Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6099537U - Wire bonder tools - Google Patents
[go: Go Back, main page]

JPS6099537U - Wire bonder tools - Google Patents

Wire bonder tools

Info

Publication number
JPS6099537U
JPS6099537U JP1983191826U JP19182683U JPS6099537U JP S6099537 U JPS6099537 U JP S6099537U JP 1983191826 U JP1983191826 U JP 1983191826U JP 19182683 U JP19182683 U JP 19182683U JP S6099537 U JPS6099537 U JP S6099537U
Authority
JP
Japan
Prior art keywords
chamfer
wire
diameter
wire bonder
honda
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983191826U
Other languages
Japanese (ja)
Other versions
JPH0142349Y2 (en
Inventor
十三男 小林
博 丑木
門沢　元昭
Original Assignee
株式会社　新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　新川 filed Critical 株式会社　新川
Priority to JP1983191826U priority Critical patent/JPS6099537U/en
Publication of JPS6099537U publication Critical patent/JPS6099537U/en
Application granted granted Critical
Publication of JPH0142349Y2 publication Critical patent/JPH0142349Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案になるワイヤホンダ用ツールの一実施例を示
す断面図である。 １・・・ワイヤ挿通用穴、２・・・下面、３，４・・・
面取６部、θ１．θ２・・・面取り角度、ｄ、・・・ワ
イヤ挿通用穴径、鳴・・・面取り部３の開口径、Ｔ・・
・下面の川幅、ｈｌ・・・面取り部３，４の高さ。The figure is a cross-sectional view showing one embodiment of the tool for wire honda according to the present invention. 1...Wire insertion hole, 2...Bottom surface, 3, 4...
6 chamfers, θ1. θ2... Chamfer angle, d,... Hole diameter for wire insertion, Ring... Opening diameter of chamfered part 3, T...
・Width of the lower surface, hl...height of the chamfered parts 3 and 4.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤ挿通用穴の先端に面取り部が形成されたワイヤホ
ンダ用ツールにおいて、前記面取り部は２段のテーパ状
に形成してなり、かつ下方の面取り部の面取り角度は４
０〜５０度に、上方の面取り部の面取り角度は１０〜２
０度に、ワイヤ挿通用穴径はワイヤ線径より８〜１２μ
ｍ大きく、下方の面取り部の開口径はワイヤ線径の２〜
３倍に、面取り部の高さはワイヤ線径の０．７〜１５倍
にそれぞれ形成されていることを特徴とするワイヤホン
ダ用ツール。In a wire honda tool in which a chamfer is formed at the tip of a wire insertion hole, the chamfer is formed in a two-step tapered shape, and the chamfer angle of the lower chamfer is 4.
0 to 50 degrees, and the chamfer angle of the upper chamfer is 10 to 2
At 0 degrees, the diameter of the hole for wire insertion is 8 to 12μ larger than the wire diameter.
m large, and the opening diameter of the lower chamfer is 2 to 2 times the wire diameter.
A tool for wire honda, characterized in that the height of the chamfered portion is 0.7 to 15 times the wire diameter.
JP1983191826U 1983-12-13 1983-12-13 Wire bonder tools Granted JPS6099537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983191826U JPS6099537U (en) 1983-12-13 1983-12-13 Wire bonder tools

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983191826U JPS6099537U (en) 1983-12-13 1983-12-13 Wire bonder tools

Publications (2)

Publication Number Publication Date
JPS6099537U true JPS6099537U (en) 1985-07-06
JPH0142349Y2 JPH0142349Y2 (en) 1989-12-12

Family

ID=30412988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983191826U Granted JPS6099537U (en) 1983-12-13 1983-12-13 Wire bonder tools

Country Status (1)

Country Link
JP (1) JPS6099537U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999033100A1 (en) * 1997-12-19 1999-07-01 Toto Ltd. Wire bonding capillary

Also Published As

Publication number Publication date
JPH0142349Y2 (en) 1989-12-12

Similar Documents

Publication Publication Date Title
JPS6099537U (en) Wire bonder tools
JPS59131806U (en) diamond core drill
JPS59190468U (en) brazing structure
JPS60142011U (en) Drill
JPS6061110U (en) Drill structure
JPS5831413U (en) coupling device
JPS5822210U (en) gun drill
JPS6067421U (en) ball joint
JPS6085317U (en) Iron wire connector for connecting blocks
JPS6144013U (en) connecting bolt
JPS59180429U (en) Wire bonding tools
JPS6073964U (en) grommet
JPS58116168U (en) Contact tip for welding torch
JPS6067420U (en) ball joint
JPS58131636U (en) brazing structure
JPS59132909U (en) Fastener
JPS59151615U (en) Drilling tool with deburring
JPS6038907U (en) Holder
JPS59182612U (en) oil pan drain plug
JPS5942818U (en) Tap attachment/detachment adapter
JPS59176714U (en) Cutter for milling the shoulder inside the jewelry stand
JPS59178102U (en) geta
JPS59132714U (en) Drilling tool with deburring
JPS5996414U (en) Retaining ring for hole
JPS58137121U (en) ball joint device