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JPS6112997B2 - - Google Patents
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JPS6112997B2 - - Google Patents

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Publication number
JPS6112997B2
JPS6112997B2 JP53020174A JP2017478A JPS6112997B2 JP S6112997 B2 JPS6112997 B2 JP S6112997B2 JP 53020174 A JP53020174 A JP 53020174A JP 2017478 A JP2017478 A JP 2017478A JP S6112997 B2 JPS6112997 B2 JP S6112997B2
Authority
JP
Japan
Prior art keywords
plating
plated
long body
nozzle
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53020174A
Other languages
Japanese (ja)
Other versions
JPS54119342A (en
Inventor
Mamoru Onda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2017478A priority Critical patent/JPS54119342A/en
Publication of JPS54119342A publication Critical patent/JPS54119342A/en
Publication of JPS6112997B2 publication Critical patent/JPS6112997B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は被メツキ長尺体の片面の一部にストラ
イプ状もしくは連続するスポツト状の部分メツキ
を施す方法に関するものである。 従来、このように被メツキ長尺体を連続的に部
分メツキする場合、 (1) メツキ不要個所にマスキングテープを貼付け
る方法、あるいは (2) メツキ槽中でメツキ不要個所を機械的に押え
つけるか隠蔽するかして不要個所にメツキ液が
入らないようにしてメツキする方法 が行われる。 しかしこのような方法は、(1)の方法ではメツキ
不要個所全面に対してマスキングテープが必要で
あるから、片面の一部分のみをメツキする場合は
その裏面に対するマスキングテープが必要である
と共に、被メツキ長尺体がメツキ槽中に全面浸漬
するためにその移動による液の持出しが多くな
り、貴金属メツキなど不利な場合が多い。また、
メツキ液に対する撹拌効果が多く期待できないか
ら、作業電流密度を高くすることができないため
に能率が悪いという難点がある。 (2)の方法では、マスキング材料を必要としない
が、メツキ部分と非メツキ部分の境界が明瞭に出
ないと共に、メツキ装置が複雑となるために高価
な装置を必要とする欠点がある。 (1),(2)のほか、主として長尺体を対象としない
一般部分メツキ法では、スクリーン印刷法、液面
制御法、局部的液当接法、ホトレジスト印刷法な
どがあるが、ホトレジスト印刷法以外はメツキ精
度あるいは長尺体の適用に難点があり、またホト
レジスト印刷法はあまりにも高級で高価である難
点がある。 本発明は上記の点に鑑みてなされたもので、筒
状体の周壁に筒状体の軸方向に沿つて直線的にノ
ズル孔を多数設けてなる噴射ノズルを用いること
によりメツキ方法を改善することにより、マスキ
ングテープを用いて被メツキ長尺体の片面に経済
的で質的に優れたストライプ状もしくはスポツト
状の部分メツキを施すことができるメツキ方法の
提供を目的とするものである。 すなわち本発明の要旨とするところは、その片
面に長手方向に沿つてストライプ状もしくは連続
するスポツト状のメツキを施すべき部分を有する
被メツキ長尺体をメツキ槽に導いて部分メツキす
る方法において、前記メツキ槽中に、筒状体の周
壁にその軸方向に沿つて直線的にノズル孔を多数
設けてなる噴射ノズルを前記ノズル孔を被メツキ
長尺体のメツキを施す部分に向けて被メツキ長尺
体と平行に配置し、一方被メツキ長尺体のメツキ
不要個所にマスキングテープを施し、被メツキ長
尺体をスポツト状槽に導き噴射ノズルからメツキ
液を噴射してメツキを行うことにある。 次に添付図面を参照して本発明を説明すると、
第1図は参考例として被メツキ長尺体1の片面全
部を部分メツキする場合を示し、第2図は実施例
2として被メツキ長尺体1の片面の一部を部分メ
ツキする場合を示すものである。夫々第3図のよ
うに筒状体の周壁に筒状体の軸方向に沿つて、直
線的にノズル孔7,7,7,……を多数設けて噴
流ノズル3を装備している。第3図において、
8,11は夫々噴流ノズル3の両側に連結された
メツキ液導入管であり、矢印12は夫々メツキ液
の流入方向を示す。 さて第1図の場合、メツキ液4を満たしたメツ
キ槽2の底に、ノズル孔7が上を向くように板5
を介して噴流ノズル3を取付け、被メツキ長尺体
1をメツキ液4の表面に接触かつ走行させてメツ
キを行なう。メツキは被メツキ長尺体1の片面全
部に行なわれる。噴流ノズル3からは、被メツキ
長尺体1に向けてメツキ液4が噴流されるので、
メツキ槽2中のメツキ液4は常に撹拌される。ま
た、メツキ槽2の外部には、ドレン管9を有する
受槽10があり、このように全体を構成すること
によりメツキ槽2からあふれ出たメツキ液4はノ
ズル3を介して循環させることにより再びメツキ
槽2に戻すことができる。 第2図の場合、被メツキ長尺体1はその片面の
一部のみをメツキするのであるから、不要個所に
はマスキングテープ6が貼られる。ただし、第1
図の場合も同様であるが、裏面に対してはマスキ
ングテープが不要である。このようにして第1図
の場合と同様にメツキが行なわれる。 次に本発明の参考例および実施例を説明する。 〔参考例〕 第1図に示す方法により下記条件で銅条の片面
を部分メツキした。工程は第4図に示される通り
である。
The present invention relates to a method for partially plating a part of one side of a long object to be plated in the form of stripes or continuous spots. Conventionally, when a long object to be plated is continuously partially plated in this way, there are two methods: (1) pasting masking tape on areas that do not need to be plated, or (2) mechanically holding down areas that do not need to be plated in a plating tank. The method of plating is done by covering up or hiding the plating liquid so that it does not get into unnecessary areas. However, with method (1), masking tape is required to cover the entire area where plating is not required, so if only a portion of one side is to be plated, masking tape is required for the back side, and the area to be plated is Since the long body is fully immersed in the plating tank, a large amount of liquid is carried out due to its movement, which is often disadvantageous when plating precious metals. Also,
