JPS6043677B2 - Method for manufacturing piezoelectric sheet - Google Patents
Method for manufacturing piezoelectric sheetInfo
- Publication number
- JPS6043677B2 JPS6043677B2 JP52105537A JP10553777A JPS6043677B2 JP S6043677 B2 JPS6043677 B2 JP S6043677B2 JP 52105537 A JP52105537 A JP 52105537A JP 10553777 A JP10553777 A JP 10553777A JP S6043677 B2 JPS6043677 B2 JP S6043677B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- piezoelectric
- binder
- piezoelectric sheet
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011230 binding agent Substances 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 11
- 239000004014 plasticizer Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910020698 PbZrO3 Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229910003781 PbTiO3 Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- FPHIOHCCQGUGKU-UHFFFAOYSA-L difluorolead Chemical compound F[Pb]F FPHIOHCCQGUGKU-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- -1 tungsten bronze type compound Chemical class 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明は圧電体シートの製造方法に関するもので、表
面が極めて平滑な圧電体シートを得ることを目的とする
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a piezoelectric sheet, and an object thereof is to obtain a piezoelectric sheet with an extremely smooth surface.
最近圧電体セラミックスの応用分野は多岐にわたり、
高密度化、小型化が急速に進んできた。Recently, the application fields of piezoelectric ceramics are wide-ranging.
Densification and miniaturization have progressed rapidly.
従来、用途に応じた所定形状の圧電素子の供給は焼結体
もしくは単結晶インゴットを切断、研磨、加工等により
なされてきたが、加工歪みによる電気的特性の劣化、さ
らには加工費用が高くつくという問題が生じている。そ
のために工程の簡略化、大量生産等から焼成と同時に所
望形状の素子が安 価に供給されることが望まれている
。一般に焼結体シートの製造方法はセラミック素材を結
合物質とともに混練し、成形して一定厚みの生シートを
作製し、用途に応じた所定形状に打抜き、これを焼成す
るという方法が知られている。しかし、焼成後の焼結体
シート製品において焼成時の収縮に伴つて変形、亀裂、
反り、穿孔、さらには鉛系圧電体セラミック材料の場合
には鉛の蒸発が起り易く、特にシートが薄くなると表面
積が大きくなり鉛の蒸発量が増え、焼結体組成のばらつ
き原因となり、機械的特性あるいは電気的特性等に大き
な影響を及ぼすという問題がある。 また、圧電体シー
トしては、圧電セラミックスの他に高分子エレクトレッ
トなどが知られており、後者は分極処理によつて作られ
る圧電体であり、とくに高分子の加工性、柔軟性を生カ
ルたフィルム状圧電体で（ポリフッ化ビニリデンなどが
電気音響変換素子として）応用がなされている。Conventionally, piezoelectric elements in a predetermined shape according to the application have been supplied by cutting, polishing, processing, etc. sintered bodies or single crystal ingots, but this leads to deterioration of electrical characteristics due to processing distortion and high processing costs. This problem has arisen. For this reason, it is desired to be able to supply devices with a desired shape at a low cost at the same time as they are fired through process simplification, mass production, etc. In general, a known method for manufacturing sintered sheets is to knead ceramic materials with a binding substance, mold them to create a green sheet of a certain thickness, punch it into a predetermined shape depending on the intended use, and then fire it. . However, after firing, sintered sheet products suffer from deformation, cracks, etc. due to shrinkage during firing.
Warping, perforation, and even evaporation of lead in the case of lead-based piezoelectric ceramic materials are likely to occur. In particular, as the sheet becomes thinner, the surface area increases and the amount of lead evaporation increases, causing variations in the composition of the sintered body and causing mechanical damage. There is a problem in that the characteristics or electrical characteristics are greatly affected. In addition to piezoelectric ceramics, polymer electrets are known as piezoelectric sheets, and the latter is a piezoelectric material made by polarization treatment. Applications have been made to film-like piezoelectric materials (such as polyvinylidene fluoride as electroacoustic transducers).
しかしながら圧電性セラミックスに比較し、加工は容易
であるが圧電性特性（誘電率、電気−機械結合係数）が
著しく劣る。本発明の目的はこれらの欠点を取り除き、
加工性に優れ、コストが安く、しかも高性能な圧電特性
を有する圧電体シートの製造方法を堤供することにある
。 本発明の方法は、圧電体セラミック素材と適量のガ
ラス粉末に有機成分である結合剤、可塑剤を加えた混合
物を有機溶媒で充分攪拌混合して泥漿を作る。However, although it is easier to process than piezoelectric ceramics, its piezoelectric properties (dielectric constant, electro-mechanical coupling coefficient) are significantly inferior. The aim of the invention is to eliminate these drawbacks and
The object of the present invention is to provide a method for manufacturing a piezoelectric sheet having excellent workability, low cost, and high performance piezoelectric properties. In the method of the present invention, a mixture of a piezoelectric ceramic material, an appropriate amount of glass powder, and organic components such as a binder and a plasticizer is sufficiently stirred and mixed with an organic solvent to form a slurry.
