JPS6118689B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for attaching an electrical component to a printed circuit board and for detecting whether or not the electrical component has been properly attached.

[Summary of the invention]

The present invention provides a lead wire folding device in which a printed circuit board is mounted and a through hole is provided in which a lead wire of an electrical component inserted through a lead wire insertion hole of the printed circuit board is inserted and the lead wire is bent into a predetermined shape. By supplying air at a predetermined pressure through a pipe to the through-hole of the bending jig and detecting the air pressure inside the pipe, it is possible to accurately detect the proper mounting state of electrical components on the printed circuit board. This is what I did.

[Conventional technology]

Conventionally, when various electrical components are attached to a printed circuit board, the lead wires of each electrical component are inserted into predetermined insertion holes of the printed circuit board, temporarily attached, and then soldered. In this case, an important issue is whether or not each lead wire is completely inserted into each insertion hole in the temporarily attached state. As a mounting and detection device for electrical parts, for example, according to Japanese Utility Model Publication No. 49-33309, there is a device that operates a limit switch by bringing a lead wire protruding from an insertion hole into contact with a contact provided at a predetermined position. is proposed.

[Problem that the invention seeks to solve]

In the conventional device described above, the contact pressure against the contactor varies depending on how the lead wire is bent, so the operation of the limit switch is uncertain. As described above, conventional devices have been unable to perform accurate detection. Furthermore, if a large number of electrical components on the same board were to be detected simultaneously, the device would become complicated and large-scale, and maintenance and inspection would also be time-consuming. Furthermore, it has been impossible to bend the lead wires of the electrical components into a predetermined shape and attach them to the printed circuit board.

[Means for solving problems]

In the present invention, a printed circuit board is placed,
A lead wire bending jig provided with a through hole for inserting a lead wire of an electrical component inserted through the lead wire insertion hole of the printed circuit board and bending the lead wire into a predetermined shape; An air supply means for supplying air at a predetermined pressure through the pipe from an opening on the opposite side to the wire insertion side, and a detection means for detecting the atmospheric pressure inside the pipe are provided.

[Effect]

The bending jig allows the electrical component to be attached to the printed circuit board while bending its lead wire into a predetermined shape. Furthermore, if the lead wire is not inserted correctly into the through hole, the air pressure inside the pipe will drop below a predetermined value, making it possible to detect an improperly installed state of the electrical component.

〔Example〕

When temporarily attaching electrical components to a printed circuit board, the lead wires are bent. The shapes of this bending are as shown in Fig. 1 A, B, C, D,
There are various types as shown in E and F. In the figure, 1 is a printed circuit board, 2a and 2b are lead wire insertion holes, 3 is an electrical component, and 4a and 4b are lead wires. In order to bend these shapes, a bending jig is used in the present invention.

Figure 2 shows lead wires 4a and 4 as shown in Figure 1E.
A bending jig 5 is shown which is used when bending b into a crank shape.

This jig 5 has a rectangular parallelepiped shape, and is provided with a pair of through holes 6a and 6b in a predetermined shape that penetrate from the top surface to the bottom surface. The upper openings of the through holes 6a, 6b are formed to have a large diameter, and the inclined portions 7 are formed according to the bending shapes of the lead wires 4a, 4b in FIG. 1E.
a and 7b are provided. Further, mounting pins 8a and 8b are provided on the bottom surface.

FIG. 3 shows an embodiment of a component detection device according to the present invention using the jig 5 described above.

At a predetermined position on the base 9, the jig 5 has pins 8a, 8
b are fitted into the mounting holes 9a, 9b of the base 9, thereby attaching the base 9. A printed circuit board 1 is placed on the top surface of the jig 5, and its insertion hole 2
a, 2b and through holes 6a, 6b are aligned. Thin pipes 11a and 11b are inserted through the openings on the bottom side of the through holes 6a and 6b, and their tips are placed at positions slightly lower than the slopes 7a and 7b of the through holes 6a and 6b, that is, as shown in the figure, the thin pipes 11a and 11b are inserted. When the part 3 is temporarily attached in a normal state, the tips of the lead wires 4a and 4b are connected to this pipe 11.
a, 11b. The other ends of the pipes 11a and 11b are connected to a pump 12 so that air at a predetermined pressure is supplied thereto. The pressure inside these pipes 11a, 11b is measured by gauges 13a, 1.
3b.

