すなわち、機枠32に取付板128を固着し、この取付
板128に固着した4箇所のガイド129に案内村13
1を上下動自在に鉄合し、この案内杵131の上端に上
下動ベース132を固着し、上記取付板128にェアシ
リンダ133を固定するとともに、そのピストンロッド
134の先端を上記上下動ベース132の中央部に接続
する。That is, the mounting plate 128 is fixed to the machine frame 32, and the guide village 13 is attached to the four guides 129 fixed to the mounting plate 128.
A vertically movable base 132 is fixed to the upper end of the guide punch 131, a air cylinder 133 is fixed to the mounting plate 128, and the tip of the piston rod 134 is attached to the vertically movable base 132. Connect to the center.
そして彼はんだ付け物取入部12においては、上誌上下
動ベース132の一側上に支持部135を介して上記一
側の被はんだ付け物受け体124を固着するとともに、
上記ベース132の他側上に一対のガイド136によっ
て超動議整可能に固定支持された支持部137を介して
上記他側の被はんだ付け物受け体125を設け、この両
側の受け体124,125の対向側面部にプリント基板
Pを係止する受段部138を設ける。また被はんだ付け
物取出部25においては、上記上下動ベース132の一
側上に支持部139を介して一対のガイドブロック14
1とェアシリンダ142とを固着し、上記ガィドブ。ッ
ク141に案内村143を介して受け体基板144を進
退自在に鉄着するとともに、この受け体基板144に上
記ェアシリンダ142のピストンロッド145の先端を
接続し、上記受け体基板144の上端面に一側の彼はん
だ付け物受け体126を固着し、また上記上下動ベース
132の他側上に一対のガイド146によって摺動調整
可能に固定支持された支持部147を介して一対のガイ
ドブロック148とェアシリンダ149とを固着し、上
記ガイドブロック148に案内杵151を介して受け体
基板152を進退自在に鉄着するとともに、この受け体
基板152に上記ヱアシリンダ149のピストンロッド
153の先端を接続し、上記受け体基板152の上端面
の前記他側の被はんだ付け物受け体127を固着し、そ
して上記両側の受け体126,127の対向側面部にプ
リント基板Pの両側部に鉄合するV溝164を形成する
。なお上記受け体124,125および126,127
は前記ホルダ6の保持爪9とは直交する方向に設け、互
いに干渉しないようにする。そうして、取入部12では
、一定下降レベルで上記受け体124,125の受段部
138にプリント基板Pを受取り、上記ピストンロッド
134を押上げて上記プリント基板Pを保持爪9のレベ
ルまで上昇させるようにし、また取出部25では、上記
保持爪9がプリント基板Pを解放する前に、この保持爪
9のレベルに位置させた上記受け体126,127を上
記ピストンロッド145,153を押出して内方に移動
し、そのV溝154によってプリント基板Pの他方の両
側部を挟特し、これによって、保持爪9とプリント基板
Pとがフラックスなどによって接着していて上記保持爪
9を開くときにプリント基板Pがずれるおそれがあるの
を上記V簿154の挟特により防止でき、そして上記保
持爪9の解放後は、上記ピストンロッド134を引下げ
受け体126,127によってプリント基板Pを保持爪
9のレベルから一−定刊降レベルまで下げるようにする
。Then, in the soldering object receiving part 12, the soldering object receiving body 124 on the one side is fixed on one side of the above-mentioned vertically movable base 132 via the support part 135,
On the other side of the base 132, a support part 137 is fixedly supported by a pair of guides 136 so as to be able to adjust the movement, and a receptacle 125 for the soldering object on the other side is provided, and the receptacles 124, 125 on both sides A receiver part 138 for locking the printed circuit board P is provided on the opposing side surface of the board. In addition, in the soldering object removal section 25, a pair of guide blocks 14 are mounted on one side of the vertically movable base 132 via a support section 139.
