JPS6043010B2 - Method for detecting lead wire shape of electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for detecting the shape of a lead wire of a self-standing electronic component that has been cut in steps.

Generally, in a free-standing electronic component such as a capacitor that has polarized lead wires, the lengths of the two lead wires 2 and 3 led out in the same direction from the component body 1 are made different, as shown in Figure 1. . A mark indicating the polarity of the lead wires 2 and 3 is stamped on the surface of the component body 1 of the electronic component 4, but the polarity can be easily determined due to the difference in the length of each lead wire 2 and 3. It has been devised so that it can be distinguished. Also, the difference in the length of the lead wires 2 and 3 makes it difficult to assemble the electronic component 4 by inserting the lead wires 2 and 3 into the through holes of the printed circuit board.
This is also done to facilitate assembly by first inserting the longer lead wire 2 and then inserting the shorter lead wire 3. Incidentally, the longer lead wires 2 and 3 are generally positive, and the shorter lead wires are negative.
For example, as shown in FIG.
It is manufactured as a band-shaped part 6 fixed at a constant pitch and arranged in a series.

Then, in this state of the band-shaped component 6, the respective lead wires 2 and 3 of each electronic component 4 are sequentially cut in steps by, for example, a lead wire step cutting device 7 shown in FIGS. 3 to 6. That is, in FIGS. 3 and 4, 8 is a conveyor such as a belt conveyor that moves intermittently, and 9 is a plurality of chucks arranged at equal intervals in parallel to the direction perpendicular to the conveyance direction on the conveyor 8. At the same time, the component bodies 1, 1, .
. is chucked, and the strip-shaped part 6 is intermittently fed together with the transport body 8 in an upright state. The lead wire step cutting device 7
is arranged at one position A where the strip-shaped component 6 that is being fed intermittently stops, and cuts the lead wires 2 and 3 of the strip-shaped component 6 at this position A in steps. In other words, the lead wire step cutting device 7 has a total of four rotary blades 10a, 1 as shown in FIG.
0b) 11a, llb, two of which are rotary blades 10
a and lla have the same shape, and have V-shaped cutting grooves 12a and 12 on the circumferential surface.
A plurality of cutting grooves 12a are formed at a constant pitch.
Between 13a is a clearance groove 14 deeper than the cutting grooves 12a and 13a.
a, 15a are formed. Further, the remaining two rotary blades 10a and llb are perfectly circular discs. and rotary blade 1
The outer peripheral surface of 0b is in contact with the cutting groove 12a (7) groove base circle 1,
A portion of the rotary blade 10b and the rotary blade 10a intersect at a sufficient distance from the groove base circle 12 of the relief groove 14a, and both rotate in opposite directions in synchronization with each other. or,
Similarly, a part of the rotary blade 11a and the rotary blade 11b intersect,
Both rotate in opposite directions in synchronization with each other. When the belt-shaped component 6 comes to position A, the former pair of rotary blades 10a, 10b rotate along the lead line alignment direction of the belt-shaped component 6, for example, to the position of the first cutting line m shown in FIG. The latter pair of rotary blades 11a and 11b move while rotating from the first cutting line m to the position of the second cutting line n below the saw step, cutting the lead wires 2 and 3 in steps as follows. do. That is, the cutting groove 1 of each rotary blade 10a, 11a
The arrangement pitch of 2a and 13a is the lead wire 2 of the strip component 6,
A set of rotary blades 10a,
When the rotary blade 10b rotates, only the positive lead wires 2 are sequentially fitted into the cutting groove 12a of the rotary blade 10a, and the rotary blade 10
It is cut at the position of the first cutting line m at the time of intersection with b.
At this time, the minus side lead wire 3 is not cut because it fits into the relief groove 14a of the rotary blade 10a and escapes from the rotary blade 10b. On the other hand, when the other pair of rotary blades 11a and 11b rotates, only the minus side lead wire 3 is sequentially fitted into the cutting groove 13a of the rotary blade 11a, and the rotary blade 11b cuts it at the position of the second cutting line n. The positive lead wire 2 fits into the relief groove 15a and is not cut. In other words, the strip part 6
When it reaches position A, the lead wire step cutting device 7 moves once in the direction perpendicular to the conveying body 8, and during this time, the strip part 6
Each positive lead wire 2, 2... is the first cutting line m
The negative lead wire 3,
3... are sequentially cut at the second cutting line n. When this lead wire cutting is completed, the strip plate 5 is removed, and the individual electronic components 4, 4, . . . are sent to the next position B while being chucked by the chuck body 9. By the way, when the lead wires 2 and 3 are cut at different levels, a slight deviation in the pitch of the lead wires causes the following defective products to be cut.