In the above configuration, when temporarily attaching the electrical component 3 to the printed circuit board 1, the lead wires 4a, 4b of the electrical component 3 are inserted through the through holes 2a, 2b through the through holes 6a,
6b, and apply force F to this electric component 3 in the vertical direction shown by the arrow. As a result, the lead wires 4a and 4b move downward while being bent at the inclined portions 7a and 7b. Then, when it reaches the appropriate position, force F is removed.

Next, in this state, air is supplied from the pump 12 through the pipes 11a and 11b. This air is blown out from the insertion holes 2a, 2b via the through holes 6a, 6b to the outside. At this time, if the electrical component 3 is installed normally, the tips of the lead wires 4a, 4b close the openings of the pipes 11a, 11b, so that the atmospheric pressure measured by the gauges 13a, 13b in the pipes 11a, 11b is at a predetermined level. The size will be . Furthermore, if the electrical component 3 is installed incompletely as shown by the dotted line, for example, the tip of the lead wire 4a has come off the pipe 11a.
The atmospheric pressure indicated by the gauge 13a inside 1a is below a predetermined value. This makes it possible to detect improper installation of the electrical component 3.

Next, the jig 5, pipes 11a, 11b and base 9
By removing the electrical component 3, the electrical component 3 can be temporarily attached to the printed circuit board 1 with the lead wires 4a and 4b bent into a crank shape as shown in FIG. 1E.

Note that a plurality of jigs 5 are installed at a plurality of predetermined positions on the base 9.
It is also possible to temporarily attach electrical components to the printed circuit board 1 at positions corresponding to the respective jigs 5. In that case, by attaching a pipe to each jig and supplying air to each pipe at the same time, it is possible to simultaneously detect the installation state of a plurality of electrical components.

In the above explanation, the lead wires 4a and 4b are
A jig 5 shown in Fig. 2 for bending the
Although we have described the case using
In case of C and D, each lead wire 4a, 4b
Jigs having through holes corresponding to the bending shape are used, and by attaching pipes to these jigs, it is possible to detect the attachment state of the electrical components in the same manner as described above.

〔Effect of the invention〕

It is possible to simultaneously attach the electrical component to a printed circuit board while bending the lead wire of the electrical component into a predetermined shape, and to detect the appropriate attachment state of the electrical component. Since the above-mentioned detection is performed by sending air through the through-hole of the bending jig, reliable detection can be performed. In particular, even if the insertion hole of the printed circuit board is clogged with board powder, it is blown away by air pressure, so detection can be performed reliably without causing a large error in the detected pressure. Furthermore, even when a large number of electrical components are mounted on the same board and detected at the same time, the configuration of the device is relatively simple, as multiple jigs can be used and a pipe can be connected to each jig. , maintenance, etc. does not require any particular effort.

[Brief explanation of the drawing]

1A, B, C, D, E, and F are cross-sectional side views showing various states in which electronic components are mounted on a printed circuit board; FIG. 2 is a perspective view showing an example of a mounting jig;
FIG. 3 is a cross-sectional side view showing an embodiment of the present invention. In each figure, 1 is a printed circuit board, 2
a and 2b are insertion holes, 3 is an electrical component, 4a and 4b are lead wires, 5 is a bending jig, 6a and 6b are through holes, 11a and 11b are pipes, 12 is a pump, 1
3a and 13b are gauges.

Claims (1)

[Claims] 1. A printed circuit board is mounted, and a through hole is provided in which a lead wire of an electrical component is inserted and bent into a predetermined shape through a lead wire insertion hole of the printed circuit board. a lead wire bending jig, an air supply means for supplying air at a predetermined pressure through a pipe from an opening on the opposite side of the lead wire insertion side of the through hole, and a detection means for detecting the air pressure inside the pipe, respectively. An electrical component mounting and detection device comprising: