JPS6128640B2 - - Google Patents
Info
- Publication number
- JPS6128640B2 JPS6128640B2 JP14969380A JP14969380A JPS6128640B2 JP S6128640 B2 JPS6128640 B2 JP S6128640B2 JP 14969380 A JP14969380 A JP 14969380A JP 14969380 A JP14969380 A JP 14969380A JP S6128640 B2 JPS6128640 B2 JP S6128640B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- growth
- temperature
- znse
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- 239000013078 crystal Substances 0.000 claims description 199
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 40
- 238000001556 precipitation Methods 0.000 claims description 39
- 239000002904 solvent Substances 0.000 claims description 27
- 239000007791 liquid phase Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002109 crystal growth method Methods 0.000 claims 3
- 239000010453 quartz Substances 0.000 description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 36
- 239000003708 ampul Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 238000009826 distribution Methods 0.000 description 22
- 150000001875 compounds Chemical class 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000012535 impurity Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052711 selenium Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 6
- 229910052714 tellurium Inorganic materials 0.000 description 6
- 238000005275 alloying Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000008710 crystal-8 Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000953 kanthal Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
本発明は、−族間化合物半導体の結晶成長
に関し、特に溶液を用いた−族間化合物半導
体の結晶成長法及び成長装置に関する。
−族間化合物半導体は、直接遷移型でかつ
禁制帯幅が大きい特徴を有しているので、−
族間化合物半導体では得られない特性を得ること
ができる魅力的な材料である。表に得られる結
晶の電気伝導形と禁制帯幅とを示す。
The present invention relates to crystal growth of -intergroup compound semiconductors, and more particularly to a method and a growth apparatus for crystal growth of -intergroup compound semiconductors using a solution. - Intergroup compound semiconductors are direct transition type and have a large forbidden band width, so -
It is an attractive material that can provide properties that cannot be obtained with intergroup compound semiconductors. The table shows the electrical conductivity type and forbidden band width of the crystal obtained.
【表】
−族間化合物半導体ほど研究が進んでいな
いために、特有の性質が十分に生かされていない
のが現状である。その代表的な結晶がZnSe、ZnS
であり、いづれの結晶も各構成元素の蒸気圧が高
く、かつ結晶の融点が高いので、一方の元素の蒸
気圧のみが高い−V族間化合物以上に結晶成長
条件の最適化の必要性があるわけである。しかし
ながら従来法では、−族間化合物の結晶成長
は高温高圧で行なう融液成長が一般的で、化学量
論的組成からの偏差についての考慮は全くなされ
ていなかつた。又比較的低温での成長が可能な
−族間化合物では主流を占めた融液成長法につ
いては、発展が遅れて殆んど開発の例をみなかつ
た。その原因としては、構成元素を溶液として用
いる成長法が余分な不純物を含まない結晶を得る
ためには最適であることは云うまでもないが、一
例としてZnSeにおいては、低温でZnSeの溶解度
が小さいことと、ZnSeの蒸気圧が比較的高いこ
とから、これらを溶媒とした溶液成長が用いられ
なかつた。そこで同じ族元素で、ZnSe、ZnSな
どに対して高溶解度性でかつ比較的低蒸気圧であ
ることからTeを溶媒として用いた溶液成長法が
開発された。しかしながらこの成長法では成長後
の結晶に数%のTeを含む、ZnSe1-xTexあるいは
ZnS1-xTexの組成を有する混晶が得られる。
以下、主に液相成長法によるZnSe単結晶の製
造方法について説明する。即ち、ZnSeは禁制帯
幅が2.8eVでpn接合が形成できれば効率の高い青
色発光ダイオードとして働くことが期待できる。
しかしながらZnSe中に数%ものTeが入つていれ
ば混晶ZnSe1-xTexとみなすべきであり、禁制帯
幅が減少して青色発光は得られなくなるし、また
TeとSeの原子半径が大きく異なるため結晶内部
歪の不均一により欠陥が発生し易くなる。従つて
できるだけTe含有量の少ない、実質的にZnSe結
晶とみなし得る結晶を得ることが望まれる。ま
た、たとえ実質的にZnSe結晶が得られたとして
もZnSe結晶はSeの蒸気圧が高いためSeの空格子
点が多く発生し、これがドナとして働くために通
常n形結晶しか得られず実用的なpn接合が得ら
れない。またSe空格子点と不純物が結びつくと
非発光中心として働く深い準位が形成されるの
で、たとえpn接合ができたとしても発光効率の
高いものは望めない。従つて、pn接合を得るこ
とのできるような完全性の高い結晶を成長する技
術が望まれている。
更に本発明者が、特開昭54−3798号において、
ZnSeの溶液成長として溶媒としてTe及びSeを用
いた方法を提供したが、この場合にも成長後の結
晶組成の精密な測定を行なうと、わずかなTeを
入れた溶媒を用いた場合にも析出する結晶には、
必ずTeが含有されたZnTe1-xSex結晶となつてお
り、構成元素以外の元素を溶媒として用いた場合
には溶媒元素が不純物として導入されるために、
成長した結晶の禁制帯幅が減少したり、Teの原
子半径が大きいために結晶中に格子歪を生じたり
するので、高純度かつ結晶欠陥の少ない結晶を成
長することが甚だしく困難であつた。
本発明は、この欠点を解消し、余分な不純物を
含まずかつ化学量論的組成からの偏差が少ない
ZnSe結晶を成長する方法及び成長装置を提供す
るものである。
以下に本発明の詳細な説明をする。
Zn、Se及びTeの温度−蒸気圧曲線を第1図
に、又表に各元素の融点、密度及び熱伝導率を
示す。[Table] - Currently, research on intergroup compound semiconductors is not as advanced as that of intergroup compound semiconductors, so their unique properties are not being fully utilized. The typical crystals are ZnSe and ZnS
Since each crystal has a high vapor pressure of each constituent element and a high melting point of the crystal, it is necessary to optimize the crystal growth conditions even more than for intergroup V compounds in which only one element has a high vapor pressure. There is a reason. However, in conventional methods, crystal growth of intergroup compounds is generally performed by melt growth at high temperature and pressure, and no consideration has been given to deviations from the stoichiometric composition. Furthermore, the melt growth method, which can be grown at relatively low temperatures and has been the mainstream for intergroup compounds, has been slow to develop and has hardly been developed. The reason for this is that, of course, the growth method using the constituent elements as a solution is optimal for obtaining crystals that do not contain extra impurities, but for example, in the case of ZnSe, the solubility of ZnSe is low at low temperatures. Because of this and the relatively high vapor pressure of ZnSe, solution growth using these as solvents could not be used. Therefore, a solution growth method using Te as a solvent was developed because it is an element in the same group as ZnSe, ZnS, etc., and has high solubility and relatively low vapor pressure. However, in this growth method, the grown crystal contains several percent of Te, ZnSe 1-x Te x or
A mixed crystal having the composition ZnS 1-x Te x is obtained. Hereinafter, a method for producing a ZnSe single crystal mainly using a liquid phase growth method will be explained. That is, ZnSe has a forbidden band width of 2.8 eV, and if a pn junction can be formed, it can be expected to work as a highly efficient blue light emitting diode.
