JPS6054836B2 - Laser processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser scalpel that uses a laser beam to incise and cut diseased tissue in the human body by slashing and cutting the affected tissue;
This article relates to a laser processing device that can be used as a processing machine for melting and cutting various materials.

In recent years, various types of lasers have been developed, and their application fields have expanded significantly.

In particular, in the field of laser processing that uses lasers as a source of optical energy, many so-called laser scalpels for the human body and cutting machines for various materials have come into existence. In this type of laser processing equipment,
Although the processing position on the workpiece is accurately determined using a beam of light, the processing depth cannot be controlled and the cutting may be performed too deeply.

This is especially dangerous when using a laser scalpel. When laser light is used to process various materials other than the human body, drilling or cutting is the main process, but at present it is nearly impossible to process holes to a desired depth. In view of these points, the present invention provides a laser processing device that is capable of processing while controlling the processing depth.

In particular, the present invention provides a processing device that enables three-dimensional processing and hole processing with a finite depth, prevents irradiation of laser light to unintended positions, and can be applied to extremely safe laser scalpels. That is, the laser processing apparatus provided by the present invention includes a laser oscillation means that oscillates a laser beam, and a laser excitation power source that excites the oscillation of the laser beam, and performs processing by irradiating the laser beam onto a workpiece. In such an apparatus, a detector for reflected light from the workpiece is disposed away from the optical axis of the irradiated laser beam, and an optical means for forming an image of the reflected light detected by the reflected light detector is provided. an excitation device that detects the machining depth by a change in the imaging position of the reflected light based on a change in the machining depth of the workpiece, and controls excitation of the laser oscillation means based on the detected machining depth; It is characterized in that it is provided with a control means.

The illustrated embodiment will be described below.

Reference numeral 1 denotes a laser oscillator, which is not shown in the drawings, but is composed of a laser beam oscillation section and a light transmission section from the oscillation section.

11 excites the laser oscillator 1 to emit laser light (beam)
A contact 10 operated by a relay 9 is interposed in a connection system R between the laser excitation power source 11 and the laser oscillator 1.

3 is an object to be processed, which in the case of a laser scalpel is an affected part of the human body or various materials. 2'' is reflected light during laser processing, and this reflected light 2'' passes through a lens 4 and is almost imaged at the position of the mask 5.

The reflected light that has passed through this mask 5 is captured by a detector 6. Reference numeral 8 denotes a correction power source that generates a reference potential 8'' for correcting the deviation in reflectance of the object to be processed 3; 7 corrects the output from the detector 6 with this reference potential for correction; This is an amplifier that outputs an operation command signal for the relay 9 when the value reaches a predetermined value.

12 is a bypass circuit connected to the connection system R between the laser excitation power source 11 and the laser oscillator 1; 13 is a resistor interposed in this bypass circuit 12; Contact 10 is connection system R
When the circuit is open (the state shown in the figure), the laser oscillator 1 is excited by receiving relatively small electric energy from the laser excitation power source 11, and the laser oscillator 1 constantly generates a weak laser beam 2 for measurement. It is configured to

M is a processing machine frame, a laser oscillator 1, a reflected light detection system 4,
5 and 6 are fixedly positioned.

This machine frame corresponds to a manipulator in the case of a laser scalpel, or is combined with a machine frame for installing or transporting a workpiece in the processing of various materials. In the above configuration, first open the relay contact 10 as shown in the figure, and then open the processing machine frame M.
The laser oscillator 1 including the laser oscillator 1 is placed opposite to the workpiece 3.

First, when the measurement laser beam 2 is irradiated from the laser oscillator 1, the reflected light 2'' of this measurement laser beam is reflected on the lens 4.
The reflected light passing through the mask 5 is captured by the detector 6. On the other hand, when the reference potential 8'' is appropriately adjusted and effective reflected light is captured by the detector 6, the amplifier 7
A signal is output from , relay 9 operates, and relay contact 10
closes the connection system R. When the relay contact 10 is closed, the laser oscillator 1 is excited by strong electrical energy and outputs a laser beam 2 for processing.

Processing of the object 3 progresses by irradiation with the processing laser beam 2. By the way, in this processing machine, the positional relationship and size of the laser optical axis, lens 4, and mask 5 are set as shown in FIG.

In other words, the distance from the laser optical axis to the center of the lens 4 is S, the size (width) of the mask 5 is, and D is the distance from the center of the lens 4 to the mask 5! Distance from processing start point A to lens 4! Then, the displacement of the processing point in the range where the reflected light 2'' passes through the mask 5, that is, the depth (distance) 1-3 from point A to point B, is expressed by the following equation.

