JPS6113950B2 - - Google Patents
Info
- Publication number
- JPS6113950B2 JPS6113950B2 JP53119585A JP11958578A JPS6113950B2 JP S6113950 B2 JPS6113950 B2 JP S6113950B2 JP 53119585 A JP53119585 A JP 53119585A JP 11958578 A JP11958578 A JP 11958578A JP S6113950 B2 JPS6113950 B2 JP S6113950B2
- Authority
- JP
- Japan
- Prior art keywords
- ferrite
- lap
- processing
- polishing
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 8
- 239000010419 fine particle Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 46
- 238000003672 processing method Methods 0.000 description 25
- 239000013078 crystal Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- 230000003746 surface roughness Effects 0.000 description 14
- 230000006866 deterioration Effects 0.000 description 11
- 239000012535 impurity Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910018605 Ni—Zn Inorganic materials 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 229910000702 sendust Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
本発明は、工作物の表面を鏡面に加工する研摩
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing method for polishing the surface of a workpiece into a mirror surface.
近年の電子部品用材料には、結晶構造の乱れ、
もしくは残留応力のない完全な鏡面加工を必要と
するものが多い。シリコン単結晶等の半導体材料
においては、材料が高純度の単結晶であることを
利用して、最終加工として化学研摩を行つている
が、工業的に用いられる多くの材料は多結晶材料
であり、また不純物の存在とは無縁ではない。こ
のような材料を化学研摩とすると、結晶の持つ異
方性により結晶粒界に段差を生じたり、不純物が
残留もしくは溶出したりして、鏡面を生成するこ
とは不可能である。 In recent years, materials for electronic components have a disordered crystal structure,
Or, many require complete mirror finishing with no residual stress. Semiconductor materials such as silicon single crystals are subjected to chemical polishing as a final processing, taking advantage of the fact that they are highly pure single crystals, but many materials used industrially are polycrystalline materials. , and is not unrelated to the presence of impurities. If such materials are chemically polished, the anisotropy of the crystals may cause steps to occur at grain boundaries, and impurities may remain or be eluted, making it impossible to produce a mirror surface.
従来、圧延ロール等の金属を鏡面加工している
のは、加工によつて、材料表面を非晶質化しなが
ら除去を行つているからであり、仕上面の結晶構
造は完全に破壊されている。この様な場合は、材
料の硬度が高くなつたり、疲労破壊強度が向上す
る等の長所を持つており、その使用目的に対して
は適した加工法であつた。 Conventionally, metals such as rolling rolls are mirror-finished because the material surface is removed while being made amorphous during processing, and the crystal structure of the finished surface is completely destroyed. . In such cases, the material has advantages such as increased hardness and improved fatigue fracture strength, and was a suitable processing method for its intended use.
しかし、電子部品用材料においては、材料その
ものの持つ性質を変えることなく鏡面を生成する
ことが必要であり、従来の鏡面研摩法は不完全で
ある。 However, in materials for electronic components, it is necessary to generate a mirror surface without changing the properties of the material itself, and conventional mirror polishing methods are incomplete.
本発明は、そのような目的に対し、ほぼ完全な
鏡面を容易に生成することが可能な研摩方法を提
供するものである。 The present invention provides a polishing method capable of easily producing a nearly perfect mirror surface for such purposes.
電子部品用材料で、既述のように結晶構造の乱
れ、もしくは残留応力のない鏡面、すなわち、加
工変質層の無い鏡面を要求されるもので、本発明
が特に効果的であるのは、磁気ヘツド用材料とし
て使用されるMz−Znフエライト、Ni−Znフエラ
イト等の高透磁率フエライトおよびセンダスト等
の金属磁性材料である。 The present invention is particularly effective for materials for electronic components that require a mirror surface without disordered crystal structure or residual stress, that is, a mirror surface without a process-altered layer, as described above. These are high magnetic permeability ferrites such as Mz-Zn ferrite and Ni-Zn ferrite, and metal magnetic materials such as sendust, which are used as head materials.
以下に、フエライトを例にとり、特に、磁気ヘ
ツドのギヤツプ面加工に本加工法を適用した場合
について詳細に説明する。 In the following, using ferrite as an example, a case in which the present processing method is applied to machining the gap surface of a magnetic head will be described in detail.