この泥漿をドクターブレード法により、用途に応じて０
．０５〜２．０Ｔｓｎの一定厚を有する高密度生シート
を作製し、必要形状に打抜いた後、３００〜４００℃の
温度で有機成分の結合剤、可塑剤を完全除去し、含有す
るガラスの軟化温度以上に昇温、焼成して室温まで冷却
して、高平滑で高性能な圧電体シート素子を得ることに
ある。本発明の方法によれば鉛系圧電性セラミック材料
はペロブスカイト型化合物、タングステンブロンズ型化
合物からなる単成分系、二成分系、三成分系のいずれで
もよい。Using the doctor blade method, this slurry can be
．． After producing a high-density green sheet with a constant thickness of 0.05 to 2.0 Tsn and punching it into the required shape, the organic binders and plasticizers are completely removed at a temperature of 300 to 400°C, and the glass contained in it is completely removed. The purpose is to obtain a highly smooth and high-performance piezoelectric sheet element by raising the temperature above the softening temperature, firing, and cooling to room temperature. According to the method of the present invention, the lead-based piezoelectric ceramic material may be a single-component type, a two-component type, or a ternary-component type consisting of a perovskite type compound or a tungsten bronze type compound.
結合剤となるガラス粉末は鉛系圧電性セラミック材料中
に含まれるＰ，の蒸発しない温度以下にて軟化するもの
であればよい。The glass powder serving as the binder may be one that softens below the temperature at which P contained in the lead-based piezoelectric ceramic material does not evaporate.
ガラスの隔着が圧電シートとしての機械的強度、圧電特
性を高める働きをする。有機結合剤としてはポリ酢酸ビ
ニル、ポリビニルブチラール、又は両者を用いる。可塑
剤は結合剤によつて選択されるが、例えばフタル酸エス
テル系（ＤＯＰ，ＤＢＰ）リン酸エス手ル系、などが望
ましい。結合剤、可塑剤の添加量はともに生シートの成
形性、加工性および高密度化の観点から各々１〜５重量
％が好ましい。溶媒としてはアルコール系、ケトン系、
ハロゲン化炭化水素系の単一成分、二成分、三成分系な
どが乾燥条件にあわせて用いられる。鉛系圧電性セラミ
ック原料は配合→混合→仮焼→混合→成形→焼成といっ
たプロセスで製造されセラミックスとなる。この場合、
Ｐｂの蒸発を抑えることが重要で積重ね方式、マツフル
方式（ＰｂＴｉＯ３，ＰｂＺｒＯ３粉体で包む）加圧方
式、ガス雰囲気方式などが工夫．されて１０００℃〜１
４００℃で焼成される。焼成された焼結体から圧電シー
トを作製するためには、焼結体を数μ〜数１０μｍの微
粉末にクラッシャー、スタンプミル、ボールミル等の粉
砕機で粉砕する。粉砕された圧電材料に結合剤加えるこ
とによつて一粒子間接合を行う。このため結合剤として
、ガラス質物質の非結晶性を利用する。これらは冷却す
ると次第に粘性を増し、一定の凝固点なしに凝固し、結
晶とならない。かかる物質は加熱すると次第に軟化して
液体なり結晶において見られるよう−な一定の熔融点が
ない。このことにより溶融が困難でなく組成を選べば低
温から高温まで広範囲のものが得られる。また温度と粘
度との関係が適当であり成形が容易である。また物理的
、化学的性質が適当であり、実用上必要な条件を充すも
のである。生シートを作製するため有機結合剤、可塑剤
、溶媒を各々所定量秤量し、ボールミル、ニーダー、ロ
ール法等の既知の混合方法で良く混合し、適当な粘度を
有する泥漿を作製する。この泥漿を有機フィルム等の平
滑な基板上に流し、ドクターブレード法にて一定厚みの
シート状に成形して乾燥し平滑な生シート作成する。こ
の生シートのセラミック素充填密度は体積比率で５０〜
６０％に）達した。次に生シートを所望の形状に打抜く
。これを表面平滑なアルミナ質、ジルコニア質などの耐
熱材料の上に敷粉を均一にしきつめ、のせる。これを電
気炉内に設置し、予備焼成して有機成分を除去した後、
圧電セラミック材料中のＰｂの蒸・発が発生しない温度
３００〜８００℃にて焼付を行う。３００゜Ｃ以下では
ガラスの熔融が不十分で８００℃以上ではＰｂの蒸発が
起るためである。The glass spacing serves to enhance the mechanical strength and piezoelectric properties of the piezoelectric sheet. As the organic binder, polyvinyl acetate, polyvinyl butyral, or both are used. The plasticizer is selected depending on the binder, and for example, phthalate type (DOP, DBP) phosphate type, etc. are preferable. The amount of binder and plasticizer added is preferably 1 to 5% by weight each from the viewpoints of moldability, workability, and densification of the green sheet. Alcohol-based, ketone-based,
Single-component, two-component, or three-component systems of halogenated hydrocarbons are used depending on the drying conditions. Lead-based piezoelectric ceramic raw materials are manufactured into ceramics through a process of blending, mixing, calcination, mixing, shaping, and firing. in this case,
