JPS6128491B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a flower pot molded from wet ceramic raw materials;
This invention relates to a mold release method for molded materials such as flower pots, which allows deep objects such as tile roof tiles and objects with many irregularities to be released from the mold without using a mold release agent.

Conventionally, mold release agents have been applied to the surface of the molding molds for deep products and ceramic products with many irregularities, as mold release is particularly difficult. It has drawbacks such as entrainment of the molding agent, resulting in wrinkles and cuts after drying, and the release agent coating layer peels off as the clay moves, making it impossible to expect a mold-releasing effect.

For example, when molding the flower pot shown in Figure 1, the mold release agent gets caught up at the edge where the clay gathers at the end, resulting in many wrinkles and cuts. When the clay peels off, it sticks directly to the mold, making it difficult to release it.

Furthermore, in the molding of the ring-shaped tiles shown in Figures 2 to 4, when the ring-shaped part shown in Figure 3 is filled with clay, the mold release agent gets caught up, causing cuts around the ring-shaped part. Occur.

Furthermore, in the molding of the Onigawara tiles shown in Figures 5 and 6, the parts with many irregularities and deeply molded parts are cut due to the involvement of the mold release agent, and the part where the backing plate is pasted contains the mold release agent. If the back plate does not stick properly, it will break. Furthermore, in the molding of the Manju Arabesque tiles shown in Figure 7 and the sleeve tiles shown in Figures 8 and 9, the release agent is similarly involved in a large part of the movement of the clay, causing peeling, wrinkles, Cuts, etc. occur.

As mentioned above, the use of a mold release agent during molding is indispensable in order to facilitate mold release, but when molding deep objects, etc., mold release agents are not necessary because they can cause various troubles. Development of a mold release method is desired.

In view of this drawback, the present invention applies a direct current between the upper mold, the lower mold, and the receiving mold to collect moisture in the molded material on the negative electrode side by electroosmotic action, and to compress the moisture in the parts that are not electrolytically released. An embodiment of the present invention will be described below based on the drawings, in an attempt to solve the above-mentioned drawbacks by supplying air and releasing the molded base without using a mold release agent. Fig. 10 shows the molding state of the flower pot, with 1 being the upper mold attached to the press ram 2 of the press molding machine, 3 being the lower mold being attached to the bed 4, and molding starting from the joint 6 of the upper mold 1 to the lower mold 3. An air-permeable insulating material 7 such as plaster is inserted across the edge molding part 6 of the base material W to insulate and separate the upper mold 1 and the lower mold 3, and the insulating material 7 is provided with an air supply port for supplying compressed air. 8 are connected. The insulator 7 may be formed of Bakelite or the like if forced mold release using compressed air is not required in the lip molding portion 6.

Reference numeral 9 designates an excess clay reservoir formed at the joint 5 between the upper mold 1 and the lower mold 3, and 10 represents an O-ring.

Reference numeral 11 designates a first DC power supply section, the positive electrode of which is connected to the upper mold 1 and the negative electrode connected to the lower mold 3, and a second power supply section 12 is separately provided, the positive electrode of which receives the molded material W. At the same time, the negative electrode is connected to the upper mold 1.

Next, to explain the operation, when the upper mold 1 is lowered and the molded material W is compression-molded between the upper mold 1 and the lower mold 3, the molded material W is compressed between the upper mold 1 and the lower mold 3 by the first DC power supply section 11. Current flows through W, and moisture in the molding base W gathers on the surface of the lower mold 8, which is the negative electrode side, due to electroosmotic action, so that a state is created in which mold release is easy between the lower mold 3 and the molding base W. . And upper mold 1
is raised to make the molding base W thinner than the lower mold 3, and then the upper mold 1 is inserted into the receiving mold 13 waiting at the take-out position.
As a result, a current flows between the upper mold 1 and the receiving mold 18 via the molding base W, and this time the upper mold 1 side becomes a negative electrode, so the moisture in the molding base W collects on the surface of the upper mold 1 and separates. The air supply port 8 is in a state where molding is easy and the edge of the mouth is not electrically released due to the interposition of the insulator 7.
The compressed air that has been press-fitted passes through the insulator 7 and blows out from the rim molding part 9, making it easy to release the mold, and then by raising the upper mold 1, the molded material W is taken out onto the receiving mold 13. .

