JPS6123822B2 - - Google Patents
Info
- Publication number
- JPS6123822B2 JPS6123822B2 JP53016735A JP1673578A JPS6123822B2 JP S6123822 B2 JPS6123822 B2 JP S6123822B2 JP 53016735 A JP53016735 A JP 53016735A JP 1673578 A JP1673578 A JP 1673578A JP S6123822 B2 JPS6123822 B2 JP S6123822B2
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- weight
- ink composition
- compound
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- -1 acroyl groups Chemical group 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 239000005056 polyisocyanate Substances 0.000 claims description 5
- 229920001228 polyisocyanate Polymers 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 4
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 claims description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 3
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 3
- AQPHBYQUCKHJLT-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2,3,4,5,6-pentabromophenyl)benzene Chemical group BrC1=C(Br)C(Br)=C(Br)C(Br)=C1C1=C(Br)C(Br)=C(Br)C(Br)=C1Br AQPHBYQUCKHJLT-UHFFFAOYSA-N 0.000 claims description 2
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 claims description 2
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims 2
- 239000000976 ink Substances 0.000 description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 2
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- AOCLMTXQVVUTEB-UHFFFAOYSA-N (2-benzylphenyl)-phenylmethanone Chemical compound C=1C=CC=C(CC=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 AOCLMTXQVVUTEB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- JTDWCIXOEPQECG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC(C)(C)C Chemical compound N=C=O.N=C=O.CCCCCC(C)(C)C JTDWCIXOEPQECG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- PJQZQEHJIUZTHC-UHFFFAOYSA-N [3-(2-ethylhexoxy)-2-hydroxypropyl] prop-2-enoate Chemical compound CCCCC(CC)COCC(O)COC(=O)C=C PJQZQEHJIUZTHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- CWZPGMMKDANPKU-UHFFFAOYSA-L butyl-di(dodecanoyloxy)tin Chemical compound CCCC[Sn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O CWZPGMMKDANPKU-UHFFFAOYSA-L 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polymerisation Methods In General (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、紫外線硬化型インキ組成物に関する
ものであり、特にプリント配線用保護皮膜として
有用な難燃性の紫外線硬化型スクリーンインキ組
成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultraviolet curable ink composition, and particularly to a flame-retardant ultraviolet curable screen ink composition useful as a protective film for printed wiring.
近年、乾燥工程の合理化の面から、紫外線硬化
型インキが普及しつつあるが、プリント配線分野
においても、従来熱風乾燥していたエツチングレ
ジスト、ソルダーレジスト、保護皮膜等を紫外線
硬化型スクリーンインキに置き換える動きが活発
である。 In recent years, UV-curable inks have become popular in order to streamline the drying process, and in the printed wiring field, UV-curable screen inks are replacing etching resists, solder resists, protective films, etc. that were traditionally dried with hot air. It is active.
一方、プリント配線基板も、用途によつては従
来のガラス繊維強化エポキシ樹脂・不飽和ポリエ
ステルや、フエノール樹脂積層板など固い板状の
ものから、フレキシブルなフイルム状のもの、例
えば、ポリエステルフイルム、耐熱塩化ビニルフ
イルム、ポリイミドフイルム、ポリアミドフイル
ムなどが基材として使われるようになつて来た。 On the other hand, depending on the application, printed wiring boards range from hard plate-like materials such as conventional glass fiber-reinforced epoxy resin, unsaturated polyester, and phenolic resin laminates to flexible film-like materials such as polyester film, heat-resistant Vinyl chloride film, polyimide film, polyamide film, etc. have come to be used as base materials.
