JPS6051256B2 - Capacitor manufacturing method - Google Patents
Capacitor manufacturing methodInfo
- Publication number
- JPS6051256B2 JPS6051256B2 JP50134302A JP13430275A JPS6051256B2 JP S6051256 B2 JPS6051256 B2 JP S6051256B2 JP 50134302 A JP50134302 A JP 50134302A JP 13430275 A JP13430275 A JP 13430275A JP S6051256 B2 JPS6051256 B2 JP S6051256B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- capacitor element
- thermal spraying
- masking tape
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明は生産性に優れ、特性的にも優れ、しかも使用材
料の有効利用を図ることができるコンデンサの製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a capacitor that has excellent productivity, excellent characteristics, and allows effective use of materials used.
まず、従来のコンデンサの製造方法について、第1図〜
第3図を用いて説明する。First, we will explain the conventional manufacturing method of capacitors in Figure 1~
This will be explained using FIG.
第1図は枠組方法を示している。Figure 1 shows the framework method.
金属化紙または金属化有機フィルムを用いたコンデンサ
素子1は枠3に配列される。この時、コンデンサ素子1
の溶射後の分離を行うために、仕切板2をコンデロロ魯
一 !i江口 Lッ →ム’一ーー1)−・^!、1■
、、・W−−フ74〃溶射時の粒子の侵入を防止するた
め、枠3の両サイドからマスク4を嵌め込む。この方法
は手作業によるため、作業性が悪く、しかも治具に溶射
粒子が付着するため、自動化が困難てあつた。第2図に
この枠組方法における溶射工程を示している。第1図の
ように枠組を完了したコンデンサ素子群は搬送装置6て
連続搬送される。一方、溶射ガン5を固定したままで側
面から溶射を行う。この方法では、続溶射面積に対して
有効付着面積が小さく、溶射使用材料の歩留が悪く、ま
た溶射厚みは中央部に厚く、周囲に向つて薄くなるため
、コンデンサ素子1の端面の溶射厚みにバラツキが生じ
る欠点があつた。第3図は溶射後の分離方法を示す図で
あり、コンデンサ素子1、仕切板2、枠3、マスク4に
分離される。Capacitor elements 1 made of metalized paper or metalized organic film are arranged in a frame 3. At this time, capacitor element 1
In order to perform separation after thermal spraying, use the partition plate 2. iEguchi Lt →mu'1-1)-・^! , 1 ■
,,・W-F74〃In order to prevent particles from entering during thermal spraying, masks 4 are fitted from both sides of the frame 3. This method was difficult to automate because it was a manual process, which resulted in poor workability and the adhesion of thermal spray particles to the jig. FIG. 2 shows the thermal spraying process in this framework method. As shown in FIG. 1, the capacitor element group whose framework has been completed is continuously transported by a transport device 6. On the other hand, thermal spraying is performed from the side while keeping the thermal spraying gun 5 fixed. In this method, the effective adhesion area is small compared to the continuous spraying area, the yield of the sprayed material is poor, and the spraying thickness is thick at the center and becomes thinner toward the periphery. The disadvantage was that there were variations in the results. FIG. 3 is a diagram showing a separation method after thermal spraying, in which the capacitor element 1, partition plate 2, frame 3, and mask 4 are separated.
この方法では、コンデンサ素子1と仕切板2に人為的な
外力を与えて分離するため、コンデンサ素子1の溶射面
の剥離または割れが生じ、コンデンサとしての誘電正接
(tanδ)特性Jの劣化を招くことがあつた。本発明
はこのような従来例における問題点を解決するもので、
生産性を向上させ、溶射材料の歩留の向上を図りかつ電
気的特性を安定にし得るコンデンサの製造方法を提供す
るものである。In this method, an artificial external force is applied to the capacitor element 1 and the partition plate 2 to separate them, resulting in peeling or cracking of the sprayed surface of the capacitor element 1, which leads to deterioration of the dielectric loss tangent (tan δ) characteristic J of the capacitor. Something happened. The present invention solves the problems in the conventional example,
The present invention provides a capacitor manufacturing method that can improve productivity, improve the yield of thermal sprayed materials, and stabilize electrical characteristics.
以・下、本発明の一実施例を示す第4図〜第7図の図面
を用いて説明する。第4図に本発明の製造方法における
テーピング工程を示しており、常温でシール面に粘着性
のないネオプレンゴムとエポキシ樹脂混合接着剤を塗布
したマスキングテープ7,8の間に、素子変形強度1k
9以上にヒートブレスされたコンデンサ素子9を素子挿
入レバー10にて挿入し、上下のシールダイス11によ
り、マスキングテープ7,8のコンデンサ素子9間の部
分を加圧加熱し、接着剤によりマスキングテープ7,8
を接着し、コンデンサ素子9を両端を露出させて包み込
む。Hereinafter, an embodiment of the present invention will be explained using the drawings of FIGS. 4 to 7. Figure 4 shows the taping process in the manufacturing method of the present invention, in which the element deformation strength is 1k between the masking tapes 7 and 8 coated with a non-tacky neoprene rubber and epoxy resin mixed adhesive on the sealing surface at room temperature.
