JPS6120090B2 - - Google Patents
Info
- Publication number
- JPS6120090B2 JPS6120090B2 JP51126937A JP12693776A JPS6120090B2 JP S6120090 B2 JPS6120090 B2 JP S6120090B2 JP 51126937 A JP51126937 A JP 51126937A JP 12693776 A JP12693776 A JP 12693776A JP S6120090 B2 JPS6120090 B2 JP S6120090B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical contact
- contact material
- layer
- particles
- self
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 9
- 229910017937 Ag-Ni Inorganic materials 0.000 claims description 8
- 229910017984 Ag—Ni Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 17
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000003466 welding Methods 0.000 description 13
- 239000012298 atmosphere Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Landscapes
- Contacts (AREA)
- Conductive Materials (AREA)
Description
本発明は、Ag―Ni系電気接点材料の製造方法
に関するものである。
従来、Ag―Ni系電気接点材料は開閉回数が数
万回程度のリレー用接点等に使用され、Ag或い
はAg合金よりも耐溶着性に優れた接点材料とし
て知られていたが、開閉回数1000回未満の初期溶
着が発生し易いという欠点があつた。
この原因を解消するため多数の初期溶着を観察
したところ、表層部Niの分布状態及び酸化状態
により初期溶着に差異が生じていることが判明し
た。すなわち、初期溶着を起こした接点材料の表
層部には比較的大きなNi粒子が散在し、マトリ
ツクスのAg同志が溶着していたのに対し、初期
溶着を起こさない材料では比較的小さなNi粒子
が分散していた。
本発明は上記知見をもとに鋭意攻究の結果完成
したもので、その目的は表層部に微細なAgに固
溶しない金属粒子を均一に分散させることにより
初期溶着を減じることのできるAg―Ni系電気接
点材料の製造方法を提供することにある。
本発明によるAg―Ni系電気接点材料の製造方
法は、Ag―Ni系電気接点材料にAgとAgに固溶し
ない金属とからなる複合析出粒子層を1〜100μ
付着せしめる工程と付着した複合析出粒子層の
Agを熱処理によつて自己拡散させる工程とから
なる。
本発明の製造方法において、Agに固溶しない
金属としてはNi,Fe,Co,MoおよびWのみが用
いられる。また、複合析出粒子層とは、Ag中に
Agに固溶しない金属が均一微細に分散している
層をさす。複合析出粒子層を付着せしめる方法と
しては、湿式めつき法、乾式めつき法、溶射法の
いずれかが用いられる。これらの方法によれば、
析出粒子が微細であるためAgとAgに固溶しない
粒子が混在して複合層を形成する。しかし、この
状態では下地のAgマトリツクスと析出したAg粒
子が一体化されていないため熱処理によつて自己
拡散させ、Ag析出粒子をAgマトリツクスに一体
化させる。この自己拡散工程が不十分であれば、
電気接点として使用中に複合層境界面からはくり
したり、またAgに固溶しない析出粒子が凝集し
て粗大化し、初期溶着の発生を抑制することがで
きないからである。好ましい熱処理の温度範囲と
しては500℃〜900℃が良い。なお、Ni,Fe,
Cr,MoおよびW以外の金属は接点性能上好まし
くない。これらの金属を添加した付着層のAg合
金は後述の加速試験において耐溶着性が優れてい
た。
上記工程にて製造されたAg―Ni系電気接点材
料の代表的組織は、第1図に示す如く表面から
100μの深さまでのAgマトリツクス1中にNi粒子
3が全く存在せず、Agに固溶しない金属粒子2
が微細に分散した組織を呈する。一方、従来の
Ag―Ni系電気接点材料組織は第2図に示す如く
表層部中にNi粒子3がまばらに存在した組織を
呈する。
然して本発明の製造方法において、付着層の厚
さを1〜100μとしたのは、1μ未満では初期溶
着の減少に効果がなくまた100μを超えると製造
に手間がかかるためである。
次に本発明の具体的な製造方法の実施例につい
て述べる。
実施例 1
Ag―20重量%Niの電気接点材料の接点表面ぶ
にAgとNiを同時に3μ,10μ,80μ真空蒸着せ
しめた後、N2雰囲気中900℃で24時間保持して付
着層中のAgを十分自己拡散させた。
実施例 2
Ag―10重量%Niの電気接点材料の接点表面部
にAgとFeを同時に1μ,10μ,80μ真空蒸着せ
