JPS6122880B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a power supply structure for an electronic device package, and particularly to a power supply structure capable of supplying a large amount of current.

In recent years, electronic devices such as computers have increased the current capacity per unit volume due to improvements in the mounting density of electronic circuit packages (hereinafter referred to as packages), as well as improvements in the degree of integration of ICs and high-density integrated circuit elements (hereinafter referred to as LSIs).
Furthermore, in order to increase the operating speed of electronic equipment and to transmit signals at low levels, it is required to suppress voltage fluctuations as much as possible. In this case, the conventional power supply structure for electronic device packages shown in Figure 1 includes a plurality of packages, interconnections between the packages, an internal power supply plane, and a power supply plane for the power supply. A connector 2 having a connector pin 15 is fixed by soldering or the like to a back panel 1 having a through hole 18 connected to a plane. The package 3 was inserted into the connector 2, and power was supplied to the package 3 from the power supply plane via the connector pins 15. In this case, if the current consumption per package was small and the permissible voltage fluctuation at the element level was within a relatively wide range, the circuit function could be sufficiently satisfied.

However, as mentioned above, with the increase in the current capacity of packages and the speeding up of electronic equipment, the allowable voltage fluctuations have become stricter, so the power supply structure via the connector pin has a sufficient current capacity due to the conductor resistance of the connector pin. Moreover, in order to supply power to the package, a large number of power supply connector pins are required, and with integration, it is difficult to secure a large number of signal connector pins. There was a flaw that made it impossible.

In addition, there is a power supply structure that supplies a large amount of current to the package of electronic equipment, as shown in FIG. A power supply socket 16 is mounted on the top and bottom of the package 3, and when the package 3 is inserted into the connector 2, the power supply pin 17 and the power supply socket 16 are connected. However, the structure was such that the power was supplied from the power supply bus 5 to the package 3 via the power supply pin 17 and the power supply socket 16. However, in this case, although it is possible to supply a large amount of current, the insertion force of the package into the connector 2 increases due to the increase in the number of connector pins due to integration, and on top of that, the insertion force due to the power connector is added. There was a drawback that it made it difficult to insert the package.

The purpose of the present invention is to solve the problem of current capacity and low impedance that occurred in the conventional power supply structure.
This solution solves all the problems of package insertion force and package insertion force, and provides a power supply structure that makes it possible to supply a large amount of current.

That is, in the present invention, a power receiving plate and a locking mechanism are mounted on the end of the package, and this locking mechanism is composed of a movable plate. A shaft having one end bent into an L shape and a movable eccentric handle at the other end is mounted in the round hole in the facing portion of the power receiving plate and the movable plate (facing each other with a gap between them).

Further, a coil spring is inserted into the shaft between the power receiving plate and the movable plate.

In addition, a power supply bus is attached to the other frame, and the power supply bus is located between the power receiving plate and the L portion of the shaft, and is operated by operating the eccentric handle. The structure is capable of supplying a large amount of current.

Next, the present invention will be explained in detail with reference to the drawings. 3 and 4, in one embodiment of the present invention, a power receiving plate 4, which is partially bent into an L shape, is fixed to the end of an electronic circuit package 3 by screws 10. In FIG. Also, bend a part into an L shape,
A movable plate 6 having an elongated hole G in a portion attached to the package cage 3 so as to be movable is attached by a pin 11 so as to be movable. There is a round hole in the facing part of the L-shaped part of the power receiving plate 4 and the movable plate 6, and one end of the L-shaped part is inserted into this hole.
A shaft 8 which is bent into a shape and has a hole at the other end is mounted, and a coil spring 9 is inserted into the shaft 8 between the power receiving plate 4 and the movable plate 6.
An eccentric handle 7 is attached to the round hole of the shaft 8 using a spring pin 14.

On the other hand, a back panel 1 with a connector 2 mounted on one side is attached to the frame 12, and a power supply bus 5 is attached to the frame 12 via an insulating plate 13 at the far end of the other back panel. Further, the power supply bus 5 is located between the power receiving plate 4 and the L-shaped portion of the shaft 8.

Next, the power supply operation will be explained with reference to FIGS. 5 to 7. First, insert the package 3 into the connector 2 on the back panel 1. Then, the eccentric handle 7 is rotated in the direction of the arrow B so that the L portion of the shaft 8 engages with the power supply bus 5. The eccentric handle 7 has a dimension E and a dimension F such that E>F.

Next, tilt the eccentric handle 7 in the direction of arrow C. At this time, the shaft 8 connects to the power supply bus 5 at point H.
The movable plate 6 moves in the direction of the arrow D by the amount of eccentricity (=EF) of the eccentric handle 7, and applies a compressive force to the coil spring 9. This compressive force is applied to the power receiving plate 4 and acts on the power supply bus 5 as a contact pressure where the power receiving plate 4 contacts the I portion.

Therefore, by changing the spring constant of the coil spring 9 and the amount of eccentricity of the eccentric handle 7, the contact pressure can be increased, and the contact resistance between the power receiving plate 4 and the power supply bus 5 can be lowered. Contact is possible.

Since the power receiving plate 4 and the power supply bus 5 can be contacted by a large metal surface, it is also possible to supply a large amount of current.

Furthermore, since the connector pins 15 on the back panel 1 are not used, the number of pins that can be used as signal pins increases.

On the other hand, since the power supply is connected after the package 3 is inserted into the connector 2 of the back panel 1, the insertion force of the package 3 can be realized without increasing.

As explained above, the present invention comprises a movable power receiving plate attached to a package, a shaft attached to the plate, a coil spring, an eccentric handle, and a power supply bus attached to a frame. Due to the structure in which the power receiving plate and power supply bus come into contact with each other under pressure, it is possible to reduce the impedance of the connection part and supply a large amount of current, and this effect can be achieved without increasing the number of connector pins or increasing the insertion force of the package. There is.

[Brief explanation of the drawing]

1 and 2 are perspective views of an example of a conventional power supply structure and another example, FIG. 3 is a perspective view of an embodiment of the present invention, and FIG. 4 is an enlarged perspective view of part A in FIG. 3. figure,
5 to 7 are diagrams showing the operation sequence of the power supply structure shown in FIG. 3 as viewed from JJ'. In the figure, 1...back panel, 2...connector, 3...package, 4...power receiving plate,
5... Power supply bus, 6... Movable plate, 7...
...Eccentric handle, 8...Shaft, 9...Coil spring, 10...Screw, 11...Pin, 12...
Frame, 13... Insulating plate, 14... Spring pin, 15... Connector pin, 16... Power supply socket, 17... Power supply pin, 1
8...Through hole.

Claims (1)

[Claims] 1 A back panel, a plurality of connectors mounted on the back panel for transmitting signals, a power supply bus fixed in parallel to the back panel via a frame and an insulating plate for supplying a large amount of current, and a power supply bus to the connectors. A power receiving plate fixed to a side perpendicular to a side for signal connection, a movable plate movably attached facing the power receiving plate, a coil spring located between the power receiving plate and the movable plate, and the power receiving plate. and a shaft having an eccentric handle penetrating through the coil spring and the movable plate, one end bent into an L shape, and movable to the other end, and when the eccentric handle is operated, one end of the shaft and the power receiving plate are connected. A power supply structure comprising: an electronic circuit package which is fixed to the power supply bus by being sandwiched between the electronic circuit package and a locking mechanism for pressing the power receiving plate against the power supply bus to establish an electrical connection.