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JPS6049149B2 - Manufacturing method of white alumina/ceramic for electronic parts - Google Patents
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JPS6049149B2 - Manufacturing method of white alumina/ceramic for electronic parts - Google Patents

Manufacturing method of white alumina/ceramic for electronic parts

Info

Publication number
JPS6049149B2
JPS6049149B2 JP54171991A JP17199179A JPS6049149B2 JP S6049149 B2 JPS6049149 B2 JP S6049149B2 JP 54171991 A JP54171991 A JP 54171991A JP 17199179 A JP17199179 A JP 17199179A JP S6049149 B2 JPS6049149 B2 JP S6049149B2
Authority
JP
Japan
Prior art keywords
ceramic
composition
electronic parts
alumina
firing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54171991A
Other languages
Japanese (ja)
Other versions
JPS5696776A (en
Inventor
毅彦 米田
敏春 野口
寛治 田添
誠 小川
宏光 多木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54171991A priority Critical patent/JPS6049149B2/en
Publication of JPS5696776A publication Critical patent/JPS5696776A/en
Publication of JPS6049149B2 publication Critical patent/JPS6049149B2/en
Expired legal-status Critical Current

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  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)

Description

【発明の詳細な説明】 本発明は電子部品用セラミック、例えばIC基板、回路
基板、集積回路用パッケージ等に用いられる電子部品用
白色アルミナ・セラミックの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a ceramic for electronic parts, such as a white alumina ceramic for electronic parts used for IC boards, circuit boards, packages for integrated circuits, and the like.

一般に電子部品用セラミックはMo、Wなどの高融点金
属を使用し、焼成の際の雰囲気を還元状態にするか、あ
るいはわすかに酸化状態にして化学的な反応を含ませメ
タライズする。
Generally, ceramics for electronic parts use high melting point metals such as Mo and W, and are metallized by making the atmosphere during firing either in a reducing state or in a slightly oxidizing state and involving a chemical reaction.

近年工程の省略としてセラミックの焼結とメタライズを
同時に行なう同時焼成技術が発達してきている。現在、
多層アルミナ・セラミックは通常内部の金属化領域と組
合わせて複数個のセラミック基板から成つており、15
00〜17000Cの範囲の高温で焼結されている。故
に電気炉の寿命、基板焼成用サ・ −、士ΛL゛ル=よ
ーノロ4々且小舌十+、゛T竺ん消薯して製造コストを
高くする欠点がある。又、電子部品用白色アルミナ・セ
ラミックは表面平滑が望まれるが、前述の高温焼成では
結晶粒成長によりすぐれた表面平滑を得ることができな
い場合が多い欠点を有す。本発明は斯かる欠点をなくす
為になされたものであり、従来のセラミック焼成温度を
大幅に低下させることができ、且つ電子部品用アルミナ
・セラミックとしてすぐれた表面平滑を与えることので
きる電子部品用白色アルミナ・セラミックの製造方法を
提供し、以つて焼成コストの低減並びにセラミックの表
面粗さの向上を図るものである。
In recent years, simultaneous firing technology has been developed that allows ceramic sintering and metallization to be performed simultaneously to eliminate the process. the current,
Multilayer alumina ceramics typically consist of multiple ceramic substrates in combination with internal metallized regions, with 15
It is sintered at high temperatures ranging from 00 to 17000C. Therefore, there is a drawback that the life of the electric furnace, the substrate firing service, the time required for firing the substrate, and the amount of time required to burn the electric furnace increase. Furthermore, white alumina ceramics for electronic parts are desired to have a smooth surface, but the above-mentioned high-temperature firing often has the disadvantage that excellent surface smoothness cannot be obtained due to crystal grain growth. The present invention was made to eliminate such drawbacks, and is an alumina ceramic for electronic parts that can significantly lower the firing temperature of conventional ceramics and that can provide excellent surface smoothness as an alumina ceramic for electronic parts. The present invention provides a method for manufacturing white alumina ceramic, thereby reducing firing costs and improving the surface roughness of the ceramic.