It is important to suppress the evaporation of Pb, so methods such as the stacking method, matzuru method (wrapping with PbTiO3 and PbZrO3 powder) pressurizing method, and gas atmosphere method are being devised. heated to 1000℃~1
It is fired at 400°C. In order to produce a piezoelectric sheet from a fired sintered body, the sintered body is crushed into a fine powder of several micrometers to several tens of micrometers using a crusher such as a crusher, stamp mill, or ball mill. Particle-to-particle bonding is achieved by adding a binder to the pulverized piezoelectric material. For this reason, the amorphous nature of glassy substances is utilized as a binder. When these are cooled, they gradually increase in viscosity, solidify without a fixed freezing point, and do not form crystals. When such materials are heated, they gradually soften to become liquids and do not have a fixed melting point like that found in crystals. As a result, it is not difficult to melt, and a wide range of materials can be obtained from low to high temperatures by selecting the composition. In addition, the relationship between temperature and viscosity is appropriate and molding is easy. In addition, it has appropriate physical and chemical properties and satisfies practically necessary conditions. To prepare a green sheet, a predetermined amount of an organic binder, a plasticizer, and a solvent are each weighed out and mixed well using a known mixing method such as a ball mill, kneader, or roll method to prepare a slurry having an appropriate viscosity. This slurry is poured onto a smooth substrate such as an organic film, formed into a sheet of a certain thickness using a doctor blade method, and dried to produce a smooth raw sheet. The ceramic elementary packing density of this raw sheet is 50 to 50 in terms of volume ratio.
reached 60%). Next, the raw sheet is punched into the desired shape. This is then placed on top of a heat-resistant material such as alumina or zirconia with a smooth surface, evenly and tightly. After installing this in an electric furnace and pre-baking to remove organic components,
Baking is performed at a temperature of 300 to 800° C. at which evaporation of Pb in the piezoelectric ceramic material does not occur. This is because if the temperature is below 300°C, the melting of the glass will be insufficient, and if it is above 800°C, evaporation of Pb will occur.
焼付が終ると適当な冷却速度で室温まで冷却し炉内より
取出す。本発明によつて得られた圧電シートはガラス・
を用いて結合させるため平滑性が良く、高密度で十分な
る機械的強度を有している。このようにして得られた圧
電シートは電気音響変換素子、スイッチ等の用途に有用
である。以下本発明の実施例について詳述する。〔実施
例１〕
ＰｂＴｌＯ３／ＰｂＺｒＯ３＝４６／５４の組成比をも
つＰｂ（Ｔｉ，Ｚｒ）０３系の圧電セラミックス材を９
００℃−２時間で仮焼、混合粉砕後３Ｃ！ｎ×３ｃｍ×
ｘ厚み１ｄに成形圧力５００ｋ９／Ｃｌｔにて成形し、
焼成温度；１３００℃焼成時間；２時間、冷却温度；２
００℃／Ｈで焼成を行つた。When the baking is finished, it is cooled to room temperature at an appropriate cooling rate and taken out from the furnace. The piezoelectric sheet obtained by the present invention is made of glass.
