JPS6115824B2 - - Google Patents
Info
- Publication number
- JPS6115824B2 JPS6115824B2 JP5601981A JP5601981A JPS6115824B2 JP S6115824 B2 JPS6115824 B2 JP S6115824B2 JP 5601981 A JP5601981 A JP 5601981A JP 5601981 A JP5601981 A JP 5601981A JP S6115824 B2 JPS6115824 B2 JP S6115824B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- sheet
- polyamide film
- polyamide
- adhesive strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
本発明は金属箔とポリアミドフイルム又はシー
トの接着方法に関するものである。更に詳しくは
金属箔とポリアミドフイルム又はシートを接着す
るにおいて該金属箔にアミノ基含有アルキルトリ
アルコキシシランを塗布乾燥した後、ポリアミド
フイルム又はシートを熱接着せしめることを特徴
とする金属箔とポリアミドフイルム又はシートの
接着方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of bonding metal foil and polyamide film or sheet. More specifically, in bonding the metal foil and the polyamide film or sheet, an amino group-containing alkyltrialkoxysilane is coated on the metal foil and dried, and then the polyamide film or sheet is thermally bonded. This invention relates to a method for adhering sheets.
従来から金属箔とポリアミドフイルム又はシー
トを熱接着(プレスで圧着)又は押出ラミネート
方法によつて積層して電熱毛布、電子カーペツト
包装材などの用途に使用することが数多く提案さ
れている。しかし、この方法による積層物は接着
強度が十分でなく、外部から折り曲げ、圧縮、引
張り等の応力又は繰り返し応力が働くと接着力が
極端に低下し、長期間にわたる使用が困難であ
る。又、この方法による積層物はポリアミドフイ
ルム又はシートの吸水性が強いことから吸湿を助
長する雰囲気中においては上記外部応力に伴う接
着力の低下を促進すると共に、自然剥離を生ずる
場合がある。この為場合によつては熱接着と同時
に吸水防止のマスキング加工を施す必要がある。 Conventionally, there have been many proposals for laminating metal foil and polyamide film or sheet by thermal adhesion (press bonding) or extrusion lamination for use in electric heating blankets, electronic carpet packaging materials, and the like. However, the laminate produced by this method does not have sufficient adhesive strength, and when stress such as bending, compression, tension, etc. or repeated stress is applied from the outside, the adhesive strength is extremely reduced, making it difficult to use for a long period of time. In addition, since the polyamide film or sheet in the laminate produced by this method has strong water absorption, in an atmosphere that promotes moisture absorption, the adhesive strength may be reduced due to the external stress, and spontaneous peeling may occur. For this reason, in some cases, it may be necessary to perform a masking process to prevent water absorption at the same time as thermal bonding.
本発明者らは、上記問題点、特に金属箔とポリ
アミドフイルム又はシート間の接着力の永続的か
つ恒久的な向上のために鋭意検討を行なつた結果
おどろくべきことに、プライマー、シランカツプ
リング剤が種々ある中、アミノ基含有アルキルト
リアルコキシシランが特にすぐれた接着力を付与
することを見い出し、本発明に到達した。 The inventors of the present invention have conducted intensive studies to address the above problems, particularly in order to permanently and permanently improve the adhesive strength between metal foil and polyamide film or sheet, and surprisingly, they have found that primer, silane coupling, etc. Although there are various agents, it has been discovered that amino group-containing alkyltrialkoxysilanes provide particularly excellent adhesive strength, and the present invention has been achieved.
即ち、金属箔とポリアミドフイルム又はシート
を接着するに際し該金属箔にアミノ基含有アルキ
ルトリアルコキシシランを塗布乾燥した後、ポリ
アミドフイルム又はシートを熱接着せしめ、経済
的、効率的に金属箔とポリアミドフイルム又はシ
ートの接着力を永続的かつ恒久的に向上させ得る
方法に到達したものである。さらに金属箔とポリ
アミドフイルム又はシートの接着に先立ち、まえ
もつてアミノ基含有アルコキシシランを塗布乾燥
した該金属箔を100℃〜280℃に加熱処理し、アミ
ノ基含有アルキルトリアルコキシシランを該金属
箔上で予備架橋することにより接着力を高め、安
定化させることが好ましい。 That is, when bonding a metal foil and a polyamide film or sheet, an amino group-containing alkyltrialkoxysilane is applied to the metal foil and dried, and then the polyamide film or sheet is thermally bonded, thereby economically and efficiently bonding the metal foil and the polyamide film. Alternatively, a method has been achieved that can permanently and permanently improve the adhesive strength of the sheet. Furthermore, prior to adhering the metal foil and the polyamide film or sheet, the metal foil, which has been coated with an amino group-containing alkoxysilane and dried, is heat-treated at 100°C to 280°C, and the amino group-containing alkyltrialkoxysilane is applied to the metal foil. Preferably, the adhesion is increased and stabilized by pre-crosslinking on top.