斯かる目的に従つて、本発明に係る電子部品用白色アル
ミナ・セラミックの製造方法は、80wt%以上のAl
。O。と、均00:MgO:5i00(wt%)が組成
図において50:20:30の点A)10:20:70
の点B、、10:60:30の点Cを結ぶΞ角形の組成
を有するB2O3、MgO、SiO2粉末からなる添加
物とよりなる組成物を準備し、前記組成物の粒径を2フ
μ以下に調整し、焼成することを特徴とする。以下本発
明の実施例について述べる。Oアルミナ・セラミックの
組成例(wt%)桟O。
In accordance with this purpose, the method for producing white alumina ceramic for electronic components according to the present invention includes an Al content of 80 wt% or more.
. O. and point A) 10:20:70 where average 00:MgO:5i00 (wt%) is 50:20:30 in the composition diagram.
A composition consisting of additives consisting of B2O3, MgO, and SiO2 powders having a Ξ-gonal composition connecting points B and C of 10:60:30 is prepared, and the particle size of the composition is adjusted to 2 μm. It is characterized by the following adjustment and firing. Examples of the present invention will be described below. Composition example of O alumina ceramic (wt%) Crosspiece O.

、MgO、SiO。の添加物A−Lまでの組成図を図に
示す。又その組成表を第1表に示す。夕A上まての組成
を有する添加物を準備する。
, MgO, SiO. The composition diagram of additives A-L is shown in the figure. The composition table is shown in Table 1. Prepare an additive having the composition shown above.

Ae2O3は純度99Wt%以上のαアルミナを用いる
。Oアルミナ・セラミック生シートの調整 上述の添加物A上までの組成物をAf2O3に添加し、
Ae2O3純度80,85,90,95,99Wt%の
組成物とし、これをボール・ミルに入れ、すべてのサン
プルに対し次の割合で溶剤、可塑剤、結合剤を添加する
As Ae2O3, alpha alumina with a purity of 99 wt% or more is used. O Preparation of alumina/ceramic green sheet Add the above-mentioned composition up to Additive A to Af2O3,
A composition with an Ae2O3 purity of 80, 85, 90, 95, 99 wt% is put into a ball mill, and a solvent, plasticizer, and binder are added to all samples in the following proportions.

Ae2O3+B2O3,MgO,SlO2添加物10鍾
量部結合剤ポリビニル・ブチラール 5 〃可塑剤ジ
・オクチル・フタレート 3 〃溶剤メタノール
10〃トルエン
12〃シクロヘキサン 20〃サン
プルは直接にスリップ流し込み組成物を得る為に上記の
セラミック、結合剤、可塑剤、溶剤の組合せをセラミッ
ク粒子の平均粒径が0.5,1,2,3μになるまで十
分混合粉砕する。
Ae2O3 + B2O3, MgO, SlO2 Additives 10 parts Binder polyvinyl butyral 5 Plasticizer di-octyl phthalate 3 Solvent methanol
10〃Toluene
12〃Cyclohexane 20〃Samples were directly slip-cast using the above combination of ceramic, binder, plasticizer, and solvent until the average particle size of the ceramic particles was 0.5, 1, 2, or 3μ to obtain a slip-cast composition. Thoroughly mix and grind.