Since the stirring effect on the plating solution cannot be expected to be large, the working current density cannot be increased, resulting in poor efficiency. Method (2) does not require a masking material, but has the disadvantage that the boundary between the plated portion and the non-plated portion is not clearly visible, and the plating device is complicated and thus requires an expensive device. In addition to (1) and (2), general partial plating methods that do not primarily target long objects include screen printing, liquid level control, localized liquid contact, and photoresist printing. Methods other than the method have drawbacks in plating accuracy and application of long objects, and photoresist printing methods have the drawback of being too high-grade and expensive. The present invention has been made in view of the above points, and improves the plating method by using an injection nozzle in which a large number of nozzle holes are linearly provided in the peripheral wall of a cylindrical body along the axial direction of the cylindrical body. Accordingly, the object of the present invention is to provide a plating method capable of applying economical and qualitatively superior partial plating in the form of stripes or spots on one side of a long object to be plated using masking tape. That is, the gist of the present invention is to provide a method for partially plating a long body to be plated, which has a portion to be plated in a striped or continuous spot shape along the longitudinal direction on one side thereof, by guiding it to a plating tank. In the plating tank, an injection nozzle having a plurality of nozzle holes linearly provided in the peripheral wall of the cylindrical body along the axial direction is used to direct the nozzle holes toward the part of the elongated body to be plated. The long body is placed parallel to the long body, masking tape is applied to the unnecessary parts of the long body to be plated, and the long body to be plated is led to a spot-shaped tank and the plating liquid is sprayed from the spray nozzle to perform the plating. be. Next, the present invention will be described with reference to the accompanying drawings.
FIG. 1 shows, as a reference example, a case in which the entire one side of the long body 1 to be plated is partially plated, and FIG. 2 shows a case in which a part of one side of the long body 1 to be plated is partially plated as a second embodiment. It is something. As shown in FIG. 3, jet nozzles 3 are provided by providing a large number of nozzle holes 7, 7, 7, . In Figure 3,
Numerals 8 and 11 are plating liquid introduction pipes connected to both sides of the jet nozzle 3, respectively, and arrows 12 indicate the inflow direction of the plating liquid. Now, in the case of Fig. 1, a plate 5 is placed at the bottom of the plating tank 2 filled with the plating liquid 4 so that the nozzle hole 7 faces upward.
A jet nozzle 3 is attached through the plate, and the long body 1 to be plated is brought into contact with and travels on the surface of the plating liquid 4 to perform plating. Plating is performed on the entire one side of the elongated body 1 to be plated. Since the plating liquid 4 is jetted from the jet nozzle 3 toward the long body 1 to be plated,
The plating liquid 4 in the plating tank 2 is constantly stirred. Further, outside the plating tank 2, there is a receiving tank 10 having a drain pipe 9, and by configuring the entire plating tank 2 in this way, the plating liquid 4 overflowing from the plating tank 2 is circulated through the nozzle 3 and reused. It can be returned to plating tank 2. In the case of FIG. 2, since only a part of one side of the elongated body 1 to be plated is to be plated, masking tape 6 is applied to unnecessary areas. However, the first
The same applies to the case shown in the figure, but masking tape is not required for the back side. In this manner, plating is performed in the same manner as in the case of FIG. Next, reference examples and examples of the present invention will be described. [Reference Example] One side of a copper strip was partially plated by the method shown in FIG. 1 under the following conditions. The process is as shown in FIG.

