JPS6124192B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a head portion in an inkjet recording device.

A plan view of the head structure of a conventional inkjet recording apparatus is shown in FIG. 1a, and a partial sectional view is shown in FIG. 1b. In the conventional head, a pair of substrates 100 and 110 are bonded, for example, with an adhesive, and between the substrates is an ink reservoir 1, and an ink supply path 3 communicating therewith. An ink chamber 2 and nozzle 4 were formed. Note that 100 parts of the substrate corresponding to the ink chamber 2 are provided with electrical and mechanical conversion elements. However, it is difficult to perform high-density printing with such heads. It had drawbacks such as being able to print only in one color.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-nozzle head that eliminates these drawbacks and is capable of high-density printing and recording of multiple colors with one head.

The double-sided multihead of the inkjet recording device of the present invention has a second substrate bonded to one side of the first substrate and a third substrate bonded to the other side, and a plurality of ink chambers and ink cartridges are provided between each of the substrates. In a double-sided multi-head of an inkjet recording device in which a supply path is formed, the first and second substrates and the first
and a third substrate, a metal solder layer is applied to an outer portion of the contour of the ink chamber and the ink supply path on one opposing surface of the third substrate, and a metal solder layer is applied to at least an outer portion of the contour of the other opposing substrate surface. form,
The second and third substrates were joined to the first substrate through the metal solder layer, and the ink chamber and ink supply path were formed between the substrates along the contour shape of the metal solder layer. It is characterized by

This will be explained below using the drawings.

FIG. 2 is a basic diagram for explaining the structure of the head of the present invention, in which a shows a plan view of the head and b shows a partial sectional view thereof. Middle board 9, upper board 10, lower board 1
1 is made of glass, ceramic, crystal, metal, or the like. Nozzles 8, ink supply channels 6, ink reservoirs 5, and ink chambers 7 are formed on both sides of the substrate 9 by plating, etching, machining, etc.
form etc. Further, on one side of the substrates 10 and 11, a nozzle 8, an ink supply path 6, an ink reservoir 5, and an ink chamber 7 are formed by a plating layer, etching, machining, etc. The combination of these substrates (plated layer only, etched and plated layer, machining and plated layer) made it possible to record multiple colors with one head.

Figures 3a, b and c show an example of how to assemble this head.

Solder plating 15 as shown in the shaded area in Figure 2
The middle substrate 9 (FIG. 3 b) on which the metal layer is formed, the upper substrate (FIG. 3 a), and the lower substrate 11 (FIG. 3 b) are stacked one on top of the other, and the whole is heated to 350° C. to 500° C. or pressurized and heated. If done at the same time, the solder-plated parts will melt and form a strong solder layer to bond the substrates together. The portion surrounded by the solder layer forms a space for an internal ink chamber, a nozzle, an ink supply path, and the like. In addition, 1
2 is a hole that supplies ink to the internal ink chamber;
It is connected to an ink supply source by a tube 13 or the like. Furthermore, the piezoelectric vibrator 14 is fixed directly above the ink chamber 7 in FIG. A detailed explanation of fusion bonding will be given below.

Figures 4a and 4b show the method of solder fusion bonding,
3 shows a part of the cross section of the head shown in FIGS. 2 and 3. FIG. Upper substrate 1 formed of glass as shown in FIG. 4a
In order to perform solder plating on one side of the lower substrate 11 made of 0 and glass and on both sides of the middle substrate 9 made of glass, a vapor deposited film 16 of Cr and Au is formed. Next, these middle substrates 9,
Cu is deposited on the vapor deposited film 16 of the upper substrate 10 and lower substrate 11.
Plating 17 is applied to several micrometers, and solder plating 15 is further applied thereon to several tens of micrometers to several hundred micrometers. (Select an appropriate value based on the design values of the nozzle shape, etc. in Figure 2.) These glass substrates are shown in Figure 4b.
By stacking them like this and heating the whole thing to 350℃~500℃ or applying pressure and heating at the same time,
The solder plating 15 portions are melted together to form a strong solder layer 18, bonding the glass substrates and forming a space 19.

Since this space 19 forms an ink chamber, an ink supply path, an ink reservoir, a nozzle, etc., protrusion of the plating layer 18 can be prevented by changing the pressure depending on the change in the plating thickness. Since a plurality of multi-nozzle ejection heads can be formed in one head in this way, the head configuration is capable of recording in a plurality of colors.

The head of the present invention can also be applied to color printing such as color images using multiple colors.

In this way, in the double-sided multi-head of the present invention, since the head is formed by joining metal layers, there is no protrusion of the joining member unlike adhesives, and a high-density head can be formed, making it possible to perform high-density printing and color recording. It is possible to provide a compact, double-sided multi-nozzle injection head with high density, which allows for the

[Brief explanation of the drawing]

FIG. 1a is a plan view of a conventional monochromatic multi-nozzle injection head, and FIG. 1b is a sectional view taken along line A-A' of a. Figure 2a
1 is a basic explanatory diagram of the inkjet recording apparatus of the present invention, and b is an individual sectional view taken along a-a' of a. FIGS. 3a, 3b and 3c are assembly diagrams of the head of the inkjet recording apparatus of the present invention. FIGS. 4a and 4b are sectional views showing a method for assembling a head of an inkjet recording apparatus according to the present invention. 1, 5... Ink reservoir, 2, 7... Ink chamber, 3,
6... Ink supply path, 4, 8... Nozzle, 9... Middle substrate, 10... Upper substrate, 11... Lower substrate, 12... Hole, 1
3...Tube, 14...Piezoelectric vibrator, 15...Solder plating, 16...Vapor deposited film, 17...Cu plating, 18...Solder, 19...Space.

Claims (1)

[Claims] 1 A double-sided inkjet recording device in which a second substrate is bonded to one side of a first substrate and a third substrate is bonded to the other side, and a plurality of ink chambers and ink supply paths are formed between each of the substrates. In the multi-head, a metal solder layer is applied to outer portions of the contours of the ink chamber and the ink supply path on opposing surfaces of one of the first and second substrates and the first and third substrates; forming a metal solder layer on at least an outer portion of the contour shape on the substrate surface;
and a third substrate is bonded to the first substrate and the metal solder layer, and the ink chamber and the ink supply path are formed between the substrates along the contour shape of the metal solder layer. A double-sided multi-head inkjet recording device.