JPS6114166B2 - - Google Patents
Info
- Publication number
- JPS6114166B2 JPS6114166B2 JP4491476A JP4491476A JPS6114166B2 JP S6114166 B2 JPS6114166 B2 JP S6114166B2 JP 4491476 A JP4491476 A JP 4491476A JP 4491476 A JP4491476 A JP 4491476A JP S6114166 B2 JPS6114166 B2 JP S6114166B2
- Authority
- JP
- Japan
- Prior art keywords
- aromatic polyamide
- thermosetting resin
- composite material
- polyamide fiber
- fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000835 fiber Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000004760 aramid Substances 0.000 claims description 20
- 229920003235 aromatic polyamide Polymers 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000004814 polyurethane Substances 0.000 claims description 19
- 229920002635 polyurethane Polymers 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- -1 amine compound Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- LAZOILSKLKUUFR-UHFFFAOYSA-N 2,2,2-triphenylethyl carbamate Chemical compound C1(=CC=CC=C1)C(COC(N)=O)(C1=CC=CC=C1)C1=CC=CC=C1 LAZOILSKLKUUFR-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- YQKXNEWHNMPIKL-UHFFFAOYSA-N Dioxamine Natural products C1=C2OCOC2=CC(C=CC(NCCC=2C=C3OCOC3=CC=2)=O)=C1 YQKXNEWHNMPIKL-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
本発明は、芳香族ポリアミド繊維と熱硬化性樹
脂とを主成分とする複合材料に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite material whose main components are aromatic polyamide fibers and a thermosetting resin.
近年、構造材料として各種補強材を使用する複
合材料いわゆるFRPがプラスチツクの寵児とな
つている。最近は軽量及び弾性等の極めて高い芳
香族ポリアミド繊維を補強材として、種々の樹脂
をマトリツクスとする複合材料の製造が新たに注
目されてきた。 In recent years, FRP, a composite material that uses various reinforcing materials as a structural material, has become the darling of plastics. Recently, the production of composite materials using aromatic polyamide fibers, which are extremely lightweight and highly elastic, as reinforcing materials and various resins as matrices, has received new attention.
ところで、このような各種マトリツクスの複合
材料の製造において、その性能を決定する最大要
因は、補強材とマトリツクスの接着性特に層間せ
ん断強度を増大せしめることである。しかし芳香
族ポリアミド繊維自体は、一般にマトリツクスと
の接着性が低いという性質があり、このため複合
材料として十分なシエア強度を示さないものであ
つた。 By the way, in the production of such composite materials of various matrices, the biggest factor determining their performance is increasing the adhesion between the reinforcing material and the matrix, especially the interlaminar shear strength. However, aromatic polyamide fiber itself generally has a property of having low adhesion to a matrix, and therefore does not exhibit sufficient shear strength as a composite material.
本発明は、かかる欠点を解決すべく種々研究の
結果完成されたものであつて、その要旨とすると
ころは、芳香族ポリアミド繊維と熱硬化性樹脂と
の界面にポリウレタン化合物を存在せしめてなる
ことを特徴とする芳香族ポリアミド繊維と熱硬化
性樹脂とを主成分とする複合材料にある。 The present invention was completed as a result of various studies to solve these drawbacks, and its gist is that a polyurethane compound is present at the interface between an aromatic polyamide fiber and a thermosetting resin. A composite material whose main components are aromatic polyamide fiber and thermosetting resin.
本発明において芳香族ポリアミド繊維は、結合
単位の15モル%以上がアミド結合であるものをい
い、例えば、ポリp−フエニレンテレフタルアミ
ド、ポリp−アミノベンゼンズアミド等が用いら
れる。 In the present invention, the aromatic polyamide fiber is one in which 15 mol% or more of the bonding units are amide bonds, and examples thereof include poly p-phenylene terephthalamide, poly p-aminobenzenzamide, and the like.
また、熱硬化性樹脂は、一般に知られている如
き、エポキシ樹脂、フエノール樹脂、不飽和ポリ
エステル樹脂等が用いられる。 Further, as the thermosetting resin, commonly known epoxy resins, phenol resins, unsaturated polyester resins, etc. are used.