しめた後、5×10-3mmHgの真空中600℃で12時間
保持して付着層中のAgを十分自己拡散させた。
実施例 3
Ag―20重量%Niの電気接点材料の接点表面部
にAg―5重量%Moを3μ,10μ,80μ溶射せし
めた後、Ar雰囲気中800℃で6時間保持して付着
層中のAgを十分自己拡散させた。
実施例 4
Ag―10重量%Niの電気接点材料の接点表面部
にAgとCrを同時に3μ,10μ,80μ真空蒸着せ
しめた後、大気中500℃で1時間保持して付着層
中のAgを十分自己拡散させた。
実施例 5
Ag―10重量%Niの電気接点材料の接点表面部
にAgとCoを同時に3μ,50μ,100μ真空蒸着
せしめた後、Ar雰囲気中800℃で6時間保持して
付着層中のAgを自己拡散させた。
実施例 6
Ag―10重量%Niの電気接点材料の接点表面部
にAgとWを同時に3μ,50μ,80μ真空蒸着せ
しめた後、大気中700℃で30分保持して付着層中
のAgを自己拡散させた。
比較例 1〜7
各実施例に対応して、Ag―10重量%Niまたは
Ag―20重量%Niの電気接点材料の接点表面部に
各実施例の複合析出粒子層を0.5μおよび200μ真
空蒸着せしめた後、Ar雰囲気中800℃で6時間保
持して付着層中のAgを自己拡散させて、比較例
1〜7とした。
然して本発明によるAg―Ni系電気接点材料の
製造方法の効果を明らかにするために、上記各実
施例1〜6の電気接点材料と比較例の電気接点材
料にて作つた各電気接点材料を下記の試験条件に
て72台で加速試験したところ、開閉回数10000回
未満の初期溶着発生台数は下表に示すような結果
が出た。尚、あわせて従来例としてAg―10重量
%NiおよびAg―20重量%Niにて作つた電気接点
の試験結果も下表に示した。
The present invention relates to a method for producing an Ag--Ni electrical contact material. Conventionally, Ag-Ni electrical contact materials have been used for relay contacts that can be opened and closed several tens of thousands of times, and are known as contact materials that have better welding resistance than Ag or Ag alloys. There was a drawback that initial welding of less than 10 times was likely to occur. In order to eliminate this cause, we observed a large number of initial welds and found that initial welds differed depending on the distribution and oxidation state of Ni in the surface layer. In other words, comparatively large Ni particles were scattered in the surface layer of the contact material that had undergone initial welding, and the Ag particles in the matrix were welded together, whereas relatively small Ni particles were dispersed in the material that did not undergo initial welding. Was. The present invention was completed as a result of intensive research based on the above knowledge, and its purpose is to reduce initial welding by uniformly dispersing fine metal particles that do not dissolve in Ag in the surface layer. An object of the present invention is to provide a method for manufacturing a Ni-based electrical contact material. The method for producing an Ag-Ni electrical contact material according to the present invention is to apply a composite precipitated particle layer of 1 to 100 μm consisting of Ag and a metal that does not dissolve in Ag to the Ag-Ni electrical contact material.