For example, when the negative lead wire 3 is fitted into the cutting groove 12a of the rotary blade 10a, it is cut to the same length as the positive lead wire 2, producing the defective example A in FIG. Similarly, when the positive lead wire 2 is fitted into the cutting groove 13a of the rotary blade 11a, it is cut to the same length as the negative lead wire 3, resulting in the defective example shown in FIG. Further, the rotary blade 10a cuts the negative lead wire 3, and the rotary blade 1
The mistake of cutting the positive lead wire 2 by 1a may occur, although the incidence is extremely low, and in this case, a reverse step cut is obtained as shown in defective example C in FIG. 7. In each of these defective examples A, C, and C, the polarity of the lead wires 2 and 3 cannot be determined, and it is necessary to remove them during the manufacturing process. Further, for this purpose, it is necessary to detect whether the shape of the lead wire is good or bad after cutting the lead wire. Therefore, as a lead wire shape detection method, conventionally, a lead wire shape as shown in FIG. 8 and FIG. A detection device 16 was deployed.

This lead wire shape detection device 16 has a support plate 17 disposed in a direction perpendicular to the transfer body 8, and a plurality of detection pieces 18 are swingably suspended from the lower surface of the support plate 17 at regular intervals. A microswitch 19 for detecting vibration of the detection piece 18 is arranged on the back side of the detection piece 18. The positive lead wire 2 is arranged to pass between each detection piece 18, and the negative lead wire 3 is arranged to pass near the bottom of each detection piece 18. In this way, if the lead wires 2 and 3 of the electronic component 4 supported by the chuck body 9 of the transfer body 8 are properly cut in steps, each lead wire 2 and 3 is cut by the support plate 17.
However, if the length of the negative lead wire 3 is cut at the regular length of the positive lead wire 2, this defective lead wire 3'' will hit the detection piece 18 and be detected. The piece 18 is tilted, the microswitch 19 detects this abnormality, and a defective lead wire 3'' is detected. However, although this detection method detects defective cases A and C in FIG. 7, it is impossible to detect defective cases A and C in FIG. Therefore, the present invention has been devised to provide a method for reliably detecting the frequently occurring defect example A in FIG. 7, the mouth, and provides an optical detection method using an optical sensor.

For example, to explain an example in which the present invention is applied to detecting the lead wire shape of an electronic component 4 that has been chucked by the transfer body 8 and the lead wire has been cut at position A. Two optical sensors 20 and 21 as shown in FIGS. 10 and 11 are provided. Each of the optical sensors 20 and 21 is a light projecting element 20a and 21a, respectively.
and light receiving elements 20b, 21b are arranged to face each other, and the first optical sensor 20 is connected to the first cutting line m and the second cutting line n of each electronic component 4, 4, . . . at position X.
The second optical sensor 21 is arranged at a height slightly below the second cutting line n. Then, when the electronic component 4 whose lead wires have been cut at different levels is transferred to position X, each optical sensor 20, 21
, n directions, the first optical sensor 20 sequentially detects and outputs the positive lead wires 2, 2... of each electronic component 4, 4..., and the second optical sensor 21 Both the positive side and negative side lead wires 2, 3, 2, 3, . . . are sequentially detected. The number of electronic components 4 currently arranged at position x is N
Then, if the lead wires 2 and 3 of each electronic component 4, 4, etc. are properly cut at the step, the first optical sensor 20 detects N lead wires, and the second optical sensor 21 detects N lead wires. Detects the main lead wire.