こうして形成されたスリップ流し込み組成物は公知の夕
技術を用いてマイラー基板上にドクタ・ブレードによつ
て幅10C77!、厚み0.57rnのシートを形成す
る。次いでこのシートは揮発性溶剤除去の為乾燥炉で1
00℃、3扮で乾燥され、マイラー基板からはがされ、
5C7n平方のシートに裁断される。従来θ品との比較
の為、CaO:MgO:SiO2=20:10:70(
Wt%比)の添加物組成を前記のサンプルと同一のα−
Ae2O3を使用し、A′203純度80,85,90
,95,99Wt%のアルミナ・セラミック粉体とし、
該粉体を前記と同様の手段で平均粒径50.5,1,2
,3μのセラミック粒子よりなるアルミナ・セラミック
生シートとする。○焼成 還元雰囲気のもとで1300とC,13500C,14
00℃,1450℃3時間焼成する。
The slip cast composition thus formed is doctor bladed onto a Mylar substrate using known casting techniques to a width of 10C77. , to form a sheet with a thickness of 0.57rn. This sheet was then dried in a drying oven for 1 time to remove volatile solvents.
It was dried at 00℃ for 3 times and peeled off from the Mylar substrate.
Cut into 5C7n square sheets. For comparison with conventional θ products, CaO:MgO:SiO2=20:10:70 (
The additive composition (Wt% ratio) was changed to the same α-
Using Ae2O3, A'203 purity 80, 85, 90
,95,99 Wt% alumina ceramic powder,
The powder was reduced to an average particle size of 50.5, 1, 2 by the same means as above.
, 3μ of ceramic particles. ○ 1300 and C, 13500C, 14 under firing reducing atmosphere
Bake at 00°C and 1450°C for 3 hours.

) 添加物A上を用いたアルミナ・セラミックシート及
び従来品のアルミナ●セラミックシートの場合のアルミ
ナ純度、生シートのセラミック粒子の平均粒径、焼成温
度、焼結度の関係を第2表〜第4表に示す。
) Alumina/ceramic sheet using Additive A and conventional alumina ●Tables 2 to 2 show the relationship between alumina purity, average particle size of ceramic particles in raw sheet, firing temperature, and degree of sintering in the case of ceramic sheet. It is shown in Table 4.

焼結度はフクシンテスト(フクシン液にセラミックをつ
け、1紛後にフクシン液がセラミック内部に侵入してな
い場合良品)、吸水率テスト(セラミックを水につけ真
空脱泡1時間後の吸水率が0.1%以下ならば良品)、
ポロシテイーテスト(セラミックを鏡面研磨し、これを
ポロシメーターを用いポロシテイーを測定し、5%以内
ならば良品とする)の結果、すべて良品でバスした楊合
のみO印をつけ、その他の場合×印とする。これよりB
2O3−MgO−SiO2系添加物A−Gを用いたアル
ミナ・セラミックでAe2O3純度80wt%以上、セ
ラミック粒子の平均粒径が2μ以下の場合、焼成温度の
著しい低下がみられる。
The degree of sintering is determined by the fuchsin test (dip the ceramic in fuchsin liquid, and if the fuchsin liquid does not penetrate into the ceramic after 1 sintering, the product is good), and the water absorption rate test (dip the ceramic in water, and after 1 hour of vacuum defoaming, the water absorption rate is 0. If it is less than .1%, it is a good product),
As a result of the porosity test (ceramic is mirror-polished and its porosity is measured using a porosimeter, if it is within 5%, it is considered to be a good product. shall be. From this B
When the alumina ceramic using 2O3-MgO-SiO2 additives A-G has an Ae2O3 purity of 80 wt% or more and the average particle size of the ceramic particles is 2μ or less, a significant decrease in the firing temperature is observed.

八03−MgO−SlO2系添加物A−Gを用いたAe
2O3純度95Wt%のアルミナ・セラミックとAl2
O3純度95Wt%の従来品の生シート中のセラミック
平均粒径と表面粗さの関係を第5表に示す。
803-Ae using MgO-SlO2-based additives A-G
Alumina ceramic with 2O3 purity of 95wt% and Al2
Table 5 shows the relationship between the ceramic average particle diameter and surface roughness in the raw sheet of a conventional product with an O3 purity of 95 Wt%.

