JPS6048835B2 - Manufacturing method of bubble memory module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a rotating magnetic field driven bubble memory module.

Bubble memory consists of a crystalline bubble garnet chip, a permanent magnet that makes the stored information on the chip non-volatile, and X and Y coils for generating rotating magnetic fields to transfer stored information, and drives a bubble magnetic domain as a storage medium. There are things to do. A detailed explanation will be given below with reference to the drawings.

Fig. 1 is a perspective view showing a conventional package configuration, Fig. 2 is a perspective view of a resin molded case with a window, which is the main part of the present invention, and Fig. 3 is a perspective view of the molded case shown in Fig. 2 as a chip package. , FIG. 4 is a completed perspective view of the memory module in which the XX coil is attached to the package of FIG. 3, and FIG. 5 is a perspective view of the solenoid coil.

First, a conventional example shown in FIG. 1 will be explained.

An E-shaped ceramic substrate 1 is formed in which the center piece 2 is wider than the other pieces 3, and a garnet chip 4 is mounted on the center piece 2 by adhesive or the like to constitute a chip package, and an X coil and a Y coil (not shown) are formed. was inserted into the finished product. However, the molded product of the ceramic substrate 1 has large dimensional deviations such as warping and bending, and not only is it not possible to obtain sufficient substrate accuracy, but also the chip 4 is fixed to the center piece 2 of the substrate 1. Only the thickness will protrude,
The assembling of the rotating magnetic field generating coil, which is a later process, also has the disadvantage of causing various inconveniences.

The present invention solves the above problems and provides a method for manufacturing a bubble memory module that is safe and easy to manufacture.

The present invention is characterized by a chip package in which a bubble garnet chip is mounted on a ceramic substrate.
In the configuration of a memory module in which orthogonal X coils and Y coils are loaded, the bubble garnet chip is housed with coding protection within a window frame of a molded body case that is fitted and integrated onto the substrate, and Case is X
This is a method for manufacturing a bubble memory module having a structure that facilitates positioning when loading coils and Y coils.

An embodiment of the present invention will be described below.

FIG. 2 shows a resin case 5 molded with epoxy resin or the like, which is the main part of the present invention.The case 5 is approximately T-shaped and has a window 6 that protects and stores the chip 4, and a window 6 that fits and holds the substrate 1. It is composed of a U-shaped portion 7 for This resin case 5 is placed over the center piece 2 of the board 1 shown in FIG. FIG. 3 shows the state in which this is done. With this configuration, the conventional problem has been solved, that is, the chip 4 that was protruding from the center piece 2 is now lower than the plane of the resin case 5 by the resin case 5 that covers the center piece 2. The subsequent coil insertion process is facilitated, and the ceramic substrate 1
It is possible to absorb insufficient dimensional accuracy in assembling the bubble memory module due to warpage, bending, etc.

The accuracy of module assembly is determined by appropriately selecting the resin material for molding, and for example, accuracy of about 0.05% can be easily ensured. Figure 4 also shows the completed package shown in Figure 3. Heart solenoid X coil 8 and Y
It is a perspective view showing the completion status of the bubble memory module with the coil 9 inserted and installed.The coil installation is done by first inserting the Y coil 9 from the direction of arrow A or A' and installing it on the central piece, and then from the direction of arrow B from the rear. All you have to do is insert and attach the X coil 8.

Each of the X-Y coils is an air-core solenoid coil as shown in FIG. 5, and after the coil is wound,
Although it is thermocompression bonded and molded, in order to make the bubble drive magnetic field distribution uniform, the cross-sectional dimensions C and D of the coil and the parallel flatness or flatness between EE and FF3 are, for example, about ±0.025TWL or less. Due to this factor, the resin case 5 can also serve as an effective coil frame. Although the above memory module has been described with reference to the basic components and related processes that constitute the present invention, in reality, the electrical terminals for device functions such as bubble detection, writing, and transfer are connected to the DIP14 pin and the DIP22 pin.
In addition, there is a permanent magnet for storing bubble information above the assembled coil shown in Figure 4 above, a magnetic field equalization magnet for uniformizing the magnetic field, an external magnetic field shield, etc., and an additional module package as required. It is used to conduct As described above, the memory module equipped with the resin molded case with window according to the present invention can easily realize high-precision assembly, improve manufacturing yield, and at the same time, make it possible to establish reliability of the memory module.

The illustrated embodiments cited in the present invention are merely examples, and it goes without saying that various modifications can be made without changing the gist thereof.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional chip package configuration, FIG. 2 is a window-equipped resin molded body according to the present invention, FIG. 3 is a perspective view of a chip packaged structure of the molded body shown in FIG. FIG. 3 is a perspective view of the structure of a memory module in which an XY coil is loaded into a completed body, and FIG. 5 is a perspective view showing a solenoid coil. 1...Ceramic substrate, 2...Central piece of substrate 1, 4...Chip, 5...
・Resin case, 6...Window part of resin case, 8,
9... Coil.

Claims (1)

[Claims] 1 A chip package with a bubble garnet chip mounted on a ceramic substrate has an X coil and a Y coil that are orthogonal to each other.
In the configuration of a memory module loaded with a coil, the bubble garnet chip is coated and protected within a window frame of a windowed resin molded case that is fitted and integrated onto the substrate, and the case is fitted with the X coil. and Y
A method for manufacturing a bubble memory module, characterized by having a structure that facilitates positioning during coil loading.