1 and the air cylinder 142, and then attach the above guide dob. A receiver board 144 is iron-mounted to the rack 141 via a guide plate 143 so that it can move forward and backward, and the tip of the piston rod 145 of the air cylinder 142 is connected to the receiver board 144, and the upper end surface of the receiver board 144 is connected to the receiver board 144. A pair of guide blocks are fixed to one side of the soldering object receptacle 126, and fixedly supported on the other side of the vertically movable base 132 by a pair of guides 146 so as to be slidable and adjustable. 148 and air cylinder 149 are fixed, and a receiver board 152 is iron-bonded to the guide block 148 via a guide punch 151 so that it can move forward and backward, and the tip of the piston rod 153 of the air cylinder 149 is connected to this receiver board 152. Then, the soldering object receiver 127 on the other side is fixed to the upper end surface of the receiver board 152, and the opposing side surfaces of the receivers 126 and 127 on both sides are iron-coupled to both sides of the printed circuit board P. A V groove 164 is formed. Note that the above receivers 124, 125 and 126, 127
are provided in a direction perpendicular to the holding claws 9 of the holder 6 so as not to interfere with each other. Then, in the intake section 12, the printed circuit board P is received at the receiving part 138 of the receiving bodies 124, 125 at a certain descending level, and the piston rod 134 is pushed up to bring the printed circuit board P up to the level of the holding claw 9. In addition, in the take-out section 25, before the holding claw 9 releases the printed circuit board P, the piston rods 145, 153 are pushed out by the receivers 126, 127 positioned at the level of the holding claw 9. The V-groove 154 pinches the other side of the printed circuit board P, thereby opening the holding claw 9 since the holding claw 9 and the printed circuit board P are adhered by flux or the like. The possibility that the printed circuit board P may sometimes shift can be prevented by the clamping of the V register 154, and after the holding claw 9 is released, the piston rod 134 is pulled down and the printed circuit board P is held by the receivers 126, 127. Try to lower it from the level of claw 9 to the lower level.
また、上記取入部12および取出部25において、上記
被はんだ付け物受け体124,125および126,1
27の一定下降レベルと同一のレベルに前記収容体56
,57の被はんだ付け物挿着部54が連続的に配置され
るようにする。Further, in the intake section 12 and the extraction section 25, the soldering object receivers 124, 125 and 126, 1
The container 56 is placed at the same level as the constant descending level of 27.
, 57 are arranged continuously.
また、上記被はんだ付け物取入部12において、上記取
入側の収容体56をはさんで上記一定下降レベルの取入
側の被はんだ付け物受け体124,125とは反対の側
の同一下降レベルに取入側の被はんだ付け物押動機機1
61を配置する。すなわち、機枠32にモータ162と
このモータ162の回転を減速するギャ機構部163と
を固定し、上記ギャ機構部163に、このギャ機構部1
63内のピニオンと噛合うラック164が形成された押
動杵165を挿着し、この押圧杵165の先端に一方の
押動爪166の基部167を固定するとともに、この基
部167に他方の押動爪168の基部169を摺敷調整
可能に固定する。この両方の押敷爪166,168の先
端にはV溝171を形成しておき、このV溝171と上
記取入側の収容体56に収容された一定のレベルのプリ
ント基板Pとが隊合するようにする。そうして、上記モ
ータ162を駆動して上記ピニオンとラック164との
噛合により上記押動杵165を押出し、上記V溝171
によって上記収容体56内の一定のレベルのプリント基
板Pを上記一定下降レベルの収入側の被はんだ付け物受
け体124,125に向け水平に押動する。In addition, in the soldering object receiving section 12, the same lowering is performed on the side opposite to the soldering object receivers 124, 125 on the receiving side at the constant lowering level across the receiving side container 56. Machine for pushing the soldered object on the intake side at the level 1
Place 61. That is, the motor 162 and the gear mechanism section 163 that decelerates the rotation of the motor 162 are fixed to the machine frame 32, and the gear mechanism section 1 is attached to the gear mechanism section 163.
A pressing punch 165 having a rack 164 that engages with the pinion in the pressing punch 163 is inserted, and the base 167 of one pressing pawl 166 is fixed to the tip of the pressing punch 165, and the other pressing punch 165 is fixed to the tip of the pressing punch 165. A base 169 of a movable claw 168 is fixed so as to be adjustable in sliding. A V-groove 171 is formed at the tips of both of the pressing claws 166, 168, and this V-groove 171 and the printed circuit board P of a certain level accommodated in the intake-side container 56 are aligned. I'll do what I do. Then, the motor 162 is driven to push out the pushing punch 165 through engagement between the pinion and the rack 164, and the V-groove 171 is pushed out.
