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JPS609360B2 - How to connect the wiring board - Google Patents
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JPS609360B2 - How to connect the wiring board - Google Patents

How to connect the wiring board

Info

Publication number
JPS609360B2
JPS609360B2 JP50058831A JP5883175A JPS609360B2 JP S609360 B2 JPS609360 B2 JP S609360B2 JP 50058831 A JP50058831 A JP 50058831A JP 5883175 A JP5883175 A JP 5883175A JP S609360 B2 JPS609360 B2 JP S609360B2
Authority
JP
Japan
Prior art keywords
wiring board
wiring
board
boards
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50058831A
Other languages
Japanese (ja)
Other versions
JPS51134158A (en
Inventor
賢造 畑田
大典 石河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50058831A priority Critical patent/JPS609360B2/en
Publication of JPS51134158A publication Critical patent/JPS51134158A/en
Publication of JPS609360B2 publication Critical patent/JPS609360B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G04HOROLOGY
    • G04GELECTRONIC TIME-PIECES
    • G04G17/00Structural details; Housings
    • G04G17/02Component assemblies

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Clocks (AREA)
  • Electromechanical Clocks (AREA)

Abstract

PURPOSE:To provide an electronic watch to enable electric connection to be conducted at a time by applying a flexible wiring board capable of compact wiring.

Description

【発明の詳細な説明】 本発明は液晶もしくは発光素子等により、時刻を表示す
るいわゆる電子時計等に用いられる配線基板の接続方法
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting wiring boards used in so-called electronic watches that display the time using liquid crystals, light emitting elements, or the like.

電子時計の構成部品は、時刻を表示させる表示パネル、
G−MOSLS1、水晶振動子、抵抗、コンデンサー電
池等の電子部品と、これらを載層する基板、さらにネジ
等の保持治具からなる。
The components of an electronic watch are a display panel that displays the time;
It consists of electronic components such as the G-MOSLS1, a crystal resonator, a resistor, a capacitor battery, a substrate on which these components are mounted, and a holding jig such as a screw.

これら構成部品は、複数板の配線基板に載層固定される
。この様な場合にあっては前記複数枚の配線基板間を電
気的に接続しなければならない。第1図で従来の前記配
線基板間の電気的接続について述べる。第1図で例えば
、C−MOSLS16を戦直した基板1と他の基板2と
を電気的に接続するために、基板端にスルーホール配線
3を設け、前記基板1と基板2との対向した位置に孔4
を設け、この孔に第1図bの如く金属製給具5を挿入し
、半田づけ、固定する事によって基板1と基板2とを電
気的に接続していた。
These components are layered and fixed on a plurality of wiring boards. In such a case, it is necessary to electrically connect the plurality of wiring boards. Referring to FIG. 1, a conventional electrical connection between the wiring boards will be described. In FIG. 1, for example, in order to electrically connect the board 1 on which the C-MOSLS 16 has been reassembled and another board 2, through-hole wiring 3 is provided at the end of the board, and the board 1 and the board 2 are facing each other. hole 4 in position
The substrates 1 and 2 were electrically connected by inserting a metal supply tool 5 into the hole as shown in FIG. 1b, and fixing it by soldering.

従来のこの様な接続方法にあっては、電気的接続を要す
る数だけの金属製拾具5が必要とされ、前記拾具5を孔
4に挿入固定する事は、治具5の数が増加する程複雑と
なり、電子時計の組立が困難となったり、コストが高く
なっていた。
In such a conventional connection method, as many metal picks 5 as required for electrical connection are required, and inserting and fixing the picks 5 into the holes 4 requires a As the number of clocks increases, the complexity becomes more complicated, making it difficult to assemble electronic watches and increasing costs.