However, if several percent of Te is contained in ZnSe, it should be considered as a mixed crystal ZnSe 1-x Te x , and the forbidden band width will decrease, making it impossible to obtain blue light emission.
Since the atomic radii of Te and Se are significantly different, defects are more likely to occur due to non-uniform strain within the crystal. Therefore, it is desirable to obtain a crystal that can be substantially regarded as a ZnSe crystal with as little Te content as possible. Furthermore, even if a ZnSe crystal is actually obtained, many Se vacancies occur in the ZnSe crystal due to the high vapor pressure of Se, and these act as donors, so usually only n-type crystals can be obtained, making it impractical. A good p-n junction cannot be obtained. Furthermore, when Se vacancies and impurities combine, a deep level is formed that acts as a non-luminescent center, so even if a pn junction is formed, high luminous efficiency cannot be expected. Therefore, there is a need for a technique for growing a highly perfect crystal that can form a pn junction. Furthermore, the present inventor, in Japanese Patent Application Laid-Open No. 54-3798,
We have provided a method using Te and Se as solvents for solution growth of ZnSe, but accurate measurement of the crystal composition after growth shows that precipitation occurs even when a solvent containing a small amount of Te is used. For crystals that
The ZnTe 1-x Se x crystal always contains Te, and if elements other than the constituent elements are used as a solvent, the solvent element will be introduced as an impurity.
It has been extremely difficult to grow crystals with high purity and few crystal defects because the forbidden band width of the grown crystal decreases and lattice distortion occurs in the crystal due to the large atomic radius of Te. The present invention eliminates this drawback, contains no extra impurities and has a small deviation from the stoichiometric composition.
A method and a growth apparatus for growing ZnSe crystals are provided. A detailed explanation of the present invention will be given below. Figure 1 shows the temperature-vapor pressure curves of Zn, Se and Te, and the table shows the melting point, density and thermal conductivity of each element.
【表】
ZnSeの構成元素のZn及びSeの性質を比較する
と蒸気圧はZnの方が低く、融点はSeの方が低
い。又密度dの関係はdSe<dZoSe<dZoであ
る。一方各元素に対するZnSe結晶の飽和溶解度
は報告されていないが、液相成長温度領域(600
〜800℃)では1%以下であると見積られるの
で、成長速度を上げるためには高温にする必要が
ある。しかしながら第1図から明らかなように
Zn及びSeの蒸気圧は、800℃以上ではかなり高
い。第1図からはずれた温度領域において、各曲
線を外挿して求めた、Zn及びSeの温度−蒸気圧
の関係及び、報告されているごく初期の相図より
求めたZnSeの溶解度を表に示す。[Table] Comparing the properties of Zn and Se, the constituent elements of ZnSe, Zn has a lower vapor pressure and Se has a lower melting point. Also, the relationship between the densities d is d Se <d Zo Se < d Zo . On the other hand, the saturation solubility of ZnSe crystals for each element has not been reported, but the liquid phase growth temperature region (600
It is estimated that it is less than 1% at temperatures (~800°C), so it is necessary to increase the temperature to increase the growth rate. However, as is clear from Figure 1,
The vapor pressures of Zn and Se are quite high above 800°C. The table shows the temperature-vapor pressure relationship of Zn and Se, determined by extrapolating each curve, and the solubility of ZnSe, determined from the very early phase diagram reported, in a temperature range that deviates from Figure 1. .
【表】【table】
【表】
表から明らかなように、Seを溶媒とするこ
とにより、ZnSeに対して同一の溶解度を有する
温度としては、Znの場合よりも200℃程度低温に
することができ、不純物の混入を最小限にできる
ので高純度結晶を得ることができる。更に重大な
利点としては、第1図でも明らかなように、従来
の成長法ではSeの蒸気圧がZnよりも高いので高
温で成長した結晶では、Seの不足した化学量論
的組成(stoichiometry)からの偏差が多い結晶
しか得られていなかつた。従つてSeを溶媒とす
ることによつてSeの不足を補い、化学量論的組
成からの偏差の少ないZnSe結晶を得ることがで
きることであり、Se圧の最適制御によつて従来
得られていなかつた低不純物密度のp形結晶の作
成も可能となる。
しかし、Seを溶媒として用いた場合の問題点
としては、成長温度を低くすることはできるが、
蒸気圧が高いこと及び適当な温度差を選ぶことに
ある。これを解決するために以下の操作を行なつ
た。
内径10mmφ程度の石英管を加工して石英ルツボ
を製作した場合には、肉厚2mm程度でも、8〜10
気圧程度の内圧には充分に耐えるので、比較的容
易に温度差の制御も可能である。しかしながら圧
力が10気圧を越えると、ルツボに歪、肉薄箇所が
ある場合には、爆発の危険が伴うので、石英ルツ
ボの外側から2重あるいは3重に空気、Ar、N2
などのガスで圧力を印加し、石英ルツボに加わる
実効的な圧力を低下させる操作が必要である。石
英ルツボの外側に圧力を印加した場合には、気体
の熱伝導率が圧力とともに比例して高くなるの
で、結晶析出部とソース結晶部との温度差の設定
が重要となる。
良好な結晶性を得るための成長条件には最適値
があり、これは、成長温度−蒸気圧−温度差−ル
ツボ周囲の圧力と相互に関連する。例えば、800
℃では、外部圧印加がなくても石英管が耐え得る
ので、40℃程度の温度差があれば良く、900℃
(Se圧は8500Torr)では、一重の圧力容器の外部
で20℃、1000℃(20240Torr)の成長では、温度
差は10℃程度が最も望ましい成長条件である。
又、ルツボ内の溶媒のSe及びソース結晶の
ZnSeの量に対しては強い限定はなく、ソース結
晶が存在すれば成長はするが、好ましい範囲とし
ては、溶媒のSe10gに対してZnSe2〜20g程度が