By this, the printed circuit board P at a certain level in the container 56 is pushed horizontally toward the soldering object receptacles 124 and 125 on the receiving side at the certain lowering level.
また、上記被はんだ付け物敬出部25において、上記一
定下降レベルの取出側の被はんだ付け物受け体126,
127をはさんで上記取出側の収容体57とは反対の側
の同一下降レベルに取母側の被はんだ付け物押動機機1
81を配置する。In addition, in the soldering object ejecting section 25, the soldering object receiver 126 on the extraction side at the constant lowering level,
At the same lowering level on the opposite side of the receptacle 57 on the take-out side across 127, there is a soldering object pushing machine 1 on the take-out side.
Place 81.
なおこの機構181は上記取入側の被はんだ付け物押動
機横161と同一の構造であるから説明を省略する。ま
たこの取出側での作用は、押動杵I65の先端のV溝1
71によって一定下降レベルの取出側の被はんだ付け物
受け体126,127に支持されているプリント基板P
を上記取出側の収容体57の一定のレベルに向けて水平
に押敷する。次に全体的に作用を説明する。Note that this mechanism 181 has the same structure as the soldering object pusher side 161 on the intake side, so a description thereof will be omitted. Also, this action on the take-out side is as follows:
71, the printed circuit board P is supported by the soldering object receivers 126 and 127 on the extraction side at a certain lowering level.
is pressed horizontally toward a certain level of the container 57 on the extraction side. Next, the overall operation will be explained.
作業者が、各段にプリント基板Pが収容された収容体5
6を取入側の収容体横送り機構111の積送りベース1
13上にセットするとともに、空の収容体57を取出側
の収容体積送り機構112の横送りベース113上にセ
ットすると、これら収容体56,57は上記機構111
,112によって取入側および取出側の収容体縦送り機
構75,76に送られこの機構75,76の縦送りベー
ス82上に位置決め固定される。A worker picks up the storage body 5 in which printed circuit boards P are stored in each stage.
6 is the stacking base 1 of the storage body transverse feeding mechanism 111 on the intake side.
13 and empty containers 57 are set on the transverse feed base 113 of the accommodation volume feeding mechanism 112 on the extraction side.
, 112 to the vertical feeding mechanisms 75, 76 for the containers on the intake side and the extraction side, and are positioned and fixed on the vertical feeding bases 82 of these mechanisms 75, 76.
そして、取入側においては、最初に収容体66は下方に
位置し、被はんだ付け物押動機横161が収容体56内
の最上段のプリント基板Pを上記収容体56から押出し
て一定下降レベルの彼はんだ付け物受け体124,12
5上にスライドさせ、このプリント基板Pは、上記受け
体124,125によってホルダ6の保持爪9のレベル
まで上昇し、このレベルでホルダ位置決め機構31によ
って一定位置に位置決めされるとともに保持爪開閉機構
42によって開き状態で待機している保持爪9によって
保持され、はんだ付けラインコンベヤーによって搬送さ
れ、はんだ付けされる。On the intake side, the container 66 is initially positioned below, and the soldering object pusher 161 pushes out the uppermost printed circuit board P in the container 56 from the container 56 to a certain lower level. The soldering object receiver 124, 12
5, this printed circuit board P is raised by the receivers 124 and 125 to the level of the holding claws 9 of the holder 6, and at this level is positioned at a fixed position by the holder positioning mechanism 31 and the holding claw opening/closing mechanism. 42 and is held by the holding claws 9 waiting in an open state, conveyed by the soldering line conveyor, and soldered.
なおこの取入側において収容体56は収容体縦送り機構
75によって間欠的に上昇し、上方の段のプリント基板
Pから下方の段のプリント基板Pの順番で収容体56か
ら排出される。また取出側では、ホルダ6がホルダ位置
決め機構31によって一定位置に位置決めされたら、保
持爪9のレベルまで上昇した両側の被はんだ付け物受け
体126,127を閉じてプリント基板Pの他方の両側
部を被持し、その後に保持爪開閉機構42によって保持
爪9を開き、上記受け体】26,127により一定下降
レベルまで下げられたプリント基板Pは、同一レベルの
被はんだ付け物押動機礎181によって上記受け体12
6,127から押出され、取出側の収容体57の各段に
収容される。Note that on this intake side, the container 56 is intermittently raised by the container vertical transport mechanism 75, and is discharged from the container 56 in the order of printed circuit boards P in the upper stage to printed circuit boards P in the lower stage. On the extraction side, once the holder 6 is positioned at a certain position by the holder positioning mechanism 31, the soldering object receivers 126 and 127 on both sides that have risen to the level of the holding claws 9 are closed, and the other side of the printed circuit board P is closed. After that, the holding claws 9 are opened by the holding claw opening/closing mechanism 42, and the printed circuit board P, which has been lowered to a certain lowering level by the receivers 26 and 127, is moved to the soldering object pushing base 181 at the same level. According to the above receiver 12
6, 127 and stored in each stage of the container 57 on the extraction side.
なおこの取出側においては最初に収容体57は上方に位
置し、プリント基板Pが挿入されるたびに収容体縦送り
機構76によって順次下方に移動し、プリント基板Pは
この収容体57の最も下の段から上方の段の順番で挿入
される。なおこのように敬入側においてもまた取出側に
おいても、すべての段にプリント基板Pが収容された状
態の重い収容体56,57が下方に位置するようにした
から、取入側の議送りベース113への収容体56の供
給および取出側の縦送りベース82からの収容体57の
取出しが作業者にとって容易である。0 また各機構の
モータやェアシリンダなどはリミットスイッチなどを利
用してシーケンス制御する。Note that on this take-out side, the container 57 is initially located at the top, and each time a printed circuit board P is inserted, it is sequentially moved downward by the container vertical feed mechanism 76, and the printed circuit board P is located at the bottom of this container 57. They are inserted in order from the row above. In addition, since the heavy containers 56 and 57 with printed circuit boards P stored in all stages are located at the bottom on both the input side and the extraction side, the transfer of the input side is difficult. It is easy for the operator to supply the containers 56 to the base 113 and to take out the containers 57 from the vertical feed base 82 on the take-out side. 0 In addition, the motors and air cylinders of each mechanism are controlled in sequence using limit switches, etc.
このように本発明によれば、彼はんだ付け物取入部およ
び彼はんだ付け物取出部において、被は夕んだ付け物を
間隔を介して上下方向に複数段に収容する収容体をはん
だ付けラインコンベヤの側方に配置するとともに、この
収容体を収容体縦送り機構によって被はんだ付け物の収
容間隔で上下方向に間欠移送するようにし、上記はんだ
付けラインコンベヤのホルダの保持爪の停止位置の下方
に上下動する彼はんだ付け物受け体を配置し、また上記
彼はんだ付け物取入部において取入側の収容体をはさん
で下降レベルの取入側の被はんだ付け物受け体とは反対
の側の同一下降レベルに取入例の被はんだ付け物押動機
横を配置するとともに、上記被はんだ付け物取出部にお
いて下降レベルの取出側の被はんだ付け物受け体をはさ
んで取出側の収容体とは反対の側の同一下降レベルに取
出側の被はんだ付け物押動機横を配置したから、自動的
に、収容体の内部の複数の被はんだ付け物をホルダの保
持爪の下方の一定のレベルに順次搬入した後に上昇させ
て保持爪に保持させることができ、また自動的に、保持
爪から解放された被はんだ付け物を一定のレベルに下降
させた後に側方の収容体に順次搬出することができ、は
んだ付けラインの作業スピードを損なうことなく、はん
だ付けラインコンベヤに対する被はんだ付け物の装着お
よび取外し作業の省力化、高能率化が図れる。As described above, according to the present invention, in the soldering material intake section and the soldering material removal section, the housing body that accommodates the soldering material in a plurality of stages in the vertical direction at intervals is connected to the soldering line. The container is placed on the side of the conveyor, and the container is intermittently transferred vertically at the storage interval of the soldering objects by the container vertical feeding mechanism, so that the holding claw of the holder of the soldering line conveyor stops at the stop position. Arrange the soldering object receptacle that moves downward and up and down, and place the soldering object receptacle on the intake side at the lower level opposite to the receptacle on the intake side in the above-mentioned soldering object intake part. Place the side of the soldering object pusher in the installation example at the same descending level on the side of Since the side of the pusher for soldering objects on the extraction side is placed at the same descending level on the opposite side of the container, it automatically moves multiple objects to be soldered inside the container to the lower part of the holding claw of the holder. It is possible to carry the soldering object sequentially to a certain level and then raise it and hold it in the holding claw, and automatically lower the object to be soldered which has been released from the holding claw to a certain level and then move it to the side storage body. It can be carried out sequentially, and the work of attaching and removing objects to be soldered to and from the soldering line conveyor can be carried out labor-saving and highly efficiently without impairing the working speed of the soldering line.
