JPS6112383B2 - - Google Patents
Info
- Publication number
- JPS6112383B2 JPS6112383B2 JP1166175A JP1166175A JPS6112383B2 JP S6112383 B2 JPS6112383 B2 JP S6112383B2 JP 1166175 A JP1166175 A JP 1166175A JP 1166175 A JP1166175 A JP 1166175A JP S6112383 B2 JPS6112383 B2 JP S6112383B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- glass body
- outer frame
- lead wire
- brazing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 238000005219 brazing Methods 0.000 claims description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】
本発明は、水晶電子腕時計等に用いられる小型
の水晶振動子等を電気的および機械的に取付ける
端子板と、それに接続されたリード線とを封着絶
縁用のガラスを介して金属製の外枠に一体的に固
定する構造をなしたハーメチツク端子の製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a terminal plate for electrically and mechanically attaching a small crystal resonator used in a crystal electronic wristwatch, etc., and a lead wire connected to the terminal plate using a sealed insulating glass. The present invention relates to a method for manufacturing a hermetic terminal which is integrally fixed to a metal outer frame via a metal outer frame.
ハーメチツク端子は、例えば第１図に示すよう
に、水晶振動子（図示せず）が電気的かつ機械的
に接続される導電性材料からなる端子板２，３に
結合された鉄・ニツケル合金のリード線４，５
と、例えば銅のように延性のある金属で作られた
ケース１に固定された鉄または鉄・ニツケル合金
で作られた外枠６とをガラス体７で気密シールす
る構造をなしている。このような構造のハーメチ
ツク端子を製造する一つの方法としては、外枠６
とリード線４，５とをガラス体７によつて絶縁封
着した後、リード線４，５と端子板２，３とを銀
銅共晶ろう材によつてろう付けする方法がある。
この方法の場合にはリード線４，５と端子板２，
３とをろう付け材によつてろう付けする際にリー
ド線４，５、外枠６、ガラス体７の各部品が再加
熱されるため、当該部品が熱衝撃により破壊され
る欠点がある。 For example, as shown in Fig. 1, a hermetic terminal is made of an iron-nickel alloy bonded to terminal plates 2 and 3 made of conductive material to which a crystal resonator (not shown) is electrically and mechanically connected. Lead wires 4, 5
and an outer frame 6 made of iron or iron-nickel alloy fixed to a case 1 made of a ductile metal such as copper, for example, are hermetically sealed with a glass body 7. One way to manufacture a hermetic terminal with such a structure is to
There is a method in which the lead wires 4, 5 are insulated and sealed with a glass body 7, and then the lead wires 4, 5 and the terminal plates 2, 3 are brazed with a silver-copper eutectic brazing material.
In this method, the lead wires 4, 5 and the terminal plate 2,
3 with a brazing material, the lead wires 4, 5, the outer frame 6, and the glass body 7 are reheated, so there is a drawback that the parts are destroyed by thermal shock.
また、他の製造方法としそは、第１図に一点鎖
線で示すように端子板２，３を一体的に形成して
おき、それにリード線４，５をろう接しておいた
後、外枠６とリード線４，５および端子板２，３
をガラス体７によつて絶縁封着し、更にその後、
上記一点鎖線で示した部分を研磨等によつて除去
して端子板２と端子板３との間を分離する方法が
ある。この方法の場合には、ガラス体５を軟化さ
せる際に端子板２，３とリード線４，５とのろう
接部分が再加熱されると共に、一点鎖線部分の除
去を精度良く行うことが困難であるため、端子板
２，３の寸法精度の低下が起り、歩留が悪化して
いた。また、端子板２，３の取り付けを規定の寸
法に維持するためには、加熱工程時に用いる治工
具が複雑になると同時に多くの工数が必要とな
り、生産性が悪く、安価な量産が不可能である。 Another manufacturing method is to form the terminal plates 2 and 3 integrally as shown by the dashed lines in Fig. 1, and then solder the lead wires 4 and 5 to the outer frame. 6, lead wires 4, 5 and terminal boards 2, 3
are insulated and sealed with the glass body 7, and further thereafter,
There is a method of separating the terminal board 2 and the terminal board 3 by removing the portion indicated by the one-dot chain line by polishing or the like. In the case of this method, when softening the glass body 5, the soldered parts between the terminal plates 2, 3 and the lead wires 4, 5 are reheated, and it is difficult to accurately remove the dashed-dotted line parts. As a result, the dimensional accuracy of the terminal plates 2 and 3 deteriorated, resulting in poor yield. In addition, in order to maintain the mounting of the terminal boards 2 and 3 within the specified dimensions, the jigs and tools used during the heating process become complicated and require a large number of man-hours, resulting in poor productivity and the impossibility of inexpensive mass production. be.
