JPS6046053B2 - Low melting point sealing composition - Google Patents
Low melting point sealing compositionInfo
- Publication number
- JPS6046053B2 JPS6046053B2 JP8531977A JP8531977A JPS6046053B2 JP S6046053 B2 JPS6046053 B2 JP S6046053B2 JP 8531977 A JP8531977 A JP 8531977A JP 8531977 A JP8531977 A JP 8531977A JP S6046053 B2 JPS6046053 B2 JP S6046053B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- less
- sealing
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 title claims description 29
- 230000008018 melting Effects 0.000 title claims description 28
- 238000007789 sealing Methods 0.000 title claims description 24
- 239000000203 mixture Substances 0.000 title claims description 12
- 239000011521 glass Substances 0.000 claims description 24
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 238000004017 vitrification Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- FPHIOHCCQGUGKU-UHFFFAOYSA-L difluorolead Chemical compound F[Pb]F FPHIOHCCQGUGKU-UHFFFAOYSA-L 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 229910052839 forsterite Inorganic materials 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Description
【発明の詳細な説明】
本発明は、低融点封着用組成物、より具体的には、無荷
重て約４００゜Ｃの温度でｍ分間以内て封着出来、アル
ミナセラミックを使用した１、Ｃパッケージに適した低
融点封着用組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a low melting point sealing composition, more specifically, a 1. The present invention relates to a low melting point sealing composition suitable for packaging.
一般に、半導体素子の気密封着は、低温で短時間に行な
われる程、素子の劣化が少なく、熱経済的にも有利であ
り、インデックスの向上も計れる。現在、１、Ｃパッケ
ージ用として用いられている低融点ガラスの中には、優
れた熱衝撃強度を有する熱失透性ガラスが知られている
が、その封着温度は最低のものでも４５０℃であり、し
かも極めて長い封着時間が必要であるため、熱経済的に
も、又素子の特性に及ぼす影響に於ても好ましいものと
は言えない。一方、セラミックとして、比較的熱膨張係
数の大きいフォルステライトを用いた１、Ｃパッケージ
では、４００℃程度で封着出来る低融点ガラスが存在す
るが、フォルステライト自体の機械的強度が弱いので破
損し易く、また膨張係数が大きいために、厳しい熱衝撃
をかけた時にパッケージがりークするという点であまり
実用的ではない。In general, when semiconductor devices are hermetically sealed at low temperatures and in a short time, the devices are less likely to deteriorate, which is thermoeconomically advantageous, and the index can be improved. Among the low melting point glasses currently used for 1.C packages, heat devitrification glass with excellent thermal shock strength is known, but its sealing temperature is 450°C at the lowest. Moreover, since an extremely long sealing time is required, it cannot be said to be preferable in terms of thermoeconomics or the effects on the characteristics of the device. On the other hand, in a 1.C package that uses forsterite, which has a relatively large coefficient of thermal expansion, as a ceramic, there is a low-melting glass that can be sealed at around 400°C, but the mechanical strength of forsterite itself is weak, so it may break. It is not very practical in that the package leaks when subjected to severe thermal shock due to its high coefficient of expansion.
本発明は、上記事情に鑑みなされたものであり、封着温
度が４００℃と極めて低く、１０分以内で封着が出来、
機械的強度の大きいアルミナセラミックに適しており、
熱衝撃強度、機械的強度が前記熱失透性ガラスに優ると
も劣らずしかも耐酸性がすぐれ、メッキ付着を起さない
封着用組成物を提供するものである。The present invention was made in view of the above circumstances, and has an extremely low sealing temperature of 400°C, and can be sealed within 10 minutes.
Suitable for alumina ceramics with high mechanical strength.
The present invention provides a sealing composition which has thermal shock strength and mechanical strength superior to those of the heat devitrification glass, has excellent acid resistance, and does not cause plating adhesion.
