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JPS6046007B2 - Sliding device using composite molding - Google Patents
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JPS6046007B2 - Sliding device using composite molding - Google Patents

Sliding device using composite molding

Info

Publication number
JPS6046007B2
JPS6046007B2 JP3195278A JP3195278A JPS6046007B2 JP S6046007 B2 JPS6046007 B2 JP S6046007B2 JP 3195278 A JP3195278 A JP 3195278A JP 3195278 A JP3195278 A JP 3195278A JP S6046007 B2 JPS6046007 B2 JP S6046007B2
Authority
JP
Japan
Prior art keywords
substrate
molded member
resin molded
hole
composite molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3195278A
Other languages
Japanese (ja)
Other versions
JPS54124078A (en
Inventor
正徳 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3195278A priority Critical patent/JPS6046007B2/en
Publication of JPS54124078A publication Critical patent/JPS54124078A/en
Publication of JPS6046007B2 publication Critical patent/JPS6046007B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 本発明は合成樹脂で形成した樹脂成形部材を基板に摺動
自在に取付けて構成する摺動装置に関し、その目的とす
るところは斯かる摺動装置をきわめて簡単にしてかつ安
価に得ることができるようにすることにある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sliding device constructed by attaching a molded resin member made of synthetic resin to a substrate in a slidable manner, and an object of the present invention is to extremely simplify the construction of such a sliding device. The objective is to make it possible to obtain it at a low cost.

従来におけるこの種の摺動装置は予め樹脂成形部材のみ
を製造しておき、金属製基板にガイド孔をあけて、その
後上記樹脂成形部材を前記孔に係合させて摺動自在とな
していた。
In conventional sliding devices of this type, only a resin molded member is manufactured in advance, a guide hole is drilled in a metal substrate, and the resin molded member is then engaged with the hole to enable free sliding. .

しかしながらこの種の装置によれば樹脂成形部材と基板
のガイド孔とがうまく係合されないことが間々あり、寸
法精度を高くとつておかなけれは樹脂成形部材が良好に
摺動せず、製造が面倒でコスト高になるものであつた。
そこで本発明はこのような従来の欠点を解消するものて
あり、以下にその一実施例について図面と共に説明する
However, with this type of device, the resin molded member and the guide hole of the board sometimes do not engage well, and unless dimensional accuracy is maintained, the resin molded member will not slide well, making manufacturing complicated. This resulted in high costs.
The present invention is intended to eliminate such conventional drawbacks, and one embodiment thereof will be described below with reference to the drawings.

第1図〜第3図は本実施例の摺動装置の完成した状態を
示しており、1は金属製の基板、2はこの基板1に設け
られた長孔、3はこの長孔2の長手方向に摺動自在に設
けられた合成樹脂の成形部材である。
Figures 1 to 3 show the completed state of the sliding device of this embodiment, with reference numeral 1 being a metal substrate, 2 being a long hole provided in this substrate 1, and 3 being a hole in this long hole 2. It is a synthetic resin molded member that is slidably provided in the longitudinal direction.

上記長孔2はその一端両側に半円状の孔4、4が設けら
れている。また長孔2の両側縁下面側には第5図、第6
図に示すように基板1の下方面に広がるテーパ部5が設
けられている。一方、樹脂成形部材3は基板1の上面側
に長孔2を覆う大きさの本体部6が、長孔2内に摺動部
7が、基板1の2面側にスイッチ等を操作するためのボ
ス部8が設けられている。上記摺動部7は上記半円孔4
に係合する突部7aとテーパ部5に係合する突部7bを
有している。これら各部が合成樹脂でーー体成形されて
樹脂成形部材3が構成されている。次に第4図、第6図
により長孔2部分の寸法関係について説明すると長孔2
の主要部の幅はレ、半円孔部4、4間の幅はレ、長孔2
の主要ノ部の長さはL3、テーパ部5の傾斜角はα゜と
なつている。
The elongated hole 2 has semicircular holes 4, 4 provided on both sides of one end thereof. Also, on the lower surface of both side edges of the elongated hole 2, there are figures 5 and 6.
As shown in the figure, a tapered portion 5 that extends downward from the substrate 1 is provided. On the other hand, the resin molded member 3 has a main body part 6 large enough to cover the long hole 2 on the top side of the board 1, a sliding part 7 inside the long hole 2, and a slide part 7 for operating a switch etc. on the second side of the board 1. A boss portion 8 is provided. The sliding part 7 is the semicircular hole 4
The protrusion 7a engages with the tapered portion 5, and the protrusion 7b engages with the tapered portion 5. Each of these parts is molded with synthetic resin to constitute the resin molded member 3. Next, the dimensional relationship between the two parts of the long hole will be explained with reference to Figures 4 and 6.
The width of the main part is L, the width between the semicircular holes 4 and 4 is
The length of the main part is L3, and the inclination angle of the tapered part 5 is α°.