而して本発明は、従来の欠点を除去すると共に
簡単な工程で精度の良いハーメチツク端子を得る
ことができるハーメチツク端子の製造方法を提供
するもので、以下図面を参照しつつその詳細を説
明する。 Therefore, the present invention provides a method for manufacturing a hermetic terminal that eliminates the drawbacks of the conventional method and can obtain a hermetic terminal with high precision through a simple process.The details of the method will be explained below with reference to the drawings. .
第２図は本発明が実施されるハーメチツク端子
の各構成部品を示す斜視図で、図中符号８は端子
板を示す。端子板８は円形部９と、円形部９の直
径方向に対称的に伸びる幅狭部１０と、幅狭部１
０に連なる幅広部１１と、上記円形部９の中央を
通り幅広部１１間に伸びるスリツト１２と、幅狭
部１０の幅方向に形成されたハーフエツチ部１３
とを有している。この端子板８は、例えば鉄50
％、ニツケル50％の鉄・ニツケル合金の導電性を
有した金属板から、ホトエツチング処理により作
られる。この場合、端子板８は一つだけを単独に
作ることもできるが、幅広部１１を介して複数個
連続して作られる。端子板８の下面には、第３図
に示されているように銀メツキ層１４と銅メツキ
層１５とからなるろう付け部材が設けられてい
る。 FIG. 2 is a perspective view showing each component of a hermetic terminal in which the present invention is implemented, and reference numeral 8 in the figure indicates a terminal plate. The terminal plate 8 includes a circular portion 9, a narrow portion 10 extending symmetrically in the diameter direction of the circular portion 9, and a narrow portion 1.
0, a slit 12 passing through the center of the circular part 9 and extending between the wide parts 11, and a half-etched part 13 formed in the width direction of the narrow part 10.
It has This terminal plate 8 is made of iron 50, for example.
%, made from a conductive metal plate of 50% nickel iron/nickel alloy by photo-etching. In this case, only one terminal board 8 can be made individually, but a plurality of terminal boards 8 can be made in succession with the wide part 11 interposed therebetween. A brazing member consisting of a silver plating layer 14 and a copper plating layer 15 is provided on the lower surface of the terminal board 8, as shown in FIG.
符号１６，１７は、例えば鉄50％、ニツケル50
％の鉄・ニツケル合金からなるリード線である。
符号１８は円柱状に成形され、仮焼結されたガラ
ス体で、上記リード線１６，１７が挿入される挿
入穴１９，２０を有している。符号２１は下縁に
段部２２を有した略円筒形状をなした外枠で、鉄
あるいは鉄・ニツケル合金で作られている。 Codes 16 and 17 are, for example, 50% iron, 50% nickel.
% iron/nickel alloy lead wire.
Reference numeral 18 is a glass body formed into a cylindrical shape and temporarily sintered, and has insertion holes 19 and 20 into which the lead wires 16 and 17 are inserted. Reference numeral 21 denotes a substantially cylindrical outer frame having a stepped portion 22 at the lower edge, and is made of iron or an iron-nickel alloy.