フエライトは電子部品用材料として汎く用いら
れている金属酸化物磁性体であるが、Mn−Znフ
エライトやNi−Znフエライトの高透磁率フエラ
イトはその高周波特性が優れているために、磁気
ヘツドの磁芯材料として使用されており、その加
工にあたつては極めて高い精度が要求される。特
に、近年、磁気記録技術が著しく進歩し、記録波
長が1μm以下となるような高密度の記録・再生
が実用化されてくると、その要求はますます厳し
くなつてきた。磁気ヘツドにおいて特に重要なの
は磁気ギヤツプを構成するギヤツプ対向面の鏡面
加工であるが、記録波長が短かくなるに従つて磁
気ギヤツプの幅も狭小化し、最近では0.3μm以
下にもなつてきているために、この鏡面も完全鏡
面といえるものでなければない。 Ferrite is a metal oxide magnetic material that is widely used as a material for electronic components, but high magnetic permeability ferrites such as Mn-Zn ferrite and Ni-Zn ferrite have excellent high frequency characteristics, so they are used in magnetic heads. It is used as a magnetic core material, and its processing requires extremely high precision. In particular, in recent years, as magnetic recording technology has made remarkable progress and high-density recording and reproduction with a recording wavelength of 1 μm or less has been put into practical use, the requirements have become increasingly severe. What is particularly important in a magnetic head is the mirror finish on the surface facing the gap that constitutes the magnetic gap, but as the recording wavelength becomes shorter, the width of the magnetic gap also becomes narrower, and recently it has become less than 0.3 μm. Furthermore, this mirror surface must also be a perfect mirror surface.
特に、フエライトは、その磁気的特性が、結晶
構造および応力に対して敏感であり、加工方法を
誤ると著しい特性劣化を生じることになる。 In particular, the magnetic properties of ferrite are sensitive to crystal structure and stress, and if the processing method is incorrect, significant deterioration of the properties will occur.
磁気ヘツド用フエライトのギヤツプ面は、ラツ
ピングやポリツシングで鏡面に加工されている
が、従来多く用いられているのは、軟質金属たと
えば錫、鉛等をラツプとして、平均粒径3μm以
下のダイヤモンドを砥粒とする研摩方法である。
この場合の表面あらさは0.05μm以下で、磁気ギ
ヤツプもマクロに見れば美しくシヤープに出来あ
がつているが、0.3μmのギヤツプを詳細に観察
すれば、第1図に示すように平均的なギヤツプ長
0.3μmに対して、表面あらさ0.05μmは無視で
きない大きさであつて、磁気ヘツドの周波数特性
を劣化させることになる。なお第1図において、
1はギヤツプを形成するための非磁性スペーサ、
たとえば、蒸着、スパツタリング等で作成された
ガラスであり、2,2′はフエライトコアであ
る。 The gap surface of ferrite for magnetic heads is polished to a mirror surface by lapping or polishing, but what has been commonly used is a lap made of a soft metal such as tin or lead, and polished with diamond having an average grain size of 3 μm or less. This is a method of polishing into particles.
In this case, the surface roughness is less than 0.05 μm, and the magnetic gap is beautifully sharp when viewed macroscopically, but if you look closely at the 0.3 μm gap, you can see that it is an average gap as shown in Figure 1. long
Compared to 0.3 μm, a surface roughness of 0.05 μm is a size that cannot be ignored, and will deteriorate the frequency characteristics of the magnetic head. In addition, in Figure 1,
1 is a non-magnetic spacer for forming a gap;
For example, it is glass made by vapor deposition, sputtering, etc., and 2 and 2' are ferrite cores.
また、従来の研摩法によるフエライトの加工変
質と、それによる磁気特性の劣化に関しては多く
の報告がなされており、我々自身も、ほぼ0.3μ
mの程度の加工変質深さの存在を確認している。
一例として、Mn−Zn単結晶フエライト(100)
面における加工変質層の状態を第2図に示す。加
工面から深さ0.02〜0.03μmの範囲は、ベイルビ
ー層とも呼ばれる非晶質層Aとなつており、この
部分では、フエライトは磁性を失つていると考え
られる。その下には結晶が微細化された層Bがあ
り、ほぼ0.1μmの深さにまで達する。さらにそ
の下は、転位、すべり等の結晶欠陥を伴う有ひず
み層Cが0.3μmの深さにまで達しており、その
下はほぼバルクとみなせる結晶構造層Dとなつて
いる。フエライトの磁性も結晶微細化層B、有ひ
ずみ層Cと回復していくが、バルク層Dに達して
もフエライト本来の磁性(たとえば透磁率)には
ならない。これは、加工変質層には大きな圧縮残
留応力が作用しており、これとバランスする引張
応力が、バルク層に作用して、弾性的なひずみを
生じているからである。 In addition, many reports have been made regarding processing alteration of ferrite due to conventional polishing methods and the resulting deterioration of magnetic properties, and we ourselves have reported
It has been confirmed that there is a processing deterioration depth of approximately 1.5 m.