即ち、本発明は、重量比で、Ｐの６０〜８０％、ＰｂＦ
０３〜１２％、均００９〜１４％、５ｉ０００．５〜２
％、Ｚｎ００〜７％、Ａ１００３０〜２％、Ｂｉ００３
０〜５％を含む低融点ガラス粉末（２）と、Ｊ 重量比
で、Ｐｂ０７０〜８６％、Ｂ０００８〜１８％、５ｉ０
００．５〜５％、Ａ１２０００〜４％、Ｚｎ００〜７％
を含む低融点粉末ガラス（Ｂ）と、５〜４４μが９０％
以上、４４μ以上が５％以下、５μ以下が５％以下で、
且つ平均粒径が８〜１５μのｉ粒度分布を有するチタン
酸鉛粉末とから成り、これらの割合が重量比で、低融点
ガラス（Ａ）４４〜５５％
低融点ガラス（Ｂ）１〜１０％
チタン酸鉛 ４０〜５５％
より好ましくは、
低融点ガラス（Ａ） ４５〜４９％低融点ガラス
（Ｂ） ３〜７％
チタン酸鉛 ４５〜４９％の範囲内にあ
る低融点封着用組成物である。That is, in the present invention, in terms of weight ratio, 60 to 80% of P, PbF
03-12%, average 009-14%, 5i000.5-2
%, Zn00~7%, A10030~2%, Bi003
Low melting point glass powder (2) containing 0-5%, J weight ratio, Pb070-86%, B0008-18%, 5i0
00.5~5%, A12000~4%, Zn00~7%
Low melting point powder glass (B) containing 5-44μ is 90%
Above, 44μ or more is 5% or less, 5μ or less is 5% or less,
and lead titanate powder having an i particle size distribution with an average particle size of 8 to 15μ, and the weight ratio of these is 44 to 55% for low melting point glass (A) and 1 to 10% for low melting point glass (B). Lead titanate 40 to 55% More preferably, low melting point glass (A) 45 to 49% Low melting point glass (B) 3 to 7% Lead titanate A low melting point sealing composition within the range of 45 to 49% be.
低融点ガラス（４）の組成を上記の如ぐ限定した理由は
以下の通りである。ＰｂＯが８０％以上になるとガラス
化が困難となり、６０％以下になると粘度が大きくなり
低温封着が困難となる。The reason for limiting the composition of the low melting point glass (4) as described above is as follows. If PbO exceeds 80%, vitrification becomes difficult, and if PbO exceeds 60%, the viscosity increases and low-temperature sealing becomes difficult.
ＰｂＦ２が１２％以上になると結晶化し易くなり封着時
流動し難くなり、３％以下になると、粘度が大きくなり
低温封着が困難となる。When PbF2 is 12% or more, it tends to crystallize and becomes difficult to flow during sealing, and when it is 3% or less, the viscosity increases and low-temperature sealing becomes difficult.
Ｂ２Ｏ３が１４％以上になると粘度が大きくなり、低温
封着が困難となり、９％以下になるとガラス化が困難と
なる。When B2O3 is 14% or more, the viscosity increases, making low-temperature sealing difficult, and when it is 9% or less, vitrification becomes difficult.
ＳｉＯ２が２％以上になると、粘度が大きくなり低温封
着が困難となり、０．５％以下になると耐水性、耐酸性
が悪くなり、又結晶化し易くなる。When SiO2 exceeds 2%, the viscosity increases and low-temperature sealing becomes difficult, and when SiO2 exceeds 0.5%, water resistance and acid resistance deteriorate, and crystallization tends to occur.
ＺｎＯが７％以上、Ｂｉ２Ｏ３が５％以上になると、結
晶化し易くなるため、封着時流動し難くなる。Ａｌ２Ｏ
３が２％以上になると粘度が大きくなり、低温封着が困
難となる。低融点ガラス（Ｂ）の組成を上記の如く限定
した理由は以下の通りてある。If the ZnO content is 7% or more and the Bi2O3 content is 5% or more, it becomes easy to crystallize and therefore becomes difficult to flow during sealing. Al2O
When 3 is 2% or more, the viscosity increases and low-temperature sealing becomes difficult. The reason for limiting the composition of the low melting point glass (B) as described above is as follows.
