JPS6045714B2 - Continuous partial plating equipment for the lower end of the workpiece - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a continuous partial plating apparatus for plating the lower end of a workpiece in the form of a rectangular thin plate, such as a printed circuit board, which is an electronic component.

Recently, there has been a dramatic increase in demand for plating the terminals at the bottom of thin printed circuit boards used for electronic components.

Conventionally, when continuously plating a thin plate-shaped workpiece, the workpiece is used as a negative electrode and an anode is placed as a counter electrode. There were two methods: one method was to transport the workpiece by rotating rollers and supply power to the workpiece, and the other was to supply power to the workpiece by sliding the workpiece with a brush. However, in the former case, the workpiece is transported by the rotation of the rollers, so it does not cause much damage to the workpiece, but the contact surface between the roller that supplies electricity and the workpiece is always in line contact, so the current cannot be generated. I couldn't get much. In the latter case, although it is possible to increase the allowable current by increasing or decreasing the contact area of the brush, the surface of the object to be treated is a sliding type, which has the disadvantage of causing minute scratches. The present invention provides a continuous partial plating apparatus that overcomes all of the above-mentioned drawbacks. Embodiments will be described in detail below with reference to the drawings. FIG. 1 is an external perspective view of a continuous partial plating apparatus according to the present invention, and for convenience of explanation, the arrow is referred to as the front. Second
The figure shows the main part of the present invention, and is a longitudinal sectional front view taken from the direction of the arrows 1-1 in FIG. FIG. 3 is an explanatory side sectional view, and is an explanatory view showing a state in which the right side of the object to be processed 1 in FIG. 2 is removed. Mainly, in Fig. 2, 1 in the center is a thin plate-shaped printed circuit board.The example is a rectangular thin plate-shaped printed circuit board with a board thickness of 1.6 TmIn, and the lower end part (terminal) to be plated.
All parts except 14 are covered with mask tape 10.

Although the mask is shown enlarged for explanation purposes, the thickness of the mask in the example is 0.2? Before and after. Reference numeral 2 denotes an endless conveyor belt made of a rubber-like elastic material, which is disposed on the conveyor itself by driving pulleys 6, 6'' as shown in FIG. Drive pulley 6,
6'' are arranged in a row, and the object to be processed 1 is held between a pair.

A power supply wire 3 made of silver-plated copper, copper-plated stainless steel, or copper is embedded around the entire outer surface of the pair of facing conveyor belts 2. In the illustration, the power supply wire 3 has a circular cross-sectional shape, but the contact surface that clamps the object to be processed can be wide or narrow as necessary, and its shape is not limited. 5,5″
1 is a belt guide 5 for conveying the conveyor belt 2 without swinging, and is supported by a guide support 8 as shown in FIG.

If the guides 5 and 5'' are connected by a holding rod 9, the stability will be further increased, and the spacing can be finely adjusted.The return side 7 of the conveyor belt 2 is made of copper or a material that supplies a negative current to the power supply wire 3. A brush 4 made of stainless steel is provided. Reference numeral 15 is a support frame for the brush 4. The left brush 4 is not shown because the figure is a symmetrical drawing.The terminal 14 is the lower end of the object to be treated. 13 is a plating solution in which is immersed, 12 is a plating treatment tank, and 11 and 11'' are anodes. Figure 4 shows the flow of workpiece 1 into and out of the plating tank. The figure showing the slit-like notches 16 and 16' is a front view of the plating tank 12, and the plating liquid leaking from the valve 17 in the notch of the plating tank 12 is drained through the outer case 12''. Afterwards, it is collected as shown by the arrow.

Note that 18 is a pedestal for this device. Next, the operation will be summarized. First, the mask tape 10 is applied to the substantially central portion of the conveyor belt 2 above the terminal portion 14 of the workpiece 1 to be plated.

Then, the conveyor belt 2 is driven, and when the workpiece 1 is held between the pair of conveyor belts and conveyed through the outer case 12'' and into the plating tank 12, the terminals 14 are immersed in the plating liquid and energized. In this case, the conveyor belt has elasticity, so the object to be processed 1 is held between the left and right belts in the figure, and the relative relationship between them is completely fixed and does not slide. Power is supplied by a pair of embedded power supply wires 3 on the left and right sides.Furthermore, a conveyor belt guide 5 is provided on the back side of the conveyor belt 2, so that the belt 3 does not run out and the workpiece 1 is always pressed at a constant level. After the plating process is completed, the workpiece 1 is carried out of the plating tank and further removed from the conveyor belt 3.
As described above, according to the present invention, the contact surface of the power supply wire 3 that is pressed into close contact with the workpiece 1 is always mechanically polished by the supply brush 4, so that the workpiece When power is supplied to 1, poor contact due to surface dirt is automatically eliminated, ensuring stable power supply.

In the device of the present invention, the conveyance and power supply are carried out by the same belt. As a result, unlike the conventional power supply method using roll clamping or the sliding power supply method using brushes, there is no misalignment between the power supply wire 3 and the workpiece 1 due to rotational friction or sliding due to the wire as in the conventional method. There is no risk of movement or injury.Also, it is possible to pass a large amount of current, which was not possible with the roll type, and the stable power supply allows high-quality plated objects to be processed without damaging them. Further, metal powder generated by power supply by the power supply brush 4 does not mix in the plating tank.

[Brief explanation of drawings]

FIG. 1 is a side view of the overall appearance of a plating apparatus according to the present invention, and FIG. 2 is a longitudinal sectional front view taken along arrows 1--2 in FIG. 1, showing essential parts of the present invention. 3 is a side sectional view of FIG. 2 with the right side removed from the center workpiece, and FIG. 4 is a perspective view of the front side of the plating tank. 1... Workpiece, 2... Conveyor belt, 3... Power supply wire, 4...
・Supply brush, 5...Venoret guide, 7...
... Belt return side, 10 ... Mask tape,
12... Plating tank, 14... Plating part (terminal).

Claims (1)

[Claims] 1. In a continuous plating device, a plating tank 12 in which a pair of anodes are arranged facing each other in the longitudinal direction at symmetrical positions with respect to a central plane, and a drive pulley above the plating tank are provided. The conveyor belt 3 consists of a movable conveyor belt, and the conveyor belt 3 consists of a pair of endless conveyor belts facing each other made of a rubber-like elastic body, and a power supply wire 3 made of copper or the like is embedded in the outer peripheral surface of each belt, and the conveyor belt 3 is made of a rubber-like elastic body and faces each other. The inner circumferential surface of the belt is supported by a belt guide 5 to prevent vibration, and the return side 7 of the conveyor belt is provided with a metal brush 4 above the outside of the plating tank for energizing the power supply wire. The object to be processed 1 is tightly held and held by the elastic conveyor belt, and the lower end of the object 1 is attached to the covered part 14.
The workpiece is immersed in the plating tank, and the non-plated part is covered with mask tape, and the plating device is moved to transfer the rectangular thin plate-shaped workpiece to the end of the conveyor belt through the slit 16 on the end side of the plating tank. A continuous partial plating device for plating the lower end of a workpiece by sequentially clamping the workpiece. 2. The belt guide according to claim 1, which is a pair of belt guides in which the belt guide 5 and the return belt 5' are connected by a holding rod 9, and the interval can be finely adjusted and stability is imparted. Continuous partial plating device for the lower end of the processed material.