JPS6050309B2 - Jig for constant acceleration testing of semiconductor devices - Google Patents
Jig for constant acceleration testing of semiconductor devicesInfo
- Publication number
- JPS6050309B2 JPS6050309B2 JP53074397A JP7439778A JPS6050309B2 JP S6050309 B2 JPS6050309 B2 JP S6050309B2 JP 53074397 A JP53074397 A JP 53074397A JP 7439778 A JP7439778 A JP 7439778A JP S6050309 B2 JPS6050309 B2 JP S6050309B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- container
- jig
- constant acceleration
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000012360 testing method Methods 0.000 title claims description 19
- 230000001133 acceleration Effects 0.000 title claims description 15
- 239000002184 metal Substances 0.000 description 7
- 239000013618 particulate matter Substances 0.000 description 6
- 238000010998 test method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
本発明は、トランジスタ、ダイオード及び集積回路に代
表される半導体装置について、その機械的耐久性を確認
するために行なわれる定加速度試験の試験用治具に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a test jig for constant acceleration tests conducted to confirm the mechanical durability of semiconductor devices such as transistors, diodes, and integrated circuits.
従来、半導体装置の機械的強度試験には、各種の試験方
法が適用されているが、ハーメチックシール等を使用し
た半導体装置用容器のように、内部が中空になつている
装置の内部接合部の強度確認試験方法としては、回転に
よつて生じる遠心力を与える定加速度試験方法が適用さ
れている。Conventionally, various test methods have been applied to mechanical strength tests of semiconductor devices, but it is difficult to test the internal joints of devices with hollow interiors, such as containers for semiconductor devices using hermetic seals. As a strength confirmation test method, a constant acceleration test method that applies centrifugal force generated by rotation is applied.
この試験方法としては、回転板(金属製円板)に半導体
装置を入れる溝を形成し、この溝の中に半導体装置を直
接入れた状態で、あるいは半導体装置を収容出来る別の
容器に半導体装置を入れ、この容器を回転板の溝に固定
した状態で回転板を規定の回転数で回転させ、この回転
数により半導体装置に所定の加速度を与える方法がとら
れる。第1図は、従来の定加速度試験用治具の平面図で
あり、第2図はそのA−Aにおける拡大断面図を示す。
すなわち金属製の回転板1と金属製蓋2及び半導体装置
3を収容して保持する金属製の中空容器4からなり、こ
れらが回転して半導体装置に所定の負荷(一般的には2
0000Gの加速度)がかけられる。In this test method, a groove is formed in a rotating plate (metallic disc) into which the semiconductor device is placed, and the semiconductor device is placed directly into the groove or placed in a separate container that can accommodate the semiconductor device. The container is fixed in the groove of the rotary plate, and the rotary plate is rotated at a specified number of rotations, thereby applying a predetermined acceleration to the semiconductor device using this number of rotations. FIG. 1 is a plan view of a conventional constant acceleration test jig, and FIG. 2 is an enlarged sectional view taken along line A-A.
That is, it consists of a metal rotary plate 1, a metal lid 2, and a metal hollow container 4 that accommodates and holds the semiconductor device 3, and these rotate to apply a predetermined load (generally 2
0000G acceleration) is applied.