As an example, Mn-Zn single crystal ferrite (100)
Figure 2 shows the state of the process-affected layer on the surface. The range from the machined surface to a depth of 0.02 to 0.03 μm is an amorphous layer A also called Beilby layer, and it is thought that the ferrite has lost its magnetism in this part. Below that, there is a layer B with finer crystals, reaching a depth of approximately 0.1 μm. Further below that, a strained layer C with crystal defects such as dislocations and slips reaches a depth of 0.3 μm, and below that is a crystal structure layer D that can be regarded as almost a bulk. The magnetism of ferrite also recovers through the crystalline refinement layer B and the strained layer C, but even when it reaches the bulk layer D, it does not return to the original magnetism (for example, magnetic permeability) of ferrite. This is because a large compressive residual stress acts on the process-affected layer, and a tensile stress that balances this acts on the bulk layer, causing elastic strain.
さて、この様な加工変質層を持つた面で構成さ
れるギヤツプは、実効的には拡大していることに
なり、しかもギヤツプエツヂの磁気的なシヤープ
さが失われており、磁気ヘツドの高周波特性を劣
化させている。 Now, the gap made up of surfaces with such a processing-affected layer is effectively expanding, and the magnetic sharpness of the gap edge has been lost, which affects the high frequency characteristics of the magnetic head. is deteriorating.
すなわち、VTR等の高密度記録用磁気ヘツド
のギヤツプ面としては、表面あらさが、ギヤツプ
長に比べて相対的に無視できる程度、たとえば、
0.3μmのギヤツプに対して表面あらさ0.01μm
以下であつて、加工変質がほとんど無いことが要
求される。これを実現する具体的な方法としてア
ルミナ等の極微細砥粒を用いようとするのが一般
的であるが、我々の実験では、アルミナを用いた
研摩では加工変質はほとんど改善されない。別の
手段として、加工によつて生じた変質を、化学的
もしくは電気化学的な方法で除去することが考え
られ、一部で実用されている。しかし、一般に結
晶は面によつて化学的な除去速度に差があり、多
結晶の場合は粒界で大きな段差を生じるためこれ
らの手段は多結晶フエライトでは有効ではない。
単結晶フエライトでは、研摩後に化学エツチング
したり、もしくは研摩液を酸性にして、砥粒によ
る研摩と化学エツチングを同時に作用させる方法
は、加工変質層を除去する上では有効であるが、
表面あらさはむしろ劣化する。また、Ni−Znフ
エライトに関しては、現在、単結晶を育成する技
術はまだ開発されていないため、単結晶にのみ有
効な方法は使えない。 In other words, the gap surface of a magnetic head for high-density recording such as a VTR should have surface roughness that is relatively negligible compared to the gap length.
Surface roughness 0.01μm for 0.3μm gap
It is required that there be almost no deterioration due to processing. As a concrete method to achieve this, it is common to use ultrafine abrasive grains such as alumina, but in our experiments, polishing using alumina hardly improves processing deterioration. As another means, removing the alteration caused by processing using chemical or electrochemical methods has been considered, and has been put into practice in some cases. However, in general, crystals have different chemical removal rates depending on their faces, and in the case of polycrystals, large steps occur at grain boundaries, so these methods are not effective for polycrystalline ferrite.
For single-crystal ferrite, chemical etching after polishing, or making the polishing liquid acidic and simultaneously applying polishing with abrasive grains and chemical etching, is effective in removing the damaged layer.
The surface roughness actually deteriorates. Furthermore, regarding Ni-Zn ferrite, the technology for growing single crystals has not yet been developed, so methods that are effective only for single crystals cannot be used.