本発明者らは、特にこのようなフレキシブル基
板に対し、性能の優れた保護インキを開発すべく
検討を進めた結果、基材フイルムおよび配線部分
の銅への付着性、電気特性、可撓性、2次物性、
さらには、最近強く要求されている難燃性に優
れ、印刷適性も良好な紫外線硬化型スクリーンイ
ンキ組成物の開発に成功したものである。本発明
の要旨とするところは、
(A) ポリイソシアネート化合物とポリヒドロキシ
化合物およびヒドロキシアクリレートを反応し
て得られる1分子中に2個以上のアクロイル基
および2個以上のウレタン結合を有する化合物
40〜80重量%、
(B) アクリルモノマー 5〜30重量%、
(C) リン酸(メタ)アクリレート
0.1〜10重量%、
(D) 難燃化剤 5〜40重量%、
(E) 光重合開始剤 0.1〜10重量%
からなる混合物を主成分とする紫外線硬化型イン
キ組成物にある。 The inventors of the present invention have carried out studies to develop a protective ink with excellent performance, especially for such flexible substrates. , secondary physical properties,
Furthermore, we have succeeded in developing an ultraviolet curable screen ink composition that has excellent flame retardancy and printability, which have been strongly demanded recently. The gist of the present invention is as follows: (A) A compound having two or more acroyl groups and two or more urethane bonds in one molecule obtained by reacting a polyisocyanate compound, a polyhydroxy compound, and a hydroxyacrylate.
40-80% by weight, (B) acrylic monomer 5-30% by weight, (C) phosphoric acid (meth)acrylate
(D) a flame retardant 5-40% by weight; and (E) a photopolymerization initiator 0.1-10% by weight.
本発明の紫外線硬化型インキ組成物において使
用される化合物の具体例は次のようである。まず
(A)成分としてはポリイソシアネート化合物と鎖伸
長剤であるポリヒドロキシ化合物およびヒドロキ
シアクリレートとを反応してえられる1分子中に
2個以上のアクロイル基および2個以上のウレタ
ン結合を有する化合物であり、ポリイソシアネー
ト化合物としては、トリレンジイソシアネート、
キシリレンジイソシアネート、ヘキサメチレンジ
イソシアネート、4・4′ジフエニルメタンジイソ
シアネート、リジンイソシアネート、イソホロン
ジイソシアネート、ダイマー酸ジイソシアネー
ト、トリメチルヘキサンジイソシアネートなどが
挙げられ、これらと低分子ポリオールとの反応物
であるポリイソシアネート類も使用しうる。鎖伸
長剤であるポリヒドロキシ化合物としては、ネオ
ペンチルグリコール、2・2・4トリメチル1・
3ペンタンジオール、1・6ヘキサンジオール、
トリエチレングリコール、トリメチロールプロパ
ン、ペンタエリスリトール、ジペンタエリスリト
ール、ビスフエノールA、水素化ビスフエノール
A、水素化ビスフエノールAとエチレンオキサイ
ド、プロピレンオキサイドとの付加物、ポリカプ
ロラフトンジオール、末端ないし側鎖にヒドロキ
シル基を有する低分子ポリエステルポリオールな
どが挙げられる。 Specific examples of compounds used in the ultraviolet curable ink composition of the present invention are as follows. first
Component (A) is a compound having two or more acroyl groups and two or more urethane bonds in one molecule, which is obtained by reacting a polyisocyanate compound with a polyhydroxy compound as a chain extender and a hydroxyacrylate. , as the polyisocyanate compound, tolylene diisocyanate,
Examples include xylylene diisocyanate, hexamethylene diisocyanate, 4,4' diphenylmethane diisocyanate, lysine isocyanate, isophorone diisocyanate, dimer acid diisocyanate, trimethylhexane diisocyanate, and polyisocyanates that are reactants of these and low-molecular polyols. Can be used. Polyhydroxy compounds that are chain extenders include neopentyl glycol, 2, 2, 4 trimethyl 1,
3 pentanediol, 1.6 hexanediol,
Triethylene glycol, trimethylolpropane, pentaerythritol, dipentaerythritol, bisphenol A, hydrogenated bisphenol A, adducts of hydrogenated bisphenol A and ethylene oxide, propylene oxide, polycaprolaftertone diol, terminal or side chain Examples include low-molecular polyester polyols having hydroxyl groups.
また、ヒドロキシアクリレートとしては、2−
ヒドロキシエチルアクリレート、2−ヒドロキシ
プロピルアクリレート、2−ヒドロキシ−3−
(2−エチルヘキシルオキシ)プロピルアクリレ
ートなどが用いられる。 In addition, as hydroxyacrylate, 2-
Hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxy-3-
(2-ethylhexyloxy)propyl acrylate and the like are used.