11 2S-t? Go 1 This means that only when the reflection point (processing point) is within the range from point A to point B, the reflected light is captured by the detector 6, the processing laser beam 2 is irradiated, and the processing depth is limited to L. become.

In addition, when point A, that is, the top surface of the object 3, is fixed, adjusting the processing machine frame M forward or backward will adjust the value of
Machining depth according to the above formula! will be adjusted. Alternatively, the size D of the mask 5 can be freely adjusted so that the machining depth value can be adjusted by adjusting this value. can be set to a desired value.

In order to adjust the machining depth by changing the reflected light 2, a method is also available in which a detector 15 equipped with an image sensor 14 is installed instead of the mask 5 and detector 6, as shown in FIG. It is possible.

This image sensor 14 is, for example, a CCD element in which minute photoelectric elements are arranged, and the reflected light 2
By setting this displacement position, the output from the detector 15 can be restricted and the machining depth can be controlled. The present invention is not limited, and various modified embodiments may be mentioned.

For example, in the illustrated example, the laser oscillator is configured to output both processing laser light and measurement laser light, and for this purpose, a circuit for outputting the measurement laser light is provided in the connection system with the excitation power source. . However, the method is not limited to the same method, and a laser beam oscillator for measurement (a light beam from an ordinary light source may be used) and a laser beam oscillator for processing are installed separately. It is also possible to control the excitation to the laser oscillator. In the illustrated example, this bypass circuit 12 may also be provided with a relay contact so that the circuit 12 is opened by the operation of the relay 9. It is also possible to replace the relays that operate these contacts with electronic circuits. Furthermore, in the illustrated detection method, a method in which two detection systems are installed in parallel is also considered in order to improve the detection characteristics.

Further, a separate display means for notifying the operator when the reflected light is detected and the processing laser is being output, such as another light (lamp) or sound (buzzer).
It is also possible to add a system mechanism. As described above, it is possible to freely adjust the dimensions of each part in FIG. 2 to adjust the machining depth.

It is also possible to attach a means for separately displaying the machining depth, such as a digital display, and it would be more convenient to display the depth during machining and the set machining depth.

It is also possible to add signal modulation/demodulation means to reliably capture the reflected light. Various methods can be considered as means for detecting changes in reflected light, and the method is not limited to the illustrated example. Lenses etc. are not necessarily necessary. Further, as the laser oscillator, various gas and solid laser oscillators such as a CO2 laser, a YAG laser, an argon laser, and a ruby laser can be used, and the most suitable oscillator is selected depending on the object to be processed.

The excitation power source and its control means are also limited to the illustrated example, and as described above, it may be a very simple system. Furthermore, the present invention is applicable to processing that involves measurement or processing that mainly involves measurement (
It can also be implemented in devices whose purpose is displacement (displacement). As described above, according to the present invention, it is possible to obtain a device in which the processing (cutting) depth is automatically and easily set, especially in laser scalpels, etc., which is convenient to use and has extremely high safety, thereby promoting the widespread use of laser scalpels. I will do it.

In addition, X. ．． Not only the two dimensions of Y but also X
．． ．． Y,. Facilitates three-dimensional processing of Z. Furthermore, it is also possible to provide an apparatus that performs processing while performing three-dimensional display under control by computer output. In this way, a processing device that is highly accurate, highly safe, and convenient to use can be obtained for various purposes.

[Brief explanation of drawings]

FIG. 1 is a diagram schematically showing the basic configuration of the present invention, FIG. 2 is a diagram showing the principle of the invention, and FIG. 3 is a diagram showing another embodiment. 1... Loser oscillator, 2... Loser light, 2''... Reflected light, 3... Workpiece, 4... Luns, 5 ...Mask, 6...
...Detector, 7...Amplifier, 8...
・Correction power supply, 8″...Reference potential, 9...
...Relay, 10...Relay contact, 11...
... Loser excitation power supply section, 12 ... Bypass circuit, 13 ... Resistor, M ... Processing machine frame,
L3...Processing depth, D...Mask size.

Claims (1)

[Claims] 1. Equipped with a laser oscillation means that oscillates a laser beam, and a laser excitation power source that excites the oscillation of the laser beam,
In the apparatus that processes the workpiece by irradiating the workpiece with the laser light, a detector for the reflected light from the workpiece is arranged away from the optical axis of the irradiated laser light, and the reflected light detector an optical means for forming an image of the detected reflected light, and detects the machining depth by a change in the imaging position of the reflected light based on a change in the machining depth of the workpiece, and A laser machining apparatus characterized by comprising an excitation control means for controlling excitation of the laser oscillation means depending on the machining depth.