JPS6047760B2 - High-speed simultaneous multilayer wiring electronic component mounting method - Google Patents

Description

[Detailed description of the invention] The present invention relates to multilayer wiring and mounting of electronic components.

Conventionally, this type of multilayer wiring and electronic component mounting has been done on a two-dimensional basis and individually and separately. In this case, since multilayer wiring is planar, it has been done by stacking each wiring layer separately, but it takes time to align each wiring layer, and mounting of electronic components has to be done separately. However, it had the disadvantage of being time consuming. An object of the present invention is to provide a multilayer wiring and a self-mounting method for electronic components, which eliminates the drawbacks of the above-mentioned conventional methods.

The multilayer wiring and electronic component mounting method of this invention is characterized by facilitating multilayer wiring and simultaneously performing multilayer wiring and electronic component mounting at high speed.

FIG. 1 is a plan view of a film having printed wiring and mounted with electronic components. In FIG. 1, a film 1 is made of an insulating material and has wiring 2 and electronic components 3. Specifically, a flexible insulating film made of polyimide or mylar is bonded with copper foil on one surface, and then a photosensitive resist and a mask with the required pattern are used, which is a technology commonly known in the manufacture of printed circuit boards. A wiring pattern is formed by exposure and development and etching, and the electronic component 3 is produced by bonding using a generally known method using a film carrier method.

FIG. 2 is a perspective view of a cylinder 6 having an empty copper portion 4 and a recess 5. FIG.

In FIG. 2, the cylinder 6 is made of a material such as metal that has good thermal conductivity. Specifically, it is produced by cutting or casting a pipe-shaped metal material. FIG. 3 is a perspective view showing the first embodiment of the present invention.

In FIG. 3, wiring is provided and electronic components 3 are mounted. Film 1 is being wrapped around cylinder 6,
Multilayer wiring and electronic component mounting are being carried out simultaneously and continuously. At this time, the accuracy of the diameter of the cylinder 6, the position of the wiring 2 and electronic components 3 on the film 1, and the thickness of the film 1 must be controlled within the accuracy required between the multilayer wiring layers. However, now a sprocket hole (not shown) similar to that implemented in conventional film carriers is formed in the film, and a pin or projection (not shown) is placed on the cylinder 6 at a position corresponding to the sprocket hole. By forming these and fitting them into each other, easy positioning becomes possible.

In this way, it can be manufactured through a series of steps, such as forming a pattern on a long film, bonding electronic components, and winding it around a cylinder made of metal, etc., so automation is easy and mass production is possible. and can be done inexpensively.

FIG. 4 is an enlarged sectional view taken along line AB in FIG. 3.

In FIG. 4, the electronic component 3 is joined to the recess 5 of the cylinder 6, the wiring 2 is multilayered, and the wiring 2 of each layer is insulated by an insulating film 1. Note that communication between each wiring layer is provided by through holes 7. FIG. 5 is a perspective view showing the embodiment of FIG. 2.

In FIG. 5, the film 1 is wound and mounted around a block 8 having a hexagonal cross section. Note that it is also possible to implement other polygonal blocks.

By using the mounting method of the present invention, multilayer wiring and electronic components can be mounted easily and at high speed. Furthermore, the mounting method of the present invention can be applied to electronic devices that need to be manufactured in large quantities at high speed;
For example, it can be particularly effectively applied to electronic devices such as computers.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view of a film with printed wiring and mounted electronic components, FIG. 2 is a perspective view of a cylinder with a recess, and FIG. 3 is a first embodiment of the invention. FIG. 4 is an enlarged sectional view taken along line AB in FIG. 3, and FIG. 5 is a perspective view showing the embodiment of FIG. 2.

In Figures 1 to 5, reference numeral 1 is a film, reference numeral 2 is wiring, reference numeral 3 is an electronic component, reference numeral 4 is an empty copper part, reference numeral 5 is a recess, reference numeral 6 is a cylinder,
Reference numeral 7 indicates a through hole, and reference numeral 8 indicates a hexagonal block.

Claims (1)

[Claims] 1. Multilayer wiring and mounting of a large number of electronic components can be achieved by wrapping a film with pre-printed wiring and a large number of electronic components mounted around a cylinder or polygonal block. An implementation method characterized by: