JPS6048588B2 - Method of plating aluminum strips - Google Patents
Method of plating aluminum stripsInfo
- Publication number
- JPS6048588B2 JPS6048588B2 JP52142027A JP14202777A JPS6048588B2 JP S6048588 B2 JPS6048588 B2 JP S6048588B2 JP 52142027 A JP52142027 A JP 52142027A JP 14202777 A JP14202777 A JP 14202777A JP S6048588 B2 JPS6048588 B2 JP S6048588B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- alloy
- aluminum
- temperature
- aluminum strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 21
- 238000007747 plating Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 229910000765 intermetallic Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 4
- 229910008757 Sn—Sb Inorganic materials 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 229910001203 Alloy 20 Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- DZXKSFDSPBRJPS-UHFFFAOYSA-N tin(2+);sulfide Chemical compound [S-2].[Sn+2] DZXKSFDSPBRJPS-UHFFFAOYSA-N 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Coating With Molten Metal (AREA)
Description
【発明の詳細な説明】
本発明は効率よくアルミ条件にメッキを施こす方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for efficiently plating aluminum.
アルミ線あるいはアルミシートなどの条件に所期の特性
を有せしめる目的で半田メッキをしたり、あるいは他の
耐食性や耐摩耗性の金属をメッキしたりすることが行な
われている。In order to give desired properties to aluminum wires or aluminum sheets, solder plating or other corrosion-resistant or wear-resistant metals are plated.
しかし、周知のようにアルミの表面には強固な安定した
酸化皮膜が形成されており、メッキするためにはます第
一にこの徴化皮膜を如何にして除去するかが問題てあつ
て、由来アルミヘのメッキの歴史はこの酸化皮膜を如何
にしてうまく除去しうまくメッキ層を形成仕しめるかに
苦心した歴史てあつたともいえる。このような酸化皮膜
除去の方法としては、従来山 フラックスを用いる方法
（２）超音波を用いる方法
（３）特別な置換メッキあるいは電気メッキによる下地
層を形成する方法（４）摩擦メッキ方法
などが知られている。However, as is well known, a strong and stable oxide film is formed on the surface of aluminum, and in order to plate it, the first problem is how to remove this oxidized film. The history of plating aluminum can be said to be a history of struggling to figure out how to remove this oxide film and how to properly form a plating layer. Methods for removing such oxide films include the conventional method of using mountain flux, (2) the method of using ultrasonic waves, (3) the method of forming a base layer by special displacement plating or electroplating, and (4) the friction plating method. Are known.
しかし、上記（１）フラックス法は強力なフラックスを
用いなければ効果がなく、有毒ガスを発生したり、残留
フラックスが極度に耐食性能を低下せしめたりするおそ
れがある。However, the above flux method (1) is ineffective unless a strong flux is used, and there is a risk that toxic gas may be generated or residual flux may extremely deteriorate corrosion resistance.
（２）の超音波法は有効ではあるが設備が高価になる上
技術的にも熟達が必要である。（３）および（４）は条
件に連続メッキをするためには不適当なものである。本
発明は上記実情にかんがみてなされたものであつて、前
記フラックスや超音波を用いることなく、接着性のすぐ
れたメッキ層をアルミ条件に連続的に形成する新規かつ
きわめて有用な方法を提供しようとするものであつて、
その要旨とするところは、メッキ用合金に当該合金の固
液温合相中にあつて硬い金属間化合物等を高山するよう
な元素を添付し、当該合金を固相温度以上、液相温度以
下の温度に保持して加圧状態とし、その中をアルミ条件
を通過せしめるようにするにある。Although the ultrasonic method (2) is effective, it requires expensive equipment and requires technical proficiency. Conditions (3) and (4) are inappropriate for continuous plating. The present invention has been made in view of the above circumstances, and aims to provide a new and extremely useful method for continuously forming a plating layer with excellent adhesive properties on aluminum without using the above-mentioned flux or ultrasonic waves. and
The gist of this is that an element is added to the alloy for plating that will build up hard intermetallic compounds during the solid-liquid temperature phase of the alloy, and the alloy is heated above the solidus temperature and below the liquidus temperature. The purpose is to maintain the temperature at a temperature of , pressurize it, and pass the aluminum condition through it.
以下に実施例に基ずいて説明する。１例をアルミ条件に
その半田付け性をよくするために ｎあるいはＰｂ−Ｓ
ｎ合金をメッキする場合について説明する。This will be explained below based on examples. In order to improve the solderability of one example under aluminum conditions, n or Pb-S was used.
The case of plating n alloy will be explained.
ＳｎあるいはＰｂ−Ｓｎ合金に１０〜３０％Ｓｂを添加
すると前記固液混合相にあつて、Ｓｎ−ＳｂあるいはＰ
ｂ−Ｓｎ−Ｓｂの液相中に硬のβ相（Ｓｎ−Ｓ瞳属間化
合物）が晶出した状態となる。When 10 to 30% Sb is added to Sn or Pb-Sn alloy, Sn-Sb or Pb is added in the solid-liquid mixed phase.
A hard β phase (Sn-S pupil intermetallic compound) crystallizes in the liquid phase of b-Sn-Sb.
かかるβ相晶出の状態にある温度に保持しておいてこれ
に圧力を生せしめあるいは圧力を附与してその中にアル
ミ線条体を通過せしめる。第１図はそのような装置の１
例を示したものである。The temperature is maintained at a state where the β-phase crystallizes, and pressure is generated or applied thereto, and the aluminum filament is passed through the temperature. Figure 1 shows one such device.
