JPS6043008B2 - How to cut lead wires of electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for cutting lead wires of a free-standing electronic component into different lengths.

For example, a capacitor has a component body 1 as shown in Figure 1.
A self-supporting type in which two lead wires 2 and 3 are led out in the same direction is often used.

The surface of the component body 1 of this electronic component 4 is marked or stamped to determine the polarity of each lead wire 2, 3.
Furthermore, the lengths of the two lead wires 2 and 3 are made different to facilitate this polarity discrimination. Such a difference in length between the lead wires 2 and 3 is regulated by the JIS standard. For example, in the electronic component 4 shown in FIG. 1, the positive lead wire 2 is made longer than the negative lead wire 3. Also, these lead wires 2 and 3
In addition to the purpose of determining polarity, the difference in length is also used, for example, when inserting the lead wires 2 and 3 of the electronic component 4 into the through-hole of a printed circuit board, the long positive lead wire 2 is inserted first, and then the It is also used to facilitate insertion of both lead wires 2 and 3 into the through hole by inserting a short negative lead wire 3 into the through hole. By the way, as shown in FIGS. 2 and 3, the self-supporting electronic component 4 is manufactured in bulk as a strip component 7 in which a plurality of components are fixed in series at equal intervals on two long strip plates 5 and 6. There is.

The tips of the positive lead wires 2 of the plurality of electronic components 4 are fixed to one band plate 5 of the band-shaped component 7, and the tips of the negative lead wires 3 are fixed to the other band plates 6, respectively. has been done. Then, a plurality of electronic components 4 are placed in the state of this band-shaped component 7.
The lead wires 2 and 3 are simultaneously cut to different lengths (step cutting) to separate the individual electronic components 4 from the strips 5 and 6 at once. Therefore, such lead wires 2 and 3
Conventionally, a step cutter 8 as shown in Fig. 4 was used to cut the steps.
, 9 was used in the following manner.

That is, the step cutters 8 and 9 are two parallel cutters and have comb-shaped uneven blades Ba, 8bN9a and 9b that suitably mesh with the opposing tips of each cutter. A band-shaped component 7 in which two band plates 5 and 6 are matched is positioned and arranged so that the two lead wires 2 and 3 of the component 4 are lined up in parallel at a constant pitch m. Therefore, double step cutter 8
, 9 and cut the positive lead wire 2 of the electronic component 4 with the corresponding fourth man Ba and the convex blade 9a, and then cut the positive lead wire 2 of the electronic component 4 with the corresponding convex blade 8.
B and fourth son 9b had cut the negative lead wire 3. By the way, what is important in cutting this lead wire is that each step cutter 8,
9 uneven blade Ba, 8b) Boundary portions 8', 9 of 9a, 9b
' is located. However, each lead wire 2, 3
The pitch m is generally narrow, 2 to 3 wt, and therefore, if the lead wires 2 and 3 are slightly bent or otherwise deformed, the following cutting defects occur frequently. For example, when the minus side lead wire 3 comes off from the convex blade 8b and the concave blade 8b and both the lead wires 2 and 3 come between the concave blade 8a and the convex blade 9a, both the lead wires 2 and 3 become as shown in Fig. 5A. As shown, the positive leads are cut to the same length, making it impossible to determine the polarity. On the contrary, positive side lead wire 2
When the lead wires 2 and 3 are separated from the concave blade 8a and the convex blade 9a and both lead wires 2 and 3 come between the convex blade 8b and the concave blade 9b, both the lead wires 2 and 3
As shown by the opening in Figure 5, the lead is cut at the negative lead length, making it impossible to determine the polarity. Furthermore, the positive lead wire 2
When the lead wire 3 on the negative side comes between the convex blade 8b and the concave blade 9b, and the lead wire 3 on the negative side comes between the concave blade 8a and the convex blade 9a, the positive lead wire 2 is on the negative side as shown by c in FIG. It is cut shorter than the lead wire 3, and the polarity determination based on the length is reversed. In fact, in these three examples, there were many poor cutting results, and the yield rate of electronic components 4 after cutting was poor. The present invention improves and eliminates the above conventional problems, and provides a method for cutting the lead wires of a self-supporting electronic component after expanding them in a direction perpendicular to the direction in which the lead wires are arranged. The present invention will be explained below with reference to embodiments of the drawings. The present invention is applied to lead wire cutting of the electronic component 4 in the above-mentioned band-shaped component 7, and one embodiment will be explained with reference to FIGS. The parallel cutter 12 is a separation plate having a wedge-shaped cross section that moves up and down as appropriate between the parallel cutters 10 and 11.