Insert the capacitor element 9 that has been heat-braced to 9 or more using the element insertion lever 10, press and heat the portion of the masking tapes 7 and 8 between the capacitor elements 9 using the upper and lower sealing dies 11, and attach the masking tape with an adhesive. 7,8
and wrap the capacitor element 9 with both ends exposed.
以後、この繰返し動作により、コンデンサ素子9を連続
的に包み込み、そしてマスキングテープ7,8によりコ
ンデンサ素子9が隣接して配置された帯状とし、その後
第5図に示すようにリール状に巻取る。マスキングテー
プ7,8の幅は、コンデンサ素子9の幅より1.5Tf
0rL広く設定し、溶射粒子の侵入を防止する。第6図
に溶射工程を示しており、帯状に連続シールされ、リー
ル状に巻取られたコンデンサ素子9群は、連続搬送装置
12により2列に並列されて搬送される。Thereafter, by repeating this operation, the capacitor elements 9 are continuously wrapped and formed into a band shape in which the capacitor elements 9 are arranged adjacently with the masking tapes 7 and 8, and then wound into a reel shape as shown in FIG. The width of the masking tapes 7 and 8 is 1.5Tf larger than the width of the capacitor element 9.
Set 0rL wide to prevent thermal spray particles from entering. FIG. 6 shows the thermal spraying process, in which nine groups of capacitor elements that have been continuously sealed in a band shape and wound up in a reel shape are conveyed in two parallel rows by a continuous conveyance device 12.
一方、溶射ガン13は、搬送装置12上部より下向に取
付けられ、搬送装置12の進行方向Aに対して直角方向
Bに往復移動をしつつ溶射を行う。片面溶射後、コンデ
ンサ素子9群,を反転し同様にもう一方の面に溶射を行
う。第7図に分離工程を示しており、溶射後の巻取リー
ル14からマスキングテープ7,8を左右に引出し、ガ
イドローラー15、スイーパー16を通して、送りロー
ラー17と受ローラー18の間!にセットする。送りロ
ーラー18の回転により、マスキングテープ7,8は分
離されかつマスキングテープ7,8に付着したコンデン
サ素子9は、スイーパー16によつて分離され、単体で
シュート19に回収3される。On the other hand, the thermal spray gun 13 is attached downward from the top of the conveying device 12, and performs thermal spraying while reciprocating in a direction B perpendicular to the traveling direction A of the conveying device 12. After spraying on one side, the 9 groups of capacitor elements are reversed and sprayed on the other side in the same manner. The separation process is shown in FIG. 7, in which the masking tapes 7 and 8 are pulled out left and right from the take-up reel 14 after thermal spraying, passed through the guide roller 15 and sweeper 16, and then passed between the feed roller 17 and the receiving roller 18! Set to . The masking tapes 7 and 8 are separated by the rotation of the feed roller 18, and the capacitor element 9 attached to the masking tapes 7 and 8 is separated by the sweeper 16 and collected 3 individually in the chute 19.
そして、各コンデンサ素子9の溶射された電極にリード
線を接続し、外装を施してコンデンオとする。Then, lead wires are connected to the sprayed electrodes of each capacitor element 9, and an exterior is applied to form a capacitor.
以上のように本発明の製造方法は、マスキングテープに
常温で粘着性のないネオプレンゴム系接着剤とエポキシ
樹脂の混合接着剤を使用することにより、低温(60〜
70℃)かつ短時間(0.2〜0.5sec)でシール
可能となり、しかも常温非粘着性であり、分離工程にお
いてコンデンサ素子9のフィルム剥離の発生がなく、ま
たマスキングテープを加熱加圧するためのシールダイス
に溶着物がノ付着することがなく、安定にかつ高速で、
マスキングテープの接着を行うことができ、マスキング
テープの分離もマスキングテープが切れることなく、ス
ムーズに行うことができる。As described above, the manufacturing method of the present invention uses a mixed adhesive of a neoprene rubber adhesive and an epoxy resin, which is not sticky at room temperature, for the masking tape at a low temperature (60 to 60℃).
70°C) and in a short time (0.2 to 0.5 sec), is non-adhesive at room temperature, does not cause the film of the capacitor element 9 to peel off during the separation process, and also because the masking tape is heated and pressurized. There is no welding material attached to the sealing die, and the process can be performed stably and at high speed.
Masking tape can be bonded, and masking tape can be separated smoothly without cutting the masking tape.
