JPS6056299B2 - semiconductor container - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved semiconductor container structure.

A semiconductor container conventionally constructed by metallizing an insulating material such as ceramic has a structure as shown in a partially sectional perspective view of FIG. That is, the ceramic substrate 1 has a metallized layer 2 (which serves as a semiconductor element fixing part) at the bottom of a recess provided in the center.
The metallized leads that spread radially from the periphery of the island part 2 are extended to the metallized part 3 on the side surface of the substrate, and one end of each metallized lead around the island part 2 is connected to a thin metal wire connection part 4 (hereinafter referred to as an island part). (hereinafter referred to as a bonding pad part), and the other end is a brazed part with a brazing material 6 of a metal lead 5 (hereinafter referred to as a pin), and is large enough to expose a bonding pad part 4 and an island part 2 on top of this part. An insulating frame 7 having an opening in the center thereof is laminated across the metallized lead part, and a metallized layer 8 is provided around the opening of the insulating frame 7.
The structure is such that the cap is sealed using brazing material.

However, if the bonding pad portions 4 are all metallized on the same plane, the LS
The bonding pad part is 100mm like the semiconductor container for I.
If more than one bonding pad is required, the width of the bonding pad and the spacing between adjacent bonding pads must be extremely narrow, and the external shape of the container cannot be made unnecessarily large, which reduces the manufacturing yield of the semiconductor container. It also had the disadvantage of impairing bonding workability. The present invention was made to solve these problems, and an object of the present invention is to provide a container suitable for a multi-pin lead semiconductor device such as [I].
The third feature of the present invention is that in a semiconductor container in which a recess is provided on one main surface of a ceramic substrate and a plurality of metallized layers serving as bonding pad portions are provided around the recess, the plurality of metallized layers are formed in the recess. The semiconductor container is located at multiple positions at different heights from the semiconductor container. According to the present invention, it is possible to make double the number of pads with the conventional bonding pad width, and it is also possible to double the bonding pad width with the same number of pads.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 is a partially sectional perspective view showing the structure of an embodiment of the semiconductor container of the present invention. To explain this structure according to the manufacturing method, first, an island portion 2' on which a semiconductor element is individually attached is printed by W metallization in the center of a first layer ceramic substrate 1a made of green tape.

Next, O having an opening 9 larger than the island portion 2',
W metallized leads 10 are formed radially from the opening 9 toward the periphery of the second layer ceramic substrate lb made of green tape with a thickness of 5 wrIn. Furthermore, the third layer ceramic substrate 1c made of green tape has an opening with the same diameter as the second layer green tape, and is shaped like a comb so that the bonding pad portion of the second layer W metallized lead 10 is exposed. A cut groove 11 is provided, and W metallized leads 1' are applied radially from the remaining portion toward the periphery. The thus metalized green tape is aligned in the order of the first layer, the second layer, and the third layer, and an insulating frame 12 for sealing the cap having an opening is placed thereon and press-bonded with a press. This is 1500-16
After firing in a furnace in a reducing atmosphere at 00°C, Ni plating is applied, and then the pin 5'' is plated with Ag on the side metallized portion 3''.
- When brazing with Cu brazing material and applying Au plating, the second
A semiconductor container is obtained in which the number of internal metallized leads is doubled as shown in the figure. When using the container according to this embodiment, for example, in the case of a container that conventionally requires 42 pins, the pin pitch interval is 2.547 m and the longitudinal dimension is 52 wr!
n container was used, but the pin spacing was changed to 1.27.
By using w$t, a container for 24 pins with a longitudinal dimension of 32T$L can be used.

This pin spacing of 1.27 wL is a dimension that is sufficiently practical in terms of manufacturing technology and mechanical strength of the pins.

Furthermore, FIG. 3 is a cross-sectional perspective view showing another embodiment of the present invention, and when it is desired to increase the mechanical strength of the pin,
An insulator 14 is sandwiched and integrated between two adjacent pins 13 and 13'' of the interval pins by, for example, a resin molding method, and this integrated pin can be used for 42 pins at an interval of 2.547 m. .

As described above, since the container according to the present invention has a structure having multi-pin leads, it becomes possible to easily mount large-sized multi-electrode chips that will be developed more and more in the future.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional perspective view of a conventional semiconductor container, and FIGS. 2 and 3 are partially sectional perspective views showing embodiments of the semiconductor container of the present invention. In Figures 1, 2 and 3, 1, 1a, 1b
, 1c...ceramic substrate, 2,2''...
Island part, 3,3″... Side metallized part, 4
...Bonding pad part, 5,5''... Zen, 6 ... Brazing material, 7 ... Insulation frame, 8
... Metallized layer, 9... Opening, 10, 1'
...W metalized lead, 11...groove,
12...Insulation frame, 13,13''...Zen, 1
4... Insulator.

Claims (1)

[Claims] 1. In a semiconductor container in which a recess is provided on one main surface of a ceramic substrate and a metallized layer serving as a bonding pad is provided on the main surface around the recess, the bonding pad has a height from the bottom of the recess. A semiconductor container characterized in that it is formed on a plurality of different surfaces.