The adhesion process and the adhering composite precipitated particle layer
This process consists of a step of self-diffusing Ag through heat treatment. In the manufacturing method of the present invention, only Ni, Fe, Co, Mo, and W are used as metals that do not dissolve in Ag. In addition, the composite precipitated particle layer is
A layer in which metals that do not dissolve in Ag are uniformly and finely dispersed. As a method for attaching the composite precipitated particle layer, any one of a wet plating method, a dry plating method, and a thermal spraying method is used. According to these methods,
Since the precipitated particles are fine, Ag and particles that do not dissolve in Ag coexist to form a composite layer. However, in this state, the underlying Ag matrix and the precipitated Ag particles are not integrated, so they self-diffuse through heat treatment, and the Ag precipitated particles are integrated into the Ag matrix. If this self-diffusion process is insufficient,
This is because during use as an electrical contact, it may peel off from the composite layer interface, or precipitated particles that are not dissolved in Ag may aggregate and become coarse, making it impossible to suppress the occurrence of initial welding. The preferred temperature range for heat treatment is 500°C to 900°C. In addition, Ni, Fe,
Metals other than Cr, Mo and W are unfavorable in terms of contact performance. The Ag alloy of the adhesion layer to which these metals were added had excellent welding resistance in the accelerated test described below. The typical structure of the Ag-Ni electrical contact material manufactured through the above process is as shown in Figure 1, starting from the surface.
There are no Ni particles 3 in the Ag matrix 1 up to a depth of 100μ, and the metal particles 2 do not dissolve in Ag.
exhibits a finely dispersed structure. On the other hand, traditional
As shown in FIG. 2, the structure of the Ag--Ni electrical contact material exhibits a structure in which Ni particles 3 are sparsely present in the surface layer. However, in the manufacturing method of the present invention, the thickness of the adhesion layer is set to 1 to 100 .mu.m, because if it is less than 1 .mu.m, it is not effective in reducing the initial welding, and if it exceeds 100 .mu.m, it takes time and effort to manufacture. Next, an example of a specific manufacturing method of the present invention will be described. Example 1 Ag and Ni were simultaneously vacuum-deposited at 3 μ, 10 μ, and 80 μ on the contact surface of an electrical contact material of Ag-20 wt% Ni, and then maintained at 900°C for 24 hours in an N 2 atmosphere to remove the deposited layer. Ag was sufficiently self-diffused. Example 2 Ag and Fe were vacuum-deposited at 1 μ, 10 μ, and 80 μ at the same time on the contact surface of Ag-10 wt% Ni electrical contact material, and then held at 600°C in a vacuum of 5 × 10 -3 mmHg for 12 hours. Ag in the adhesion layer was sufficiently self-diffused. Example 3 After spraying 3μ, 10μ, and 80μ of Ag-5wt% Mo onto the contact surface of an electrical contact material made of Ag-20wt% Ni, the adhesive layer was maintained at 800°C for 6 hours in an Ar atmosphere. Ag was sufficiently self-diffused. Example 4 Ag and Cr were vacuum-deposited at 3 μ, 10 μ, and 80 μ at the same time on the contact surface of an electrical contact material of Ag-10 wt% Ni, and then held at 500°C in the atmosphere for 1 hour to remove the Ag in the deposited layer. Enough self-diffusion. Example 5 Ag and Co were vacuum-deposited at 3 μ, 50 μ, and 100 μ at the same time on the contact surface of an Ag-10 wt% Ni electrical contact material, and then held at 800°C for 6 hours in an Ar atmosphere to remove the Ag in the deposited layer. self-spread. Example 6 Ag and W were vacuum-deposited at 3 μ, 50 μ, and 80 μ at the same time on the contact surface of an Ag-10 wt% Ni electrical contact material, and then held in the atmosphere at 700°C for 30 minutes to remove the Ag in the deposited layer. Self-spread. Comparative Examples 1 to 7 Corresponding to each example, Ag-10wt%Ni or
After vacuum-depositing composite precipitated particle layers of 0.5μ and 200μ of each example on the contact surface of Ag-20wt%Ni electrical contact material, the layers were held at 800°C for 6 hours in an Ar atmosphere to remove the Ag in the deposited layer. Comparative Examples 1 to 7 were prepared by self-diffusion. However, in order to clarify the effects of the method for producing Ag-Ni-based electrical contact materials according to the present invention, each electrical contact material made from the electrical contact materials of Examples 1 to 6 and the electrical contact materials of Comparative Examples was tested. An accelerated test was conducted on 72 units under the test conditions below, and the results for the number of units in which initial welding occurred after opening and closing less than 10,000 times were as shown in the table below. The table below also shows the test results of electrical contacts made of Ag-10 wt% Ni and Ag-20 wt% Ni as conventional examples.