さらに、金属箔とポリアミドフイルム又はシー
トの接着した積層シートを(該ポリアミドの融点
−70℃)−(該ポリアミドの融点+100℃)の範囲
内で加熱処理し、架橋反応、接着反応の未反応部
分を出来る限り反応を完結させることにより、一
層接着力を安定化することが出来る。 Furthermore, the laminated sheet in which the metal foil and the polyamide film or sheet are adhered is heat-treated within the range of (melting point of the polyamide -70°C) - (melting point of the polyamide +100°C), and the unreacted portions of the crosslinking reaction and adhesion reaction are By completing the reaction as much as possible, the adhesive force can be further stabilized.
本発明に於いて使用される金属箔は、例えばア
ルミニウム、銅、錫、金、銀、クローム、タング
ステン等の薄い展延性の優れた金属の薄膜であれ
ば何でも良く、ポリアミドはナイロン6、ナイロ
ン66、ナイロン610、ナイロン11、ナイロン12又
は、これらの共重合体等であり、該ポリアミドに
安定剤、その他改質剤等が添加されることをこば
むものではない。 The metal foil used in the present invention may be any thin film of a metal with excellent malleability, such as aluminum, copper, tin, gold, silver, chrome, tungsten, etc. The polyamide may be nylon 6, nylon 66, etc. , nylon 610, nylon 11, nylon 12, or copolymers thereof, and it is not a problem to add stabilizers or other modifiers to the polyamide.
金属箔とポリアミドフイルム又はシートを熱接
着する方法としては押出しラミネート接着方法や
熱プレス方法などがある。 Methods for thermally bonding a metal foil and a polyamide film or sheet include an extrusion lamination bonding method and a hot press method.
押出ラミネートは通常一般に行なわれる方法で
良いが、好ましくは金属箔に接触する加圧ロール
の表面を断熱処理する方が良い。 Extrusion lamination may be carried out by any commonly used method, but it is preferable to heat-insulate the surface of the pressure roll that comes into contact with the metal foil.
アミノ基含有アルキルトリアルコキシシランを
塗布した金属箔及びポリアミドをラミネートした
積層物の加熱処理はオープン又はトンネル炉、赤
外線ランプ等通常一般に行なわれる方法を用いる
ことが可能である。 For the heat treatment of the laminate of the metal foil coated with the amino group-containing alkyltrialkoxysilane and the polyamide, a commonly used method such as an open or tunnel furnace or an infrared lamp can be used.
本発明で言うアミノ基含有アルキルトリアルコ
キシシランは、例えばN−β(アミノエチル)γ
アミノプロピルトリメトキシシラン等を用いる
ことが出来るが、本発明はこれに限定されるもの
ではない。 The amino group-containing alkyltrialkoxysilane referred to in the present invention is, for example, N-β (aminoethyl)γ
Aminopropyltrimethoxysilane or the like can be used, but the present invention is not limited thereto.
次に実施例を挙げて説明する。 Next, an example will be given and explained.
実施例 1
アルミニウム薄膜(厚み20μ)に0.5%
H2NC2H4NHC3H6Si(OCH3)3メタノール溶液
(信越シリコン(株)製、KBM603)をドクターブレ
ードで塗布、150℃で5分間乾燥した後、ナイロ
ン12シート(厚み200μ)に両面から貼合せ、5
Kg/cm2、200℃で1分間プレスした。Example 1 0.5% on aluminum thin film (thickness 20μ)
H 2 NC 2 H 4 NHC 3 H 6 Si (OCH 3 ) 3 methanol solution (manufactured by Shin-Etsu Silicon Co., Ltd., KBM603) was applied with a doctor blade, dried at 150°C for 5 minutes, and then coated on a nylon 12 sheet (thickness 200μ). Paste from both sides, 5
Kg/cm 2 and pressed for 1 minute at 200°C.