Further, FIG. 13 shows another specific embodiment of the present invention, in which the molded base W can be smoothly released from the mold by electrical release during the molding of sleeve tiles. Thin plate-shaped insulators 15, 15', etc. are interposed on the upper surface and side surfaces of the mold 14 to insulate and separate them from the lower mold 16, or to prevent wear on the sliding contact portions of the side surfaces of the upper mold 14 with the lower mold 16. Therefore, a metal face plate 18 is used with an insulator 17 interposed therebetween.

In this embodiment, during the molding and mold release operations, the upper mold 14 side is released first;
The negative electrode of the first DC power supply unit 11 is connected to the upper mold 14, and the positive electrode is connected to the lower mold 16,
Moisture is collected on the contact surface between the upper mold 14 and the molding base W, and due to the action of the film of the collected water, as the upper mold 14 rises, the molding base W does not adhere to the upper mold 14 side and smoothly moves. It is configured to perform a mold release operation.

When releasing the flower pot from the mold, the insulator 7 is used to supply compressed air to the edge of the pot which is not electrically released. In this embodiment applied to roof tiles, the insulators 15, 15, . . . or the face plate 18 are in the form of thin plates, and the portion where electrical release does not act is small, so blowing compressed air is not particularly necessary.

In short, the present invention provides an upper mold 1 for molding flower pots, etc.
The positive electrode of the first DC power source 11 is connected to the lower electrode 3, and the molding base W is molded between the upper mold 1 and the lower mold 3. The upper mold 1 is raised and lowered. After releasing the molded material W from the mold 3, the positive electrode of the second DC power supply section 12 is connected to the receiving mold 13, and the negative electrode is connected to the upper mold 1, and the molded material WW is released together with the upper mold 1 into the receiving mold 13. Insert it inside,
In addition, an insulator 7 having air permeability is interposed in the edge molding part 6 of the upper mold 1 corresponding to the edge of the molding base W.
After that, pressurized air is blown out through the upper mold 1.
Since the molded base material W is taken out into the receiving mold 13 by raising the molding body W, when the upper mold 1 is raised after molding, the upper mold 1
Due to the electroosmotic action between the lower mold 3 and the lower mold 3, moisture in the molding base W gathers on the surface of the lower mold 3 on the negative electrode side, making it easier to release the mold from the lower mold 3. When taking out to 13, upper mold 1 and receiving mold 13
Due to the electroosmotic action between them, moisture collects on the surface of the receiving mold 13 on the negative electrode side, resulting in a mold release state, and through the insulator 7 having air permeability, the opening of the molding base W which is not electrolytically released. Since compressed air is supplied to the edges, the molded material W can be smoothly taken out to the receiving mold 13, and the upper mold 1,
Since there is no need to apply a mold release agent to the surface of the lower mold 3, it is possible to reduce costs and improve quality, and it also contributes to improving the working environment, which has great practical effects.

[Brief explanation of the drawing]

The figure shows one embodiment of the present invention.
9 to 9 are diagrams showing examples of defective products produced by the conventional mold release method.
The figure shows another embodiment. 1...upper mold, 3...lower mold.

Claims (1)

[Claims] 1. Connecting the positive electrode of the first DC power supply unit to the upper mold for molding a flower pot, etc., and connecting the negative electrode to the lower mold, and forming a molding base between the upper mold and the lower mold. death,
After the upper mold is raised and the molded material is released from the lower mold, the positive electrode of the second DC power supply section is connected to the receiving mold, and the negative electrode is connected to the upper mold, and the molded material is released together with the upper mold into the receiving mold. compressed air is blown out through a breathable insulator inserted into the molded part of the upper mold which corresponds to the rim of the molded material, and then the upper mold is raised to receive the molded material. A method for releasing a molded material for a flower pot, etc., which is characterized in that it is taken out into a mold. 2 The molding molds are the upper mold and lower mold for molding sleeve tiles,
The negative electrode of the first linear power supply section is brought into contact with the upper mold, and the positive electrode is connected with the lower mold, and after molding is performed between the upper mold and the lower mold, the upper mold is released. A method for releasing a molded material such as a flowerpot according to claim 1.