JPS6120088B2 - - Google Patents
Info
- Publication number
- JPS6120088B2 JPS6120088B2 JP9435779A JP9435779A JPS6120088B2 JP S6120088 B2 JPS6120088 B2 JP S6120088B2 JP 9435779 A JP9435779 A JP 9435779A JP 9435779 A JP9435779 A JP 9435779A JP S6120088 B2 JPS6120088 B2 JP S6120088B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- organic solvent
- water
- copper
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 34
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 238000007254 oxidation reaction Methods 0.000 claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000002500 effect on skin Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Description
本発明は送電容量を増加せんとして導体の交流
抵抗を軽減することを目的とした絶縁導体の製造
方法である。
一般に超高圧大容量送電ケーブルにおける技術
開発の目的はケーブル1回線当りの送電容量を増
加せしめることであり、そのためには(1) 導体の
大サイズ化、(2) ケーブルの高電圧化、(3) ケー
ブルの低損失化が必要である。
而してケーブルの低損失化を図ることは、それ
自体省資源につながる効果をもつが、例えば地中
ケーブルの場合、その送電容量を限定しているも
のはケーブルの発熱に基づく温度上昇のため、ケ
ーブルの低損失化はケーブルの容量を増加せしめ
ると共にケーブルサイズの縮少化につながるもの
である。
従来この低損失化をはかるために、ケーブルを
構成している導体、絶縁体、金属シースについて
種々検討を行つているものであつた。
この内導体については、導体の大サイズに伴う
表皮効果の低減対策について研究が行われている
が、いまだ試作の段階であり実用化に至つていな
いものである。
なお表皮効果とは交流ケーブルの場合通常のオ
ームロスの他に交流磁場によつて導体表面に過電
流ロスが生ずる。この過電流は表皮効果をひき起
し、導体抵抗を大きくする。
本発明はかかる現状に鑑み、大サイズ導体の表
皮効果を低減させる方法について鋭意研究を行つ
た結果、導体表面を絶縁処理することが極めて有
効であり、導体を酸化処理することにより導体表
面に形成される酸化銅が優れた絶縁性を有するこ
とを確め本発明に至つたものである。即ち本発明
は水溶性にして且つ約100℃以下の沸点を有する
有機溶剤と水との混和液に苛性ソーダ及び次亜塩
素酸ソーダを添加溶解した酸化処理液中に、銅導
体を浸漬した後、該有機溶剤の沸点又はその近傍
の温度に加熱して該銅導体の表面に酸化銅皮膜を
形成せしめることを特徴とするものである。
本発明において導体の表面を酸化せしめるため
の酸化処理液にいて詳述すると、
まず有機溶剤と水との混和液に使用する有機溶
剤は水に可溶にして且つ沸点が約100℃以下のも
の例えばメタノール、エタノールが好ましい。又
有機溶剤と水との割合は水1に対し有機溶剤0.2
〜2の範囲に配合したものを使用する。
この混合液の中に酸化剤として苛性ソーダ及び
次亜塩素酸ソーダを添加するものであるが、その
添加量は通常上記混和液1中に苛性ソーダ10〜
80g、次亜塩素酸ソーダ50〜150gを溶解せしめ
たものが好ましい。
この処理液中に銅導体を浸漬せしめて酸化反応
をせしめるものであるが処理液が常温ではその反
応が促進されない。従つて有機溶剤の沸点又はそ
の近傍例えば±20℃程度の温度に加熱して使用す
るものである。
なお浸漬時間は1〜3分程度で十分酸化するこ
とが出来る。従つて処理液中に導体を走行して通
過せしめながら酸化せしめてもよい。
而して上記処理液の媒体として水と有機溶剤と
の混和液を使用した理由は、上記の如く加熱する
ことによつて有機溶剤が水中にて沸騰して水を撹
拌するため導体との酸化反応が著しく促進される
ためである。
又苛性ソーダ及び次亜塩素酸ソーダの添加量に
ついて上記混和液1に苛性ソーダ80g及び次亜
塩素酸ソーダ150gを夫々超えて添加した場合に
は危険性を伴うものであり、又苛性ソーダ10g及
び次亜塩素酸ソーダ50g未満の場合には、酸化反
応が促進されず、銅導体の表面に酸化膜を被着せ
しめることが出来ないためである。
又本発明方法は上記処理液に5KC〜20MCの超
音波を加えつつ導体と反応せしめることにより導
体内への酸化処理液の浸透並に酸化反応が格段と
促進され、酸化処理時間を短縮することが出来
る。
又導体を高周波誘導加熱等により酸化処理液の
加熱温度以上に予熱しつつ酸化処理液中を通過せ
しめることにより、酸化処理時間を短縮すること
が出来る。
次に本発明の実施例について説明する。
実施例
1×2000mm26分割銅導体について、第1表に示
す如き処理条件によつて上記導体面に黒色の酸化
皮膜を密着せしめた。
なお本発明方法と比較するために酸化処理液と
して組成の異なるものを使用し、上記同様に導体
面を酸化せしめたが全く酸化膜は形成されず殆ん
ど銅色のままの状態であつた。