上記した部品によつて構成されるハーメチツク
端子の製造方法を次に説明する。 A method of manufacturing a hermetic terminal constructed from the above-mentioned parts will now be described.
まず、組立工程によつてリード線１６，１７を
ガラス体１８の挿入穴１９，２０に各々挿入する
と共に、リード線１６，１７の一端に端子板８の
円形部９の下面を対向配置し、更にガラス体１８
を外枠２１にはめる。組立工程によつて組立てら
れる各部品は、第４図に示すように鋳型治具２
３，２４内で組立てられて相対位置が規制され
る。この鋳型治具２３，２４はカーボンによつて
作られ、端子板８が前述したように複数個連続し
て設けられている場合には、各端子板８の円形部
９に対応する位置に鋳型治具２３，２４の部品収
容部が配置されている。なお、鋳型治具２３，２
４は案内棒（図示せず）によつて上下方向に摺動
可能になつているが、水平方向の移動は抑止され
ている。 First, in the assembly process, the lead wires 16 and 17 are respectively inserted into the insertion holes 19 and 20 of the glass body 18, and the lower surface of the circular part 9 of the terminal plate 8 is placed opposite to one end of the lead wires 16 and 17. Furthermore, the glass body 18
into the outer frame 21. Each part assembled in the assembly process is placed in a mold jig 2 as shown in Figure 4.
3 and 24, and their relative positions are regulated. These mold jigs 23 and 24 are made of carbon, and when a plurality of terminal plates 8 are provided in succession as described above, molds are placed at positions corresponding to the circular portions 9 of each terminal plate 8. Component storage portions for jigs 23 and 24 are arranged. In addition, the mold jig 23, 2
4 can be slid vertically by a guide rod (not shown), but movement in the horizontal direction is restrained.
組立工程で組立てられた各部品は鋳型治具２
３，２４と共に、中性または弱還元性雰囲気炉内
において900℃の温度で約30分間加熱する。この
時、第６図に示す銀Agと銅Cuとからなる合金の
溶融特性から判るように、銀あるいは銅単独では
溶融しない900℃以下の温度においても、所定の
重量比あるいは原子比の範囲にある銀・銅合金は
溶融状態となる。従つて、端子板８の下面に設け
た銀メツキ層１４と銅メツキ層１５は上記加熱工
程時に、熱拡散等によつて銀・銅合金化し、溶融
状態となる。これによつて端子板８とリード線１
６，１７とがろう付けされる。また。加熱工程に
よつて、バリウム・ソーダ・鉛系のガラス体１８
が軟化し、外枠２１、リード線１６，１７、端子
板８が気密に封着される。 Each part assembled in the assembly process is molded into mold jig 2.
3 and 24, and heated at a temperature of 900° C. for about 30 minutes in a neutral or weakly reducing atmosphere furnace. At this time, as can be seen from the melting characteristics of the alloy consisting of silver Ag and copper Cu shown in Figure 6, even at temperatures below 900 degrees Celsius, where silver or copper alone do not melt, a predetermined weight ratio or atomic ratio can be achieved. Some silver-copper alloys become molten. Therefore, the silver plating layer 14 and the copper plating layer 15 provided on the lower surface of the terminal board 8 are turned into a silver-copper alloy by thermal diffusion or the like during the heating process, and are in a molten state. With this, the terminal plate 8 and the lead wire 1
6 and 17 are brazed. Also. Through the heating process, barium/soda/lead glass body 18
is softened, and the outer frame 21, lead wires 16, 17, and terminal plate 8 are hermetically sealed.
加熱工程の終了後、鋳型治具２３，２４から各
部品を取り出し、端子板８のハーフエツチ部１３
を介して円板部９から幅狭部１０、幅広部１１を
切り離す。この工程によつて第５図に示すように
ハーメチツク端子が作られ、端子板８はスリツト
１２（第２図）に規制された隙間を隔てた２つの
半円形の板に分割される。 After the heating process is completed, each part is taken out from the mold jigs 23 and 24, and the half-etched part 13 of the terminal plate 8 is removed.