本発明において繊維と樹脂の接着に用いるポリ
ウレタン化合物とは、分子中にヒドロキシル基、
カルボシキル基、アミノ基、活性メチレン基等の
活性水素基を2個以上含有する物質、例えば、ポ
リエステル、ポリエーテルの如き通常ポリオール
といわれている化合物とポリイソシアネートとの
反応物をいう。 In the present invention, the polyurethane compound used for bonding fibers and resin has hydroxyl groups in the molecule,
It refers to a reaction product of a polyisocyanate and a substance containing two or more active hydrogen groups such as a carboxyl group, an amino group, or an active methylene group, such as a compound commonly called a polyol such as polyester or polyether.
ここでポリエステルとは、シユウ酸、コハク
酸、グルタル酸、アジピン酸、ピメリン酸、スベ
リン酸、アゼライン酸、セバシン酸、マレイン
酸、フマル酸、フタル酸、イソフタル酸等の酸若
しくはそれらの酸無水物物の1種又は2種以上と
エチレングリコール、ジエチレングリコール、ト
リエチレングリコール、プロピレングリコール、
ブチレングリコール、トリメチロールプロパン、
トリメチロールエタン、ヘキサントリオール、グ
リセリン、ソルビトール等のポリオール化合物と
のエステル化反応によつて得られるものをいう。 Here, polyester refers to acids such as oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, and isophthalic acid, or their acid anhydrides. one or more of these and ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol,
butylene glycol, trimethylolpropane,
It is obtained by esterification reaction with polyol compounds such as trimethylolethane, hexanetriol, glycerin, and sorbitol.
また、ポリエーテルとは、エチレンオキサイ
ド、プロピレンオキサイド、トリメチレンオキサ
イド、ブチレンオキサイド、α−メチルトリメチ
レンオキサイド、3,3′−ジメチルトリメチレン
オキサイド、テトラヒドロフラン、ジオキサン、
ジオキサミン等の環状エーテルを開環重合または
共重合することにより得られるものをいう。 Polyethers include ethylene oxide, propylene oxide, trimethylene oxide, butylene oxide, α-methyltrimethylene oxide, 3,3'-dimethyltrimethylene oxide, tetrahydrofuran, dioxane,
It is obtained by ring-opening polymerization or copolymerization of cyclic ethers such as dioxamine.
さらに、ポリイソシアネートとは、トリレンジ
イソシアネート、3,3′−ビトリレン4,4′−ジ
イソシアネート、ジフエニルメタン4,4′−ジイ
ソシアネート、3,3′−ジメチルジフエニルメタ
ン4,4′−ジイソシアネート、2,4−トリレン
ジイソシアネートダイマー、1,5−ナフチレン
ジイソシアネート、メタフエニレンジイソシアネ
ート、トリフエニルメタン4,4″トリイソシアネ
ート、ヘキサメチレンジイソシアネート、ヘキサ
ントリオールまたはトリメロールプロパンと2,
4−トリレンジイソシアネートとの反応物である
トリフエニルウレタン等をいう。 Furthermore, polyisocyanate includes tolylene diisocyanate, 3,3'-bitrylene 4,4'-diisocyanate, diphenylmethane 4,4'-diisocyanate, 3,3'-dimethyldiphenylmethane 4,4'-diisocyanate, 2, 4-tolylene diisocyanate dimer, 1,5-naphthylene diisocyanate, metaphenylene diisocyanate, triphenylmethane 4,4″ triisocyanate, hexamethylene diisocyanate, hexanetriol or trimerolpropane and 2,
Refers to triphenyl urethane, etc., which is a reaction product with 4-tolylene diisocyanate.