又、治具6及び孔4が配線基板1,2の比較的大きい面
積を占有し、前記基板1,2に載層する電子部品の数が
限られるために電子時計全体の形状が大型化する不都合
があった。そして、組立途中において配線基板の単独の
電気的特性の測定が出来ず歩留りが悪く、信頼性にも欠
ける面があった。そこで、本発明は電子時計の配線基板
間の電気的接続等に用いられ、上記欠点をことごとく排
除した配線基板の接続方法を提供せんとするものである
。本発明の実施例に用いられる配線基板の構成を第2図
、第3図、第4図で詳細に説明する。
Furthermore, the jig 6 and the hole 4 occupy a relatively large area of the wiring boards 1 and 2, and the number of electronic components that can be layered on the boards 1 and 2 is limited, resulting in an increase in the size of the entire electronic watch. There was an inconvenience. Furthermore, it is not possible to measure individual electrical characteristics of the wiring board during assembly, resulting in poor yield and a lack of reliability. SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a method for connecting wiring boards, which is used for electrical connections between wiring boards of electronic watches, and which completely eliminates the above-mentioned drawbacks. The structure of the wiring board used in the embodiment of the present invention will be explained in detail with reference to FIGS. 2, 3, and 4.

まず、前記接続に用いる基板の形状について第2図で説
明すれば、ポリィミィド、テフロン等の可榛性樹脂11
の表面に鋼箔12と12′aもしくは12bが接着され
た構造であって、可榛性樹脂11の厚さは10〜10帆
の、銅箔12,12′の厚さは10〜10呼机程度であ
り、自由に折曲げが出釆るものである。第3図は配線基
板の平面構造を示したものであって、配線基板間を蟻競
する領域13と、一方の回路基板に接続したのち電気的
測定を行なうための領域が設けられ、前記電気的測定を
行なう領域は領域13のパターン中よりも少なくとも広
く形成されるものである。
First, the shape of the board used for the connection will be explained with reference to FIG.
It has a structure in which steel foils 12 and 12'a or 12b are adhered to the surface of the flexible resin 11 and the thickness of the copper foils 12 and 12' is 10 to 10 mm. It can be bent freely. FIG. 3 shows the planar structure of the wiring board, which includes an area 13 where wiring boards compete, and an area 13 where electrical measurements are made after connection to one circuit board. The area where the target measurement is performed is at least wider than the area 13 in the pattern.

可操性樹脂11上の銅箔12,12′は光蝕刻技術、化
学蝕刻技術により所定のパターンを形成している。
The copper foils 12, 12' on the flexible resin 11 are formed into a predetermined pattern by photoetching or chemical etching.

パターンを形成した銅箔12には半田づけ作業を良好に
するために、半田メッキあるいは金メッキ処理が行なわ
れる。又可操性樹脂11に設けた孔14は、半田づけ終
了後、機械的強度を増すために、配線基板に固定するた
めのネジ穴である。領域13の配線密度は、光蝕刻技術
によって形成すれば、銅箔12部分の中は0.1柵、鋼
箔間距離も0.1柳に形成できる。第4図で、本発明の
実施例を説明する。
The patterned copper foil 12 is subjected to solder plating or gold plating to improve soldering work. The holes 14 provided in the flexible resin 11 are screw holes for fixing to the wiring board after soldering to increase mechanical strength. If the wiring density in the area 13 is formed by photoetching, the inside of the copper foil 12 portion can be 0.1 wire, and the distance between the steel foils can be 0.1 willow. An embodiment of the present invention will be described with reference to FIG.

‘a}:ヱポキシ又はアルミニウムを主体とした配線基
板21にはC−MOSLSI等の電子回路22が載置さ
れ、これよりの配線で他の配線基板へ電気的に接続する
ための端子群23を配線基板21の端へ位置させている
'a}: An electronic circuit 22 such as C-MOSLSI is mounted on a wiring board 21 mainly made of epoxy or aluminum, and a group of terminals 23 for electrical connection to other wiring boards is mounted on the wiring board 21, which is mainly made of epoxy or aluminum. It is located at the end of the wiring board 21.

{b}:第3図で説明した可榛‘性を有する配線基板2
4を、配線基板21の端子群23と位置合せを行ない、
半田づけ固定させる。
{b}: Wiring board 2 having flexibility as explained in FIG.
4 with the terminal group 23 of the wiring board 21,
Fix by soldering.