The narrow part 10 and the wide part 11 are separated from the disc part 9 via the. Through this process, a hermetic terminal is produced as shown in FIG. 5, and the terminal plate 8 is divided into two semicircular plates separated by a gap regulated by the slit 12 (FIG. 2).
以上、図面を参照しつつ本発明に従うハーメチ
ツク端子の製造方法の詳細を説明して来たが、本
発明が適用されるハーメチツク端子は、第２図に
示すような各部品を使用するものに限定されるも
のはない。例えば端子板８をスリツト１２に規制
される間隔で２つに分割するために、ハーフエツ
チ部１３を形成してあるが、それは円形部９から
幅狭部１０、幅広部１１を切り離す際に不要な外
力が円形部９に及ぶのを防止すると同時に切断作
業を容易にする目的のものであつて、ハーフエツ
チ部１３に代えて、くびれ部を設けても同一目的
を達成できるものである。また、本発明は端子板
およびリード線が１個あるハーメチツク端子にも
実施することができるものである。なお、端子板
およびリード線が複数個あるハーメチツク端子の
場合には、加熱工程後、不要部分を除去してスリ
ツトにより複数の端子板を得る本発明の方法は、
端子板の間隔の寸法精度が非常に高く、量産化の
ための各工程の機械化が容易となる著しい利点が
ある。 Although the details of the method for manufacturing a hermetic terminal according to the present invention have been explained above with reference to the drawings, the hermetic terminal to which the present invention is applied is limited to those using each component as shown in FIG. There is nothing to be done. For example, in order to divide the terminal plate 8 into two at intervals regulated by the slits 12, a half-etched part 13 is formed, but this is unnecessary when cutting the narrow part 10 and wide part 11 from the circular part 9. The purpose is to prevent external forces from being applied to the circular portion 9 and at the same time to facilitate the cutting operation, and the same purpose can be achieved even if a constricted portion is provided in place of the half-etched portion 13. Further, the present invention can also be implemented in a hermetic terminal having one terminal plate and one lead wire. In the case of a hermetic terminal having a plurality of terminal plates and lead wires, the method of the present invention involves removing unnecessary portions after the heating process and obtaining a plurality of terminal plates by slitting.
The dimensional accuracy of the spacing between the terminal plates is extremely high, and there is a significant advantage that it is easy to mechanize each process for mass production.
端子板とリード線とのろう付けを、端子板の下
面に設けた銀と銅との多層メツキからなるろう付
け部材で行つているが、加熱工程時にガラス体が
軟化する温度で溶融する他のろう付け部材を予め
端子板の下面、あるいはリード線が接続される対
応位置に一部分に設けておいてもよい。 The terminal board and the lead wire are brazed using a multi-layer plating of silver and copper provided on the bottom surface of the terminal board, but other brazing materials that melt at a temperature that softens the glass body during the heating process are used. The brazing member may be provided in advance on a portion of the lower surface of the terminal plate or at a corresponding position to which the lead wire is connected.
端子板８に水晶振動子を電気的かつ機械的に取
り付ける場合、端子板８のスリツト１３は水晶振
動子の厚さより5/100程度、広い幅に形成する。 When the crystal resonator is electrically and mechanically attached to the terminal plate 8, the slit 13 of the terminal plate 8 is formed to have a width approximately 5/100 wider than the thickness of the crystal resonator.
第６図のAg−Cu平衡状態図において、は液
相線、は固相線、，は溶解度曲線、Ａは銀
の溶融点、Ｂは銅の溶融点、Ｃは共晶点である。 In the Ag-Cu equilibrium diagram of FIG. 6, is the liquidus line, is the solidus line, is the solubility curve, A is the melting point of silver, B is the melting point of copper, and C is the eutectic point.