斯様な構造の本実施例装置の製造工程を説明すると、ま
ず第4図〜第7図に示すように基板1に長孔2を穿孔す
る。
To explain the manufacturing process of the device of this embodiment having such a structure, first, a long hole 2 is bored in a substrate 1 as shown in FIGS. 4 to 7.

そしてこの基板1を第8図にi示すように上下の金型9
、10間に装着する。上金型9には樹脂成形部材3の本
体部6を形成するための凹部11が設けられている。ま
た下金型10には樹脂成形部材3のボス部8を形成する
ための穴部12が設けられている。この突部12に連通
している孔13は樹脂注入用の孔である。上、下両金型
9,10間に基板1に挾持し、孔13から凹部11,1
2及び基板1の長孔2内に合成樹脂を注入充填し冷却固
化させて、上、下金型を分割すると第9図〜第11図に
示すような基板1と樹脂成形部部材3の複合成形品が得
られる。この複合成形品において、樹脂成形部材3と基
板1の長孔2との間には図示の如く隙間が生じる。
Then, this substrate 1 is placed into upper and lower molds 9 as shown in FIG.
, to be worn between 10 and 10 hours. The upper mold 9 is provided with a recess 11 for forming the main body 6 of the resin molded member 3. Further, the lower mold 10 is provided with a hole 12 for forming the boss portion 8 of the resin molded member 3. A hole 13 communicating with this protrusion 12 is a hole for resin injection. The substrate 1 is held between the upper and lower molds 9 and 10, and the recesses 11 and 1 are formed through the holes 13.
When synthetic resin is injected and filled into the long holes 2 of the substrate 2 and the substrate 1, cooled and solidified, and the upper and lower molds are divided, a composite of the substrate 1 and the resin molded member 3 as shown in FIGS. 9 to 11 is obtained. A molded product is obtained. In this composite molded product, a gap is created between the resin molded member 3 and the elongated hole 2 of the substrate 1 as shown in the figure.

これは樹脂の冷却に伴う収縮にするもので、上記隙間は
長孔2の周壁と樹脂成形部材3の摺動部7との間、テー
パ部5と突部7bとの間に生じる。前者の隙間をΔSと
し合成樹脂の持つ収縮率をSとするとΔS1=S上1で
ある。またテーパ −1Z−T部5
の角度α0はα0=捻n −ロユ(T1:基板1の厚さ
)であるから、レ〉ZTlとするならばテーパ部5と樹
脂成形部材3の突部7bとの間に隙間が生じ樹脂成形部
材3は基板1から離れてしまうが、テーパ部5と突部7
bとの係合、本体部6と基板1との係合、半円孔部4と
突部7aとの係合によつて位置保持され移動し得ない。
This is caused by the contraction of the resin as it cools, and the gap is created between the peripheral wall of the elongated hole 2 and the sliding portion 7 of the resin molded member 3, and between the tapered portion 5 and the protrusion 7b. If the former gap is ΔS and the shrinkage rate of the synthetic resin is S, then ΔS1=1 above S. Also taper -1Z-T section 5
Since the angle α0 is α0=twist n - royu (T1: thickness of the substrate 1), if Le>ZTl, a gap is created between the taper part 5 and the protrusion 7b of the resin molded member 3, and the resin Although the molded member 3 separates from the substrate 1, the tapered part 5 and the protrusion 7
b, the engagement between the main body 6 and the substrate 1, and the engagement between the semicircular hole 4 and the projection 7a, the position is held and cannot be moved.

そこて第9図において基板1を長孔2短手方向すなわち
半円孔部4の対称線11を基準にして下方側に折曲げる
と第1図〜第3図に示すように樹,脂成形部材3の矢印
15方向の移動を阻止していた長孔2の他端周壁部が除
かれるので、該部材3は矢印15方向に摺動可能となる
Therefore, in FIG. 9, when the substrate 1 is bent downward with respect to the lateral direction of the elongated hole 2, that is, the line of symmetry 11 of the semicircular hole portion 4, resin molding is performed as shown in FIGS. 1 to 3. Since the peripheral wall portion of the other end of the elongated hole 2 that was preventing movement of the member 3 in the direction of the arrow 15 is removed, the member 3 can now slide in the direction of the arrow 15.

この摺動はボス部8が基板1の折曲片1aに当接するこ
とによつて阻止される。なお第12図に示すように長孔
2をテーパ部5を有しない単純形状として樹脂成形部材
3を形成すると長孔2の加工作業が簡単になるため全体
として作業時間を単縮することが可能となる。
This sliding is prevented by the boss portion 8 coming into contact with the bent piece 1a of the substrate 1. Note that, as shown in FIG. 12, if the resin molded member 3 is formed by forming the long hole 2 into a simple shape without the tapered portion 5, the machining work of the long hole 2 becomes easier, so that the overall working time can be shortened. becomes.