Therefore, the detection signals of both optical sensors 20 and 21 are counted and the respective count values Na (=N) and Nb (=2N) are obtained.
By calculating this, it is possible to detect lead wire breakage defects. That is, for example, if Na is multiplied by 2 and the formula 2Na=Nb holds true, it is determined that all the electronic components 4, 4, . . . are properly cut. Furthermore, if the negative lead wire 3 of one electronic component 4 is cut to the same length as the regular length of the positive lead wire 2, the first optical sensor 20 will also cut this defective lead wire 3. Upon detection, the count value becomes N+1, and the equation 2Na=Nb does not hold, so 2Na>Nb. Conversely, if the positive lead wire 2 of one electronic component 4 is cut at the regular length of the negative lead wire 3, the count value detected by the first optical sensor 20 will be N - 1, which is also 2Na. The equation =Nb does not hold and becomes 2Na<Nb.
In other words, the defective example A in FIG. 7, the mouth, is detected. The count values Na and Nb may be calculated using any method, but can be easily performed using a microcomputer as described below.

For example, as shown in FIG. 12, the output of the light emitting element 20b of the first photosensor 20 is amplified by the amplifier circuit 22 and inputted to the counter 23, where the count value Na is halled, and then the I/024, that is, the external The data is input to the CPU (Central Processing Unit) 25 via a device coupling device, right-shifted, and 2Na data, which is double the input Na data, is stored in the register. On the other hand, the light emitting element 21 of the second optical sensor 21
The output of Nb is amplified by the amplifier circuit 26 and inputted to the counter 27, where the count value Nb is holed and inputted to the CPU 25 via the I/024. And Nb with CPU25
Calculate the difference between the data of 2Na and the data of 2Na stored in the register, and check whether 2Na=Nb holds or not.
It should be taken out at a signal of 1°. In addition, the above formula 2Na=N
b. When there is an electronic component 4 with a reverse level difference as in defect example 11 in FIG. 7, the lead shape detection device 16 shown in FIG. 8 is used in conjunction with the detection by each optical sensor 20, 21. This is desirable.

In addition to an optical sensor, a magnetic sensor or the like can also be used as the sensor. As explained above, according to the present invention, it is possible to reliably detect defective products whose lead wires are both cut short, and since the detection method is based on a sensor, it is possible to detect defective products with high speed and high speed without damaging the lead wires. Accurate and reliable detection becomes possible.

[Brief explanation of drawings]

Fig. 1 is a front view of a self-supporting electronic component, Fig. 2 is a front view of a band-shaped component having the electronic component shown in Fig. 1, and Figs. 3 and 4 are side views for explaining the lead wire step cutting device. 5 is an enlarged operational view of a part of FIG. 4, FIG. 6 is a side view of the lead wire cutting operation by the device shown in FIG. 4, and FIG. 7 is a front view showing examples of various types of defects in electronic components. , FIGS. 8 and 9 are a side view and a sectional view taken along the line T-T of a conventional lead wire shape detection device, and FIGS. 10 and 11 are schematic side views showing an example of a device for implementing the method of the present invention. and a plan view, and FIG. 12 is a block diagram of a circuit (microcomputer) that determines the quality of the lead wire shape based on the output of the optical sensor used in the present invention. 1... Part body, 2, 3... Lead wire, 4... Electronic component, 20... First sensor,
21...Second sensor, m...First cutting line, n...Twentieth cutting line.

Claims (1)

[Claims] 1. When a plurality of self-supporting electronic components are arranged in a series and each lead wire is cut in steps, there is a first cutting line at the position where the lead wire is cut long and a second cutting line where the lead wire is cut short.
A first sensor scans between the cutting lines, and a second sensor scans the vicinity of the second cutting line on the part body side, and the number of lead wires is counted using the output of each sensor, and these two count values are calculated. 1. A method for detecting the shape of a lead wire of an electronic component, characterized in that the shape of the lead wire is determined based on the shape of the lead wire.