叙上の如く本発明に従うハーメチツク端子の製
造方法は、ガラス体を加熱工程によつて軟化させ
ると同時に端子板に設けたろう付け部材を溶融さ
せて端子板とリード線とのろう接を行うため、従
来のように外枠とリード線との気密封着と、端子
板とリード線とのろう接を別工程で行つていた場
合よりも製造工程を簡素化でき、しかも再加熱に
基づく熱衝撃による破壊を防止することができ、
さらに、加熱工程終了後、端子板の端部を除去す
る工程により端子板をスリツトに規制させて分割
するため、分割された端子板間の間隔を精度良く
作ることができる等の利点を有し、歩留が良く量
産化が可能である等、充分に所期の目的を達成し
得、実施上多大な効果を奏する。 As mentioned above, the method for manufacturing a hermetic terminal according to the present invention softens the glass body through a heating process and at the same time melts the brazing member provided on the terminal plate to braze the terminal plate and the lead wire. The manufacturing process can be simplified compared to the conventional method, in which the airtight sealing of the outer frame and the lead wires and the soldering of the terminal plate and the lead wires are performed in separate processes, and there is no thermal shock caused by reheating. can prevent destruction caused by
Furthermore, after the heating process is completed, the ends of the terminal plates are removed and the terminal plates are divided into slits, which has the advantage that the intervals between the divided terminal plates can be created with high accuracy. The present invention has a high yield rate and can be mass-produced, so that it can fully achieve the intended purpose and has great practical effects.
第１図はハーメチツク端子の構造を示す縦断面
図、第２図は本発明に従う製造方法が適用される
ハーメチツク端子の各部品の分解斜視図、第３図
は第２図に示されている端子板の側面図、第４図
は第２図に示された各部品を組立工程によつて鋳
型治具に組立てた状態を示す縦断面図、第５図は
加熱工程が終了したハーメチツク端子の縦断面
図、第６図はろう付け部材として用いられる銀・
銅合金の平衡状態図である。
８…端子板、１２…スリツト、１４，１５…ろ
う付け部材としての銀メツキ層と銅メツキ層、１
６，１７…リード線、１８…ガラス体、１９，２
０…挿入穴、２１…外枠。
FIG. 1 is a longitudinal sectional view showing the structure of a hermetic terminal, FIG. 2 is an exploded perspective view of each component of the hermetic terminal to which the manufacturing method according to the present invention is applied, and FIG. 3 is the terminal shown in FIG. 2. A side view of the plate, Figure 4 is a vertical cross-sectional view showing the parts shown in Figure 2 assembled into a mold jig through the assembly process, and Figure 5 is a vertical cross-section of the hermetic terminal after the heating process has been completed. The top view and Figure 6 are of silver used as a brazing member.
It is an equilibrium state diagram of a copper alloy. 8...Terminal board, 12...Slit, 14, 15...Silver plating layer and copper plating layer as brazing members, 1
6, 17... Lead wire, 18... Glass body, 19, 2
0...insertion hole, 21...outer frame.