ＰｂＯが８６％以上になるとガラス化が困難となり、７
０％以下になると粘度が大きくなる。When PbO exceeds 86%, vitrification becomes difficult, and 7
When it becomes 0% or less, the viscosity increases.
Ｂ２Ｏ３が１８％以上になると粘度が大きくなり、８％
以下になると、ガラス化が困難になる。ＳｉＯ２が５％
以上になると、粘度が大きなり０．５一％以下になると
、耐水性、耐酸性が悪くなり、又結晶化し易くなる。When B2O3 exceeds 18%, the viscosity increases and becomes 8%.
Below this, vitrification becomes difficult. SiO2 is 5%
If the viscosity exceeds 0.51% or less, the water resistance and acid resistance will deteriorate and crystallization will occur easily.
．Ａｌ２Ｏ３が４％以上になると、粘度が大きなる。．． When Al2O3 is 4% or more, the viscosity increases.
チタン酸鉛の粒度を上記の如く限定した理由は以下の通
りてある。５μ以下が５％以上になると、封着時流動し
難くなり、熱膨張係数が大きくなる。The reason for limiting the particle size of lead titanate as described above is as follows. When the ratio of 5μ or less is 5% or more, it becomes difficult to flow during sealing, and the coefficient of thermal expansion becomes large.
４４ｐ以上が５％以上になると、封着時に微小クラック
が生じ、気密リークを起し易くなる。When the content of 44p or more is 5% or more, microcracks occur during sealing, making it easy to cause airtight leakage.
平均粒径が８μ以下になると、熱膨張係数が大きくな・
り、１５μ以上になると封着時に微小クラックが生じ、
気密リークを起し易くなる。低融点ガラス（４）、低融
点ガラス（Ｂ）、チタン酸鉛の混合割合を上記の如く限
定した理由は、以下の通りである。When the average particle size is 8μ or less, the coefficient of thermal expansion becomes large.
If the thickness exceeds 15μ, microcracks will occur during sealing.
Airtight leaks are likely to occur. The reason why the mixing ratio of the low melting point glass (4), the low melting point glass (B), and the lead titanate was limited as described above is as follows.
低融点ガラス（４）が４４％以下になると低温封着が困
難となり、５５％以上になるど熱膨張係数が大きくなり
、アルミナセラミックに適さなくなる。If the content of the low melting point glass (4) is less than 44%, low-temperature sealing becomes difficult, and if it is more than 55%, the coefficient of thermal expansion increases, making it unsuitable for alumina ceramics.
低融点ガラス（Ｂ）が１０％以上になると低温封着が困
難となり、１％以下になると、メッキ付着が発生し易く
なる。チタン酸鉛が４０％以下になると、熱膨張係数が
大きくなり、アルミナセラミックに適さなくな）り、５
５％以上になると低温封着が困難となる。When the low melting point glass (B) is 10% or more, low temperature sealing becomes difficult, and when it is 1% or less, plating adhesion is likely to occur. If the lead titanate content is less than 40%, the coefficient of thermal expansion will become large, making it unsuitable for alumina ceramics.
If it exceeds 5%, low-temperature sealing becomes difficult.
以下実施例に基づいて、本発明を説明する。表１は本発
明に於て使用する低融点ガラス（４）の実施例で、その
組成及び屈状点を示す。表２は本発明に於て使用する低
融点ガラス（Ｂ）の実施例を示す。The present invention will be described below based on Examples. Table 1 shows an example of the low melting point glass (4) used in the present invention, and shows its composition and bending point. Table 2 shows examples of low melting point glasses (B) used in the present invention.
低融点ガラス（４）及び（Ｂ）の粉末は、以下の手順で
作成する。Powders of low melting point glasses (4) and (B) are created by the following procedure.