良い。
ソース結晶の設定法としては、種々あるが、表
に示すように比重の関係は、dSe<dZoSe<d
Zoなので、Seを溶媒として用いた場合には、
ZnSeが重いのでソース結晶の設定に工夫が必要
である。縦型ルツボを用いた場合には、ソース結
晶を上部に投入すると、下部の結晶析出部には、
温度差及び比重差により結晶が析出するわけであ
るが、比重差が比較的大きいので、溶媒に溶解し
た結晶が析出するだけでなく、ソース結晶自体が
析出部に移動してしまい大型単結晶の形成を阻害
することになる。そこで、大型単結晶を析出する
方法としては、Se及びZnSeの性質を考慮し、横
型構造にし、結晶析出部と、ソース結晶部の二室
を並べ、両室がSe溶媒によつて連結されかつ、
ソース結晶部にZnSeを沈めることによつて、Se
溶媒に溶解した結晶のみが、両室間の温度差によ
つて結晶析出部に移動するので、規則正しい結晶
成長機構によつて成長が進行することによつて大
型単結晶を成長することが可能となる。
以下に実施例を示し、具体的に説明する。
実施例 1
本発明に用いた結晶成長装置及び結晶成長時の
温度分布を第2図に示す。
結晶成長は、結晶成長装置の主要部分である炉
芯管1及びこの外周に巻いたヒータ線2により結
晶成長に必要な温度を与える。炉芯管1中に石英
製のアンプル11をカンタル線などの耐熱線(図
示せず)により石英アンプル上部のフツク10を
用いて吊り下げる。石英アンプル11の構造とし
ては、石英アンプル下部の結晶析出部15は単結
晶核が析出しやすい様に、開口角30゜〜60゜程度
の円錐状に形成する。更にアンプル上部からの熱
が結晶析出部15の先端を通りアンプル外部に流
れるように、結晶析出部先端に石英無垢棒を溶着
したヒートシンク14を形成する。ヒートシンク
の効果を増加するために石英の外周に耐熱網など
の熱伝導率の大きな材質を配置しても効果的であ
る。石英アンプル11の寸法としては、例えば内
径8mmφ、石英の内厚2mm、長さ100mmである。
この中に溶媒のSe13を10g入れ、この上部に成
長すべき結晶のソース結晶(小粒径ZnSeの多結
晶)12を5g配置し、10-6Torrより良好な真
空度で石英アンプルの上部を封じ切つた後、フツ
ク10を溶着する。結晶成長時の炉の温度分布と
してはヒータ2の巻き方により第2図イ−2に示
すようにソース結晶部12の温度が結晶析出部1
5の温度より高くなるような温度分布17とす
る。
結晶成長の際実際の温度としては、ソース結晶
部12で850〜950℃、結晶析出部で800〜900℃
で、両領域の間隔は約5cm程度となるが、成長温
度に対する温度差としては800℃では20℃/cm〜50
℃/cmの範囲が好ましく、40℃/cm前後が最適であ
つた。又成長温度が900℃程度の場合には10〜30
℃/cmの範囲で20℃/cm前後が良好であつた。
結晶成長時のSe圧は溶媒の温度により決定さ
れ、ちなみに800℃でのSeの圧力は約3.5気圧、
900℃では約11気圧である。
結晶成長時間としては800℃で約10日間、900℃
で7日間成長することにより石英管内壁に沿つた
バルク状単結晶を得ることができた。成長した結
晶をスライスすることにより基板結晶として用い
ることができる。成長結晶を単結晶化するために
結晶析出部に単結晶核を発生させる方法として成
長開始時に、結晶析出部の温度を10℃〜20℃の範
囲で、時間を10〜60min程度でパルス状に温度を
変化させることにより、析出する結晶の単結晶部
を大きくすることができる。
第3図にパルス状の温度サイクル図を示すが、
結晶成長温度aにおいて、結晶析出部15に輪送
された成長核が大小数個あつた場合には、夫々の
核から結晶の析出が生じ、得られた結晶は多結晶
となつてしまう。これを防ぐためにbの様に結晶
成長温度より10〜20℃温度を上昇すると飽和溶解
度が増すので成長核のうち小さなものが溶けてし
まい大きな核のみが残る。次にcにおいて成長温
度に戻すと飽和溶解度が減少するので、過飽和と
なつた結晶は残つた成長核上に成長して成長核を
大きくする。このプロセスを何回か繰り返すこと
により一番大きな結晶核のみが残りこれを中心と
して単結晶成長が行なわれることになる。第2図
イに示す構造の石英アンプルでも、一応大きな単
結晶を得ることができるが、更に効果的な例を第
2図ロ,ハに示す。
第2図イの構造における問題点としては、ソー
ス結晶は粉末に近い小粒径のものを用いる場合に
は、Seの表面張力で表面に浮くが、バルク状結
晶を用いる場合には、ZnSe結晶の比重がSeより
も大きいために成長中にソース結晶が自重により
下部に沈降し、溶媒に溶けずに結晶析出部に累積
してしまうために規則正しい表面泳動による単結
晶成長を阻害し、ソース結晶上への多結晶成長が
行なわれることがある。これを防ぐ目的でソース
結晶と結晶析出部の中間部に溶媒に溶解しないで
直接沈降してしまう大きなソース結晶をトラツプ
する装置21,22を付加したのが、第2図ロ,
ハに示す成長装置である。
即ち、第2図ロ,ハのように、ソース結晶部と
析出部との間にスリツト状のものを入れることが
望ましい。第2図ロでは、石英アンプル内部を例
えば内径3mmφ程度のくびれを入れ、又第2図ハ
では、2×2mm程度の枡目を有する網目状のすの
こを入れる。第2図ハ−2にすのこの平面図の形
状例を示す、この枡目の寸法は、ソース結晶の大
きさに依存するが、本実施例では4×4×4mm3
程度のソース結晶を数個入れてあるので、これが
通過しない程度の大きさの枡目寸法ならば良いこ
とになる。材質としては、石英、カーボンなどの
加工性があり、かつSeと反応性の少ないものが
良い。その他の領域の形状は第2図イの例とほぼ
同様である。第2図ロ,ハの場合の方が、バルク
結晶中の単結晶部分が大きく成長した。
実施例 2
SeとZnSeの比重はdSe<dZoSeの関係にあるこ
とは既に述べたが、この関係を積極的に利用する
ことにより良好な結晶性のものが得られた。即
ち、ZnSe結晶をSe溶媒中に入れると、結晶は溶
媒に溶解する前に溶液下部に沈降してしまう。そ
こで第4図イ,ロに縦型構造、第4図ハに横型構
造のアンプルの実施例を示した。第4図イ−1,
ロ−1,ハ−1はアンプルの正面図、第4図イ−
2,ロ−2はソース結晶部の断面図、第4図イ−
3,ロ−3,ハ−3はアンプルの水平面内の温度
分布図、第4図イ−4,ハ−4はアンプルの垂直
方向の温度分布図である。縦型構造の場合には、
ソース結晶12を結晶析出部15の対向面に設定
する場合に工夫を要し、イ−1は結晶析出部15
よりも内径の大きな石英管を接続し、内径の大き
な領域にソース結晶室25を形成して、この中に
ソース結晶を配置する。又ロ−1では石英管の内
壁にソース結晶を入れた容器26を宙吊りにして
Se溶媒で覆うなどの方法がある。いづれもソー
ス結晶が溶媒に溶解せずに、結晶析出部15に沈
降することを防ぐ手段が施されている。しかし比
重差を有効に利用した方法としてはハ−1図に示
す横型の方が効果的で、横型に2室を設け一方に
ソース結晶12をソース結晶室25の下部に沈漬
させ他方を結晶析出部15とし、両室を溶媒の
Se13で連結させた形式がさらに好ましい。
又、結晶成長時の温度分布としては、第4図イの
場合はイ−3に示すように、ソース結晶25では
27′のように中心部の温度を低くし、周辺部か
ら中心部に向かつてソース結晶12が熱拡散しや
すくする。又結晶析出部15では、結晶が横方向
では一定温度で成長するような温度分布27″に
する。又、縦方向に対しては、第4図イ−4に示
すように結晶析出部の温度はほぼ一定となるよう
にし、かつそれよりも上方では高温になるような
温度分布28にすることが望ましい。このような
温度分布を実現するには、一温度帯炉を用いても
実現できるが、結晶析出部15、ソース結晶部2
5を別体の炉による二温度帯炉なども有効であ
る。
第4図ロについてもほぼ同様であるが、ソース
結晶部26の横方向の温度分布としては、第4図
ロ−3の29に示すように中心部を高くすること
が望ましいが、炉の構成が困難な場合には、2
9′のような同一温度でもソース結晶は密度差に
よつて拡散することができる。縦方向の温度分布
は第4図イ−4と同様である。
第4図ハの横型形式の場合では、アンプルを縦
型にした第4図イ,ロの場合よりも温度分布の設
定が重要である。横方向の温度分布は、第4図ハ
−3の36のように、ソース結晶部25の温度を
結晶析出部15の温度よりも高くすることが必要
で、かつ第4図ハ−4の35に示すように結晶析
出部15の上下にも温度差をつけることが必要で
ある。この条件を満足するための加熱炉として
は、第4図ハ−2に示すような上下別体でかつ独
立に温度制御が出来る炉37が望ましく、本実施
例では、二つ割りの炉芯管38,38′の接続部
で上下独立に配置したヒータ39,39′の縦割
り炉を用いて第4図ハ−3,ハ−4の温度分布を
実現して成長を行なつた。
結晶析出部15の上部形状は内径8mmφの円柱
で下部を頂角60゜前後の円錐形状とし高さは40mm
である。接続管40の内径は、4mmφで長さ50mm
でソース結晶12は4×4×4mm3程度の大きさ
に切つたバルク結晶を5g程度入れ、Se13を
10g程度投入した。封じ切り箇所はソース結晶投
入室25の近辺である。
この場合には、溶液中に垂直方向の温度差をつ
けるとともに、結晶の析出を促進するために、結
晶析出部15に設置するヒートシンク14として
は、結晶析出部15の下部に熱で伝導率の高い耐
熱鋼、ニツケル板などの耐酸化性物質を置き、炉
の低温側へ延ばすことにより、成長速度を増加さ
せることができる。この結果、結晶性が良く大き
な単結晶を得ることができる。
実施例 3
800℃程度の低温においては、Se中のZnSeの飽
和溶解度が小さいために、上述した温度差液相成
長法によつても、成長速度が極めて遅く、実用の
ものを得ることは困難である。そこで、高温にし
て溶解度を高くすることが望ましいが、高温にす
るとSeの蒸気圧は、10数気圧にも達し、石英管
の耐圧限界を越えるため爆発の危険を伴うことに
なるので、次のような操作をすることが効果的で
ある。第5図イに示すように成長用アンプル11