本発明によつて芳香族ポリアミド繊維と熱硬化
性樹脂との界面にポリウレタン化合物を存在させ
るためには(1)芳香族ポリアミド繊維若しくはそれ
らよりなる編織物、コードをポリウレタン化合物
の水分散液、有機溶媒溶液で処理し、通常100〜
350℃程度で、30秒〜30分間乾燥した後熱硬化性
樹脂に含浸させる方法を用いてもよく、また(2)ポ
リウレタン化合物を熱硬化性樹脂に混和した後、
該混和物に芳香族ポリアミド繊維を含浸させる方
法を用いてもよいが、前者(1)の方法が接着性の面
で優れているので好ましい。 In order to make the polyurethane compound exist at the interface between the aromatic polyamide fiber and the thermosetting resin according to the present invention, (1) aromatic polyamide fibers or knitted fabrics and cords made of the aromatic polyamide fibers are mixed with an aqueous dispersion of a polyurethane compound, an organic Treated with solvent solution, usually 100~
You may also use a method of drying at about 350°C for 30 seconds to 30 minutes and then impregnating it into the thermosetting resin. (2) After mixing the polyurethane compound with the thermosetting resin,
Although a method of impregnating the mixture with aromatic polyamide fibers may be used, the former method (1) is preferred because it is excellent in terms of adhesiveness.
なお本発明においては、繊維をポリエステル又
はポリエーテルとポリイソシアネートの混合物で
処理し、繊維上で両者を反応させてポリウレタン
化合物をを形成せしめもよい。 In the present invention, the fibers may be treated with a mixture of polyester or polyether and polyisocyanate, and the two may be reacted on the fibers to form a polyurethane compound.
またポリウレタン化合物の使用に際し、ポリウ
レタン化合物の末端基の種類に応じて即ち末端基
が−NCO基であるポリウレタン化合物には、ア
ミン化合物例えばメチレンビス2−クロロアニリ
ン等を、末端基が−OH基であるポリウレタン化
合物にはイソシアネート化合物を併用した方が接
着が優れているので好ましい。 In addition, when using a polyurethane compound, depending on the type of the terminal group of the polyurethane compound, that is, for a polyurethane compound whose terminal group is a -NCO group, an amine compound such as methylene bis 2-chloroaniline etc. may be used. It is preferable to use an isocyanate compound in combination with the polyurethane compound because it provides excellent adhesion.
本発明において芳香族ポリアミド繊維と熱硬化
性樹脂(マトリツクス成分)の割合は、成形しよ
うとする構造体の用途・目的によつて種々変化す
るが、通常その範囲は、構造体に対して芳香族ポ
リアミド繊維が10〜90重量%、熱硬化性樹脂が90
〜10重量%である。 In the present invention, the ratio of aromatic polyamide fibers and thermosetting resin (matrix component) varies depending on the use and purpose of the structure to be molded, but usually the range is 10-90% by weight polyamide fiber, 90% thermosetting resin
~10% by weight.
上記組成のほかに、芳香族ポリアミド繊維と熱
硬化性樹脂との界面に前記ポリウレタン化合物を
付着せしめるのであるが、その付着量は該繊維重
量に対して0.1〜5%、好ましくは0.3〜3%であ
る。 In addition to the above composition, the polyurethane compound is attached to the interface between the aromatic polyamide fiber and the thermosetting resin, and the amount of the attached polyurethane compound is 0.1 to 5%, preferably 0.3 to 3%, based on the weight of the fiber. It is.
また、構造体の用途・目的に応じて若干の増量
剤、顔料、耐候性または耐熱性用安定剤等の添加
剤を上記マトリツクス成分中に添加混用すること
もできる。この添加剤の量は構造体の重量に対し
て通常20%以下とするのが適当である。 Further, depending on the use and purpose of the structure, some additives such as fillers, pigments, stabilizers for weather resistance or heat resistance, etc. may be added to the matrix component. Suitably, the amount of this additive is usually 20% or less based on the weight of the structure.
樹脂に含浸させて接着した後は、常法により加
熱、加圧し樹脂を硬化すれば、芳香族ポリアミド
繊維で補強された熱硬化性樹脂が得られるもので
ある。 After being impregnated with resin and bonded, if the resin is cured by heating and pressurizing in a conventional manner, a thermosetting resin reinforced with aromatic polyamide fibers can be obtained.