半田づけ工程の概略も説明する。基板21又は配線基板
24の銅箔部分にはあらかじめAuメッキ、Niメッキ
、半田メッキ等の処理をしておき、基板24を重ね合せ
、配線基板24の上から半田ごてで加圧すれば、半田づ
けが行なえる。あるいは他の方法として、赤外線による
半田づけ、又は熱風による半田づけ等があるが、いずれ
を用いても良い。【c}:半田づけ領域が長い場合には
この工程は必要としないが、機械的強度を増すために押
え板25で配線基板24を押え、ネジ26で固定する。
An outline of the soldering process will also be explained. If the copper foil portion of the board 21 or the wiring board 24 is previously treated with Au plating, Ni plating, solder plating, etc., the boards 24 are stacked on top of each other, and pressure is applied from above the wiring board 24 with a soldering iron. Can be used for soldering. Alternatively, there are other methods such as infrared soldering or hot air soldering, and any of these methods may be used. [c}: This step is not necessary if the soldering area is long, but in order to increase mechanical strength, the wiring board 24 is held down with a holding plate 25 and fixed with screws 26.

この状態において配線基板24の他端を用いて前記C−
MOSLS122の電気的特性を測定する事ができる。
池端は通常用いられるコネクター等に挿入するだけで、
電気測定が実施できる様に充分に広い間隔を有している
。【d):ついで、‘c}の電気的測定が終ったならば
、領域13のみを残して切断してしまう。
In this state, use the other end of the wiring board 24 to
The electrical characteristics of the MOSLS 122 can be measured.
Simply insert Ikebata into a commonly used connector, etc.
The spacing is wide enough to allow electrical measurements to be made. [d): Next, when the electrical measurement of 'c} is completed, it is cut leaving only the region 13.

‘e’:切断した他端に他の配線基板27を重ね、‘b
’でのべた手法により半田づけ固定を行ない、しかるの
ち押え板25′とネジ26′とにより更に機械時に固定
する。
'e': Lay another wiring board 27 on the other end of the cut, 'b'
Soldering is carried out using the method described above, and then further fixing is performed using a presser plate 25' and screws 26' during machining.

この状態において、基板21と基板27は電気的に回路
が形成される事になる。‘f’:最終的には図に見られ
る様に、基板21と基板27とを重ね合せ、スベーサ2
9を介してネジ30で基板同志を固定する。
In this state, an electrical circuit is formed between the substrate 21 and the substrate 27. 'f': As shown in the figure, the substrate 21 and the substrate 27 are finally superimposed, and the substrate 2
The boards are fixed to each other with screws 30 via screws 9.

孔28,28′はネジ止め用の穴である。図の状態にお
いて基板24は内側に折曲げた構造となっている。基板
24には電気的特性用の端子を形成した図を示している
が、回路が単純であったり、不必要な劫よ、領域13の
部分だけで良い。又、押え板25,25′あるいはネジ
は必要とする接続強度を有するならば必らずしも必要と
しない。第5図は基板24の他の構成例であって、領域
13に相当する部分を複数設けたものである。
The holes 28, 28' are holes for screwing. In the state shown in the figure, the substrate 24 has a structure bent inward. Although the diagram shows terminals for electrical characteristics formed on the substrate 24, if the circuit is simple or unnecessary, only the area 13 may be used. Further, the holding plates 25, 25' or screws are not necessarily required as long as they have the necessary connection strength. FIG. 5 shows another example of the structure of the substrate 24, in which a plurality of portions corresponding to the regions 13 are provided.

この構成にあっては、まずB′の領域を配線基板の接続
に用い、これが終了すれば、13′,13′′′の領域
を次々と利用できるため、経済的鮫果を大ならしめた構
成である。このように、本発明によれば次に示すすぐれ
た効果を奏することができる。
In this configuration, the region B' is first used for connecting the wiring board, and once this is completed, the regions 13' and 13''' can be used one after another, resulting in a large economical benefit. It is the composition. As described above, according to the present invention, the following excellent effects can be achieved.

■ 本発明によれば、電子腕時計の如く小型の構成にあ
っては、配線基板同志の後続密度を高める事ができるた
め、少ない面積で多くの接続が可能となる。
(2) According to the present invention, in the case of a small structure such as an electronic wristwatch, it is possible to increase the density of interconnection boards, so that many connections can be made in a small area.