全体を更に石英管などの耐圧容器51に入れ、こ
の容器51内に不活性ガスの圧力52を印加する
ことにより成長用アンプルの相対圧を低下させる
方法である。
例えば石英アンプル11内のSe圧が10〜20気
圧の場合には、Ar又は空気などを石英あるい
は、ステンレス製等の耐熱鋼よりなる耐圧容器5
1に5〜10気圧加圧すると、石英アンプル11に
印加される圧力は実効的に5〜10気圧となり充分
に石英の耐圧内に入ることになる。この方法を実
施例1及び2に述べた成長用アンプルに対して行
なうと成長速度は格段に促進され、2〜3日程度
で大きな単結晶を得ることができる。加圧方法と
しては、不活性ガス圧を印加した場合を示す。不
活性ガスボンベ53を用い、加圧ポンプ54と石
英管51との接続は、ステンレス製などの耐圧コ
ネクタ55によつて行なうと容易である。
更に耐圧容器51内の保活性ガス圧52はボン
ベ53に直結された圧力調整器56により調整す
る。又ボンベ53と圧力容器54との間には圧力
調整器と直列に三方向のストツプバルブ57を装
備することにより結晶成長終了後の耐圧管51内
の圧力52を降下するために有効である。
加圧方法としてガスボンベを用いた方法を説明
したが、ガスボンベの代りにコンプレツサを用い
て圧縮空気圧を印加することによつても同様な操
作が可能である。
第5図イには1段の圧力印加の例を示したが、
2段、3段の圧力印加についても全く同様の思想
で耐圧操作が可能である。その例を第5図ロ,ハ
に示す。説明を簡単にするために、石英アンプル
11及び耐圧管の構造のみを示すが、その他の部
分は第5図イと全く同様である。第5図ロは2段
加圧の例で、1段加圧の場合の耐圧管51の外側
に、第2の耐圧管61を配置する。石英アンプル
11内の圧力が30気圧で結晶成長を行なう場合に
は、第1の耐圧管内の圧力52を20気圧、第2の
耐圧管61の圧力62を10気圧にすれば、各部の
圧力はそれぞれ10気圧となり、石英管の耐圧限界
内におさまることになる。
第5図ハは、3段印加の例で、石英アンプル1
1内の圧力が40気圧で結晶成長を行なう場合で第
5図ロに示した耐圧管構造にもう一段耐圧管63
を配置し、この内部に更に圧力64を印加すれば
第5図ロと同様に各部にはそれぞれ10気圧印加さ
れることになる。
以上は、自然発生的に結晶を析出させる方法に
ついて説明したが、結晶析出箇所に、単結晶を挿
入することにより、より結晶性の良いバルク状単
結晶を得ることができる。各実施例とも同一であ
るので、代表的な例として、第2図イに示す石英
アンプルを用いた場合を示すが、他の構造の場合
にも同様である。
実施例 4
バルク状結晶をX線回折により、ZnSeの結晶
面<111>あるいは<100>面に対して±2
゜程度の精度でスライスし、#4000のAl2O3で研
磨し更に例えば商品名FM4の研磨材(ポリツシ
ユ用アルミナ研磨材)を用い、バフ板上でミラー
ポリツシング後、超音波洗浄を充分行ない、Br
−メタノールあるいは、商品名シカクリーン(コ
リン系エツチング液)で数分間エツチングを行な
い鏡面に仕上げる。この結晶は種結晶71になる
ので、第6図イに示すように結晶析出部15の底
部にミラー状結晶面が上側になるようにセツトす
る。セツトの方法としては、結晶がちようど収納
される石英製あるいはグラフアイト製などの容器
を用いて成長方向に対して直角になるようにする
か、容器の底部に結晶をセツトし、石英などの爪
状のもので結晶を押えることなどにより適宜可能
である。成長開始前には、溶液13と種結晶71
が接触しないように溶液を分離し、成長温度で数
時間合金を行ない、飽和溶解度程度Se13中に
ZnSe12が溶解した後、第6図ロに示すように
溶液13と種結晶71を接触させて、成長を開始
する。800℃数日間の成長で高さ2cm程度のバル
ク状単結晶を得ることができた。
実施例 5
実施例4の応用例としては、第7図イに示すよ
うに種結晶挿入箇所81に直径8mmφ、厚さ400
μm程度のn形単結晶基板82を挿入し、900℃
程度の温度で1〜3時間程度合金した後、炉全体
を傾斜させ、第7図ロの状態とすることにより
Se溶液13を浸漬することにより、基板結晶8
2上へエピタキシヤル成長を行なう。合金時間が
短いと、溶液浸漬直後に基板結晶82を溶解して
しまうことになるので、十分な合金温度と時間が
必要で、800℃では8〜12時間、850℃では5〜10
時間程度必要である。また、基板結晶82とソー
ス結晶12との間の温度差は、20℃/cm〜100℃/
cmで50℃/cm程度が最も望ましい。温度差が大き
すぎると結晶性が悪くなり、良好なデバイスが製
作できない。また温度差が小さすぎると、基板結
晶と溶液間で結晶の相互互換が生じ、成長初期に
は、基板結晶82を溶解する危険性が大きいので
成長に適当な温度差があるわけである。
成長層の厚みとしては、800℃では、0.1〜0.33
μm、900℃では0.2〜0.6μm/hr程度の成長速度
で、結晶性の良好なエピタキシヤル成長層を得る
ことができる。
成長厚みは、温度差、時間とともに比例関係が
成立することが分つた。上記の温度差で、成長温
度900℃の場合には、0.05μm/hr〜0.3μm/hrの
範囲の成長速度を得ることができる。成長した結
晶の特性としては、不純物無添加結晶では、p形
伝導で、不純物密度1×1015/cm3である。Na、
Li、Au、Ag、Cuなどの族元素、P、As、Sb
などの族元素を添加すると、低抵抗P形成長層
を得ることができ、またGa、In、Alなどの族
元素あるいは、F、Cl、Br、Iなどの族元素
の添加によつて、n形低抵抗層が得られた。
なお略第7図ハに示すように、基板結晶82を
溶液13上部に置き、合金後第6図ニに示すよう
に反転してもよい。これでも略々同様の結果が得
られている。このような例に限らず、基板結晶を
溶液の上部に設定し、溶液の下部を高温にするこ
とによつてもエピタキシヤル成長は可能である。
以上説明したように、本発明は比較的低温で高
蒸気圧を有するSeを主体とした−族間化合
物のZnSe、ZnSSeなどの半導体結晶の成長法及
び成長装置を提供するものである。[Table] As is clear from the table, by using Se as a solvent, the temperature at which ZnSe has the same solubility can be lowered by about 200°C than in the case of Zn, and the contamination of impurities can be reduced. Since it can be minimized, high purity crystals can be obtained. An even more important advantage is that, as is clear in Figure 1, in conventional growth methods, the vapor pressure of Se is higher than that of Zn, so crystals grown at high temperatures have a stoichiometry that is deficient in Se. Only crystals with large deviations from the above were obtained. Therefore, by using Se as a solvent, it is possible to compensate for the lack of Se and obtain ZnSe crystals with less deviation from the stoichiometric composition. It also becomes possible to create p-type crystals with low impurity density. However, the problem with using Se as a solvent is that although the growth temperature can be lowered,
The key is to have a high vapor pressure and choose an appropriate temperature difference. To solve this problem, I performed the following operations. If a quartz crucible is manufactured by processing a quartz tube with an inner diameter of about 10 mmφ, even if the wall thickness is about 2 mm, the
Since it can sufficiently withstand internal pressures on the order of atmospheric pressure, it is also possible to control temperature differences relatively easily. However, if the pressure exceeds 10 atmospheres, there is a risk of explosion if the crucible is distorted or has thin walls, so air, Ar, and N 2 are added double or triple from the outside of the quartz crucible.
