JPS6124971B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a molding die device for resin-sealing semiconductor elements such as semiconductor integrated circuits.

Conventionally, this type of mold apparatus has been designed as shown in FIGS. 1 and 2, which are perspective views of a lower mold part and an upper mold part. In FIG. 1, numeral 1 denotes a lower mold section, which consists of a lower mold cavity block 2, a center block 3, and a heating block 4 to which these are attached. 5 is an injection port receiving part from which the injected resin is distributed; 6
1 is a flow path, and 7 is a cavity portion provided at a number of locations, the inlet of which is restricted by a gate portion 8. 9
A positioning pin, a cavity block 2, and a center block 3 are provided with a plurality of bolt holes 10 and counterbores 11 for alignment with the upper mold part, and are each attached to the heating block 4 by mounting bolts 12.

Next, in FIG. 2, reference numeral 13 indicates an upper mold part, which includes a cavity block 14 and a center block 15 of the upper mold.
and a heating block 16 to which these are attached. 17 is a resin injection port, 18 is a cavity portion of the upper mold provided at multiple locations corresponding to the cavity portion 7 of the lower mold, and 19 is a positioning hole for matching with the lower mold portion, into which the positioning pin 9 is inserted. . The cavity block 14 and center block 15 are provided with a plurality of bolt holes 10 and counterbores 11, and are each attached to the heating block 16 by mounting bolts 12.

The upper mold part 13 is stacked on the lower mold part 1, semiconductor elements (not shown) are placed in both cavity parts 7 and 18, and the lower mold part 1 and the upper mold part 13 are combined. The resin is heated by the heating blocks 4 and 16, and the sealing resin is injected under pressure through the injection port 17 and cured to form a resin-sealed package for the semiconductor device.

In the conventional device described above, the cavity portions 7, 1
If the position of the lead frame of the semiconductor element placed in the lead frame 8 was shifted, the injected resin would leak from the cavities 7 and 18 and the flow path 6 and flow into the counterbores 11 and 11. Further, when the resin sealing was completed, the upper mold part 13 was removed from the lower mold part 1, and both were washed with a cleaning liquid, the washed resin flowed into the counterbores 11, 11. Therefore, later, the lower mold part 1 and the upper mold part 13
When disassembling each for maintenance or repair, it becomes difficult to remove the mounting bolts 12, requiring a great deal of time and effort.

In this invention, a sealing member is removably fitted into a counterbore into which the head of a bolt is sunk for attaching each cavity block and center block of a lower mold part and an upper mold part to each corresponding heating block. The top of the sealing member protrudes from the top surface of the counterbore, which prevents resin during injection and resin removed during cleaning from flowing into the counterbore, reduces the top of the sealing member from being covered with leaked resin, and prevents the bottom of the mold from being covered with leaking resin. The purpose is to facilitate the disassembly of the upper mold part.

FIG. 3 is a longitudinal cross-sectional view of the mounting bolt part of the lower mold part of a mold apparatus showing an embodiment of the present invention, and the lower mold part 1 is the same as the conventional apparatus described above, and 1 to 12 are shown in FIG. 1. This is the same as the conventional device, so the explanation will be omitted. 20
A sealing member is fitted into the counterbore 11 for the mounting bolt 12, and is formed by directly injecting a heat-resistant resin such as silicone resin in liquid form and hardening it to exhibit rubber-like elasticity and be easily removed.

The top of this sealing member 20 protrudes from the top surface of the counterbore 11 (lower than the top surfaces of the cavity block 2 and center block 3) to reduce the amount of leaked resin covering the top during injection, and to reduce the amount of resin leaked during injection. This facilitates the removal work of the sealing member 20.

In addition, when one embodiment of the present invention is applied, the upper mold part is also made of the same upper mold part 13 shown in FIG. .