化学的な加工法に関しては、さらにいくつかの
問題点があるが、その第一は端部のダレの問題で
ある。除去量が少い場合は顕著ではないが、いわ
ゆるデイープエツチを行うと、形状精度が劣化す
る。第二の問題はフエライト中の不純物の存在で
あつて、他の電子部品材料、たとえばSi等と比較
するとフエライトは一般に極めて不純物の多い材
料であつて、化学エツチングでは除去できない不
純物も多い。たとえばMn−Zn単結晶フエライト
ではるつぼの白金の混入を完全に防止することは
極めて困難である。ホツトプレスフエライト等の
多結晶フエライトでも、結晶粒界の不純物の折出
は避け難い。このような不純物は一般にフエライ
トのエツチヤントでは除去されずに、エツチング
後は凸起として残ることになる。この凸起は、言
うまでもなく、0.3μm程度のギヤツプを形成す
る上での障害となり、ギヤツプ長の精度を劣下さ
せる。第三の問題として、磁気ヘツドのコアとし
てフエライトを研摩するとき、ギヤツプ対向面は
フエライトとガラスの複合構造となつていること
が多く、フエライトのエツチングを行うと、ガラ
ス部が凸起となつてしまう。従つてガラスのエツ
チングをさらに行うことも必要になり、種々のエ
ツチングをくり返すことによつて不良発生の可能
性が大きくなる。 There are several other problems with chemical processing, the first of which is the problem of sag at the edges. Although it is not noticeable when the amount of removal is small, the shape accuracy deteriorates when so-called deep etching is performed. The second problem is the presence of impurities in ferrite.Compared to other electronic component materials such as Si, ferrite generally has extremely high impurities, and there are many impurities that cannot be removed by chemical etching. For example, with Mn--Zn single crystal ferrite, it is extremely difficult to completely prevent platinum from being mixed into the crucible. Even in polycrystalline ferrite such as hot-pressed ferrite, precipitation of impurities at grain boundaries is unavoidable. Such impurities are generally not removed by a ferrite etchant and remain as protrusions after etching. Needless to say, this protrusion becomes an obstacle in forming a gap of about 0.3 μm, and deteriorates the accuracy of the gap length. The third problem is that when ferrite is polished as the core of a magnetic head, the surface facing the gap often has a composite structure of ferrite and glass, and when the ferrite is etched, the glass part becomes convex. Put it away. Therefore, it is necessary to perform further etching of the glass, and repeating various types of etching increases the possibility of defects occurring.
次に本発明加工法について説明する。 Next, the processing method of the present invention will be explained.
第3図は本発明加工法において用いる研摩装置
の一例である。円板状のラツプ3は回転軸4によ
り回転駆動され、ラツプ3の外周は円筒外壁5で
囲まれて液体容器を構成している ここに研摩液
6が入れられて、液中研摩を行うようになつてい
る。工作物のフエライト7は試料ホルダ8に熱軟
化樹脂等で接着されており、試料ホルダ8は軸受
12で支えられる回転軸9に結合されており、回
転駆動軸13、歯車11および歯車10を介して
回転駆動される。回転軸9は軸受12中で軸方向
には拘束されておらず、静止時には自重でラツプ
3にフエライト7が接しているが、ラツプ3およ
び試料ホルダ8が回転すると研摩液6の流体圧に
よつて、ラツプ3とフエライト7の間に動圧の流
体軸受の状態が作られ、試料ホルダ8は浮上す
る。なお、必要に応じて、歯車10の上からバネ
等で圧力を付加したり、荷重を追加することもな
される。装置は剛性の高いベース14で構築され
ており、高精度の回転運動が可能になつている。
第3図では試料ホルダ8が強制駆動されて、ラツ
プ3との間で遊星運動を行う装置の例を示した
が、他にも修正輪方式の平面研摩装置を用いて
も、試料とラツプとの間に動圧の流体軸受状態が
実現されれば同様の効果を得ることができる。こ
の動圧流体軸体を実現するためには、研摩液6の
流速を高めることもしくは粘性を高めることが有
効である。具体的には、流速を高める手段とし
て、ラツプ3もしくは試料ホルダ8の回転数を高
めることが直接的な手段であるが、平面研摩装置
においては一般に高速運動は精度劣化の原因とな
りがちであつて好ましくない。他の手段として、
ラツプ3の表面に溝を設けること、およびラツプ
3の表面あらさを大きくすることが有効である。
本加工法ではラツプ3とフエライト7が加工中に
は直接接触しないことが一つの特徴であるため、
通常の研摩装置の様にラツプ表面の表面あらさが
仕上り面に影響するようなことはない。 FIG. 3 shows an example of a polishing apparatus used in the processing method of the present invention. A disc-shaped lap 3 is rotationally driven by a rotating shaft 4, and the outer periphery of the lap 3 is surrounded by a cylindrical outer wall 5 to constitute a liquid container. A polishing liquid 6 is placed here to perform submerged polishing. It's getting old. The ferrite 7 of the workpiece is bonded to a sample holder 8 with heat-softening resin or the like, and the sample holder 8 is connected to a rotating shaft 9 supported by a bearing 12, and the ferrite 7 is connected to a rotating shaft 9 supported by a bearing 12. Rotationally driven. The rotating shaft 9 is not restrained in the axial direction in the bearing 12, and when it is stationary, the ferrite 7 is in contact with the lap 3 due to its own weight, but when the lap 3 and sample holder 8 rotate, the ferrite 7 is in contact with the lap 3 due to the fluid pressure of the polishing liquid 6. As a result, a dynamic pressure fluid bearing condition is created between the lap 3 and the ferrite 7, and the sample holder 8 floats up. Note that, if necessary, pressure may be applied from above the gear 10 using a spring or the like, or a load may be added. The device is constructed with a highly rigid base 14, allowing highly accurate rotational movement.