中空容器4は、四角柱又は円柱形の外形で、内部は半導
体装置が入るよう試料に合わせた形状に内部加工がされ
ている。半導体装置と接触する回転板1の溝、あるいは
中空容器4の溝は半導体装置の外形にあわせ、複雑でか
つ高い精度の加工技術が要求される。しカルそれにもか
かわらず、半導体装置の外形寸法のバラツキなどにより
半導体装置と溝との接触が不均一な場合には、半導体装
置のハーメチックシールされた容器に異常なりが働いて
、容器が破壊され、初期の目的を達成出来ない場合が発
生する。更に固定が不可能な外部導出端子に於いては、
加速度により端子が異常に変形し、製品としての価値が
損なわれるという問題がある。J 本発明の目的は、定
加速度試験に於いて、半導体装置を固定する容器の形状
を単純にし、かつ半導体装置に不適切な負荷が働くこと
を防止し、試験を容易に実施することが可能な試験用治
具を提供することにある。The hollow container 4 has a quadrangular prism or cylindrical outer shape, and the interior is machined to fit a sample so that a semiconductor device can be accommodated therein. The grooves of the rotary plate 1 or the grooves of the hollow container 4 that come into contact with the semiconductor device require complex and highly accurate processing techniques to match the external shape of the semiconductor device. However, if the contact between the semiconductor device and the groove is uneven due to variations in the external dimensions of the semiconductor device, abnormalities may occur in the hermetically sealed container of the semiconductor device, causing the container to break. , there may be cases where the initial objective cannot be achieved. Furthermore, for external lead-out terminals that cannot be fixed,
There is a problem in that the terminal deforms abnormally due to acceleration and the value as a product is lost. J An object of the present invention is to simplify the shape of a container for fixing a semiconductor device in a constant acceleration test, prevent an inappropriate load from being applied to the semiconductor device, and make it possible to easily perform the test. The objective is to provide a test jig that is suitable for testing.
丁 本発明は、半導体装置の定加速度試験の実施に際し
て用いる治具において、半導体装置と粒状物質を同時に
詰め込む中空の容器と、該容器を収容して保持する回転
板を備えた事を特徴とする。The present invention provides a jig used for constant acceleration testing of semiconductor devices, which is characterized by comprising a hollow container into which a semiconductor device and particulate matter are simultaneously packed, and a rotary plate that accommodates and holds the container. .
以下図面を用いて本発明を説明する。第3図は半導体装
置を中空容器に保持した断面図である。The present invention will be explained below using the drawings. FIG. 3 is a sectional view of a semiconductor device held in a hollow container.
半導体装置を収容する金属製の中空容器4は、中空の四
角柱又は円柱形をなし、内部に半導体装置3及び粒状物
質5が詰められ、バッキング6をはさんで蓋7がかぶせ
られた状態になつている。粒状物質5は、遠心力に耐え
かつ半導体装置を傷つけないことが必要で、粒度#10
00(約25ミクロン)程度が適しており、材質は炭化
硅素、アルミナ、石粉あるいは金属粉など任意に選定さ
れる。この容器4に半導体装置3を入れ、粒状物質5を
隙間がないように詰め込む。A metal hollow container 4 that accommodates the semiconductor device has a hollow square or cylindrical shape, and is filled with the semiconductor device 3 and particulate matter 5, and is covered with a lid 7 with a backing 6 in between. It's summery. The particulate matter 5 needs to withstand centrifugal force and not damage the semiconductor device, and has a particle size of #10.
00 (approximately 25 microns) is suitable, and the material is arbitrarily selected such as silicon carbide, alumina, stone powder, or metal powder. The semiconductor device 3 is placed in this container 4, and the granular material 5 is packed therein so that there are no gaps.
詰め込みに際しては、若干の振動を与えた方が良い。バ
ッキングは加速度試験中に、あるいはその前後に粒状物
質が飛散しない目的のために使用される。このようにし
て半導体装置を収容した金属製容器を、回転板に設けた
凹部に入れ、全体に蓋を被せ、所定の回転数にて半導体
装置に一定の加速度を与えることによつて定加速度試験
が遂行出来る。When stuffing, it is better to give it some vibration. Backing is used to prevent particulate matter from scattering during or before acceleration testing. The metal container containing the semiconductor device in this way is placed in a recess provided in the rotating plate, the lid is placed over the whole, and a constant acceleration test is performed by applying a constant acceleration to the semiconductor device at a predetermined number of rotations. can be carried out.
第4図及び第5図は金属製中空容器の他の実施例であり
、容器と蓋の固定がネジ方式(第4図)及びゴム栓(第
5図)によつて行なわれる外は、第3図の説明と同様で
ある。Figures 4 and 5 show other embodiments of the metal hollow container, except that the container and the lid are fixed by screws (Figure 4) and rubber plugs (Figure 5). This is the same as the explanation for FIG.