さらに、250℃で5分間二次加熱処理をした。
接着強度を測定した結果は101Kg/cmであつた。 Further, a secondary heat treatment was performed at 250°C for 5 minutes.
The adhesive strength was measured and found to be 101 kg/cm.
比較例 1
同様の方法で、γ−グリシジオキシプロピルト
リメトキシシラン(信越シリコン(株)製KBM403)
を用いたときの接着強度は0.6Kg/cmであつた。Comparative Example 1 Using the same method, γ-glycidioxypropyltrimethoxysilane (KBM403 manufactured by Shin-Etsu Silicon Co., Ltd.)
The adhesive strength when using was 0.6 kg/cm.
又、イソプロピルイソステアロイルジ−4−ア
ミノベンゾイルチタネートを用いたときの接着強
度は0.3Kg/cmであつた。 Further, the adhesive strength when using isopropyl isostearoyl di-4-aminobenzoyl titanate was 0.3 kg/cm.
Claims (1)
着するに際し、該金属箔にアミノ基含有アルキル
トリアルコキシシランを塗布乾燥した後、ポリア
ミドフイルム又はシートを熱接着せしめることを
特徴とするポリアミドフイルム又はシートと金属
箔の接着方法。1. A polyamide film or sheet and a metal foil characterized in that when adhering the metal foil and the polyamide film or sheet, an amino group-containing alkyltrialkoxysilane is applied to the metal foil and dried, and then the polyamide film or sheet is thermally bonded. Adhesion method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5601981A JPS57169348A (en) | 1981-04-13 | 1981-04-13 | Method of bonding polyamide film or sheet and metallic foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5601981A JPS57169348A (en) | 1981-04-13 | 1981-04-13 | Method of bonding polyamide film or sheet and metallic foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57169348A JPS57169348A (en) | 1982-10-19 |
| JPS6115824B2 true JPS6115824B2 (en) | 1986-04-25 |
Family
ID=13015346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5601981A Granted JPS57169348A (en) | 1981-04-13 | 1981-04-13 | Method of bonding polyamide film or sheet and metallic foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57169348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349815U (en) * | 1986-09-17 | 1988-04-04 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5647939A (en) * | 1994-12-05 | 1997-07-15 | Integrated Liner Technologies, Inc. | Method of bonding a cured elastomer to plastic and metal surfaces |
-
1981
- 1981-04-13 JP JP5601981A patent/JPS57169348A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349815U (en) * | 1986-09-17 | 1988-04-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57169348A (en) | 1982-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004503631A5 (en) | ||
| JPS6115824B2 (en) | ||
| US5998020A (en) | Composite film and lead frame with composite film attached | |
| JPS6052941B2 (en) | Method for manufacturing curl-free composite material consisting of polyimide and metal foil | |
| JP2890747B2 (en) | Flexible printed circuit board and method of manufacturing the same | |
| JPWO2001029136A1 (en) | Novel polyimide copolymer and metal laminate using the same | |
| TW466721B (en) | Cap attach surface modification for improved adhesion | |
| JPH10209583A (en) | Flexible metal foil polyimide laminate | |
| JPS6399282A (en) | Bonding of polyimide formed article | |
| JP2989132B2 (en) | Manufacturing method of polyamide laminated aluminum plate | |
| JPS6121983A (en) | Non-oxide ceramic-metal composite material | |
| JPH0412897B2 (en) | ||
| JP2623598B2 (en) | Manufacturing method of aluminum electrolytic capacitor | |
| JPH0134255B2 (en) | ||
| JP4203131B2 (en) | Method for producing soft copper foil with good wettability | |
| JPS6226887Y2 (en) | ||
| JPS62220527A (en) | Production of laminate of metallic foil and polyfilm by bonding | |
| JPH0315537B2 (en) | ||
| TW200605420A (en) | Flexible metal foil-polyimide laminate and its manufacturing method | |
| JPH04215494A (en) | Laminated board for metal base printed circuit | |
| JPS5831745A (en) | Laminated steel plate for reflection plate and its manufacture | |
| JP2715076B2 (en) | Planar heating element | |
| JPH05190581A (en) | Semiconductor component manufacturing method | |
| JPS6259874B2 (en) | ||
| JPH11214604A (en) | Lead frame with heat sink and semiconductor device using the same |