JPS61146972U - - Google Patents
Info
- Publication number
- JPS61146972U JPS61146972U JP1985030454U JP3045485U JPS61146972U JP S61146972 U JPS61146972 U JP S61146972U JP 1985030454 U JP1985030454 U JP 1985030454U JP 3045485 U JP3045485 U JP 3045485U JP S61146972 U JPS61146972 U JP S61146972U
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- lead pins
- wiring board
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図はリードピン付き可撓性印刷配線板端子
部の横断面図で、1は絶縁フイルム、2は接着剤
、3は銅回路、4は接着剤、5はオーバーレイ層
、6は接着剤、7は補強板、8は導体端子、9は
半田、10はリードピンを示す。
第2図はリール状リードピンの一例で、11は
挿入ピン、12はピンフレームを示す。
第3図は本考案の実施状態図で、21はコネク
ター、22はリードピン付き端子、23は可撓性
印刷配線板、24はリードピン、25は硬質印刷
配線板を示す。
又第4図a,b,cは従来技術による接続部を
示す図で、31は絶縁フイルム、32は接着剤、
33は銅回路、34は接着剤、35はオーバーレ
イ層、36は差し込みピン、37は半田、38は
端子部、39は半田、40は銅回路、41は接着
剤を示す。
FIG. 1 is a cross-sectional view of the terminal section of a flexible printed wiring board with lead pins, in which 1 is an insulating film, 2 is an adhesive, 3 is a copper circuit, 4 is an adhesive, 5 is an overlay layer, 6 is an adhesive, 7 is a reinforcing plate, 8 is a conductor terminal, 9 is solder, and 10 is a lead pin. FIG. 2 shows an example of a reel-shaped lead pin, with reference numeral 11 indicating an insertion pin and 12 indicating a pin frame. FIG. 3 is a diagram showing the implementation state of the present invention, in which 21 is a connector, 22 is a terminal with lead pins, 23 is a flexible printed wiring board, 24 is a lead pin, and 25 is a rigid printed wiring board. Further, FIGS. 4a, b, and c are diagrams showing connection parts according to the prior art, in which 31 is an insulating film, 32 is an adhesive,
33 is a copper circuit, 34 is an adhesive, 35 is an overlay layer, 36 is an insertion pin, 37 is solder, 38 is a terminal portion, 39 is solder, 40 is a copper circuit, and 41 is an adhesive.
Claims (1)
該端子部と補強板とを貫通するリードピンで、嵌
合し、該リードピンを導電性材料で導体端子に固
着せしめたことを特徴とするリードピン付き可撓
性印刷配線板。 Attach a reinforcing plate to the terminal part of the flexible printed wiring board,
A flexible printed wiring board with lead pins, characterized in that the terminal portion and the reinforcing plate are fitted with lead pins that pass through the reinforcing plate, and the lead pins are fixed to the conductor terminals using a conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030454U JPS61146972U (en) | 1985-03-04 | 1985-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030454U JPS61146972U (en) | 1985-03-04 | 1985-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146972U true JPS61146972U (en) | 1986-09-10 |
Family
ID=30530166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985030454U Pending JPS61146972U (en) | 1985-03-04 | 1985-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146972U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022138239A (en) * | 2021-03-10 | 2022-09-26 | 日本メクトロン株式会社 | Flexible printed wiring board with crimp terminals and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822755B1 (en) * | 1968-03-12 | 1973-07-09 | ||
| JPS5939885B2 (en) * | 1979-08-27 | 1984-09-27 | 松下電器産業株式会社 | Method for manufacturing abnormal voltage absorbing element |
-
1985
- 1985-03-04 JP JP1985030454U patent/JPS61146972U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822755B1 (en) * | 1968-03-12 | 1973-07-09 | ||
| JPS5939885B2 (en) * | 1979-08-27 | 1984-09-27 | 松下電器産業株式会社 | Method for manufacturing abnormal voltage absorbing element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022138239A (en) * | 2021-03-10 | 2022-09-26 | 日本メクトロン株式会社 | Flexible printed wiring board with crimp terminals and manufacturing method thereof |
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