このような(A)成分は、インキ皮膜の基本物性を
与える成分で、空気中の紫外線照射による硬化性
が良好であるとともに、皮膜に可撓性、強靭性を
与える成分である。 Component (A) is a component that provides the basic physical properties of the ink film, and is a component that has good curing properties when exposed to ultraviolet rays in the air, and also provides flexibility and toughness to the film.
(A)成分の使用量は40〜80重量%が好適で40%以
下では皮膜の可撓性が劣るし、80%以上では、(A)
成分自体の粘度が高いので、インキ組成物の粘度
が高くなり過ぎ印刷適性が不良となり好ましくな
い。 The amount of component (A) used is preferably 40 to 80% by weight; if it is less than 40%, the flexibility of the film will be poor, and if it is more than 80%, (A)
Since the viscosity of the components themselves is high, the viscosity of the ink composition becomes too high, resulting in poor printability, which is not preferable.
(B)成分であるアクリルモノマーは、反応性稀釈
剤として使用するものであるが、低揮発性である
とともに、硬化性、皮膜物性に悪影響を与えない
ものであることが必要で、テトラヒドロフルフリ
ルアクリレート、ベンジルアクリレート、セロソ
ルブアクリレート、2エチルヘキシルアクリレー
ト、エポキシステアリルアクリレートなどのアク
リルモノマー類が用いうるが、中でもテトラヒド
ロフルフリルアクリレート、セロソルブアクリレ
ート、2−エチルヘキシルアクリレートが極めて
良好な結果を与える。 The acrylic monomer, component (B), is used as a reactive diluent, but it must have low volatility and not have a negative effect on curability or film properties. Acrylic monomers such as acrylate, benzyl acrylate, cellosolve acrylate, 2-ethylhexyl acrylate, and epoxystearyl acrylate can be used, among which tetrahydrofurfuryl acrylate, cellosolve acrylate, and 2-ethylhexyl acrylate give very good results.
(B)成分の使用量は5〜30%が好適で、5%以下
では組成物の粘度低下が充分でないし、30%以上
では硬化性が低下し、さらに皮膜の強靭性も低下
するので望ましくない。 The amount of component (B) to be used is preferably 5 to 30%, and if it is less than 5%, the viscosity of the composition will not be reduced sufficiently, and if it is more than 30%, the curability will decrease and the toughness of the film will also decrease, so it is not desirable. do not have.
(C)成分であるリン酸(メタ)アクリレートとし
ては、次式で示される化合物が用いられる。 As the phosphoric acid (meth)acrylate which is component (C), a compound represented by the following formula is used.
(RはHまたはCH3、mは1、2、3、nは0、
1、2 m+n=3)
具体的には、リン酸1モルとヒドロキシエチル
アクリレートないしヒドロキシプロピルアクリレ
ート3モルとの縮合生成物が好適である。 (R is H or CH 3 , m is 1, 2, 3, n is 0,
1,2 m+n=3) Specifically, a condensation product of 1 mole of phosphoric acid and 3 moles of hydroxyethyl acrylate or hydroxypropyl acrylate is suitable.
このような(C)成分はプリント配線を形成する銅
への付着性向上剤であり、少量の添加で付着性が
著しく向上するが、過量であると硬化性および皮
膜の耐水性が低下するので、好適範囲は0.1〜10
%である。 Component (C) is an adhesion improver to the copper that forms printed wiring, and adding a small amount will significantly improve adhesion, but if it is added in excess, the curing properties and water resistance of the film will decrease. , the preferred range is 0.1 to 10
%.