そしてこれによりはんだ付け作業の高能率化をも達成で
きるようになった。This also made it possible to achieve high efficiency in soldering work.
図は本発明の一実施例を示すもので、第1図ははんだ付
けラインの平面図、第2図はその被はんだ付け物取入部
および被はんだ付け物取出部の正面図、第3図は被はん
だ付け物取入部の平断面図、第4図は第3図のW−N線
断面図、第5図は第3図のV−V線断面図、第6図は第
3図のW−W線断面図、第7図は縦送りベース部の分解
斜視図、第8図は保持爪開面機構の平面図、第9図は取
出側の被はんだ付け物受け体の駆動機構の斜視図である
。
P・・・・・・被はんだ付け物としてのプリント基板、
1・・・・・・はんだ付けラインコンベヤ、6…・・・
ホルダ、9・・・・・・保持爪、12・・・・・・彼は
んだ付け物取入部、13,19……フラクサ、14,2
1……ヒータ、15,22……はんだ槽、25……被は
んだ付け物取出部、42・・・・・・保持爪開閉機構、
56,57・・・・・・収容体、75,76・・・・・
・収容体縦送り機構、124,125,126,127
……被はんだ付け物受け体、161,181・・・・・
・被はんだ付け物押動機横。
第2図
第6図
*’四
界0図
鬼4図
界5図
*ワ図
第8図
※0図The figures show one embodiment of the present invention, in which Fig. 1 is a plan view of a soldering line, Fig. 2 is a front view of the soldering object inlet part and the soldering object ejection part, and Fig. 3 is a plan view of the soldering line. 4 is a sectional view taken along the line W-N in FIG. 3, FIG. 5 is a sectional view taken along the line V-V in FIG. 3, and FIG. 6 is a sectional view taken along the line W in FIG. -W sectional view, Figure 7 is an exploded perspective view of the vertical feed base, Figure 8 is a plan view of the holding claw opening mechanism, and Figure 9 is a perspective view of the drive mechanism of the soldering object receiver on the extraction side. It is a diagram. P... Printed circuit board as an object to be soldered,
1... Soldering line conveyor, 6...
Holder, 9... Holding claw, 12... Soldering material intake part, 13, 19... Fluxer, 14, 2
1... Heater, 15, 22... Solder bath, 25... Soldered object removal section, 42... Holding claw opening/closing mechanism,
56, 57... Containment body, 75, 76...
・Container vertical feeding mechanism, 124, 125, 126, 127
...Receptor for soldering objects, 161, 181...