〔実施例〕〔Example〕

参考例と同じ条件において脱脂、水洗の後に乾
燥を加え、第2図に示す方法により銅条の片面を
銀でストライプメツキした。メツキ巾は銅条の中
央部5mmである。 得られた製品は、ニツケルメツキ厚さ2μ、銀
メツキ厚さ3μのもので、0.5t×35×170m、約
30Kgのこの製品を3.5hrで完成させた。 以上のように、本発明においては被メツキ長尺
体の片面にストライプ状もしくは連続するスポツ
ト状の部分メツキを施す場合、これら部分メツキ
位置に対抗して筒状体の周壁にその軸方向に沿つ
て直線的にノズル孔を多数設けてなる噴射ノズル
を用いることにより、この噴射ノズルによつてメ
ツキ液の撹拌が十分に行なわれるために、被メツ
キ長尺体のメツキすべき部分のストライプ幅ある
いはスポツト領域が非常に小さいものであつても
陰極表面へのイオン供給拡散が促進され、メツキ
電流密度を高め作業速度を速めることができると
共に、長手方向にメツキ厚さのバラツキ、メツキ
光沢のむらのない均一なメツキを得ることができ
る。マスキングテープを用いて部分メツキする本
発明においては、ストライプ幅あるいはスポツト
領域が小さくなるとマスキングテープの厚みによ
つてメツキすべき部分が谷となるためにメツキ液
の撹拌が重要であり、この点本発明は噴射ノズル
の存在によつて確実に撹拌することができる。な
お、被メツキ長尺体を持たない従来のメツキ方法
ではこの半分の電流密度しかとれない。 また、本発明は被メツキ長尺体の片面をメツキ
液の噴流方向に向けてメツキ液に当接させて走行
させることによつて、マスキング材の節約を図る
ことができると共に、被メツキ長尺体をメツキ液
との接触部が少なくすることができるために槽外
へのメツキ液の持出しを減らすことができる効果
がある。
After degreasing and washing with water under the same conditions as in the reference example, drying was added, and one side of the copper strip was striped with silver by the method shown in FIG. The plating width is 5 mm at the center of the copper strip. The obtained product has a nickel plating thickness of 2μ and a silver plating thickness of 3μ, and is 0.5t x 35 x 170m, approx.
This product weighing 30Kg was completed in 3.5hr. As described above, in the present invention, when partial plating in the form of stripes or continuous spots is applied to one side of a long object to be plated, the circumferential wall of the cylindrical object is applied along the axial direction in opposition to the partial plating position. By using an injection nozzle with a large number of nozzle holes arranged in a straight line, the plating liquid is sufficiently agitated by the injection nozzle. Even if the spot area is very small, ion supply and diffusion to the cathode surface is promoted, increasing the plating current density and speeding up the work speed, as well as eliminating variations in the plating thickness in the longitudinal direction and uniform plating gloss. Uniform plating can be obtained. In the present invention, in which partial plating is performed using masking tape, stirring of the plating solution is important because when the stripe width or spot area becomes small, the part to be plated becomes a valley due to the thickness of the masking tape. The invention allows reliable stirring due to the presence of the injection nozzle. Note that a conventional plating method that does not use a long body to be plated can only obtain half the current density. Further, in the present invention, by running the elongated body to be plated in contact with the plating liquid with one side facing the jet direction of the plating liquid, it is possible to save masking material, and also to make the long body to be plated Since the number of parts of the body that come into contact with the plating solution can be reduced, there is an effect that the removal of the plating solution out of the tank can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明を説明するための参考例説明
図、第2図は本発明の部分メツキ方法の一実施例
説明図、第3図は本発明に係る噴射ノズルの斜視
図、第4図はメツキ工程図である。 1……被メツキ長尺体、2……メツキ槽、3…
…噴射ノズル、4……メツキ液、5……板、6…
……マスキングテープ、7……ノズル孔、8,1
1……メツキ液導入管、9……ドレン管、10…
…受槽、13……電解脱脂、14……水洗、15
……酸洗、16……ニツケルメツキ、17……銀
メツキ、18……乾燥、19……送出し、20…
…巻取り、21……マスキングテープ貼付機。
FIG. 1 is an explanatory diagram of a reference example for explaining the present invention, FIG. 2 is an explanatory diagram of an embodiment of the partial plating method of the present invention, FIG. 3 is a perspective view of an injection nozzle according to the present invention, and FIG. is the Metsuki process diagram. 1... long body to be plated, 2... plating tank, 3...
...Spray nozzle, 4...Plating liquid, 5...Plate, 6...
...Masking tape, 7...Nozzle hole, 8,1
1... Metsuki liquid introduction pipe, 9... Drain pipe, 10...
...Receiving tank, 13...Electrolytic degreasing, 14...Water washing, 15
... Pickling, 16 ... Nickel plating, 17 ... Silver plating, 18 ... Drying, 19 ... Sending out, 20 ...
... Winding, 21... Masking tape pasting machine.