It is necessary to reduce the effective pressure applied to the quartz crucible by applying pressure with a gas such as When pressure is applied to the outside of the quartz crucible, the thermal conductivity of the gas increases in proportion to the pressure, so setting the temperature difference between the crystal precipitation area and the source crystal area is important. There is an optimum value for growth conditions for obtaining good crystallinity, which is interrelated with growth temperature - vapor pressure - temperature difference - pressure around the crucible. For example, 800
℃, the quartz tube can withstand even without external pressure applied, so a temperature difference of about 40℃ is sufficient, and 900℃
(Se pressure is 8500 Torr), the most desirable growth conditions are 20°C outside a single pressure vessel, and a temperature difference of about 10°C for growth at 1000°C (20240 Torr). In addition, Se in the solvent in the crucible and the source crystal
There is no strong limit to the amount of ZnSe, and it will grow if a source crystal is present, but the preferred range is about 2 to 20 g of ZnSe per 10 g of Se in the solvent. There are various ways to set the source crystal, but as shown in the table, the relationship of specific gravity is d Se < d Zo Se < d
Since it is Zo , when Se is used as a solvent,
Since ZnSe is heavy, it is necessary to devise a source crystal setting. When using a vertical crucible, if the source crystal is placed at the top, the crystal precipitation area at the bottom will contain
Crystals precipitate due to differences in temperature and specific gravity, but since the difference in specific gravity is relatively large, not only the crystals dissolved in the solvent will precipitate, but the source crystal itself will move to the precipitation area, resulting in the formation of large single crystals. This will inhibit its formation. Therefore, the method for precipitating a large single crystal is to take into consideration the properties of Se and ZnSe, create a horizontal structure, arrange two chambers, a crystal precipitation part and a source crystal part, and connect both chambers by Se solvent. ,
By sinking ZnSe into the source crystal part, Se
Only the crystals dissolved in the solvent move to the crystal precipitation area due to the temperature difference between the two chambers, so growth progresses through a regular crystal growth mechanism, making it possible to grow large single crystals. Become. Examples will be shown below and specifically explained. Example 1 The crystal growth apparatus used in the present invention and the temperature distribution during crystal growth are shown in FIG. For crystal growth, the temperature necessary for crystal growth is provided by a furnace core tube 1, which is the main part of the crystal growth apparatus, and a heater wire 2 wound around the outer circumference of the furnace core tube 1. A quartz ampoule 11 is suspended in a furnace core tube 1 by a heat-resistant wire (not shown) such as a Kanthal wire using a hook 10 at the top of the quartz ampoule. As for the structure of the quartz ampoule 11, the crystal precipitation part 15 at the lower part of the quartz ampoule is formed into a conical shape with an opening angle of about 30° to 60° so that single crystal nuclei can be easily precipitated. Furthermore, a heat sink 14 is formed by welding a solid quartz rod to the tip of the crystal precipitation part so that heat from the upper part of the ampoule flows through the tip of the crystal precipitation part 15 to the outside of the ampoule. In order to increase the effectiveness of the heat sink, it is also effective to arrange a material with high thermal conductivity, such as a heat-resistant mesh, around the outer periphery of the quartz. The dimensions of the quartz ampoule 11 are, for example, an inner diameter of 8 mmφ, an inner thickness of quartz of 2 mm, and a length of 100 mm.
Put 10g of Se13 as a solvent in this, place 5g of the source crystal (small-sized ZnSe polycrystal) 12 on top of this, and open the top of the quartz ampoule with a vacuum better than 10 -6 Torr. After sealing, the hook 10 is welded. As for the temperature distribution in the furnace during crystal growth, the temperature of the source crystal part 12 varies depending on the way the heater 2 is wound, as shown in FIG.
Temperature distribution 17 is set such that the temperature is higher than that of temperature 5. The actual temperature during crystal growth is 850 to 950°C in the source crystal part 12 and 800 to 900°C in the crystal precipitation part.