この場合、樹脂成形部材3の抜け止め手段を要する場合
は別個に設ければよいものである。以上のように本発明
の複合成形による摺動装置は基板に樹脂成形部材を複合
成形による組付け、基板を曲げるだけのきわめて簡単な
手段で摺動装ノ置を構成することができるので、コスト
の低減、組立工程の大幅な消減が図れることは言うまで
もなく、高精度で良好に動作する装置をばらつきなく提
供することができるものである。
In this case, if a means for preventing the resin molded member 3 from coming off is required, it may be provided separately. As described above, the sliding device by composite molding of the present invention can be constructed by extremely simple means of assembling the resin molded member to the board by composite molding and bending the board, so it is cost-effective. Needless to say, it is possible to reduce the amount of noise and the number of assembly steps required, and it is also possible to provide a device that is highly accurate and operates well without any variation.

しかも摺動装置の数が増えてその組立工数は1個の装置
分だけの工数で製造できるもので、その産業性は大なる
ものである。
Moreover, since the number of sliding devices increases, the number of assembly steps required for assembly is only that for one device, and the industrial efficiency is great.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例における摺動装置の平面図、
第2図は同正面図、第3図は第1図のA−A″線断面図
、第4図は同装置を構成する基板の平面図、第5図は第
4図のB−B″縦断面図、第6図は第5図の要部拡断面
図、第7図は第4図のC−C″線断面図、第8図は同装
置を製造する金型を示す断面図、第9図は同金型により
製造された複合成形品の平面図、第10図は第9図のD
一D″線断面図、第11図は第9図のE上″線断面図、
第12図は本発明の他の実施例を示す断面図である。 1・・・・・・基板、1a・・・・・折曲面、2・・・
・・・長孔、3・・・・・樹脂成形部材。
FIG. 1 is a plan view of a sliding device in an embodiment of the present invention;
FIG. 2 is a front view of the same, FIG. 3 is a cross-sectional view taken along the line A-A'' in FIG. 1, FIG. 4 is a plan view of the board constituting the device, and FIG. 6 is an enlarged sectional view of the main part of FIG. 5, FIG. 7 is a sectional view taken along line C-C'' in FIG. 4, and FIG. 8 is a sectional view showing a mold for manufacturing the device. Figure 9 is a plan view of a composite molded product manufactured using the same mold, and Figure 10 is D of Figure 9.
11 is a sectional view taken along the line E of FIG. 9,
FIG. 12 is a sectional view showing another embodiment of the present invention. 1...Substrate, 1a...Bending surface, 2...
...Long hole, 3...Resin molded member.

Claims (1)

【特許請求の範囲】 1 基板に長孔を設け、該基板の長孔全体に合成樹脂を
充填し複合成形することにより樹脂成形部材を形成し、
上記長孔の一部を含んで上記基板を折曲げ、樹脂成形部
材を上記長孔をガイドとして摺動自在としてなる複合成
形による摺動装置。 2 長孔をその開口周縁にテーパ部を有する孔となし、
このテーパ部に樹脂成形部材が係合されようになして前
記樹脂成形部材を抜け止めしてなる特許請求の範囲第1
項記載の複合成形による摺動装置。
[Claims] 1. A resin molded member is formed by providing a long hole in a substrate, filling the entire long hole of the substrate with a synthetic resin, and performing composite molding,
A sliding device by composite molding, in which the substrate is bent to include a part of the elongated hole, and the resin molded member can be slid freely using the elongated hole as a guide. 2. The elongated hole has a tapered portion at the opening periphery,
Claim 1: A resin molded member is engaged with the tapered portion to prevent the resin molded member from coming off.
A sliding device made of composite molding as described in Section 1.
JP3195278A 1978-03-20 1978-03-20 Sliding device using composite molding Expired JPS6046007B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3195278A JPS6046007B2 (en) 1978-03-20 1978-03-20 Sliding device using composite molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3195278A JPS6046007B2 (en) 1978-03-20 1978-03-20 Sliding device using composite molding

Publications (2)

Publication Number Publication Date
JPS54124078A JPS54124078A (en) 1979-09-26
JPS6046007B2 true JPS6046007B2 (en) 1985-10-14

Family

ID=12345286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3195278A Expired JPS6046007B2 (en) 1978-03-20 1978-03-20 Sliding device using composite molding

Country Status (1)

Country Link
JP (1) JPS6046007B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10458020B2 (en) * 2015-04-14 2019-10-29 Ebara Corporation Substrate processing apparatus and substrate processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10458020B2 (en) * 2015-04-14 2019-10-29 Ebara Corporation Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JPS54124078A (en) 1979-09-26

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