Claims (1)

【特許請求の範囲】[Claims] 1 その片面に長手方向に沿つてストライプ状も
しくは連続するスポツト状のメツキを施すべき部
分を有する被メツキ長尺体をメツキ槽に導いて部
分メツキする方法において、前記メツキ槽中に、
筒状体の周壁にその軸方向に沿つて直線的にノズ
ル孔を多数設けてなる噴射ノズルを前記ノズル孔
を被メツキ長尺体のメツキを施す部分に向けて被
メツキ長尺体と平行に配置し、一方被メツキ長尺
体のメツキ不要個所にマスキングテープを施し、
被メツキ長尺体をメツキ槽に導き噴射ノズルから
メツキ液を噴射してメツキを行うことを特徴とす
る部分メツキ方法。
1. In a method of partially plating a long body to be plated, which has a part to be plated in a striped or continuous spot pattern along the longitudinal direction on one side thereof, into a plating tank for partial plating, in the plating tank,
A jet nozzle, which has a plurality of nozzle holes linearly provided in the peripheral wall of a cylindrical body along its axial direction, is directed parallel to the long body to be plated so that the nozzle holes are directed toward the part of the long body to be plated that is to be plated. On the other hand, apply masking tape to the parts of the long body to be plated that do not need to be plated.
A partial plating method characterized in that a long body to be plated is guided into a plating tank, and plating is performed by spraying a plating liquid from an injection nozzle.
JP2017478A 1978-02-22 1978-02-22 Partially plating method Granted JPS54119342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017478A JPS54119342A (en) 1978-02-22 1978-02-22 Partially plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017478A JPS54119342A (en) 1978-02-22 1978-02-22 Partially plating method

Publications (2)

Publication Number Publication Date
JPS54119342A JPS54119342A (en) 1979-09-17
JPS6112997B2 true JPS6112997B2 (en) 1986-04-11

Family

ID=12019805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017478A Granted JPS54119342A (en) 1978-02-22 1978-02-22 Partially plating method

Country Status (1)

Country Link
JP (1) JPS54119342A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140895A (en) * 1986-12-02 1988-06-13 Nippon Yusoki Co Ltd Fan for motor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311693A (en) * 1986-07-02 1988-01-19 Fuji Plant Kogyo Kk Plating device for belt-like material
DE4426705C1 (en) * 1994-07-20 1995-09-07 Mannesmann Ag Inversion casting installation with a crystalliser
CN104651911A (en) * 2015-02-13 2015-05-27 东莞庞思化工机械有限公司 A kind of recovery device and recovery method of electroplating dripping liquid

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5342147A (en) * 1976-09-29 1978-04-17 Nisshin Steel Co Ltd Continuous oneeside electroplating method of metallic strip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140895A (en) * 1986-12-02 1988-06-13 Nippon Yusoki Co Ltd Fan for motor

Also Published As

Publication number Publication date
JPS54119342A (en) 1979-09-17

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