JPS6127465B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sputtering apparatus, and particularly to a sputtering apparatus suitable for using a ferromagnetic material as a target.

Sputtering equipment is widely used to create thin films of metals or non-metals. In these devices, a magnetic field with a component parallel to the target surface is used in front of the target in order to increase the speed of sputtering and increase the efficiency of film formation. It uses the magnetic field that passes through the target and emerges from the surface.

However, when the target is a ferromagnetic material, the influence of the magnetic pole on the back surface of the target is difficult to reach the front surface. For this reason, various ideas have been devised to utilize magnetic fields when sputtering ferromagnetic materials. One method is to place the magnetic pole in front of the target. However, in this case, there is a risk that the material on the magnetic pole surface will be sputtered, so to avoid this, the magnetic pole portion is covered with a material that is compositionally the same or similar to the target.

In the sputtering device that covers the magnetic pole in this manner, it is possible to sputter the ferromagnetic material at a certain speed, and it is also possible to prevent the magnetic pole itself from being sputtered. However, if the sputtering speed was further increased, the temperature of the material covering the magnetic pole would increase, which would further increase the temperature of the magnetic pole, which would adversely affect the characteristics.

Therefore, an object of the present invention is to arrange a magnetic pole in front of a target as described above, and to cover the front surface of this magnetic pole with a material that is compositionally the same as or similar to that of the target, and in addition, the covered material and the magnetic pole are An object of the present invention is to provide an apparatus that can suppress the temperature rise during sputtering of ferromagnetic materials, and can therefore sputter ferromagnetic materials at a higher speed.

For this reason, a part of the apparatus of the present invention has the following configuration. That is, a metal block with excellent thermal conductivity and at least a non-ferromagnetic material is placed surrounding or along the magnetic pole on the front side of a target made of a ferromagnetic material, and both the top surface of this block and the magnetic pole aligned with the block are placed. A magnetic pole cover of the same or similar composition as the target material is applied to cover the target material. It is important that the metal block is in close contact with both the magnetic pole cover and the target surface or the metal part of the base that holds the target.

Next, a detailed description will be given with reference to the drawings.

FIG. 1 is a cross-sectional view of the configuration of an embodiment of the present invention. In FIG. 1, a base 1 made of magnetic stainless steel has an annular magnet 2 near its outer periphery, a columnar magnet 3 in the center, a target 4 made of permalloy, etc. attached thereto. Further, on this base 1, an annular copper block 5 is disposed along the inside of the annular magnet 2, and columnar copper blocks 6 are disposed at several locations on the outside of the magnet 2 in contact with the magnet 2. Further, there is a copper block 7 surrounding the central columnar magnet 3.

An annular cover 8 is placed over the magnetic pole surface of the magnet 2 and the top surfaces of the copper blocks 5 and 6. This cover 8 is made of the same material as the target 4.
A magnetic pole cover 9 made of the same material is also placed over the magnetic pole face of the central magnet 3 and the steel block 7 surrounding it. What is important when constructing these is to assemble them so that the magnetic pole covers 8, 9 and the copper blocks 5, 6 are in close contact with each other, and the copper blocks and the base 1 are in close contact with each other so as not to impair heat conduction. This can be done by making the height of the annular magnets 2 and 3 slightly lower than the height of the copper blocks 5 and 6, respectively, since the base has considerable magnetism, so that the covers 8 and 9 and the base 1 can be magnetized. This can be easily achieved by strongly attracting each other through 2 and 3. Note that since the purpose of the magnet is to create a magnetic field parallel to the target in front of the target, the magnets and the magnet 3 are naturally magnetized in opposite directions. Furthermore, the base 1 can be cooled with water.

In the example shown in FIG. 1, the magnetic pole covers 8 and 9 were sufficiently cooled, and no temperature rise that would affect the characteristics of the magnets 2 and 3 was observed.

FIG. 2 is a cross-sectional view of the structure of another embodiment of the present invention. In Figure 2, target 14
is embedded in a base 11 equipped with a cooling mechanism, and the other part of the base 11 is a ring-shaped magnet 12, and a ring-shaped copper block placed closely along both the inner and outer surfaces of this magnet 12. A magnet 13 at the center of 15 and 15', a copper block 17 surrounding the magnet, etc. are attached. These pole covers 18 and 19, which are made of the same material as the target covering the pole faces and the copper block, are substantially the same as in the previously described embodiment. This example also has an excellent cooling effect,
Therefore, it was easy to increase the speed of sputtering.

FIG. 3 is a cross-sectional view of a configuration of still another embodiment of the present invention. In Figure 3, target 24
constitutes a base (corresponding to 1 in Fig. 2) equipped with a cooling mechanism, and other parts are the same as the embodiment shown in Fig. 2. In this embodiment, the target 24 serves as a base, which simplifies the structure and provides an excellent cooling effect, making it easy to increase the sputtering speed.

As is clear from the above embodiments, in the present invention, the heat generated in the metal plates covering the magnetic poles is quickly guided to the cooling mechanism of the base through the copper block. Therefore, as explained in the description of the embodiment, the metal plate of the magnetic pole cover and the copper block or the copper block and the base part are in close surface contact,
Very low resistance to heat conduction.

Although copper was used as the material for the blocks in the above-described embodiments, any metal with excellent thermal conductivity can be used instead of copper. For example, aluminum gives good results, but other metals may also be used. Also, the shape of the block and the part to which it is attached can be modified in many ways, but the heat generated in the metal plate covering the magnetic pole placed in front of the target can be transferred to the cooling section through the metal block with good heat conduction. It is clear that all sputtering devices with ejection mechanisms are within the scope of the present invention.

[Brief explanation of the drawing]

FIG. 1, FIG. 2, and FIG. 3 are all cross-sectional views showing the configuration of an embodiment of the present invention. Explanation of symbols: 1 represents the base, 2 represents the ring magnet, 3 represents the columnar magnet, 4 represents the target, 5, 5', 6 and 7 represent the copper block, 8 and 9 represent the magnetic pole cover, and 14 and 24 represent the target, respectively. ing.

Claims (1)

[Claims] 1. At least one pair of magnetic poles is provided in close proximity to a target made of a ferromagnetic material, at least a part of the magnetic poles is placed in front of the target, and the part of the magnetic pole that appears in front of the target is provided with the target. A magnetic pole cover made of the same or similar material is provided, and a metal having good thermal conductivity and at least not a ferromagnetic material is provided between the magnetic pole cover and a target close to the magnetic pole or a base on which the target is placed. A sputtering device characterized by closely interposing blocks of.