The present invention is a method of manufacturing an insulated conductor, which aims to reduce the AC resistance of the conductor in order to increase the power transmission capacity. Generally, the purpose of technological development in ultra-high voltage, high capacity power transmission cables is to increase the power transmission capacity per line of the cable, and to do so, (1) increasing the size of the conductor, (2) increasing the voltage of the cable, (3) ) It is necessary to reduce the cable loss. Reducing loss in cables has the effect of conserving resources in itself, but in the case of underground cables, for example, the power transmission capacity is limited by temperature rise due to heat generation in the cables. Reducing cable loss increases cable capacity and reduces cable size. Conventionally, in order to reduce this loss, various studies have been conducted on the conductor, insulator, and metal sheath that make up the cable. Regarding this inner conductor, research is being conducted on measures to reduce the skin effect caused by the large size of the conductor, but it is still in the prototype stage and has not yet been put into practical use. In the case of AC cables, the skin effect means that in addition to the normal ohmic loss, overcurrent loss occurs on the conductor surface due to the AC magnetic field. This overcurrent causes a skin effect and increases conductor resistance. In view of the current situation, the present invention has conducted extensive research on methods for reducing the skin effect of large-sized conductors, and has found that it is extremely effective to insulate the surface of the conductor, and that the skin effect can be formed on the surface of the conductor by oxidizing the conductor. The present invention was achieved by confirming that the copper oxide produced by the present invention has excellent insulating properties. That is, in the present invention, after a copper conductor is immersed in an oxidation treatment solution in which caustic soda and sodium hypochlorite are added and dissolved in a mixture of water and an organic solvent that is water-soluble and has a boiling point of about 100°C or less, The method is characterized in that a copper oxide film is formed on the surface of the copper conductor by heating it to a temperature at or near the boiling point of the organic solvent. To explain in detail the oxidation treatment liquid for oxidizing the surface of the conductor in the present invention, first, the organic solvent used for the mixture of organic solvent and water is one that is soluble in water and has a boiling point of about 100°C or less. For example, methanol and ethanol are preferred. The ratio of organic solvent to water is 1 part water to 0.2 part organic solvent.
Use a mixture in the range of 2 to 2. Caustic soda and sodium hypochlorite are added to this mixed solution as oxidizing agents, and the amount added is usually 10 to 10% of the above mixed solution.