【表】【table】
【表】
ここで、開閉回数というのは、溶着するまでに
開閉した回数を言い、溶着した場合はその回数を
表示して終了させ、10000回でも溶着しない場合
は「10001〜」と表示した。
上記の表で明らかなように本発明の製造方法に
よつて得られたAg―Ni系電気接点材料は、従来
のAg―Ni系電気接点材料に比べ、数段優れた初
期の耐溶着性を有するものであり、このことは本
発明によるAg―Ni系電気接点材料の製造方法が
極めて有意義な為製造方法のあるものであること
を示している。[Table] Here, the number of times of opening and closing refers to the number of times the product was opened and closed before welding. If welding occurred, the number of times was displayed and the process ended. If welding did not occur even after 10,000 times, "10,001~" was displayed. As is clear from the table above, the Ag-Ni electrical contact material obtained by the manufacturing method of the present invention has an initial welding resistance that is several orders of magnitude better than that of conventional Ag-Ni electrical contact materials. This shows that the method for manufacturing the Ag--Ni electrical contact material according to the present invention is extremely meaningful and therefore exists.
第1図は本発明の製造方法によつて得られた
Ag―Ni系電気接点材料の組織の要部を示す断面
図、第2図は従来例の断面図である。
1…Agマトリツクス、2…均一に分散されて
いるAgに固溶しない微細な金属粒子、3…Ni粒
子。
Figure 1 is obtained by the manufacturing method of the present invention.
FIG. 2 is a cross-sectional view showing the main part of the structure of an Ag--Ni electrical contact material, and FIG. 2 is a cross-sectional view of a conventional example. 1...Ag matrix, 2...Fine metal particles that are uniformly dispersed and do not dissolve in Ag, 3...Ni particles.
Claims (1)
い金属とから成る複合析出粒子層を1〜100μ付
着せしめる工程とこの付着した複合析出粒子層中
のAgを熱処理によつて自己拡散させる工程とか
らなることを特徴とするAg―Ni系電気接点材料
の製造方法。1 A process of attaching a composite precipitated particle layer of 1 to 100 μm consisting of Ag and a metal that does not dissolve in Ag to the Ag-Ni electrical contact material, and self-diffusion of Ag in this adhered composite precipitate particle layer by heat treatment. A method for producing an Ag--Ni electrical contact material, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12693776A JPS5352977A (en) | 1976-10-22 | 1976-10-22 | Method of manufacturing aggni electric contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12693776A JPS5352977A (en) | 1976-10-22 | 1976-10-22 | Method of manufacturing aggni electric contact material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5352977A JPS5352977A (en) | 1978-05-13 |
| JPS6120090B2 true JPS6120090B2 (en) | 1986-05-20 |
Family
ID=14947584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12693776A Granted JPS5352977A (en) | 1976-10-22 | 1976-10-22 | Method of manufacturing aggni electric contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5352977A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57194229A (en) * | 1981-05-25 | 1982-11-29 | Tanaka Kikinzoku Kogyo Kk | Electrical contact material |
| JPS5896834A (en) * | 1981-12-02 | 1983-06-09 | Tanaka Kikinzoku Kogyo Kk | Electric contact material |
| JPS58104143A (en) * | 1981-12-17 | 1983-06-21 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
| JPS58126607A (en) * | 1982-01-22 | 1983-07-28 | 田中貴金属工業株式会社 | Electric contact material |
-
1976
- 1976-10-22 JP JP12693776A patent/JPS5352977A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5352977A (en) | 1978-05-13 |
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