Because it is bonded using , it has good smoothness, high density, and sufficient mechanical strength. The piezoelectric sheet thus obtained is useful for applications such as electroacoustic transducers and switches. Examples of the present invention will be described in detail below. [Example 1] Pb(Ti,Zr)03-based piezoelectric ceramic material having a composition ratio of PbTlO3/PbZrO3=46/54 was
Calcined at 00℃ for 2 hours, mixed and crushed at 3C! n×3cm×
Molded to x thickness 1d at a molding pressure of 500k9/Clt,
Firing temperature: 1300℃ Firing time: 2 hours Cooling temperature: 2
Firing was performed at 00°C/H.
その時の結晶粒径は約２〜３μであつた。その後焼結体
をスタンプミルにて粉砕し、３２メッシュのフルイをバ
スさせてシート用材料とする。結合剤としてのガラス組
成は低温で軟化する材料が好ましく、ＰｂＦ２：２０モ
ル％；Ｂ．Ｏ３；３３．４モル％、ＺｎＯ；４０モル％
、ＳｉＯ２；７．６モル％の化学組成を有する低融点ガ
ラスを作成し、微粉末化したのち結合剤として用いる。
有機結合剤としては第１表に示すところの結合剤、およ
び可塑剤（添加樹脂量の１／２重量％）を各々加え、原
料に対して５０Ｗｔ％のメチルアルコールでよく攪拌混
合し、さらにボールミルにて２＠間混合して泥漿を作成
した。この泥漿をポリエステルフィルム上に流し、トク
ターブレードにてシート状に成形し自然乾燥して生シー
トを作製した。この時の生シートの厚みは１００μｍで
あつた。生シート密度は第１表に示す。次に、打抜成形
機を用いて生シートを直径３ｃｙ！ｍの円板状に打抜き
、電気炉内に表面平滑なアルミナ板の上にのせて設置し
、第１表に示すところの焼付条件でグレーズ化を行つた
。The crystal grain size at that time was approximately 2 to 3 microns. Thereafter, the sintered body is crushed in a stamp mill and passed through a 32 mesh sieve to obtain a sheet material. The glass composition as a binder is preferably a material that softens at low temperatures; PbF2: 20 mol%; B. O3; 33.4 mol%, ZnO; 40 mol%
, SiO2; A low melting point glass having a chemical composition of 7.6 mol % is prepared and used as a binder after being pulverized.
As an organic binder, the binder shown in Table 1 and a plasticizer (1/2 weight % of the amount of added resin) were added, mixed well with 50 wt % methyl alcohol based on the raw materials, and then milled in a ball mill. A slurry was prepared by mixing for 2 hours. This slurry was poured onto a polyester film, formed into a sheet using a tractor blade, and air-dried to produce a green sheet. The thickness of the green sheet at this time was 100 μm. The green sheet density is shown in Table 1. Next, a raw sheet with a diameter of 3 cy! is made using a punching machine. It was punched out into a disk shape of m in size, placed in an electric furnace on an alumina plate with a smooth surface, and glazed under the baking conditions shown in Table 1.
焼付後、徐冷して、シートを取出した。この圧電シート
は半径方向に３〜８％の収縮率を示したが、割れ、反り
、穿孔を生せず平滑性の優れたものであつた。その時の
電気特性を第１表に示す。〔実施例２〕
ＰｂＴｌＯ３；ＰｂＺｒＯ３；Ｐｂ（Ｍｇｌｌ３Ｎｂ２
ｌ３）０３＝３７．５；２５．０；３７．５の組成比を
持つＰｂ（Ｍｇｌｌ３Ｎｂ２ｌ３）ＴｉＺｒＯ３系の圧
電セラミックス材を９０６℃−２時間で仮焼。After baking, the sheet was slowly cooled and taken out. Although this piezoelectric sheet exhibited a shrinkage rate of 3 to 8% in the radial direction, it exhibited excellent smoothness without cracking, warping, or perforation. The electrical characteristics at that time are shown in Table 1. [Example 2] PbTlO3;PbZrO3;Pb(Mgll3Nb2
l3) A Pb(Mgll3Nb2l3)TiZrO3-based piezoelectric ceramic material having a composition ratio of 03=37.5; 25.0; 37.5 was calcined at 906°C for 2 hours.