また、本発明における溶射方式による溶射法を行うこと
により、溶射総面積に対する有効溶射面積が従来の方法
より高くなり、使用溶射料の歩留を向上させることがで
き、しかも溶射ガンが往復移動をしつつ溶射を行うため
、溶射パターンが重り合つた状態となり、溶射厚みが均
一化する。In addition, by performing the thermal spraying method according to the present invention, the effective spraying area relative to the total spraying area is higher than that of the conventional method, and the yield of the thermal spraying material used can be improved.Moreover, the thermal spraying gun does not have to move back and forth. Since the thermal spraying is performed while the spraying is being carried out, the thermal spraying patterns overlap, and the thermal spraying thickness becomes uniform.
この溶射ガンの往復移動回数を増すことにより、さらに
溶射厚みのバラツキは少なくなる。さらに、本発明の方
法におけるコンデンサ素子の分離方法は、人為的な外力
を加えないため、溶射面の割れや剥離の発生がなくコン
デンサの誘電正接(Tanδ)に対して悪影響を与えず
電気特性の安定を図ることがてきる。By increasing the number of reciprocating movements of the thermal spraying gun, the variation in the thermal spraying thickness can be further reduced. Furthermore, the method of separating capacitor elements in the method of the present invention does not apply artificial external force, so there is no cracking or peeling of the sprayed surface, there is no adverse effect on the dielectric loss tangent (Tanδ) of the capacitor, and the electrical characteristics are improved. You can achieve stability.
このように本発明の製造方法によれば、コンデンサの溶
射工程の生産性の向上、材料ロスの低減、コンデンサの
電気的特性の安定化を図ることができるものである。As described above, according to the manufacturing method of the present invention, it is possible to improve the productivity of the capacitor thermal spraying process, reduce material loss, and stabilize the electrical characteristics of the capacitor.
第1図、第2図および第3図はそれぞれ従来のコンデン
サの製造方法の各工程を示す斜視図、第4図、第5図、
第6図および第7図はそれぞれ本発明の一実施例による
コンデンサの製造方法の各工程を示す斜視図である。
7,8・・・・・・マスキングテープ、9・・・・・コ
ンデンサ素子、13・・・・・・溶射ガン。1, 2, and 3 are perspective views showing each step of a conventional capacitor manufacturing method, and FIG. 4, FIG. 5,
6 and 7 are perspective views showing each step of a method for manufacturing a capacitor according to an embodiment of the present invention. 7, 8... Masking tape, 9... Capacitor element, 13... Thermal spray gun.
Claims (1)
を施した2枚のマスキングテープ間にコンデンサ素子を
隣接するように配置し、各コンデンサ素子間のマスキン
グテープのみを加熱加圧することにより前記混合接着剤
により接着してコンデンサ素子を両端を露出させて包み
込み、このコンデンサ素子群を連続搬送し、その上部よ
りコンデンサ素子の進行方向に対して直角方向に往復運
動する溶射ガンにより金属を溶射し、金属の溶射後、マ
スキングテープを分離してコンデンサ素子単体として取
出し、溶射された金属にリードを設け、外装することを
特徴とするコンデンサの製造方法。1. Capacitor elements are placed adjacently between two pieces of masking tape coated with a mixed adhesive of neoprene adhesive and epoxy resin, and the mixed adhesive is applied by heating and pressing only the masking tape between each capacitor element. The capacitor elements are wrapped with adhesive and exposed at both ends, and the group of capacitor elements is continuously conveyed, and metal is sprayed from above using a spray gun that reciprocates in a direction perpendicular to the direction of movement of the capacitor elements. 1. A method for manufacturing a capacitor, which comprises: after spraying, separating the masking tape to take out a single capacitor element, providing leads on the sprayed metal, and packaging the capacitor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50134302A JPS6051256B2 (en) | 1975-11-07 | 1975-11-07 | Capacitor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50134302A JPS6051256B2 (en) | 1975-11-07 | 1975-11-07 | Capacitor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5257958A JPS5257958A (en) | 1977-05-12 |
| JPS6051256B2 true JPS6051256B2 (en) | 1985-11-13 |
Family
ID=15125097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50134302A Expired JPS6051256B2 (en) | 1975-11-07 | 1975-11-07 | Capacitor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6051256B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5731878B2 (en) * | 2011-04-08 | 2015-06-10 | ニチコン株式会社 | Method for manufacturing metalized film capacitor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5058556A (en) * | 1973-09-25 | 1975-05-21 | ||
| JPS5136560A (en) * | 1974-09-25 | 1976-03-27 | Oki Engineering Kk | Chikudenkisoshi no masukinguho |
| JPS5325946A (en) * | 1976-08-24 | 1978-03-10 | Jiyouetsu Denro Kougiyou Kk | Waste heat collecting apparatus for electric furnace |
-
1975
- 1975-11-07 JP JP50134302A patent/JPS6051256B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5257958A (en) | 1977-05-12 |
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