次に(D)難燃化剤は、インキ組成物の紫外線硬化
性、皮膜の可撓性、強靭性、インキの印刷適性を
考慮して選択しなければならないが、リン酸エス
テル、ハロゲン化合物、リン−ハロゲン化合物、
無機化合物等、広範囲の化合物について、単独或
いは組合せ系につき検討したところ、リン系のも
のは硬化性、皮膜物性を低下させる傾向にあり、
また三酸化アンチモンのような無機系は紫外線透
過性が悪く、皮膜内部の硬化を著しく阻害させる
などの欠点があるが、ハロゲン化合物は比較的良
好であることが判つた。特に、ヘキサブロモベン
ゼン、デカブロモフエニール、デカブロモジフエ
ニルエーテルなどの臭素化芳香族化合物が最も良
い性能を与えるものであり、(A)成分に対する難燃
効果が大きく、硬化性にも殆んど影響なく、しか
も、これら化合物は微細な粉体であり、組成物に
分散させると、(A)成分の欠点である曵糸性をなく
する効果があり、そのためスクリーン印刷適性が
向上するので、特に望ましいものである。場合に
よつてはこれらの臭素化芳香族化合物の若干の低
臭素化物も使用しうる。このような(D)難燃化剤の
使用量は、難燃性、皮膜の可撓性の面から5〜40
%が適当である。 Next, (D) the flame retardant must be selected taking into consideration the ultraviolet curability of the ink composition, the flexibility and toughness of the film, and the printability of the ink, including phosphoric acid esters, halogen compounds, phosphorus-halogen compound,
When we examined a wide range of compounds, including inorganic compounds, either singly or in combination, we found that phosphorus-based compounds tend to reduce curing properties and film properties;
In addition, inorganic compounds such as antimony trioxide have drawbacks such as poor UV transmittance and significantly inhibit hardening of the inside of the film, but halogen compounds have been found to be relatively good. In particular, brominated aromatic compounds such as hexabromobenzene, decabromophenyl, and decabromodiphenyl ether provide the best performance, have a large flame retardant effect on component (A), and have little to no curability. Moreover, these compounds are fine powders, and when dispersed in a composition, they have the effect of eliminating the spinnability, which is a drawback of component (A), and therefore improve the suitability for screen printing. Particularly desirable. In some cases, some lower brominated versions of these brominated aromatic compounds may also be used. The amount of flame retardant (D) used is 5 to 40% in terms of flame retardancy and film flexibility.
% is appropriate.
また(E)光重合開始剤は、単独または組合せ系で
用いられるが、具体的にはベンゾインメチルエー
テル、ベンゾインエチルエーテル、ベンゾインイ
ソプロピルエーテル、ベンゾイン−n−ブチルエ
ーテル、ベンジルベンゾフエノン、クロルアンス
ラキノン、2・2ジエトキシアセトフエノン、ベ
ンゾフエノンと第3級アミンとの混合系などが挙
げられる。 The photopolymerization initiator (E) may be used alone or in combination, and specifically includes benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzylbenzophenone, chloranthraquinone, Examples include 2.2-diethoxyacetophenone and a mixed system of benzophenone and tertiary amine.
インキ組成物中に含まれる(E)光重合開始剤量は
0.1〜10%の範囲で用いるのが硬化速度および皮
膜特性の面で望ましい。 The amount of (E) photoinitiator contained in the ink composition is
It is desirable to use it in the range of 0.1 to 10% in terms of curing speed and film properties.
このようにして得られた紫外線硬化型インキ組
成物に対し、さらに付着性、可撓性、耐食性等を
向上させる目的で、熱可塑性樹脂を混合すること
も行われ、熱可塑性樹脂例とては、アクリルコポ
リマー、塩化ビニル−酢酸ビニルコポリマー、ポ
リエステル、ポリアミド、エポキシ樹脂等があ
る。 In order to further improve adhesion, flexibility, corrosion resistance, etc., a thermoplastic resin is mixed into the ultraviolet curable ink composition obtained in this way. Examples of thermoplastic resins include: , acrylic copolymers, vinyl chloride-vinyl acetate copolymers, polyesters, polyamides, epoxy resins, etc.
また、スクリーンインキとしての印刷適性を向
上させるためや、着色のため、通常の充填剤、消
泡剤、レペリング剤、曵糸性防止剤、染料、顔料
などを混合することも行われる。 Further, in order to improve printability as a screen ink or for coloring, ordinary fillers, antifoaming agents, repelling agents, anti-threading agents, dyes, pigments, etc. are also mixed.
本発明の紫外線硬化型インキ組成物の硬化に用
いられる光源としては、低圧水銀灯、高圧水銀
灯、アーク灯、クセノンランプ、ガリウムランプ
等、放射波長200〜450mμのランプが有効であ
る。 As the light source used for curing the ultraviolet curable ink composition of the present invention, lamps with a radiation wavelength of 200 to 450 mμ, such as low pressure mercury lamps, high pressure mercury lamps, arc lamps, xenon lamps, and gallium lamps, are effective.