混合粉砕後３ＣｎＬ×３Ｃ７Ｆ！×厚み１ｃｍに成形圧
５００ｋ９／Ｃｌｔにて成形し実施例１４同様にシート
用材料とする。結合剤としてのガラス組成か、円Ｏ；７
０モル％、Ｂ２Ｏ３；５モル％、ＳｉＯ２；２５モル％
の化学組成を有するガラスを作成し、微粉末化したのち
結合剤として用いる。有機結合剤としては第２表に、示
すところの結合剤、および可塑剤を添加樹脂量の１／２
重量各々加え、原料に対して５０Ｗｔ％のエチルアルコ
ールでよく攪拌混合し、さらにボールミルにて２＠間混
合して泥漿を作成した。シートの作製は〔実施例１〕と
同様の方法で作製した。シート密度は第２表に示す。次
に打抜成形機を用いて生シートを直径３０ｗ０ｎの円板
状に打抜抜き、電気炉内に表面平滑なアルミナ板の上に
のせて設置し、第２表に示すところの焼付条件でグレー
ズ化を行つた。After mixing and grinding, 3CnL×3C7F! x Molded to a thickness of 1 cm at a molding pressure of 500k9/Clt to obtain a sheet material in the same manner as in Example 14. Glass composition as a binder, circle O; 7
0 mol%, B2O3; 5 mol%, SiO2; 25 mol%
A glass with the chemical composition is prepared, pulverized, and used as a binder. As the organic binder, the binder and plasticizer shown in Table 2 are added to 1/2 of the amount of resin.
Each weight was added and mixed with 50 wt % ethyl alcohol based on the raw materials by stirring, and further mixed for 2 hours in a ball mill to prepare a slurry. The sheet was produced in the same manner as in [Example 1]. The sheet density is shown in Table 2. Next, the green sheet was punched out into a disk shape with a diameter of 30w0n using a punching machine, placed on an alumina plate with a smooth surface in an electric furnace, and baked under the baking conditions shown in Table 2. Glaze was applied.
この圧電シートは半径方向に３〜８％の収縮率を示した
が、割れ反り、穿孔を生ぜず平滑性の優れたものであつ
た。その時の電気特性を第２表に示す。以上のように本
発明によれば加工性に優れ、コストが安く、しかも高性
能な圧電特性を有する圧電体シートを得ることができる
。Although this piezoelectric sheet showed a shrinkage rate of 3 to 8% in the radial direction, it did not crack, warp, or perforate and had excellent smoothness. The electrical characteristics at that time are shown in Table 2. As described above, according to the present invention, it is possible to obtain a piezoelectric sheet having excellent workability, low cost, and high performance piezoelectric properties.
Claims (1)
ク粒子の１〜２種量％のガラス粉末と有機成分である結
合剤・可塑剤とからなる一定厚みの生シートを作製して
所定の形状に打抜いた後、３００〜４００℃の温度で前
記有機成分の結合剤、可塑剤を除去し、この焼成用シー
トを３００〜９００℃の温度で焼成することを特徴とす
る圧電体シートの製造方法。 ２ 有機結合剤としてポリビニルブチラール、ポリ酢酸
ビニル、あるいはその両者を用いた特許請求の範囲第１
項記載の圧電体シートの製造方法。 ３ 有機結合剤としてポリビニルブチラール、ポリ酢酸
ビニル、あるいはその両者を用いた特許請求の範囲第１
項記載の圧電体シートの製造方法。[Scope of Claims] 1. A green sheet with a constant thickness is prepared which is made of lead-based piezoelectric ceramic particles, glass powder containing 1 to 2% of the ceramic particles, and a binder/plasticizer that is an organic component. After punching into a predetermined shape, the binder and plasticizer of the organic components are removed at a temperature of 300 to 400°C, and the sheet for firing is fired at a temperature of 300 to 900°C. A method for manufacturing a piezoelectric sheet. 2 Claim 1 in which polyvinyl butyral, polyvinyl acetate, or both are used as the organic binder
A method for manufacturing a piezoelectric sheet as described in . 3 Claim 1 in which polyvinyl butyral, polyvinyl acetate, or both are used as the organic binder
A method for manufacturing a piezoelectric sheet as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52105537A JPS6043677B2 (en) | 1977-09-01 | 1977-09-01 | Method for manufacturing piezoelectric sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52105537A JPS6043677B2 (en) | 1977-09-01 | 1977-09-01 | Method for manufacturing piezoelectric sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5438599A JPS5438599A (en) | 1979-03-23 |
| JPS6043677B2 true JPS6043677B2 (en) | 1985-09-30 |
Family
ID=14410324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52105537A Expired JPS6043677B2 (en) | 1977-09-01 | 1977-09-01 | Method for manufacturing piezoelectric sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6043677B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194921A (en) * | 1989-12-22 | 1991-08-26 | Showa Denko Kk | Semiconductor epitaxial wafer and its manufacture |
-
1977
- 1977-09-01 JP JP52105537A patent/JPS6043677B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5438599A (en) | 1979-03-23 |
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