・Next to the pusher for the soldered object. Figure 2 Figure 6 * 'Four worlds 0 Figure Demon 4 Figure World 5 * Wa Figure 8 *0 Figure
Claims (1)
ンコンベヤによつて搬送されるホルダと、このホルダに
設けられ被はんだ付け物を保持する保持爪と、上記はん
だ付けラインコンベヤに沿つて順次設けた被はんだ付け
物取入部、フラクサ、ヒータ、はんだ槽および被はんだ
付け物取出部と、上記被はんだ付け物取入部および被は
んだ付け物取出部において上記保持爪の停止位置の上方
に配置され上記保持爪を開閉する取入側および取出側の
保持爪開閉機構と、上記被はんだ付け物取入部および被
はんだ付け物取出部においてはんだ付けラインコンベヤ
の側方に配置され被はんだ付け物を間隔を介して上下方
向に複数段に収容した取入側の収容体および取出側の空
の収容体と、この取入側および取出側の収容体を被はん
だ付け物の収容間隔で上下方向に間欠移送する取入側お
よび取出側の収容体縦送り機構と、上記被はんだ付け物
取入部および被はんだ付け物取出部において上記保持爪
の停止位置の下方に配置され下降レベルから上昇して被
はんだ付け物を上記保持爪のレベルに上げる取入側の被
はんだ付け物受け体および保持爪のレベルから下降して
被はんだ付け物を下降レベルに下げる取出側の被はんだ
付け物受け体と、上記被はんだ付け物取入部において上
記取入側の収容体をはさんで上記下降レベルの取入側の
被はんだ付け物受け体とは反対の側の同一下降レベルに
配置され上記取入側の収容体の収容された一定のレベル
の被はんだ付け物を上記下降レベルの取入側の被はんだ
付け物受け体に向けて水平に押動する取入側の被はんだ
付け物押動機構と、上記被はんだ付け物取出部において
上記下降レベルの取出側の被はんだ付け物受け体をはさ
んで上記取出側の収容体とは反対の側の同一下降レベル
に配置され上記下降レベルの取出側の被はんだ付け物受
け体に支持されている被はんだ付け物を上記取出側の収
容体の一定のレベルに向けて水平に押動する取出側の被
はんだ付け物押動機構とを具備することを特徴とするは
んだ付け装置。1. A soldering line conveyor, a holder conveyed by this soldering line conveyor, holding claws provided on this holder to hold objects to be soldered, and objects to be soldered sequentially provided along the soldering line conveyor. The retaining claws are arranged above the stop positions of the holding claws in the attachment intake section, the fluxer, the heater, the solder bath, the soldering object removal section, and the soldering object introduction section and the soldering object removal section. The holding claw opening/closing mechanism on the intake side and the extraction side is arranged on the side of the soldering line conveyor in the soldering object intake section and the soldering object extraction section, and the holding claw opening/closing mechanism is arranged on the side of the soldering line conveyor at the above-mentioned soldering object intake section and soldering object extraction section. An intake system in which intake-side storage bodies and empty extraction-side storage bodies are housed in multiple stages in the direction, and these intake-side and extraction-side housing bodies are intermittently transferred in the vertical direction at intervals for storing objects to be soldered. The storage body vertical feeding mechanism on the side and ejection side is arranged below the stop position of the holding claw in the soldering object intake section and the soldering object extraction section, and rises from the lowered level to move the soldering object above the soldering object. A soldering object receiver on the intake side that raises the object to be soldered to the level of the holding claw, an object receiving object to be soldered on the extraction side that descends from the level of the holding claw and lowers the object to be soldered, and the above-mentioned object to be soldered. In the intake section, the object receptacle on the intake side is arranged at the same lower level on the opposite side of the lower level with respect to the receptacle on the intake side, and the object receptacle on the intake side is housed therein. a soldering object pushing mechanism on an intake side that horizontally pushes an object to be soldered at a certain level toward a soldering object receptacle on an intake side at the descending level; A soldering object receptacle on the retrieval side of the lowered level, which is disposed at the same lower level on the opposite side of the receptacle on the retrieval side of the receptacle on the retrieval side of the lowered level in the retrieval part; a soldering object pushing mechanism on the extraction side that horizontally pushes the object to be soldered supported on the body toward a certain level of the container on the extraction side. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16118779A JPS6040949B2 (en) | 1979-12-12 | 1979-12-12 | soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16118779A JPS6040949B2 (en) | 1979-12-12 | 1979-12-12 | soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5684168A JPS5684168A (en) | 1981-07-09 |
| JPS6040949B2 true JPS6040949B2 (en) | 1985-09-13 |
Family
ID=15730236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16118779A Expired JPS6040949B2 (en) | 1979-12-12 | 1979-12-12 | soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6040949B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564929A (en) * | 1981-11-25 | 1986-01-14 | Hitachi, Ltd. | Information recording and reproducing apparatus with tracking control by sampling |
| JPS59130676A (en) * | 1983-01-18 | 1984-07-27 | Kenji Kondo | Automatic soldering device |
-
1979
- 1979-12-12 JP JP16118779A patent/JPS6040949B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5684168A (en) | 1981-07-09 |
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