以下実施例により、本発明の方法を詳しく説明
する。実施例中、部とあるのは重量部の意であ
る。 The method of the present invention will be explained in detail with reference to Examples below. In the examples, parts mean parts by weight.
実施例 1
ポリエーテル(アデカP−700、旭電化社製)
730部、キシリレンジイソシアネート280部、アク
リル酸2−ヒドロキシエチル230部、ジラウリン
酸n−ブチルスズ0.2部およびハイドロキノンモ
ノメチルエーテル0.2部を反応容器中、70℃、6
時間反応させ、ウレタンアクリレート化合物を得
た。Example 1 Polyether (ADEKA P-700, manufactured by Asahi Denka Co., Ltd.)
730 parts of xylylene diisocyanate, 280 parts of 2-hydroxyethyl acrylate, 0.2 parts of n-butyltin dilaurate, and 0.2 parts of hydroquinone monomethyl ether in a reaction vessel at 70°C.
The mixture was reacted for a period of time to obtain a urethane acrylate compound.
このウレタンアクリレート化合物65部、カルビ
トールアクリレート10部、デカブロモジフエニー
ル20部、トリスメタクリロキシホスフエート5
部、シアニンプルー1部、消泡剤1部およびベン
ゾインブチルエーテル3部を3本ロールを用いて
混練し、印刷適性良好な紫外線硬化型スクリーン
インキ組成物を得た。 65 parts of this urethane acrylate compound, 10 parts of carbitol acrylate, 20 parts of decabromodiphenyl, 5 parts of trismethacryloxyphosphate
1 part of cyanine blue, 1 part of antifoaming agent, and 3 parts of benzoin butyl ether were kneaded using three rolls to obtain an ultraviolet curable screen ink composition with good printability.
ポリイミドフイルムを基材とする銅プリント配
線板上に150メツシユスクリーンを用いて上記の
紫外線硬化型スクリーンインキ組成物を印刷し、
200W/inの高圧水銀灯2本を装着した紫外線照射
装置を用い、コンベア速度5m/minで照射し、
付着性、可撓性、難燃性、電気特性の優れた保護
被覆されたプリント配線板が得られた。 The above ultraviolet curable screen ink composition is printed on a copper printed wiring board based on polyimide film using a 150 mesh screen,
Using an ultraviolet irradiation device equipped with two 200W/in high-pressure mercury lamps, irradiation was carried out at a conveyor speed of 5m/min.
A protective coated printed wiring board with excellent adhesion, flexibility, flame retardancy, and electrical properties was obtained.
実施例 2
実施例1で用いたと同様のウレタンアクリレー
ト化合物40部、テトラヒドロフルフリルアクリレ
ート10部、デカブロモジフエニールエーテル30
部、トリスアクリロキシホスフエート5部、エポ
キシ樹脂(EPON1001、シエル社製)15部、炭酸
カルシウム5部、シアニングリーン1部、消泡剤
1部およびジエトキシアセトフエノン2部を混練
し、印刷適性の良好な紫外線硬化型インキ組成物
を得た。Example 2 40 parts of the same urethane acrylate compound used in Example 1, 10 parts of tetrahydrofurfuryl acrylate, 30 parts of decabromodiphenyl ether
1 part, trisacryloxyphosphate 5 parts, epoxy resin (EPON1001, manufactured by Ciel) 15 parts, calcium carbonate 5 parts, cyanine green 1 part, antifoaming agent 1 part and diethoxyacetophenone 2 parts were kneaded and printed. A UV-curable ink composition with good suitability was obtained.
ポリエステルフイルムを基材とする銅プリント
配線板上に、上記紫外線硬化型インキ組成物を実
施例1と同様に印刷し、硬化させたところ付着
性、可撓性、難燃性の良好な絶縁保護されたプリ
ント配線板が得られた。 When the above ultraviolet curable ink composition was printed on a copper printed wiring board based on polyester film in the same manner as in Example 1 and cured, insulation protection with good adhesion, flexibility, and flame retardancy was obtained. A printed wiring board was obtained.