焼成温度は過焼成による結晶粒成長に起因する表面粗さ
悪化防止の為、次の通りとする。 A−
G 従来品 0.5μ,1μのとき1380℃ 14800C2μ
〃 1450℃ 1550℃ 3μ 〃 1500 C
1600℃ これより、本発明により得られた白色アルミナ・セラミ
ックは従来品と比較して表面粗さの向上がみられる。
The firing temperature is as follows in order to prevent surface roughness from deteriorating due to crystal grain growth due to over-firing. A-
G Conventional product 0.5μ, 1μ: 1380℃ 14800C2μ
〃 1450℃ 1550℃ 3μ 〃 1500℃
1600°C From this, it can be seen that the white alumina ceramic obtained by the present invention has improved surface roughness compared to the conventional product.

以上詳述したように、本発明の電子部品用白色アルミナ
・セラミックの製造方法によつて得られた白色アルミナ
●セラミックは従来のものに比較して、焼成温度及び表
面粗さの著しく低下する特長を有する。
As detailed above, the white alumina ceramic obtained by the method of manufacturing white alumina ceramic for electronic components of the present invention has the advantage of significantly lower firing temperature and surface roughness compared to conventional products. has.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明のB2O3−MgO−SiO2系添加物の
三元組成図である。
The drawing is a ternary composition diagram of the B2O3-MgO-SiO2 additive of the present invention.

Claims (1)

【特許請求の範囲】[Claims] 1 80wt%以上のAl_2O_3と、B_2O_3
:SiO_2(wt%)が組成図において50:20:
30の点A、10:20:70の点B、10:60:3
0の点Cを結ぶ三角形の組成を有するB_2O_3,M
gO,SiO_2粉末からなる添加物とよりなる組成物
を準備し、前記組成物の粉径を2μm以下に調整し、焼
成することを特徴とする電子部品用白色アルミナ・セラ
ミックの製造方法。
1 80wt% or more Al_2O_3 and B_2O_3
:SiO_2 (wt%) is 50:20 in the composition diagram:
30 point A, 10:20:70 point B, 10:60:3
B_2O_3,M which has a triangular composition connecting point C of 0
A method for producing white alumina ceramic for electronic components, which comprises preparing a composition comprising additives consisting of gO, SiO_2 powder, adjusting the powder diameter of the composition to 2 μm or less, and firing.
JP54171991A 1979-12-29 1979-12-29 Manufacturing method of white alumina/ceramic for electronic parts Expired JPS6049149B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54171991A JPS6049149B2 (en) 1979-12-29 1979-12-29 Manufacturing method of white alumina/ceramic for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54171991A JPS6049149B2 (en) 1979-12-29 1979-12-29 Manufacturing method of white alumina/ceramic for electronic parts

Publications (2)

Publication Number Publication Date
JPS5696776A JPS5696776A (en) 1981-08-05
JPS6049149B2 true JPS6049149B2 (en) 1985-10-31

Family

ID=15933494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54171991A Expired JPS6049149B2 (en) 1979-12-29 1979-12-29 Manufacturing method of white alumina/ceramic for electronic parts

Country Status (1)

Country Link
JP (1) JPS6049149B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6221754A (en) * 1985-07-18 1987-01-30 富士通株式会社 Method of tempering alumina-borosilicate glass composite body
DE3744125A1 (en) * 1987-12-24 1989-07-06 Thomson Brandt Gmbh ELECTRIC WIRE
JP3450045B2 (en) * 1994-02-28 2003-09-22 京セラ株式会社 Wear-resistant alumina sintered body and method for producing the same
JP4747067B2 (en) * 2006-03-20 2011-08-10 株式会社住友金属エレクトロデバイス White ceramics and reflector, semiconductor light emitting element mounting substrate and semiconductor light emitting element storage package
KR20160124321A (en) * 2015-04-16 2016-10-27 삼성전기주식회사 Insulator composition for ceramic package and producing method thereof
KR20170138221A (en) * 2016-06-07 2017-12-15 삼성전기주식회사 Insulator composition and manufacturing method using the same

Also Published As

Publication number Publication date
JPS5696776A (en) 1981-08-05

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