これにより電子時計自体を小型にでき、更に商品的イメ
ージを高める事ができる。■ 従来の如く接続数だけの
治具が必要でなく、1個の部品によって多数個の接続を
実現できるばかりでなく、この接続に要する部品コスト
、生産コストを著じるしく低減でき、安価な電子時計を
提供できる。
As a result, the electronic watch itself can be made smaller, and the product image can be further enhanced. ■ Unlike conventional methods, jigs for the number of connections are not required, and not only can multiple connections be made with one component, but the cost of parts and production costs required for these connections can be significantly reduced, making it an inexpensive method. We can provide electronic clocks.

■ 配線基板の単独の電気的特性の測定が実施できるた
め粗立工程の歩轡り向上、あるいは信頼性の箸じるしい
向上を望む事ができる。
- Since it is possible to measure the electrical characteristics of a single wiring board, it is possible to improve the rough-cutting process or to significantly improve reliability.

■ 更に基板間が可裸性を有する配線基板で接続され、
自由に折曲げができるため、組立途中での検査あるいは
不良時のチェック等の場合、容易に検査、チェックがで
きる。
■ Furthermore, the boards are connected with a bare wiring board,
Since it can be bent freely, it can be easily inspected and checked during assembly or when checking for defects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは従来の電子時計における基板間の薮続状態の
斜視図、同bは従釆の拾具の斜視図、第2図a,bは本
発明の実施例に用いられる可榛性を有する配線基板の断
面図、第3図はその配線基板の平面図、第4図a,fは
本発明の一実施例の要部組立工程図、第5図は本発明に
用いる他の配線板の平面図である。 21・・・配線基板、22・・・電子回路部品、23…
端子群、24・・・可操性を有する配線基板、27・・
・他の配線基板。 第1図 第2図 第3図 第4図 第5図
Fig. 1a is a perspective view of a state in which the boards are connected in a conventional electronic watch, Fig. 1b is a perspective view of a follower pick-up, and Figs. 3 is a plan view of the wiring board, FIGS. 4a and 4f are main part assembly process diagrams of an embodiment of the present invention, and FIG. 5 is another wiring used in the present invention. It is a top view of a board. 21... Wiring board, 22... Electronic circuit component, 23...
Terminal group, 24... Wiring board having maneuverability, 27...
・Other wiring boards. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 1 配線基板間で接続するための第1の領域と、電気的
特性を測定するための第2の領域を有する可撓性配線基
板の前記第1の領域の第1の部分を第1の配線基板に接
続し、前記第2の領域により電気的測定を行なった後、
前記第1,第2の領域とを分離切断し、切断された前記
第1の領域の第2の部分を第2の配線基板に接続する配
線基板の接続方法。
1 A first portion of the first region of a flexible wiring board having a first region for connecting between wiring boards and a second region for measuring electrical characteristics is connected to a first wiring. After connecting to the substrate and performing electrical measurements by the second region,
A method for connecting a wiring board, comprising separating and cutting the first and second regions, and connecting a second portion of the cut first region to a second wiring board.
JP50058831A 1975-05-16 1975-05-16 How to connect the wiring board Expired JPS609360B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50058831A JPS609360B2 (en) 1975-05-16 1975-05-16 How to connect the wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50058831A JPS609360B2 (en) 1975-05-16 1975-05-16 How to connect the wiring board

Publications (2)

Publication Number Publication Date
JPS51134158A JPS51134158A (en) 1976-11-20
JPS609360B2 true JPS609360B2 (en) 1985-03-09

Family

ID=13095581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50058831A Expired JPS609360B2 (en) 1975-05-16 1975-05-16 How to connect the wiring board

Country Status (1)

Country Link
JP (1) JPS609360B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167657A (en) * 1991-12-12 1993-07-02 Matsushita Electric Ind Co Ltd Support device for on-vehicle telephone set

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4241439A (en) * 1980-01-04 1980-12-23 Timex Corporation Substrate board/carrier frame assembly
JPS6055076U (en) * 1983-09-26 1985-04-17 トヨクニ電線株式会社 Connection flat cable

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167657A (en) * 1991-12-12 1993-07-02 Matsushita Electric Ind Co Ltd Support device for on-vehicle telephone set

Also Published As

Publication number Publication date
JPS51134158A (en) 1976-11-20

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