熱硬化性樹脂の硬化剤としては、従来公知のも
のでよく例えばエポキシ樹脂には三フツ化ホウ素
モノエチルアミン錯塩等、不飽和ポリエステル樹
脂には過酸化ベンゾイル等を用いればよい。 As the curing agent for the thermosetting resin, conventionally known ones may be used, such as boron trifluoride monoethylamine complex salt for epoxy resins, benzoyl peroxide, etc. for unsaturated polyester resins.
本発明方法により製造された上記複合構造体
は、種々の用途・目的に適用される。例えば高い
強度及び弾性を必要とするようなスポーツ用具、
レジヤー用具、各種器具、部品等を始め、軽くて
強度、弾性及び耐熱性に秀れた特性を要求する宇
宙航空用品、自動車、その他の機器等に用いて効
果がある。 The composite structure manufactured by the method of the present invention can be applied to various uses and purposes. For example, sports equipment that requires high strength and elasticity,
It is effective for use in leisure equipment, various instruments, parts, etc., as well as aerospace products, automobiles, and other equipment that require lightness and excellent properties of strength, elasticity, and heat resistance.
以下本発明を実施例により詳述する。 The present invention will be explained in detail below with reference to Examples.
実施例 1
高弾性タイプのポリp−フエニレンテレフタル
アミドフイラメント1500dを、商品名デスモコー
ル400(両末端ヒドロキシル基ポリウレタン、バ
イエル社製)のメチルエチルケトン溶液、デスモ
コール400と商品名タケネートD−102(トリレン
ジイソシアネートとトリメチロールプロパンとの
反応物、武田薬品社製)をOH当量/NCO当量が
1/1.3の当量比で配合したメチルエチルケトン溶
液に各々浸漬処理し、250℃で1分間乾燥した。
付着量は1%であつた。かく処理された繊維を商
品名ポリマール308(不飽和ポリエーテル樹脂、
武田薬品社製)100部、商品名ナイパーBO(過酸
化ベンゾイルをDOPでペースト状にしたもの、
日本油脂製)2部よりなる樹脂液に含浸させ適当
な枚数積層し、繊維を一方向に揃えた状態で熱プ
レスにより130℃で1時間成形硬化(プレス圧10
Kg/cm2)し、さらに130℃で1時間ポストキユア
した。Example 1 A highly elastic type poly p-phenylene terephthalamide filament 1500d was mixed with a methyl ethyl ketone solution of Desmocol 400 (trade name, polyurethane with hydroxyl groups at both ends, manufactured by Bayer), Desmocol 400 and Takenate D-102 (trade name). A reaction product of diisocyanate and trimethylolpropane (manufactured by Takeda Pharmaceutical Co., Ltd.) with OH equivalent/NCO equivalent
Each sample was immersed in a methyl ethyl ketone solution mixed at an equivalent ratio of 1/1.3, and dried at 250°C for 1 minute.
The adhesion amount was 1%. The treated fibers are manufactured under the trade name Polymer 308 (unsaturated polyether resin,
(manufactured by Takeda Pharmaceutical Co., Ltd.) 100 copies, product name Niper BO (benzoyl peroxide made into a paste with DOP,
They were impregnated with a resin liquid consisting of 2 parts (NOF) and laminated in an appropriate number of layers, and with the fibers aligned in one direction, they were molded and cured for 1 hour at 130℃ using a heat press (press pressure 10
Kg/cm 2 ) and further post-cured at 130°C for 1 hour.