Although Fig. 3 shows an example of a device in which the sample holder 8 is forcibly driven and performs planetary motion between the sample and the lap 3, there are other ways in which the sample and the lap can be moved even if a correction wheel type surface polishing device is used. A similar effect can be obtained if a fluid bearing state of dynamic pressure is realized during this period. In order to realize this dynamic pressure fluid axis, it is effective to increase the flow rate or increase the viscosity of the polishing liquid 6. Specifically, a direct means of increasing the flow velocity is to increase the rotational speed of the lap 3 or the sample holder 8, but in general, high-speed motion tends to cause deterioration of accuracy in surface polishing equipment. Undesirable. As another means,
It is effective to provide grooves on the surface of the lap 3 and to increase the surface roughness of the lap 3.
One of the characteristics of this processing method is that the lap 3 and ferrite 7 do not come into direct contact during processing.
Unlike normal polishing equipment, the roughness of the lap surface does not affect the finished surface.
研摩液6は、MgO微粒子を蒸留水に混ぜて懸
濁液にしたものであり、平均粒径は小さいものが
望ましく、0.1μm程度のものが入手容易であ
る。MgOの濃度を高くすると、加工能率は向上
するが、面ダレを生じ易くなる。従つて加工目的
によつて適当な濃度を選ぶべきであるが、磁気ヘ
ツドのギヤツプ面の研摩においては、5重量%以
下にするのが良い。また動圧流体軸受状態を安定
にする目的で、研摩液6の粘度を高める手段とし
て、グリセリン等の増粘剤を蒸留水に溶解させる
ことが有効であるが、グリセリンの量を多くする
と加工能率が低下する傾向となる。 The polishing liquid 6 is a suspension of fine MgO particles mixed with distilled water, and preferably has a small average particle size, and those with an average particle size of about 0.1 μm are easily available. Increasing the concentration of MgO improves processing efficiency, but increases the likelihood of surface sagging. Therefore, an appropriate concentration should be selected depending on the purpose of processing, but for polishing the gap surface of a magnetic head, it is best to keep it at 5% by weight or less. Furthermore, in order to stabilize the condition of the hydrodynamic bearing, it is effective to dissolve a thickener such as glycerin in distilled water as a means of increasing the viscosity of the polishing fluid 6. However, increasing the amount of glycerin increases the machining efficiency. tends to decrease.
MgO微粒子以外の固体粒子が研摩液6に混入
すると鏡面の生成が困難となるため、蒸留水の管
理雰囲気の清浄度維持には細心の注意が必要であ
るが、さらに重要なのはラツプ3の材質と加工お
よび管理状態である。ダイヤモンド砥粒等を用い
る研摩方法では、使用する砥粒を用いてラツプ3
の平面度を管理・維持しており、初期のラツプ表
面の加工法を特に限定する必要は無いが、本加工
法ではラツプ3の減耗が極めてわずかであるため
に、初期に平面度を出しておく必要がある。また
ラツプ面を加工した後に不純物が残留することも
防止しなければならない。この様な条件を満足す
るために、ラツプ3の材質としては、錫、アルミ
ニウム、黄銅等の軟質金属を用い、旋盤で切削を
行う。 If solid particles other than MgO fine particles are mixed into the polishing liquid 6, it will be difficult to create a mirror surface, so careful attention must be paid to maintaining the cleanliness of the atmosphere in which the distilled water is controlled.More importantly, the material of the lap 3 Processed and controlled. In polishing methods that use diamond abrasive grains, etc., the abrasive grains used are
The flatness of the lap 3 is managed and maintained, and there is no need to limit the initial processing method for the lap surface. However, since this processing method causes very little wear on the lap 3, it is necessary to improve the flatness at the initial stage. It is necessary to keep it. It is also necessary to prevent impurities from remaining after processing the lap surface. In order to satisfy these conditions, the wrap 3 is made of a soft metal such as tin, aluminum, or brass, and is cut using a lathe.