Each of the parallel cutters 10, 11 faces each other with a slight step d, and a recessed groove 13 into which the tips of the parallel cutters 10, 11 are fitted into both sides of the separation plate 12 at the same step d as the step d. 14 is formed. Each of the above parallel cutters 1
0 and 11 are arranged horizontally with a constant interval between them, and a separation plate 12 is arranged in a downward fixed position between the two parallel to the parallel cutters 10 and 11 with its wedge-shaped tip facing upward. 6 state).

In this state, the strip-shaped component 7 is inserted between the parallel cutters 10 and 11, with each component body 1 supported by the chuck mechanism 15, for example. At this time, the cutting point P1 of the positive lead wire 2 of each electronic component 4 is at the same height as the upper edge of the tip of one of the parallel cutters 10, and the negative lead wire 3
The cutting point 8 is at the same height as the upper edge of the tip of the other parallel cutter 11, and each strip 5, 6 is at the same height as the top edge of the other parallel cutter 11, and
positioning the band-shaped part 7 so that it is located above the tip of the
maintain that state. First, the separating plate 12 is vertically raised, and its tip is connected to the two strip plates 5 and 5 of the strip component 7.
6, and press and spread the strips 5 and 6 in the thickness direction.
When the grooves 13 and 14 of the separating plate 12 rise to a position where they face the parallel cutters 10 and 11, they are stopped at that position and the strip plates 5 and 6 are separated by the thickness of the separating plate 12.
Each lead wire 2, 3 is spread along both sides of the separation plate 12. Next, each of the parallel cutters 10 and 11 is moved inward in parallel, and each tip portion is cut into the corresponding concave groove 13 and 11 of the separating plate 12.
(Status shown in Figure 8). Then, each positive lead wire 2 of a plurality of electronic components 4 is inserted into one groove 13 of the separation plate 12.
is crossed, and each negative lead wire 3 is inserted into the other concave groove 14.
are across, so when the parallel cutter 10 is inserted into the groove 13, each positive lead wire 2 is cut at the same time by the tip edge of the parallel cutter 10 and the edge of the groove 13, and similarly the groove 14 and the parallel cutter 11 for each negative lead wire 3
are disconnected at the same time. Therefore, each parallel cutter 10, 11
The positive lead wire 2 is cut longer than the negative lead wire 3 by the step difference d between the grooves 13 and 14. Furthermore, since the step cutting is performed by cutting the positive lead wire 2 and the negative lead wire 3 independently using different parallel cutters 10 and 11, there is no fear of cutting defects. Note that the present invention is not limited to the above-mentioned embodiment. For example, the belt-shaped component 7 is vertically fed horizontally, a separating plate is fixedly arranged on the extension line of the feeding direction, and the belt-shaped component 7 is fed by horizontally feeding the belt-shaped component 7. It is also possible to perform step cutting by spreading the plates 5 and 6 along both sides of the separating plate.

Further, the grooves of the separation plate may be stepped, or the grooves and steps may be omitted and may be formed flat. Further, the electronic component is not limited to a capacitor, but the present invention can be applied to any self-supporting electronic component in which lead wires are cut in steps at different lengths. As explained above, according to the present invention, a parallel cutter can be used to cut the lead wires of free-standing electronic components at different levels, and since the corresponding cutters can be used to cut the lead wires of different lengths, parallel cutting, reverse level cutting, etc. There are no cutting defects, and the yield rate of electronic parts can be improved.

[Brief explanation of the drawing]

Figure 1 is a front view showing an example of an electronic component, Figures 2 and 3 are
The figures are a front view and a side view of the band-shaped component having the electronic component shown in Fig. 1, Fig. 4 is a schematic perspective view of the main part for explaining the conventional lead wire cutting method, and Fig. 5 is a diagram showing various defects in lead wire cutting. FIGS. 6 and 7 are a front view showing an example of a non-defective product; FIGS. FIG. 8 is a partially schematic perspective view and a side view of the apparatus shown in FIG. 7 and FIG. 7 at the time of cutting the lead wire. 1... Part body, 2, 3... Lead wire, 4... Electronic component.

Claims (1)

[Claims] 1. Multiple lead wires led out in the same direction from the component body are spread out in a direction perpendicular to the direction in which the lead wires are lined up, and each lead wire is cut at different lengths from the component body at once. Features: Lead wire cutting method for electronic components.