得られた複合材料(繊維含有率60%)より長さ
20mm、巾6mm、厚み3mmのテストピースを作成
し、シヨートビーム三点曲げ法(スパン間距離13
mm、クロスヘツドスピード1mm/分)により層間
せん断強度(ILSS)を測定したところ、前記デ
スモコール400のみのものは5.1Kl/mm2、デスモコ
ール400とタケネートD−102併用のものは5.5
Kg/mm2であつた。ポリウレタン化合物を用いず作
成した複合材料のILSSは3.0Kg/mm2であつた。 The length of the resulting composite material (60% fiber content)
A test piece of 20 mm, width 6 mm, and thickness 3 mm was made, and the short beam three-point bending method (distance between spans 13
When the interlaminar shear strength (ILSS) was measured using Desmocol 400 alone (1mm/min, crosshead speed 1mm/min), it was 5.1 Kl/mm 2 and 5.5 for the Desmocol 400 and Takenate D-102 combination.
It was Kg/ mm2 . The ILSS of the composite material prepared without using a polyurethane compound was 3.0 Kg/mm 2 .
実施例 2
実施例1においてデスモコール400とタケネー
トD−102併用のもので処理した繊維をエピコー
ト828(エポキシ樹脂、シエル化学製)100部、
三フツ化ホウ素モノエチルアミン錯塩5部よりな
る樹脂液に含浸させて、適当な枚数積層し、繊維
を一方向に揃えた状態で熱プレスにより150℃で
1時間成形硬化(プレス圧10Kg/cm2)し、さらに
170℃で2時間ポストキユアした。Example 2 The fibers treated with a combination of Desmocol 400 and Takenate D-102 in Example 1 were treated with 100 parts of Epikote 828 (epoxy resin, manufactured by Ciel Chemical),
Impregnated with a resin solution consisting of 5 parts of boron trifluoride monoethylamine complex salt, an appropriate number of sheets are laminated, and with the fibers aligned in one direction, molding and curing are performed at 150℃ for 1 hour using a hot press (press pressure 10Kg/cm 2 ) and further
Post-cure was performed at 170°C for 2 hours.
得られた複合材料(繊維含有率60%)のILSS
を実施例1と同様に測定したところ6.6Kg/mm2で
あつた。ポリウレタン化合物を用いずに作成した
複合材料のILSSは4.8Kg/mm2であつた。 ILSS of the obtained composite material (60% fiber content)
When measured in the same manner as in Example 1, it was 6.6 Kg/mm 2 . The ILSS of the composite material prepared without using a polyurethane compound was 4.8 Kg/ mm2 .
実施例 3
実施例1で用いた芳香族ポリアミド繊維をL−
1007(両末端イソシアネート基、ポリウレタンエ
ラストマー用プレポリマー、武田薬品社製)のメ
チルエチルケトン溶液、L−1007と商品名キユア
ミンM(4,4′−メチレンビス−(2−クロロア
ニリン)、イハラ農薬製)をNH2当量/NCO当量
が0.9で配合したメチルエチルケトン溶液に各々
浸漬処理し、250℃で1分間乾燥した。付着量は
1%であつた。かく処理された繊維を実施例1と
同様にして不飽和ポリエステル樹脂とからなる複
合材料(繊維含有率60%)を作成し、ILSSを測
定したところ、L−1007のみのものは4.5Kg/
mm2、L−1007とキユアミンM併用のものは5.3
Kg/mm2であつた。Example 3 The aromatic polyamide fiber used in Example 1 was
A methyl ethyl ketone solution of 1007 (isocyanate group at both ends, prepolymer for polyurethane elastomer, manufactured by Takeda Pharmaceutical Co., Ltd.), L-1007 and the trade name Kyuamine M (4,4'-methylenebis-(2-chloroaniline), manufactured by Ihara Nogyaku) were added. Each sample was immersed in a methyl ethyl ketone solution containing a ratio of NH 2 equivalent/NCO equivalent of 0.9, and dried at 250° C. for 1 minute. The adhesion amount was 1%. A composite material (fiber content: 60%) consisting of the thus treated fibers and unsaturated polyester resin was prepared in the same manner as in Example 1, and the ILSS was measured, and it was found that the ILSS of only L-1007 was 4.5 kg/
mm 2 , 5.3 for the combination of L-1007 and Kyuamine M
It was Kg/ mm2 .