Claims (1)
キシ化合物およびヒドロキシアクリレートを反
応して得られる1分子中に2個以上のアクロイ
ル基および2個以上のウレタン結合を有する化
合物 40〜80重量%、 (B) アクリルモノマー 5〜30重量%、 (C) リン酸(メタ)アクリレート
0.1〜10重量%、 (D) 難燃化剤 5〜40重量%、 (E) 光重合開始剤 0.1〜10重量% からなる混合物を主成分とする紫外線硬化型イン
キ組成物。 2 (B) アクリルモノマーがテトラヒドロフルフ
リルアクリレート、ベンジルアクリレート、セ
ロソルブアクリレート、2エチルヘキシルアク
リレート、エポキシステアリルアクリレートか
ら選ばれた1種または2種以上の混合物である
特許請求の範囲第1項記載の紫外線硬化型イン
キ組成物。 3 (D) 難燃化剤が、ヘキサブロモベンゼン、デ
カブロモジフエニール、デカブロモジフエニル
エーテルから選ばれた1種または2種以上の混
合物である特許請求の範囲第1項記載の紫外線
硬化型インキ組成物。[Scope of Claims] 1 (A) Compound having two or more acroyl groups and two or more urethane bonds in one molecule obtained by reacting a polyisocyanate compound with a polyhydroxy compound and a hydroxyacrylate 40 to 80 weight %, (B) Acrylic monomer 5-30% by weight, (C) Phosphoric acid (meth)acrylate
An ultraviolet curable ink composition whose main component is a mixture consisting of 0.1 to 10% by weight, (D) 5 to 40% by weight of a flame retardant, and (E) 0.1 to 10% by weight of a photopolymerization initiator. 2 (B) The ultraviolet curing method according to claim 1, wherein the acrylic monomer is one or a mixture of two or more selected from tetrahydrofurfuryl acrylate, benzyl acrylate, cellosolve acrylate, 2-ethylhexyl acrylate, and epoxystearyl acrylate. Type ink composition. 3 (D) The ultraviolet curing method according to claim 1, wherein the flame retardant is one or a mixture of two or more selected from hexabromobenzene, decabromodiphenyl, and decabromodiphenyl ether. Type ink composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1673578A JPS54110002A (en) | 1978-02-16 | 1978-02-16 | Ultraviolettrayysetting ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1673578A JPS54110002A (en) | 1978-02-16 | 1978-02-16 | Ultraviolettrayysetting ink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54110002A JPS54110002A (en) | 1979-08-29 |
| JPS6123822B2 true JPS6123822B2 (en) | 1986-06-07 |
Family
ID=11924517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1673578A Granted JPS54110002A (en) | 1978-02-16 | 1978-02-16 | Ultraviolettrayysetting ink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54110002A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000050527A1 (en) * | 1999-02-25 | 2000-08-31 | Lord Corporation | Coating method utilizing unsaturated phosphoric acid triesters |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5699210A (en) * | 1980-01-14 | 1981-08-10 | Asahi Chem Ind Co Ltd | Photosensitive resin composition |
| DE3136818C2 (en) * | 1980-09-19 | 1990-08-02 | Hitachi Chemical Co., Ltd., Tokio/Tokyo | Use of a photosensitive mixture and a photosensitive recording material for forming a solder mask |
| JPS5764734A (en) * | 1980-10-08 | 1982-04-20 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element |
| JPS57134493A (en) * | 1981-02-12 | 1982-08-19 | Sankin Kogyo Kk | Phosphoric ester derivative |
| JPH04106167A (en) * | 1990-08-28 | 1992-04-08 | Hayakawa Rubber Co Ltd | Radiation-curable ink composition |
| JP2006328227A (en) * | 2005-05-26 | 2006-12-07 | Fujifilm Holdings Corp | Ink composition, image-forming method and recorded article |
| JP5733911B2 (en) * | 2009-05-21 | 2015-06-10 | 日本合成化学工業株式会社 | Active energy ray-curable inkjet ink composition and inkjet ink resin composition |
-
1978
- 1978-02-16 JP JP1673578A patent/JPS54110002A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000050527A1 (en) * | 1999-02-25 | 2000-08-31 | Lord Corporation | Coating method utilizing unsaturated phosphoric acid triesters |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54110002A (en) | 1979-08-29 |
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