This is an example.
溶融合金層２と連結される導入管１の両端部にダイス３
，３’を設け、例えばアルミ線１０をダイス３，３’を
貫通するようにして引き抜き状態とする。溶融合金２０
は図のように連結孔４を介して導入管１中に充填され、
アルミ線１０は当該溶融合金中も通過するようになつて
いる。溶融合金２０は上記の状態にあつては導入管１中
において自重により内圧を生ずることとなるほかにアル
ミ線１０が図中矢印方向に引抜かれる際に導入管１内を
図中矢印方向に移動する作用が生じそれにより内圧を生
する結果となる。このように金属間化合物の微少晶出粒
子の多数介在する間において内圧負荷の状態の中をアル
ミ線１０が無理に通過する結果、アルミ線１０の表面酸
化皮膜が溶融合金中の金属間化合物によりこ．すり取ら
れ、アルミ表面が露出するや否やすぐ隣接状態にある液
粗分の合金と反応して治金学的な溶融メッキ層が形成さ
れることとなる、メッキ層はグイス３においてしごかれ
て必要メッキ皮膜となつてアルミ線上に形成され、メッ
キアルミ線１０’として製品として巻き取られる。Dies 3 are installed at both ends of the introduction pipe 1 connected to the molten alloy layer 2.
, 3' are provided, and the aluminum wire 10, for example, is drawn out so as to pass through the dies 3, 3'. Molten alloy 20
is filled into the introduction tube 1 through the connecting hole 4 as shown in the figure,
The aluminum wire 10 also passes through the molten alloy. In the above state, the molten alloy 20 generates internal pressure in the introduction tube 1 due to its own weight, and also moves in the direction of the arrow in the figure when the aluminum wire 10 is pulled out in the direction of the arrow in the figure. This effect results in the creation of internal pressure. As a result of the aluminum wire 10 being forced to pass through a state of internal pressure load between a large number of microcrystallized particles of intermetallic compounds, the surface oxide film of the aluminum wire 10 is formed by the intermetallic compounds in the molten alloy. child. As soon as the aluminum surface is scraped off and exposed, the plating layer is squeezed in the Gouisu 3, reacting with the adjacent liquid coarse alloy to form a metallurgical hot-dip plating layer. A necessary plating film is formed on the aluminum wire, and the plated aluminum wire 10' is wound up as a product.
本発明にあつては、如何なるメッキ層でもメッキ可能と
いう訳ではなく、所定の硬い晶出物を液相中に生ずる前
記Ｓｎ−ＳｂやＳｂ−Ｓｎ−ＳｂあるいはＡｌ？−Ｓｉ
合金のＳｉの量を多くしてＳｉの初晶を生じめるなどそ
れなりの硬に晶出粒の形成が可能である場合でないと適
用できない。In the present invention, it is not possible to plate any type of plating layer, but the Sn-Sb, Sb-Sn-Sb or Al? -Si
This method cannot be applied unless it is possible to form crystallized grains with a certain degree of hardness, such as by increasing the amount of Si in the alloy to produce Si primary crystals.
しかしながら、これにより下地メッキ層をつくりその上
に必要目的の別の合金をメッキすることは容易となる。
また本発明においてはメッキ合金に所定の加圧状態をつ
くることが必要であつて単なるどぶづけでは効果を生じ
ないことも実験により確認された。発明者らは本発明方
法を採用し連続的にメッキされたアルミ条体を効率よく
製造しており、順次その成果を提案していく予定である
。However, this makes it easy to create a base plating layer and plate another alloy for the desired purpose thereon.
Furthermore, it has been confirmed through experiments that it is necessary to create a predetermined pressurized state in the plating alloy in the present invention, and that mere dousing will not produce any effect. The inventors have adopted the method of the present invention to efficiently manufacture continuously plated aluminum strips, and plan to successively present the results.
第１図は本発明を実施する１例を示す説明図である。 FIG. 1 is an explanatory diagram showing one example of implementing the present invention.
Claims (1)
い金属間化合物等を晶出するような元素を添加し、当該
合金を固相温度以上液相温度以下の温度に保持して加圧
状態とし、その中をアルミ条体を通過せしめるようにす
るアルミ条体へのメッキ方法。1 Adding an element that crystallizes hard intermetallic compounds, etc. in the solid-liquid mixed phase of the alloy to the alloy for plating, and heating the alloy while maintaining it at a temperature above the solidus temperature and below the liquidus temperature. A method of plating an aluminum strip in a pressure state and allowing the aluminum strip to pass through it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52142027A JPS6048588B2 (en) | 1977-11-25 | 1977-11-25 | Method of plating aluminum strips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52142027A JPS6048588B2 (en) | 1977-11-25 | 1977-11-25 | Method of plating aluminum strips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5474233A JPS5474233A (en) | 1979-06-14 |
| JPS6048588B2 true JPS6048588B2 (en) | 1985-10-28 |
Family
ID=15305655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52142027A Expired JPS6048588B2 (en) | 1977-11-25 | 1977-11-25 | Method of plating aluminum strips |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048588B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4390589A (en) * | 1982-02-26 | 1983-06-28 | Bell Telephone Laboratories, Incorporated | Metal coating of fibers |
-
1977
- 1977-11-25 JP JP52142027A patent/JPS6048588B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5474233A (en) | 1979-06-14 |
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