定加速度試験は、通常半導体装置の3次元方向でかつそ
の正逆の方向合わせてその都度6方向について規定の力
が加えられ、その機械的強度が確認される。In the constant acceleration test, a specified force is usually applied in each of six directions in three-dimensional directions of the semiconductor device, including the forward and reverse directions, and its mechanical strength is confirmed.
このため従来の半導体装置を保持する容器は、被試験半
導体装置毎にその外形に合わせて複雑な加工を強いられ
ていたが、本発明によれば、単純な加工でかつ広範囲な
種類の形状の半導”体装置を1つの治具で処理する事が
可能となる。更に半導体装置と中空容器壁との間に粒状
物質が詰め込まれることによつて容器壁と半導体装置と
の間に隙間がなくなり、半導体装置に不適切な負荷が働
いて破壊することが防止される。For this reason, conventional containers for holding semiconductor devices have been forced to undergo complicated processing to match the external shape of each semiconductor device under test. Semiconductor devices can be processed with one jig. Furthermore, by packing particulate matter between the semiconductor device and the hollow container wall, a gap is created between the container wall and the semiconductor device. This prevents the semiconductor device from being damaged by an inappropriate load.
第1図は従来の治具の平面図、第2図はそのA−A断面
図、第3図、第4図、第5図はそれぞれ本発明に用いる
中空容器の実施例を示す断面図である。
1・・・・・・回転板、2・・・・・・回転板の蓋、3
・・・・・・半導体装置、4・・・・・・中空容器、5
・・・・・・粒状物質、6・・・・・・バッキング、7
・・・・・・中空容器の蓋。FIG. 1 is a plan view of a conventional jig, FIG. 2 is a sectional view taken along the line A-A, and FIGS. 3, 4, and 5 are sectional views each showing an example of a hollow container used in the present invention. be. 1... Rotating plate, 2... Rotating plate lid, 3
... Semiconductor device, 4 ... Hollow container, 5
...Particulate matter, 6...Backing, 7
・・・・・・Lid of hollow container.
Claims (1)
に用いる治具において、蓋を備え被試験半導体装置を収
容する中空容器と、該容器内に被試験半導体装置を固定
するために詰め込まれた粒状物質と、該容器を収容する
凹部が回転軸まわりに複数個所設けられた回転板と、該
回転板を覆う蓋とを具備したことを特徴とする半導体装
置の定加速度試験用治具。1. A jig used when performing a constant acceleration test by applying centrifugal force to a semiconductor device, which includes a hollow container equipped with a lid for accommodating the semiconductor device under test, and a container packed inside the container to secure the semiconductor device under test. 1. A jig for constant acceleration testing of a semiconductor device, comprising: a rotating plate having a plurality of concave portions around a rotating shaft for accommodating the container; and a lid covering the rotating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53074397A JPS6050309B2 (en) | 1978-06-19 | 1978-06-19 | Jig for constant acceleration testing of semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53074397A JPS6050309B2 (en) | 1978-06-19 | 1978-06-19 | Jig for constant acceleration testing of semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS551539A JPS551539A (en) | 1980-01-08 |
| JPS6050309B2 true JPS6050309B2 (en) | 1985-11-07 |
Family
ID=13546000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53074397A Expired JPS6050309B2 (en) | 1978-06-19 | 1978-06-19 | Jig for constant acceleration testing of semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050309B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3404394B1 (en) | 2016-01-15 | 2023-11-22 | Kokusai Keisokuki Kabushiki Kaisha | Vibration application device |
| JP6820006B2 (en) * | 2016-01-15 | 2021-01-27 | 国際計測器株式会社 | Vibration device, vibration table and vibration method |
-
1978
- 1978-06-19 JP JP53074397A patent/JPS6050309B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS551539A (en) | 1980-01-08 |
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