次に本発明の加工例について説明する。第4図
はMn−Zn単結晶フエライトの加工面の表面あら
さであり、Rmaxは10Å以下である。フエライト
の格子定数が8〜9Åであることを考えると、も
はやこれ以上の鏡面は望み難い。なお、使用した
測定器はテーラ・ホブソン社のタリステツプであ
る。 Next, processing examples of the present invention will be explained. Figure 4 shows the surface roughness of the machined surface of Mn-Zn single crystal ferrite, and Rmax is 10 Å or less. Considering that the lattice constant of ferrite is 8 to 9 Å, it is difficult to expect a mirror surface higher than this. The measuring instrument used was Taylor Hobson Talystep.
第5図はNi−Zn多結晶フエライトの場合であ
るがこの場合には、結晶面の加工速度の異方性が
あらわれており、結晶粒界で20〜30Åの段差を生
じている。ただし、粒内の表面あらさは、やはり
10Å以下である。Mn−Zn多結晶フエライトの場
合には、この粒界段差はほぼ20Å程度であつた。
これらの加工面の結晶性を調べるために、電子回
折像をとると、菊池線が明瞭にあらわれており、
化学エツチングで処理した面と同等の結晶性を有
していることがわかつた。また、μリングの側面
を本加工法で研摩して透磁率を測定したところ、
ほぼバルクの値を示し、残留応力がほとんど存在
しないことを確認した。すなわち、本加工法で
は、加工変質は検出されなかつた。 FIG. 5 shows the case of Ni--Zn polycrystalline ferrite. In this case, anisotropy in processing speed of crystal planes appears, resulting in a step of 20 to 30 Å at grain boundaries. However, the surface roughness inside the grain is still
It is 10 Å or less. In the case of Mn-Zn polycrystalline ferrite, this grain boundary step was approximately 20 Å.
In order to examine the crystallinity of these machined surfaces, we took an electron diffraction image and found that Kikuchi lines clearly appeared.
It was found that the surface had the same crystallinity as the surface treated with chemical etching. In addition, when we polished the side surface of the μ-ring using this processing method and measured its magnetic permeability, we found that
It was confirmed that the value was almost that of the bulk, and that there was almost no residual stress. That is, with this processing method, no processing deterioration was detected.
また第4図に用いたMn−Zn単結晶フエライト
においては平均径2〜3μmの白金の析出があつ
たが微分干渉顕微鏡による観察では、極めてわず
かの凹みと見なされる程度であり、表面あらさの
測定においては、スタイラス先端の幅が2.5μm
のため、凹みを検出できなかつたが、推定では50
Å以下の凹みであり、ギヤツプを構成する上では
全く問題にならない。第5図のNi−Zn多結晶フ
エライトの場合も粒界に析出した不純物による鏡
面の劣化は全く観察されなかつた。 In addition, in the Mn-Zn single crystal ferrite used in Figure 4, platinum was precipitated with an average diameter of 2 to 3 μm, but when observed with a differential interference microscope, it was seen as a very slight depression, and the surface roughness was measured. In this case, the width of the stylus tip is 2.5 μm.
Therefore, the dent could not be detected, but it is estimated that 50
The concavity is less than Å, so it is not a problem at all when constructing a gap. Also in the case of the Ni--Zn polycrystalline ferrite shown in FIG. 5, no deterioration of the mirror surface due to impurities precipitated at the grain boundaries was observed.
第6図は、Mn−Zn多結晶フエライトに、ガラ
スを充填して複合構造としたものの加工面であ
る。用いたガラスはビツカース硬度500Kg/mm2の鉛
ガラスである。ガラスとフエライトの境では約
200Åの段差が生じているが、フエライト部が凸
となつており、この場合もギヤツプを構成する上
での不都合はない。さらに、フエライト部の端部
に着目すると、シヤープなエツジとなつており本
加工法が、ダレの無い、形状精度の優れた加工法
であることがわかる。 FIG. 6 is a processed surface of Mn-Zn polycrystalline ferrite filled with glass to form a composite structure. The glass used was lead glass with a Bitkers hardness of 500 Kg/mm 2 . At the boundary between glass and ferrite, approximately
Although there is a step difference of 200 Å, the ferrite part is convex, so there is no problem in forming the gap in this case as well. Furthermore, if we pay attention to the edges of the ferrite parts, we can see that they have sharp edges, which shows that this processing method has no sag and has excellent shape accuracy.