FIG. 4 is a front view of a sealing member showing another embodiment of the present invention, in which the sealing member 26 is made of heat-resistant synthetic resin (for example, silicone resin, fluororesin),
It is removably fitted into the cavity parts 2, 14 of the lower mold part and the upper mold part and the counterbore 11 of the center blocks 3, 15, and prevents the inflow of injected resin and the inflow of removed resin during cleaning. The sealing member 26 is a push-in plug with a head, and the top is counterbore 11.
protrudes from the top surface of the

FIG. 5 is a cross-sectional view of a mounting bolt portion of the lower mold part of a mold apparatus showing another different embodiment of the present invention, in which numerals 4 to 10 and 12 are the same as those in the conventional apparatus. The lower mold section 21 consists of a cavity block 22, a center block 23, and a heating block 4 to which these are attached. 24 is a counterbore into which the head of the mounting bolt 12 is sunk, and is provided with a female thread 24a. A sealing member 25 is screwed into the female thread 24a and is a screw-in plug, the top of which protrudes from the upper surface of the counterbore 24. This sealing member 25 is made of a heat-resistant synthetic resin such as a silicone resin or a fluororesin, and is designed to withstand the heating of the mold, be easily removed during disassembly, and preferably has elasticity.

Furthermore, female threads 24a are provided in the cavity block and center block of the upper mold part in the counterbore for the mounting bolt 12 in the same manner as shown in FIG.
Screw in and seal. In this way, the counterbore of all the mounting bolts 12 in the lower mold part and the upper mold part are closed with the sealing member 25.

As described above, according to the present invention, the sealing member is removably inserted into the counterbore for the mounting bolt that attaches each cavity block and center block of the lower mold part and the upper mold part to each heating block. This prevents leaked injection resin and resin removed during cleaning from flowing into the counterbore, and facilitates disassembly of the upper and lower mold parts.

Further, since the top of the sealing member protrudes from the upper surface of the counterbore, the top is less likely to be covered with leaked resin, and the removal work of the sealing member is facilitated.

[Brief explanation of the drawing]

1 and 2 are perspective views of a lower mold part and an upper mold part of a conventional molding die apparatus, and FIG. 3 is a perspective view of a mounting bolt part of the lower mold part of a molding die apparatus according to an embodiment of the present invention. 4 is a front view of a sealing member showing another embodiment of the present invention, and FIG. 5 is a longitudinal sectional view of a mounting bolt portion of the lower mold part of a molding die device according to another different embodiment of the present invention. It is a front view. 1... Lower mold part, 2... Cavity block, 3
...Center block, 4...Heating block, 7...
...Cavity part, 11...Counterbore, 12...Mounting bolt, 13...Upper mold part, 14...Cavity block, 15...Center block, 16...Heating block, 18...Cavity part, 20... ... Sealing member, 21 ... Lower mold part, 22 ... Cavity block, 23 ... Center block, 24 ... Counterbore, 24a ... Female thread, 25 ... Sealing member, 26
...Blocking member. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] 1. A lower mold part in which a cavity block and a center block provided with a plurality of cavity parts are attached to a heating block by mounting bolts, and a plurality of mold parts corresponding to each cavity part of this lower mold part. A cavity block and a center block are attached to the heating block with mounting bolts, and an upper mold part is overlapped and joined to the lower mold part, and both of the cavity blocks and the center block are attached to the heating block with mounting bolts. A bolt counterbore is provided on the overlapping side of the block, and the head of the above-mentioned mounting bolt is sunk into it.
In the mold device for resin-sealing the semiconductor elements placed in both of the cavity parts by molding and curing the injected resin, in the counterbore for each of the bolts of both the cavity blocks and the center block, A resin for a semiconductor element, characterized in that a sealing member made of a heat-resistant synthetic resin material is removably fitted and sealed to prevent intrusion of leaked resin due to the injection, and the top of the sealing member protrudes from the upper surface of the counterbore. Sealing mold equipment. 2. The semiconductor device according to claim 1, wherein the sealing member is formed by injecting liquid synthetic resin into the bolt counterbore and curing it, and has rubber-like elasticity and is removable. Resin sealing mold equipment. 3. The resin-sealing mold device for a semiconductor element according to claim 1, wherein the sealing member is a push-in plug having a head. 4. A mold for resin-sealing a semiconductor element according to claim 1, wherein a counterbore for the bolt is provided with an internal thread, and the sealing member is made of a threaded plug and is screwed into the counterbore. Device.