Therefore, the distance between the two regions is approximately 5 cm, but the temperature difference with respect to the growth temperature is 20 °C/cm to 50 °C at 800 °C.
The range of ℃/cm was preferable, and around 40℃/cm was optimal. In addition, when the growth temperature is about 900℃, it is 10 to 30
In the range of ℃/cm, around 20℃/cm was good. The Se pressure during crystal growth is determined by the temperature of the solvent, and by the way, the pressure of Se at 800°C is approximately 3.5 atm.
At 900℃, the pressure is approximately 11 atm. Crystal growth time is approximately 10 days at 800℃, 900℃
After 7 days of growth, a bulk single crystal along the inner wall of the quartz tube could be obtained. By slicing the grown crystal, it can be used as a substrate crystal. As a method of generating single crystal nuclei in the crystal precipitation area in order to make the growing crystal into a single crystal, at the start of growth, pulse the temperature of the crystal precipitation area in the range of 10℃ to 20℃ for about 10 to 60 minutes. By changing the temperature, it is possible to increase the size of the single crystal part of the precipitated crystal. Figure 3 shows a pulsed temperature cycle diagram.
If there are several large and small growth nuclei transferred to the crystal precipitation section 15 at the crystal growth temperature a, crystals will precipitate from each nucleus, and the resulting crystal will become polycrystalline. To prevent this, as shown in b, if the temperature is raised by 10 to 20°C above the crystal growth temperature, the saturation solubility will increase, so the small ones among the growing nuclei will melt and only the large ones will remain. Next, when the temperature is returned to the growth temperature at c, the saturated solubility decreases, so the supersaturated crystals grow on the remaining growth nuclei and enlarge the growth nuclei. By repeating this process several times, only the largest crystal nucleus remains and single crystal growth is performed around this nucleus. A large single crystal can be obtained even with the quartz ampoule having the structure shown in FIG. 2A, but more effective examples are shown in FIGS. 2B and 2C. The problem with the structure shown in Figure 2 A is that when a source crystal with a small particle size close to powder is used, it floats on the surface due to the surface tension of Se, but when a bulk crystal is used, a ZnSe crystal Since the specific gravity of Se is higher than that of Se, the source crystal settles to the bottom due to its own weight during growth, and accumulates in the crystal precipitation area without being dissolved in the solvent, which inhibits single crystal growth due to regular surface migration, and the source crystal Polycrystalline growth on top may occur. In order to prevent this, devices 21 and 22 were added to the intermediate part between the source crystal and the crystal precipitation area to trap large source crystals that would not dissolve in the solvent and would settle directly, as shown in Fig. 2(b).
This is the growth apparatus shown in Fig. That is, as shown in FIG. 2B and C, it is desirable to insert a slit-like material between the source crystal part and the precipitation part. In FIG. 2B, a constriction with an inner diameter of, for example, about 3 mm is inserted into the inside of the quartz ampoule, and in FIG. FIG. 2 H-2 shows an example of the shape of a plan view of the grating. The dimensions of this square depend on the size of the source crystal, but in this example, it is 4 x 4 x 4 mm .
Since several source crystals of about 100 mL are inserted, it is sufficient if the grid size is large enough to prevent the source crystals from passing through. The material is preferably one that is easy to work with, such as quartz or carbon, and has little reactivity with Se. The shapes of the other regions are almost the same as the example shown in FIG. 2A. In the cases shown in FIG. 2 (b) and (c), the single crystal portion in the bulk crystal grew larger. Example 2 It has already been mentioned that the specific gravity of Se and ZnSe has a relationship of d Se <d ZoSe , and by actively utilizing this relationship, a product with good crystallinity was obtained. That is, when ZnSe crystals are placed in a Se solvent, the crystals settle to the bottom of the solution before being dissolved in the solvent. Therefore, FIGS. 4A and 4B show examples of ampules having a vertical structure, and FIG. 4C shows an example of a horizontal structure. Figure 4 E-1,
Ro-1 and Ha-1 are front views of the ampoule, Fig. 4
2. Row 2 is a cross-sectional view of the source crystal part, Figure 4 E.
3, R-3 and H-3 are temperature distribution charts in the horizontal plane of the ampoule, and FIG. 4 A-4 and H-4 are temperature distribution charts in the vertical direction of the ampoule. In case of vertical structure,
When setting the source crystal 12 on the opposite surface of the crystal precipitation part 15, some effort is required, and E-1 is the crystal precipitation part 15.
A quartz tube with an inner diameter larger than that is connected to form a source crystal chamber 25 in the region with the larger inner diameter, and the source crystal is placed in this chamber. In addition, in Row 1, a container 26 containing source crystals is suspended from the inner wall of the quartz tube.
There are methods such as covering with Se solvent. In either case, means is provided to prevent the source crystals from settling in the crystal precipitation section 15 without being dissolved in the solvent. However, as a method of effectively utilizing the difference in specific gravity, the horizontal type shown in Fig. H-1 is more effective. Two chambers are provided in the horizontal type, and the source crystal 12 is submerged in the lower part of the source crystal chamber 25 in one, and the source crystal 12 is immersed in the other side. The precipitation section 15 is used as the precipitation section 15, and both chambers are filled with solvent.
More preferred is a format in which it is linked with Se13.
In addition, as for the temperature distribution during crystal growth, in the case of Figure 4A, as shown in A-3, in the source crystal 25, the temperature is lowered at the center as indicated by 27', and the temperature is increased from the periphery to the center. The former source crystal 12 facilitates thermal diffusion. In addition, in the crystal precipitation area 15, the temperature distribution is set to 27'' so that the crystal grows at a constant temperature in the horizontal direction.Also, in the vertical direction, the temperature of the crystal precipitation area is adjusted as shown in Fig. 4-4. It is desirable to have a temperature distribution 28 in which the temperature is almost constant and the temperature is higher above it.Such a temperature distribution can be achieved by using a single-temperature zone furnace. , crystal precipitation part 15, source crystal part 2
A two-temperature zone furnace using a separate furnace is also effective. The same applies to FIG. 4B, but as for the lateral temperature distribution of the source crystal part 26, it is desirable to make the central part higher as shown in 29 in FIG. If it is difficult, 2
Even at the same temperature such as 9', the source crystal can diffuse due to the density difference. The temperature distribution in the longitudinal direction is similar to that shown in Fig. 4-4. In the case of the horizontal format shown in FIG. 4C, setting the temperature distribution is more important than in the cases of FIGS. 4A and 4B, in which the ampoule is vertical. The temperature distribution in the lateral direction requires that the temperature of the source crystal part 25 be higher than the temperature of the crystal precipitation part 15, as shown in 36 in FIG. It is necessary to create a temperature difference between the upper and lower portions of the crystal precipitation area 15 as shown in FIG. As a heating furnace to satisfy this condition, it is desirable to use a furnace 37 as shown in FIG. Growth was carried out using a vertical furnace with heaters 39 and 39' arranged vertically and independently at the connection point 38' to achieve the temperature distributions shown in FIG. 4, H-3 and H-4. The shape of the upper part of the crystal precipitation part 15 is a cylinder with an inner diameter of 8 mmφ, and the lower part is a conical shape with an apex angle of about 60°, and the height is 40 mm.
