JPS6117139B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a semiconductor device manufacturing apparatus using a lead tape having a plurality of continuous integrated lead groups.

Conventional semiconductor device manufacturing equipment that uses lead tape has a tape guide that has a fixed angle in the tape feeding and feeding directions with the origin at the center of the bonding position and has a curved shape at the bonding position. .

In this equipment, the positioning of the joint between the lead tape and the pellet during bonding is achieved by installing a device that images the pellet and the lead tape, and the operator monitors the video signal to ensure that the position of the lead tape is aligned with the joint on the pellet. This is done by moving the tape position to match. but,
In this case, since the lead tape has a curved surface due to the tape guide, alignment using images causes positional deviation during bonding. This positional deviation has the disadvantage of causing poor bonding between the lead tape and the semiconductor device and incorrect wiring. In addition, since the feed elevation angle of the lead tape is arbitrary and equal, when a pellet that has completed bonding moves one unit of the lead frame together with the lead tape, it contacts a pellet adjacent to the lead frame in the direction of movement, and the pellet that the pellet contacts touches the surface. The wiring layer was damaged, resulting in defects.

The present invention eliminates the above-described conventional drawbacks and provides a semiconductor device manufacturing apparatus that enables accurate and stable bonding.

The present invention provides a mechanical unit for feeding out a lead tape having a plurality of continuous integrated lead groups, a stage for placing a semiconductor device element, and a mechanism unit for sending out a lead tape having a plurality of continuous integrated lead groups, a stage for placing a semiconductor device element on the stage, and a mechanism unit for sending out a lead tape having a plurality of consecutive integrated lead groups. It is characterized by having a tape guide that remains parallel at least until the end of bonding and has an elevation angle whose origin is the end of the unit lead frame in the tape feeding direction of the unit lead frame located at the bonding position. It is characterized by having a tape guide having an elevation angle whose origin is the end of the frame in the tape feeding direction.

The present invention will be explained below using the drawings. FIG. 1 is a perspective view of a conventional semiconductor device manufacturing apparatus. In the figure, 1 is a lead tape, 2 is a semiconductor device, 3 is a tape guide, 4 is a stage, and 5
indicates an imaging device, and 6 indicates a bonding tool. FIG. 2 shows the shape of a conventional tape guide. 3 and 4 are perspective views of an embodiment of the present invention. In the figure, 7 is a bonding tool, 8 is a tape guide, and 9 is a semiconductor device mounted on a stage. The hole provided in the tape guide is for the passage of the bonding tool, ie, this position becomes the bonding position. Further, the tape guide is provided with a groove along the tape's width in the direction of travel for stably advancing the tape. In FIG. 3, since the lead tape is maintained parallel to the bonding position, there is no misalignment between the positioning at the bonding position on the monitor using the imaging device from above and the position at the time of bonding. In addition, since it has an elevation angle past the bonding position, the bonded semiconductor device and the semiconductor device on the stage do not come into contact with each other. The elevation angle θ of the tape guide with respect to the stage at this time is θ, where t is the thickness of the semiconductor device, l is the length between one unit lead frame of the lead tape, and a is the length of the lead frame of the semiconductor device in the advancing direction. ＞
It is necessary that tan ^-1 2t/l-a.

For example, l=5.43mm length of semiconductor device a=0.9
If the thickness of the tape is 0.4 mm, the tape should be placed above the adjacent semiconductor edge, taking into account the downward sagging of the tape.
Approximately 0.1 mm is required, and the appropriate value for θ is an elevation angle of approximately 12 degrees, and l = 4.75, a = 1.0 mm, and t =
I found that an elevation angle of 15° is a suitable value for 0.4mm. In FIG. 4, the tape guide is held parallel to the stage surface only in the bonding position. Also in this case, during bonding, the alignment between the lead tape and the semiconductor device does not change when the bonding tool is lowered, and bonding can be performed in an accurate position.

Furthermore, since the tape feeding direction also has an elevation angle, the possibility of contact between the tape in the feeding direction and the semiconductor device during bonding is reduced.

As described above, according to the present invention, the lead tape and the semiconductor device can be accurately aligned and stable bonding can be performed.

[Brief explanation of the drawing]

Fig. 1 is a schematic perspective view showing a conventional semiconductor device manufacturing equipment, Fig. 2 is a perspective view showing a conventional tape guide, and Fig. 3 is a unit lead frame parallel to the stage and the bonding position. FIG. 4 is a perspective view of an embodiment of the present invention showing a tape guide having an elevation angle with the end in the tape feeding direction as the origin, and FIG. FIG. 7 is a perspective view of another embodiment of the present invention showing a tape guide having an elevation angle with both ends in the feeding direction as the origin. In the figure, 1...Lead tape, 2...Semiconductor device (wafer), 3...Tape guide, 4
... stage, 5 ... imaging device, 6 ... bonding tool, 7 ... bonding tool, 8 ...
Tape guide, 9... stage.

Claims (1)

[Claims] 1. A mechanism unit for feeding out a lead tape in which an integrated set of leads is arranged in a unit lead frame, and a plurality of sets of the unit lead frames are arranged, and a semiconductor element is mounted thereon. and a tape guide for maintaining the lead tape in a predetermined position when bonding the semiconductor element placed on the stage and a set of leads on the lead tape. In the semiconductor device manufacturing apparatus described above, the surface of the portion of the tape guide that faces the set of lead groups is a flat surface parallel to the upper surface of the stage, so that the surface of the tape guide that maintains the flat surface is flat. The origin is the part opposite the end in the tape feeding direction of one unit lead frame having a group, and the tape guide extends upward in a straight line at an elevation angle. and a groove adapted to the width of the lead tape is provided in the tape guide, which has a portion connected to the tape guide extending upward in a straight line.