まず光明丹、弗化鉛、硼酸、珪酸、酸化亜鉛、水酸化ア
ルミニウム、三二酸化ビスマスを、上記表に示す組成に
なるように調合し、白金ルツボで、約８００℃３吟間溶
融した後、板状に成形し、アルミナボールミルで粉砕し
た後、１５０メッシュのステンレス篩で分級する。First, Komyotan, lead fluoride, boric acid, silicic acid, zinc oxide, aluminum hydroxide, and bismuth sesmuth oxide were mixed to have the composition shown in the table above, and after melting in a platinum crucible at approximately 800°C for 3 minutes, It is formed into a plate shape, pulverized with an alumina ball mill, and then classified with a 150-mesh stainless steel sieve.
チタン酸鉛は、ＴｉＯ２とＰｌＯのモル比が１：１とな
るように、酸化チタン及びりサージを調合し、１１５０
′Ｃで２時間焼成した後、焼成物を前記粒度になるよう
に粉砕、分級する。尚、チタン酸鉛の熱膨張係数は、３
０〜２５０℃の温度範囲で約−６０×１０−７／℃であ
る。表３は、本発明に係る低融点封着用組成物の実二施
例で、各成分の配合割合及び特性を示す。上記表３に示
すフリットを用い、下記の手順でＩＣパッケージ用とし
ての適合性を評価した。まず、前記フリットとビークル
（アクリル樹脂５％をα−テルピネオールに溶かした溶
液）とを混合し、ペーストを作成した。このペーストを
スクリーン印刷法により、セラミックベース及びセラミ
ックキャップに印刷した。印刷厚は３００μ程度とした
。次にペーストを印刷したベース及びキャップを３７０
′Ｃに加熱し、５分間仮焼した。Lead titanate is prepared by mixing titanium oxide and Resurge so that the molar ratio of TiO2 and PlO is 1:1.
After firing for 2 hours at 'C, the fired product is crushed and classified to the above particle size. The coefficient of thermal expansion of lead titanate is 3
It is about -60x10-7/°C in the temperature range of 0 to 250°C. Table 3 is a second example of a low melting point sealing composition according to the present invention, and shows the blending ratio and characteristics of each component. Using the frits shown in Table 3 above, suitability for use in IC packages was evaluated according to the following procedure. First, the frit and a vehicle (a solution of 5% acrylic resin dissolved in α-terpineol) were mixed to create a paste. This paste was printed on a ceramic base and a ceramic cap by a screen printing method. The printing thickness was about 300μ. Next, attach the base and cap printed with paste to 370
'C and calcined for 5 minutes.
昇温は５℃／分、降温は急冷とした。ベース、キャップ
及びリードフレームを所定の形状に組み立て、電気炉中
で４００℃１紛間加熱し封着した。The temperature was raised at 5° C./min and the temperature was lowered rapidly. The base, cap, and lead frame were assembled into a predetermined shape and sealed by heating at 400° C. in an electric furnace.
昇温は５０℃／分、冷却は５゜Ｃ／分とした。次に封着
体（パッケージ）を５０％の硫酸で７０゜Ｃ１１分間酸
処理し、リードフレームの酸化膜を除去した。The temperature was increased at 50°C/min, and the cooling was performed at 5°C/min. Next, the sealed body (package) was acid-treated with 50% sulfuric acid at 70° C. for 11 minutes to remove the oxide film on the lead frame.
蒸留水で水洗した後、硫酸スズメッキ浴で、リードフレ
ーム部にスズメッキをほどこした。電流密度は、２Ａ／
デシメーター、メッキ時間は約１吟間とした。メッキ終
了後、蒸留水で水洗し、乾燥した。After washing with distilled water, the lead frame was tin plated in a tin sulfate plating bath. The current density is 2A/
The decimator and plating time were about 1 gin. After plating, it was washed with distilled water and dried.