Claims (1)
付け部材を設けた端子板と、上記端子板に接続さ
れるリード線と、上記リード線が挿入される挿入
穴を備えたガラス体と、金属製の外枠との各部品
を、上記外枠内に上記ガラス体が介在され、上記
ガラス体に上記リード線が挿入され、上記リード
線の一端に上記ろう付け部材を介して上記端子板
が対向配置される状態に組立てる組立工程と、上
記ガラス体が軟化し、かつ上記ろう付け部材が溶
融する温度に上記組立工程で組立てられた各部品
を加熱する加熱工程とからなり、上記ガラス体を
介して上記外枠に上記端子板およびリード線を一
体的に固定し、かつ上記ろう付け部材を介して上
記端子板とリード線とをろう付けすることを特徴
とするハーメチツク端子の製造方法。 ２ 細長いスリツトを有しろう付け部材が設けら
れた導電性材料からなる端子板と、上記端子板に
接続される複数のリード線と、上記リード線が
各々挿通される挿入穴を備えたガラス体と、金属
製の外枠との各部品を、上記外枠内に上記ガラス
体が介在され、上記ガラス体に上記リード線が
各々挿通され、上記リード線の各一端が上記ろう
付け部材を介して上記スリツトをはさんで端子板
に対向配置される状態に組立てる組立工程と、上
記ガラス体が軟化すると共に上記ろう付け部材が
溶融する温度に上記組立工程で組立てられた各部
品を加熱する加熱工程と、上記加熱工程の終了後
上記外枠にガラス体を介して固定された上記端子
板の端部を除去し、上記スリツトに規制させて上
記端子板を複数に分割する工程とからなり、上記
ろう付け部材を介して上記リード線を分割された
端子板に各々ろう付けすることを特徴とするハー
メチツク端子の製造方法。[Claims] 1. A terminal board made of a conductive material and provided with a brazing member on at least a portion, a lead wire connected to the terminal board, and an insertion hole into which the lead wire is inserted. The parts of the glass body and the metal outer frame are arranged such that the glass body is interposed in the outer frame, the lead wire is inserted into the glass body, and one end of the lead wire is connected to the brazing member through the brazing member. and a heating step to heat each component assembled in the assembly step to a temperature at which the glass body softens and the brazing member melts. , a hermetic terminal characterized in that the terminal plate and the lead wire are integrally fixed to the outer frame via the glass body, and the terminal plate and the lead wire are brazed via the brazing member. manufacturing method. 2. A glass body comprising a terminal plate made of a conductive material having an elongated slit and provided with a brazing member, a plurality of lead wires connected to the terminal board, and insertion holes into which the lead wires are respectively inserted. and a metal outer frame, the glass body is interposed in the outer frame, the lead wires are inserted through the glass body, and one end of each lead wire is inserted through the brazing member. an assembly process in which the parts are assembled to face the terminal board across the slit, and a heating process in which each part assembled in the assembly process is heated to a temperature at which the glass body softens and the brazing member melts. and a step of removing the end portion of the terminal board fixed to the outer frame via the glass body after the heating step and dividing the terminal board into a plurality of parts by regulating the slit, A method for manufacturing a hermetic terminal, comprising brazing the lead wires to the divided terminal plates through the brazing members.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166175A JPS5186364A (en) | 1975-01-28 | 1975-01-28 | HAAMECHITSUKUTANSHINOSEIZOHOHO |
| GB315776A GB1478448A (en) | 1975-01-28 | 1976-01-27 | Method of making an hermetically sealed terminal |
| CH103276A CH609527B (en) | 1975-01-28 | 1976-01-28 | PROCESS FOR MANUFACTURING TIGHTLY SEALED CONNECTIONS. |
| US05/653,003 US4033017A (en) | 1975-01-28 | 1976-01-28 | Manufacturing method of a hermetically sealed terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1166175A JPS5186364A (en) | 1975-01-28 | 1975-01-28 | HAAMECHITSUKUTANSHINOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5186364A JPS5186364A (en) | 1976-07-28 |
| JPS6112383B2 true JPS6112383B2 (en) | 1986-04-08 |
Family
ID=11784153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1166175A Granted JPS5186364A (en) | 1975-01-28 | 1975-01-28 | HAAMECHITSUKUTANSHINOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5186364A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3028080U (en) * | 1995-10-25 | 1996-08-30 | 崇人 橘井 | Tube packed butter or margarine and cheese |
-
1975
- 1975-01-28 JP JP1166175A patent/JPS5186364A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3028080U (en) * | 1995-10-25 | 1996-08-30 | 崇人 橘井 | Tube packed butter or margarine and cheese |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5186364A (en) | 1976-07-28 |
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