実施例 4
実施例3においてL−1007とキユアミンM併用
のもので処理した繊維を商品名スミライトレジン
PR−5091(フエノール樹脂、住友化学製)に含
浸させて、適当な枚数積層し、繊維を一方向に揃
えた状態で熱プレスにより150℃で1時間成形硬
化(プレス圧10Kg/cm2)し、さらに170℃で2時
間ポストキユアした。得られた複合材料(繊維含
有率60%)のLISSは6.1Kg/mm2であつた。ポリウ
レタン化合物を用いず作成した複合材料のILSS
は4.5Kg/mm2であつた。Example 4 The fibers treated with a combination of L-1007 and Kyuamine M in Example 3 were treated with the product name Sumilight Resin.
Impregnated with PR-5091 (phenolic resin, manufactured by Sumitomo Chemical), an appropriate number of sheets were laminated, and with the fibers aligned in one direction, the fibers were molded and cured at 150℃ for 1 hour (press pressure 10Kg/cm 2 ). , and further post-cured at 170°C for 2 hours. The LISS of the obtained composite material (60% fiber content) was 6.1 Kg/mm 2 . ILSS of composite materials created without using polyurethane compounds
was 4.5Kg/ mm2 .
以上の各実施例から明らかなように本発明方法
により製造した芳香族ポリアミド繊維補強樹脂
は、繊維と樹脂の接着に優れ、芳香族ポリアミド
繊維の優れた特性が十分反映されたものである。 As is clear from the above examples, the aromatic polyamide fiber-reinforced resin produced by the method of the present invention has excellent adhesion between fibers and resin, and the excellent properties of aromatic polyamide fiber are fully reflected.
Claims (1)
面にポリウレタン化合物を存在させ、加熱硬化さ
せてなることを特徴とする芳香族ポリアミド繊維
と熱硬化性樹脂とを主成分とする複合材料。 2 末端基がイソシアネートであるポリウレタン
化合物とアミン化合物を併用して存在させる特許
請求の範囲第1項記載の芳香族ポリアミド繊維と
熱硬化性樹脂とを主成分とする複合材料。 3 末端基がヒドロキシルであるポリウレタン化
合物とイソシアネート化合物を併用して存在させ
る特許請求の範囲第1項記載の芳香族ポリアミド
繊維と熱硬化性樹脂とを主成分とする複合材料。[Scope of Claims] 1 A polyurethane compound is present at the interface between the aromatic polyamide fiber and the thermosetting resin, and the aromatic polyamide fiber and the thermosetting resin are cured by heating. composite material. 2. A composite material comprising an aromatic polyamide fiber and a thermosetting resin as main components according to claim 1, in which a polyurethane compound whose terminal group is an isocyanate and an amine compound are present in combination. 3. A composite material mainly composed of aromatic polyamide fiber and thermosetting resin according to claim 1, in which a polyurethane compound whose terminal group is hydroxyl and an isocyanate compound are present in combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4491476A JPS52128982A (en) | 1976-04-22 | 1976-04-22 | Composite materials consisting mainly of aromatic polyamide fibers and thermosetting resins and their |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4491476A JPS52128982A (en) | 1976-04-22 | 1976-04-22 | Composite materials consisting mainly of aromatic polyamide fibers and thermosetting resins and their |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52128982A JPS52128982A (en) | 1977-10-28 |
| JPS6114166B2 true JPS6114166B2 (en) | 1986-04-17 |
Family
ID=12704716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4491476A Granted JPS52128982A (en) | 1976-04-22 | 1976-04-22 | Composite materials consisting mainly of aromatic polyamide fibers and thermosetting resins and their |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52128982A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334283A (en) * | 1986-05-01 | 1988-02-13 | モト−リタ リミテイド | Steering handle for car |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6052937B2 (en) * | 1980-02-26 | 1985-11-22 | 住友ベークライト株式会社 | Manufacturing method for copper clad laminates |
-
1976
- 1976-04-22 JP JP4491476A patent/JPS52128982A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334283A (en) * | 1986-05-01 | 1988-02-13 | モト−リタ リミテイド | Steering handle for car |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52128982A (en) | 1977-10-28 |
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