上記手順で作成した封着体につき、フリット部へのメッ
キ付着の有無と熱衝撃試験（ＭＩＬ−ＳＴＤ一８８３、
条件Ａ）後の気密リークの有無を調べた。表３に示した
フリットのすべてにつき、上記の評価を行なつたところ
、すべて良好な結果を示し、ＩＣパッケージ用として適
していることが確認された。The sealed body prepared by the above procedure was tested for presence or absence of plating on the frit part and thermal shock test (MIL-STD-883,
The presence or absence of airtight leakage after condition A) was investigated. When all of the frits shown in Table 3 were evaluated as described above, they all showed good results and were confirmed to be suitable for IC packages.
以上のように、本発明の低融点封着用組成物は極めて低
温て封着がてき、熱衝撃強度も大きく、メッキ付着も起
さず、従来用いられていた種々の低融点ガラスの欠点を
十分補うことができる新規のガラスである。As described above, the low melting point sealing composition of the present invention can be sealed at extremely low temperatures, has high thermal shock strength, does not cause plating adhesion, and can sufficiently overcome the drawbacks of various conventionally used low melting point glasses. This is a new type of glass that can be supplemented.
Claims (1)
２％、Ｂ＿２Ｏ＿３９〜１４％、ＳｉＯ＿２０．５〜２
％、ＺｎＯ０〜７％、Ａｌ＿２Ｏ＿３０〜２％、Ｂｉ＿
２Ｏ＿３０〜５％を含み、且つ屈伏点が３２０℃以下の
低融点ガラス粉末（Ａ）と、重量比で、ＰｂＯ７０〜８
６％、Ｂ＿２Ｏ＿３８〜１８％、ＳｉＯ＿２０．５〜５
％、Ａｌ＿２Ｏ＿３０〜４％、ＺｎＯ０〜７％を含む低
融点ガラス粉末（Ｂ）と、５〜４４μが９０％以上、４
４μ以上が５％以下、５μ以下が５％以下で、且つ平均
粒径が８〜１５μの粒度分布を有するチタン酸鉛粉末と
から成り、これらの割合が重量比で、低融点ガラス（Ａ
）４４〜５５％ 低融点ガラス（Ｂ）１〜１０％ チタン酸鉛４０〜５５％ の範囲内にある低融点封着用組成物。[Claims] 1. PbO60-80%, PbF_23-1 in weight ratio
2%, B_2O_39-14%, SiO_20.5-2
%, ZnO0-7%, Al_2O_30-2%, Bi_
Low melting point glass powder (A) containing 30 to 5% of 2O and having a yield point of 320°C or less, and PbO of 70 to 8% by weight
6%, B_2O_38~18%, SiO_20.5~5
%, Al_2O_30-4%, ZnO 0-7% (B), and 5-44μ is 90% or more, 4
It consists of lead titanate powder having a particle size distribution of 5% or less of 4μ or more, 5% or less of 5μ or less, and an average particle size of 8 to 15μ, and these proportions are based on the weight ratio of low melting point glass (A
) 44 to 55% Low melting point glass (B) 1 to 10% Lead titanate 40 to 55% A low melting point sealing composition within the range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8531977A JPS6046053B2 (en) | 1977-07-15 | 1977-07-15 | Low melting point sealing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8531977A JPS6046053B2 (en) | 1977-07-15 | 1977-07-15 | Low melting point sealing composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5436314A JPS5436314A (en) | 1979-03-17 |
| JPS6046053B2 true JPS6046053B2 (en) | 1985-10-14 |
Family
ID=13855284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8531977A Expired JPS6046053B2 (en) | 1977-07-15 | 1977-07-15 | Low melting point sealing composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046053B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004172142A (en) * | 2004-02-24 | 2004-06-17 | Ngk Spark Plug Co Ltd | Spark plug manufacturing method |
-
1977
- 1977-07-15 JP JP8531977A patent/JPS6046053B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004172142A (en) * | 2004-02-24 | 2004-06-17 | Ngk Spark Plug Co Ltd | Spark plug manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5436314A (en) | 1979-03-17 |
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