It is preferable to dissolve 80 g of sodium hypochlorite and 50 to 150 g of sodium hypochlorite. The copper conductor is immersed in this treatment liquid to cause an oxidation reaction, but the reaction is not promoted when the treatment liquid is at room temperature. Therefore, it is used by heating to a temperature at or near the boiling point of the organic solvent, for example, about ±20°C. Note that sufficient oxidation can be achieved with a dipping time of about 1 to 3 minutes. Therefore, the conductor may be oxidized while passing through the treatment liquid. The reason why a mixture of water and an organic solvent was used as the medium for the above-mentioned treatment liquid is that when heated as described above, the organic solvent boils in the water and stirs the water, which prevents oxidation with the conductor. This is because the reaction is significantly accelerated. Regarding the amount of caustic soda and sodium hypochlorite added, it is dangerous if more than 80 g of caustic soda and 150 g of sodium hypochlorite are added to the above mixed solution 1, respectively. This is because if the amount of acid soda is less than 50 g, the oxidation reaction will not be promoted and an oxide film cannot be deposited on the surface of the copper conductor. In addition, in the method of the present invention, by applying ultrasonic waves of 5KC to 20MC to the above-mentioned processing solution and allowing it to react with the conductor, the penetration of the oxidation processing solution into the conductor and the oxidation reaction are greatly promoted, thereby shortening the oxidation processing time. I can do it. Further, the oxidation treatment time can be shortened by preheating the conductor to a temperature higher than the heating temperature of the oxidation treatment liquid by high-frequency induction heating or the like and passing it through the oxidation treatment liquid. Next, examples of the present invention will be described. Example A black oxide film was adhered to the conductor surface of a 1×2000 mm 2 six-segment copper conductor under the treatment conditions shown in Table 1. In order to compare with the method of the present invention, an oxidation treatment solution with a different composition was used and the conductor surface was oxidized in the same manner as above, but no oxide film was formed and it remained almost copper-colored. .
【表】【table】
【表】
次に実施例(2)の導体及び比較例(1)の導体につい
て夫々導体の表皮効果を測定するため交流電位差
計を使用して行つた。その結果は第2表に示す通
りである。[Table] Next, an AC potentiometer was used to measure the skin effect of the conductor of Example (2) and Comparative Example (1). The results are shown in Table 2.
【表】
上表から明らかの如く本発明方法によれば導体
の表皮効果が酸化膜のない銅導体に比して約1/3
となり導体損失低減の効果が著しく表明できたも
のである。
以上詳述した如く本発明方法によれば導体の低
損失化することが出来るため、CVケーブル,OF
ケーブル及び管路地下ケーブル等に適用し極めて
有用なものである。[Table] As is clear from the above table, according to the method of the present invention, the skin effect of the conductor is approximately 1/3 that of a copper conductor without an oxide film.
Therefore, the effect of reducing conductor loss was clearly demonstrated. As detailed above, according to the method of the present invention, conductor loss can be reduced, so CV cables, OF
It is extremely useful for cables, conduits, underground cables, etc.
Claims (1)
有機溶剤と水との混和液に苛性ソーダ及び次亜塩
素酸ソーダを添加溶解した酸化処理液中に銅導体
を浸漬した後、該有機溶剤の沸点又はその近傍の
温度に加熱して、該銅導体の表面に酸化銅皮膜を
形成せしめることを特徴とする絶縁導体の製造方
法。1 After immersing a copper conductor in an oxidation treatment solution in which caustic soda and sodium hypochlorite are added and dissolved in a mixture of water and an organic solvent that is water-soluble and has a boiling point of 100°C or less, the boiling point of the organic solvent is A method for manufacturing an insulated conductor, which comprises heating the copper conductor to a temperature at or near that temperature to form a copper oxide film on the surface of the copper conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9435779A JPS5619809A (en) | 1979-07-25 | 1979-07-25 | Method of manufacturing insulated conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9435779A JPS5619809A (en) | 1979-07-25 | 1979-07-25 | Method of manufacturing insulated conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5619809A JPS5619809A (en) | 1981-02-24 |
| JPS6120088B2 true JPS6120088B2 (en) | 1986-05-20 |
Family
ID=14108031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9435779A Granted JPS5619809A (en) | 1979-07-25 | 1979-07-25 | Method of manufacturing insulated conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5619809A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595668B2 (en) * | 1981-03-02 | 1984-02-06 | 株式会社フジクラ | Method for forming an insulating oxide film on copper or copper alloy |
-
1979
- 1979-07-25 JP JP9435779A patent/JPS5619809A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5619809A (en) | 1981-02-24 |
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