第7図は、センダストの加工面の表面あらさで
ある。この場合は多結晶金属であるにもかかわら
ず結晶粒界はほんど観察されず、不純物等の影響
と思われる「うねり」を含めても、表面あらさは
20Å以下である。 FIG. 7 shows the surface roughness of the processed surface of Sendust. In this case, although it is a polycrystalline metal, very few grain boundaries are observed, and even with the inclusion of "undulations" that may be caused by impurities, the surface roughness is very low.
It is 20 Å or less.
他に、本加工法の有効な材料を調べるために、
種々の材料の加工を実施した。金属に関しては、
既述のセンダスト以外に、加工変質の無い完全鏡
面のニーズに之しいため、実験した材料は少いが
基本的には軟質金属ほど加工面の品質は劣つてお
り鏡面とは云い難いが、ステンレス鋼に関しては
表面あらさ20Å程度の研摩が可能であることを確
認した。 In addition, in order to investigate materials that are effective for this processing method,
Processing of various materials was carried out. Regarding metals,
In addition to Sendust, which has already been mentioned, there are few materials that have been tested due to the need for a perfect mirror surface without processing deterioration, but basically the softer the metal, the lower the quality of the machined surface and it is difficult to call it a mirror surface, but stainless steel We confirmed that it is possible to polish steel to a surface roughness of approximately 20 Å.
セラミツクスに関してはフエライトからAl2O3
まで多くの材料が加工可能であり、表面あらさも
50Å以下の鏡面が得られた。ただ、セラミツクス
の場合もビツカース硬度の低いものは高度の鏡面
が得られなかつた。 Regarding ceramics, ferrite to Al 2 O 3
Many materials can be processed, and the surface roughness can be
A mirror surface of less than 50 Å was obtained. However, even in the case of ceramics, it was not possible to obtain a highly mirrored surface with low Vickers hardness.
本加工法の特徴はMgO微粒子を研摩剤として
用いることであるが、他の研摩微粒子には、それ
ぞれ問題点がある。たとえば、Al2O3、SiO2、
Cr2O3等の硬質微粒子では、表面あらさを100Å
以下にすることは不可能であつたし、加工変質を
無くすこともできなかつた。Fe2O3、Fe3O4等の
軟質粒子の場合は加工変質を極めて少くすること
は可能であつたが、多結晶材料においては、粒界
の段差が発生し、完全な鏡面とすることができな
かつた。さらに軟質のCaCO3、ZnO等の微粒子の
場合には、加工作用は認められるものの、加工速
度が極めて遅く、工業的に用いることはできな
い。 A feature of this processing method is the use of MgO fine particles as an abrasive, but other abrasive particles have their own problems. For example, Al 2 O 3 , SiO 2 ,
For hard particles such as Cr 2 O 3 , the surface roughness is 100 Å.
It was impossible to do the following, and it was also impossible to eliminate processing deterioration. In the case of soft particles such as Fe 2 O 3 and Fe 3 O 4 , it was possible to minimize processing deterioration, but in polycrystalline materials, grain boundary steps occur and it is difficult to obtain a perfect mirror surface. I couldn't do it. Furthermore, in the case of soft particles such as CaCO 3 and ZnO, although a processing effect is recognized, the processing speed is extremely slow and cannot be used industrially.
すなわち、MgOのみが、既述の様に、多結
晶、単結晶を問わずに、無変質の鏡面生成が可能
であつた。本加工法において注意しなければなら
ない点の一つは、ラツプと工作物の直接接触を防
止することであり、既述の動圧流体軸受の膜が破
れると、加工面には大きな傷を生じ、ラツプも破
損する。本加工法では動圧流体軸受が安定である
限り、高度の無変質鏡面の生成が約束される。 That is, as mentioned above, only MgO was capable of producing an unaltered mirror surface, regardless of whether it is polycrystalline or single crystalline. One of the points to be careful about in this machining method is to prevent direct contact between the lap and the workpiece, and if the membrane of the hydrodynamic bearing mentioned above breaks, it will cause large scratches on the machined surface. , the lap will also be damaged. This processing method promises to produce a highly unaltered mirror surface as long as the hydrodynamic bearing is stable.