It is. The inner diameter of the connecting pipe 40 is 4mmφ and the length is 50mm.
For the source crystal 12, put about 5g of bulk crystal cut into a size of about 4 x 4 x 4 mm, and add Se13.
I put in about 10g. The sealed portion is near the source crystal charging chamber 25. In this case, in order to create a vertical temperature difference in the solution and promote the precipitation of crystals, a heat sink 14 installed in the crystal precipitation section 15 is installed at the bottom of the crystal precipitation section 15 with a thermal conductivity. The growth rate can be increased by placing oxidation-resistant materials such as high heat-resistant steel or nickel plates and extending them to the cold side of the furnace. As a result, a large single crystal with good crystallinity can be obtained. Example 3 At a low temperature of about 800°C, the saturation solubility of ZnSe in Se is low, so even with the temperature difference liquid phase growth method described above, the growth rate is extremely slow and it is difficult to obtain a practical product. It is. Therefore, it is desirable to raise the temperature to increase its solubility, but if the temperature is raised, the vapor pressure of Se will reach tens of atmospheres, which exceeds the pressure limit of the quartz tube and poses a risk of explosion. It is effective to perform operations like this. As shown in FIG. 5A, the growth ampoule 11
This is a method of lowering the relative pressure of the growth ampoule by placing the whole in a pressure-resistant container 51 such as a quartz tube and applying an inert gas pressure 52 to the container 51. For example, when the Se pressure in the quartz ampoule 11 is 10 to 20 atm, Ar or air is added to the pressure vessel 5 made of quartz or heat-resistant steel such as stainless steel.
When 5 to 10 atmospheres of pressure is applied to the quartz ampoule 11, the effective pressure applied to the quartz ampoule 11 becomes 5 to 10 atmospheres, which is well within the pressure resistance of quartz. When this method is applied to the growth ampoules described in Examples 1 and 2, the growth rate is greatly accelerated, and a large single crystal can be obtained in about 2 to 3 days. As the pressurization method, the case where inert gas pressure is applied is shown. Using the inert gas cylinder 53, the pressurizing pump 54 and the quartz tube 51 can be easily connected using a pressure-resistant connector 55 made of stainless steel or the like. Further, the preservative activated gas pressure 52 in the pressure container 51 is adjusted by a pressure regulator 56 directly connected to the cylinder 53. Furthermore, by providing a three-way stop valve 57 in series with a pressure regulator between the cylinder 53 and the pressure vessel 54, it is effective to reduce the pressure 52 in the pressure tube 51 after crystal growth is completed. Although a method using a gas cylinder has been described as a pressurizing method, a similar operation is also possible by applying compressed air pressure using a compressor instead of a gas cylinder. Figure 5A shows an example of one-stage pressure application;
Pressure-resistant operation is also possible with the same concept for the second and third stages of pressure application. Examples are shown in Figure 5 B and C. In order to simplify the explanation, only the structures of the quartz ampoule 11 and the pressure tube are shown, but the other parts are exactly the same as in FIG. 5A. FIG. 5B shows an example of two-stage pressurization, in which a second pressure-resistant tube 61 is arranged outside the pressure-resistant tube 51 in the case of one-stage pressurization. When crystal growth is performed at a pressure in the quartz ampule 11 of 30 atm, if the pressure 52 in the first pressure tube 61 is 20 atm and the pressure 62 in the second pressure tube 61 is 10 atm, the pressure at each part will be Each has a pressure of 10 atm, which is within the pressure limit of the quartz tube. Figure 5 C shows an example of three-stage application, with quartz ampoule 1
When crystal growth is carried out at a pressure of 40 atm inside the pressure tube 63, an additional pressure tube 63 is added to the pressure tube structure shown in Figure 5B.
If a pressure 64 is further applied inside this, 10 atmospheres will be applied to each part as shown in FIG. 5B. Although the method for spontaneously precipitating crystals has been described above, a bulk single crystal with better crystallinity can be obtained by inserting a single crystal into the location where the crystal is precipitated. Since each embodiment is the same, a typical example will be shown in which a quartz ampoule shown in FIG. 2A is used, but the same applies to other structures. Example 4 Bulk crystal was analyzed by X-ray diffraction to determine the angle of ±2 with respect to the <111> or <100> crystal plane of ZnSe.
Slice with an accuracy of about 100°, polish with #4000 Al 2 O 3 , mirror polish on a buffing plate using, for example, a polishing material with the trade name FM4 (alumina polishing material for polishing), and then perform ultrasonic cleaning. Do enough, Br
- Etch for a few minutes with methanol or CicaClean (a choline-based etching liquid) to create a mirror finish. Since this crystal becomes a seed crystal 71, it is set at the bottom of the crystal precipitation part 15 so that the mirror-like crystal plane faces upward, as shown in FIG. 6A. The setting method is to use a container made of quartz or graphite, etc., in which the crystals are stored, so that they are perpendicular to the growth direction, or to set the crystals at the bottom of the container, and to store the crystals in a container made of quartz or graphite. This can be done appropriately by pressing the crystal with a nail-like object. Before the start of growth, the solution 13 and the seed crystal 71 are
Separate the solutions so that they do not come into contact with each other and carry out the alloying for several hours at the growth temperature to reach a saturation solubility of Se13.
After the ZnSe 12 is dissolved, the solution 13 and the seed crystal 71 are brought into contact with each other to start growth, as shown in FIG. 6B. After several days of growth at 800°C, we were able to obtain a bulk single crystal with a height of about 2 cm. Example 5 As an application example of Example 4, as shown in FIG.
Insert an n-type single crystal substrate 82 of about μm and heat to 900°C.
After alloying for about 1 to 3 hours at a temperature of
By immersing the Se solution 13, the substrate crystal 8
2. Epitaxial growth is performed on the 2nd layer. If the alloying time is short, the substrate crystal 82 will be melted immediately after immersion in the solution, so sufficient alloying temperature and time are required. At 800°C, it will take 8 to 12 hours, and at 850°C, it will take 5 to 10 hours.
It takes about an hour. Further, the temperature difference between the substrate crystal 82 and the source crystal 12 is between 20°C/cm and 100°C/cm.
The most desirable temperature is approximately 50°C/cm. If the temperature difference is too large, crystallinity deteriorates, making it impossible to manufacture good devices. On the other hand, if the temperature difference is too small, mutual compatibility of crystals will occur between the substrate crystal and the solution, and there is a great risk of melting the substrate crystal 82 in the initial stage of growth, so there is an appropriate temperature difference for growth. The thickness of the growth layer is 0.1 to 0.33 at 800℃.