第4図で説明したMn−Zn単結晶フエライトで
ビデオヘツドを製作し、従来加工法によるヘツド
と、その特性を比較した結果、低周波域では両者
に差は認められなかつたが、高周波域では本加工
法の方が明らかに優れていた。すなわち、5MHz
(記録波長1μm相当)における出力は、本加工
法によるヘツドの方が2〜3dB高かつた。これ
は、本加工法によつて、無変質の鏡面が得られた
効果であるが、さらに、本加工法の加工面は極め
て清浄な面であり、従来加工法では種々の洗浄を
行つても除去できなかつた汚れによる不良が、本
加工法の場合には問題にならなかつた。 A video head was manufactured using the Mn-Zn single crystal ferrite explained in Figure 4, and its characteristics were compared with a head made using conventional processing methods. As a result, no difference was observed between the two in the low frequency range, but in the high frequency range. This processing method was clearly superior. i.e. 5MHz
The output at (corresponding to a recording wavelength of 1 μm) was 2 to 3 dB higher in the head produced by this processing method. This is due to the fact that this processing method provides an unaltered mirror surface, but furthermore, the processed surface of this processing method is an extremely clean surface, even when various cleaning methods are used with conventional processing methods. Defects due to dirt that could not be removed did not become a problem in the case of this processing method.
この様に、本発明は、磁気ヘツド用磁性材料の
加工に用いた場合に、特に有効であり、高性能の
磁気ヘツドを安定かつ容易に作ることを可能にす
るものである。 As described above, the present invention is particularly effective when used for processing magnetic materials for magnetic heads, and makes it possible to stably and easily manufacture high-performance magnetic heads.
第1図は従来加工法による磁気ヘツドのギヤツ
プ部の詳細を示す図、第2図は従来加工法による
加工変質層を示す図、第3図は本発明加工法に用
いる加工装置の一例を示す側断面図、第4図〜第
7図はそれぞれ本発明の加工法による加工面の例
を示す図である。
3……ラツプ、5……円筒外壁、6……研摩
液、7……工作物、8……試料ホルダ、9……回
転軸、10,11……歯車、13……回転駆動
軸。
Fig. 1 is a diagram showing the details of the gap part of the magnetic head by the conventional processing method, Fig. 2 is a diagram showing the processed damaged layer by the conventional processing method, and Fig. 3 is an example of the processing equipment used in the processing method of the present invention. The side sectional view and FIGS. 4 to 7 are views showing examples of processed surfaces by the processing method of the present invention, respectively. 3... Wrap, 5... Cylindrical outer wall, 6... Polishing liquid, 7... Workpiece, 8... Sample holder, 9... Rotating shaft, 10, 11... Gear, 13... Rotating drive shaft.
Claims (1)
工作物の加工面とラツプを相対運動させ、加工液
を作動流体として前記加工面とラツプの間に動圧
流体軸受状態を形成し、前記加工面とラツプを非
接触状態に保ちつつ、前記加工液中のMgO微粒
子を加工面に衝突させ、前記工作物の加工面を鏡
面に加工することを特徴とする研摩方法。1. In a processing liquid in which MgO fine particles are suspended in water,
The machining surface of the workpiece and the lap are caused to move relative to each other, and a dynamic pressure fluid bearing state is formed between the machining surface and the lap using machining fluid as a working fluid, and the machining is performed while maintaining the machining surface and the lap in a non-contact state. A polishing method characterized in that the machined surface of the workpiece is machined into a mirror surface by colliding MgO fine particles in a liquid with the machined surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11958578A JPS5544787A (en) | 1978-09-27 | 1978-09-27 | Grinding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11958578A JPS5544787A (en) | 1978-09-27 | 1978-09-27 | Grinding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5544787A JPS5544787A (en) | 1980-03-29 |
| JPS6113950B2 true JPS6113950B2 (en) | 1986-04-16 |
Family
ID=14764998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11958578A Granted JPS5544787A (en) | 1978-09-27 | 1978-09-27 | Grinding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5544787A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57197884A (en) * | 1981-05-29 | 1982-12-04 | Sony Corp | Composite substrate |
| JPS58186554A (en) * | 1982-04-20 | 1983-10-31 | Sumitomo Special Metals Co Ltd | Method of accurately polishing material composed of aluminum oxide and titanium carbide |
| JPS6171950A (en) * | 1984-09-14 | 1986-04-12 | Canon Inc | Ultrasonic vibration float polishing device |
| JPS62102455A (en) * | 1985-10-30 | 1987-05-12 | Sony Corp | Machining method for rotating drum |
-
1978
- 1978-09-27 JP JP11958578A patent/JPS5544787A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5544787A (en) | 1980-03-29 |
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