An epitaxial growth layer with good crystallinity can be obtained at a growth rate of about 0.2 to 0.6 μm/hr at 900° C. It was found that the growth thickness is proportional to the temperature difference and time. With the above temperature difference, when the growth temperature is 900° C., a growth rate in the range of 0.05 μm/hr to 0.3 μm/hr can be obtained. As for the characteristics of the grown crystal, a crystal without addition of impurities has p-type conduction and an impurity density of 1×10 15 /cm 3 . Na,
Group elements such as Li, Au, Ag, Cu, P, As, Sb
By adding group elements such as Ga, In, Al, etc., or group elements such as F, Cl, Br, I, etc., a low resistance P-type growth layer can be obtained. A shaped low resistance layer was obtained. The substrate crystal 82 may be placed on top of the solution 13 as shown in FIG. 7C, and after alloying, the substrate crystal 82 may be turned over as shown in FIG. 6D. Almost the same results are obtained with this method. Epitaxial growth is not limited to this example, but epitaxial growth is also possible by setting the substrate crystal above the solution and heating the bottom of the solution to a high temperature. As explained above, the present invention provides a method and apparatus for growing semiconductor crystals such as ZnSe and ZnSSe, which are Se-based intergroup compounds having a high vapor pressure at a relatively low temperature.
第1図はSe、Zn、Teの蒸気圧対温度のグラ
フ、第2図は本発明の実施例1の各例を説明する
ための図であり、イ−1,ロ,ハ−1は側面図、
イ−2は温度分布のグラフ、ハ−2はすのこ状部
材の上面図であり、第3図は結晶成長開始時の温
度サイクルの一例、第4図は本発明の実施例2の
各例を説明するための図であり、イ−1,ロ−
1,ハ−1は側面図、イ−2,ロ−2,ハ−2は
断面図、イ−3,イ−4,ロ−3,ハ−3,ハ−
4は温度分布のグラフであり、第5図イ,ロ,ハ
は実施例3の各例を示す概略断面図、第6図イ,
ロは実施例4を説明する概略断面図、第7図イ,
ロ,ハ,ニは実施例4の応用例を説明するための
概略断面図である。
11……アンプル、12……ソース結晶13…
…Se、14……ヒートシンク、15……結晶析
出部、17……温度分布、21,22……大きな
ソース結晶をストツプする装置、25,26……
ソース結晶室、27……横方向の温度分布、28
……縦方向の温度分布、29……横方向の温度分
布、35……縦方向の温度分布、36……横方向
の温度分布、37……縦割成長炉、38……炉芯
管。
Fig. 1 is a graph of vapor pressure versus temperature of Se, Zn, and Te, and Fig. 2 is a diagram for explaining each example of Embodiment 1 of the present invention. figure,
A-2 is a graph of temperature distribution, H-2 is a top view of a slatted member, FIG. 3 is an example of a temperature cycle at the start of crystal growth, and FIG. 4 is a graph of each example of Example 2 of the present invention. This is a diagram for explaining,
1, H-1 is a side view, A-2, R-2, H-2 is a sectional view, E-3, E-4, R-3, H-3, H-2
4 is a graph of temperature distribution, FIGS.
B is a schematic sectional view for explaining Embodiment 4, FIG. 7A,
B, C, and D are schematic cross-sectional views for explaining an application example of the fourth embodiment. 11...Ampoule, 12...Source crystal 13...
...Se, 14... Heat sink, 15... Crystal precipitation section, 17... Temperature distribution, 21, 22... Device for stopping large source crystal, 25, 26...
Source crystal chamber, 27... Lateral temperature distribution, 28
...Temperature distribution in the vertical direction, 29...Temperature distribution in the horizontal direction, 35...Temperature distribution in the longitudinal direction, 36...Temperature distribution in the horizontal direction, 37...Vertical growth furnace, 38...Furnace core tube.
Claims (1)
設け、前記溶媒の高温側をソース結晶部、低温側
を結晶析出部とする配置となし、前記ソース結晶
部にソース結晶を配置し、前記結晶析出部及び前
記ソース結晶部を一定温度に保持し、前記結晶析
出部にZnSe結晶を析出させることを特徴とする
ZnSeの結晶成長法。 2 前記結晶析出部にあらかじめZnSe単結晶を
設置し、前記単結晶上にエピタキシヤル成長層を
成長させることを特徴とする前記特許請求の範囲
第1項記載のZnSeの結晶成長法。 3 前記結晶成長を、耐圧容器内で行なうことを
特徴とする前記特許請求の範囲第1項又は第2項
記載のZnSeの結晶成長法。 4 結晶析出部とソース結晶部を有し、かつ前記
結晶析出部及び前記ソース結晶部を一定温度に保
つための加熱手段を有することを特徴とする
ZnSeの結晶成長装置。 5 結晶析出部とソース結晶部を有する成長装置
を収容し、前記成長装置の外部より高圧ガスを印
加するための耐圧管を有することを特徴とする
ZnSeの液相成長装置。[Claims] 1 Se is used as a solvent, a temperature difference is provided in the solvent, and the high temperature side of the solvent is arranged as a source crystal part and the low temperature side as a crystal precipitation part, and the source crystal part is in the source crystal part. is arranged, the crystal precipitation part and the source crystal part are maintained at a constant temperature, and the ZnSe crystal is deposited in the crystal precipitation part.
ZnSe crystal growth method. 2. The ZnSe crystal growth method according to claim 1, characterized in that a ZnSe single crystal is placed in advance in the crystal precipitation area, and an epitaxial growth layer is grown on the single crystal. 3. The ZnSe crystal growth method according to claim 1 or 2, wherein the crystal growth is performed in a pressure-resistant container. 4. It has a crystal precipitation part and a source crystal part, and has a heating means for keeping the crystal precipitation part and the source crystal part at a constant temperature.
ZnSe crystal growth equipment. 5. It houses a growth device having a crystal precipitation section and a source crystal section, and is characterized by having a pressure-resistant tube for applying high-pressure gas from the outside of the growth device.
ZnSe liquid phase growth equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55149693A JPS5777098A (en) | 1980-10-24 | 1980-10-24 | Method and apparatus for growing znse in liquid phase |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55149693A JPS5777098A (en) | 1980-10-24 | 1980-10-24 | Method and apparatus for growing znse in liquid phase |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5777098A JPS5777098A (en) | 1982-05-14 |
| JPS6128640B2 true JPS6128640B2 (en) | 1986-07-01 |
Family
ID=15480740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55149693A Granted JPS5777098A (en) | 1980-10-24 | 1980-10-24 | Method and apparatus for growing znse in liquid phase |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5777098A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157231U (en) * | 1986-03-28 | 1987-10-06 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041033B2 (en) * | 1982-06-24 | 1985-09-13 | 財団法人 半導体研究振興会 | crystal growth equipment |
| JPS6037077B2 (en) * | 1982-07-02 | 1985-08-23 | 財団法人 半導体研究振興会 | ZnSe crystal growth method |
| JPS6050759B2 (en) * | 1982-07-14 | 1985-11-09 | 財団法人 半導体研究振興会 | ZnSe epitaxial growth method and growth apparatus |
| JP4908348B2 (en) * | 2007-08-24 | 2012-04-04 | ヤマハ発動機株式会社 | Motorcycle |
-
1980
- 1980-10-24 JP JP55149693A patent/JPS5777098A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157231U (en) * | 1986-03-28 | 1987-10-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5777098A (en) | 1982-05-14 |
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